JP3674494B2 - Electronic component suction nozzle and electronic component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component suction nozzle for sucking an electronic component, and an electronic component mounting apparatus on which the suction nozzle is mounted.
[0002]
[Prior art]
As a handling method such as transfer of electronic parts, a method using vacuum suction is widely used. In this method, a suction nozzle provided with a suction hole is brought into contact with the electronic component, and the electronic component is sucked using a negative pressure generated by vacuum suction of the suction hole. Since the suction nozzle used here is in direct contact with the electronic component, various types of nozzles are used depending on the shape and size of the target electronic component.
[0003]
[Problems to be solved by the invention]
By the way, in recent years, various measures are being taken to eliminate the use of lead, which is a toxic metal, from the field of electronic component manufacturing as much as possible due to a demand for prevention of environmental pollution. As part of this, plans to replace the protective film that covers areas other than the connection terminals on the upper surface of chip-type electronic components such as resistors with resin films such as epoxy from glass films that contain lead as a component in the past doing.
[0004]
However, when a chip-type electronic component whose upper surface is covered with a resin film is mounted by a suction nozzle, mounting defects are likely to occur as described below due to the properties and shape of the resin film. Hereinafter, description will be given with reference to the drawings. FIG. 4 is an explanatory view of a vacuum suction state of a chip-type electronic component by a conventional suction nozzle. In FIG. 4A, connection terminals A are formed on the upper surface and both side surfaces of both ends of the chip-type electronic component P. A resin film B for protecting the circuit layer formed on the electronic component P is formed in a range other than the terminal A on the upper surface of the electronic component P. The resin film B is obtained by applying a resin such as an epoxy resin to be solidified, and the thickness on the upper surface is not constant but has a convex cross-sectional shape.
[0005]
FIG. 4B shows a state in which the suction nozzle C provided with the suction hole D is brought into contact with the upper surface of the electronic component P and is vacuum-sucked. That is, the suction nozzle C is positioned and lowered with respect to the electronic component P, and vacuum suction is performed from the suction hole D with the lower end pressed against the upper surface of the electronic component P. Thereby, the electronic component P is vacuum-sucked by the lower end part of the suction nozzle C, and can be picked up. In this state, the mounting head on which the suction nozzle C is mounted moves onto the substrate, and the electronic component P is released from the suction nozzle C by releasing the vacuum suction after landing the electronic component P at the mounting point. The mounting of the electronic component is completed.
[0006]
However, in the chip-type electronic component P on which the resin resin film B is formed as described above, the resin film having a convex shape at the contact portion with the electronic component P as shown in FIG. In some cases, the end E of the suction hole D is pressed against the surface of the resin film B so that B fits inside the suction hole D, and the electronic component P is fixed to the lower end of the suction nozzle C. In such a case, even if the vacuum suction is released, the electronic component P does not leave the suction nozzle C, causing a mounting error.
[0007]
As described above, when the conventional suction nozzle is applied as it is to a chip-type electronic component using a resin as a protective film, there may be a problem such as a mounting error, and a suction nozzle capable of reliable mounting has been desired.
[0008]
Accordingly, the present invention provides a suction nozzle for an electronic component that can be mounted reliably without causing a problem with respect to a chip-type electronic component on which a resin protective film is formed, and an electronic component mounting on which the suction nozzle is mounted. An object is to provide an apparatus.
[0009]
[Means for Solving the Problems]
The electronic component suction nozzle according to claim 1 is mounted on a mounting head of an electronic component mounting apparatus and vacuum-sucks a chip-type electronic component at a lower end portion by vacuum suction from a suction hole communicating with the mounting head. A suction nozzle including a main body portion mounted on the mounting head and provided with the suction hole, and a suction portion provided with a suction hole that contacts the electronic component and sucks the electronic component. A cross-sectional shape formed so as to cover a range other than the connection terminal on the upper surface of the chip-type electronic component is a convex shape in the contact opening diameter of the contact opening portion where the hole opens and contacts the electronic component The size of the protective film is larger than the size of the protective film so that the inner end of the contact opening portion does not come into contact with the protective film so that the protective film does not get stuck in the adsorption hole.
[0010]
Suction nozzle of an electronic component according to claim 2, wherein the lower end of the suction holes are made inner tapered, the angle is in the 120 ° or more obtuse angle shape.
[0012]
The electronic component mounting apparatus according to claim 3 is an electronic component mounting apparatus that holds a chip-type electronic component by vacuum suction and mounts the chip-type electronic component on a substrate, wherein the suction nozzle abuts on the upper surface of the electronic component and vacuum-sucks the electronic component mounting device. A mounting head to which the suction nozzle is mounted, a moving means for moving the mounting head between the electronic component supply unit and the substrate, and a vacuum suction means for vacuum suction from the suction nozzle via the mounting head. wherein the suction nozzle is a suction nozzle of an electronic component according to claim 1 or 2.
[0013]
According to the present invention, the shape of the contact hole portion where the suction hole opens and contacts the electronic component is formed, and the inner end surface of the contact hole portion is the upper surface of the chip-type electronic component during electronic component suction. By adopting a shape that does not come into contact with the formed protective film, it is possible to prevent problems caused by the resin film on the upper surface of the electronic component getting stuck in the contact opening portion of the suction hole.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional view of a mounting head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. It is a fragmentary sectional view of the adsorption nozzle of the electronic component of the form.
[0015]
First, an electronic component mounting apparatus using an electronic component suction nozzle will be described with reference to FIG. In FIG. 1, two Y-axis tables 2A and 2B are juxtaposed on both ends of a base 1, and an X-axis table 3 is installed on the Y-axis tables 2A and 2B. A moving block 4 is attached to the X-axis table 3, and the moving block 4 includes a camera 5 and a mounting head 6. An electronic component suction nozzle 10 is mounted on the mounting head 6.
[0016]
The moving block 4 is moved in the horizontal direction by the Y-axis tables 2A and 2B and the X-axis table 3, and the electronic components are vacuum-sucked and picked up by the mounting head 6 from the tape feeder 8 disposed in the supply unit 7, and the substrate 9 Mount on top. The camera 5 recognizes the recognition mark on the substrate 9, and the position of the moving block 4 when the electronic component is mounted is corrected based on the recognition result. The Y-axis tables 2A and 2B and the X-axis table 3 are moving means for moving the mounting head 6 between the electronic component supply unit 7 and the substrate 9.
[0017]
Next, the suction nozzle 10 of the electronic component mounted on the mounting head 6 will be described with reference to FIG. The suction nozzle 10 includes a main body 11 and a shaft-like suction part 12 extending downward from the main body 11. The upper portion of the main body 11 is a conical tapered portion 11a, and the suction nozzle 10 is detachably mounted on the mounting head 6 by inserting the tapered portion 11a into the mounting portion 6a provided on the mounting head 6. The
[0018]
A suction hole 11b is formed inside the taper portion 11a. When the taper portion 11a is attached to the attachment portion 6a, the suction hole 11b communicates with the vacuum suction means 14 connected via the attachment portion 6a. The suction hole 11b communicates with the suction hole 12a provided through the suction part 12 to the lower end. With the suction nozzle 10 mounted on the mounting head 6, the vacuum suction means 14 is driven to perform vacuum suction from the suction hole 12a.
[0019]
The suction part 12 has a shape in which the lower part is tapered and narrowed, and the lower end part is a contact opening part 12b in which the suction hole 12a is opened to contact the electronic component. By driving the vacuum suction means 14 with the contact opening 12b in contact with the upper surface of the electronic component, the electronic component is sucked and held by the suction nozzle 10. The lower surface of the circular flange 13 provided above the suction unit 12 is a reflection plate that reflects illumination light emitted from the light source when the electronic component is recognized, and the electronic component held by the suction nozzle 10 is reflected by the reflected light. Illuminate from above.
[0020]
Next, with reference to FIG. 3, the detailed shape of the contact opening part 12b of the adsorption | suction part 12 is demonstrated. As shown in FIG. 3A, the lower end portion of the suction hole 12a opened in the contact opening portion 12b is chamfered (inner taper processing), and indicates the diameter of the opening in the lower end surface of the suction portion 12. The contact hole diameter d is set to be larger than the size b of the resin film B formed on the upper surface of the chip-type electronic component P to be attracted. Further, the angle α of the inner end E of the contact opening 12b is an obtuse angle with an angle of 120 degrees or more.
[0021]
FIG. 3B shows a state where the chip-type electronic component P provided with the resin film B is sucked and held using the suction portion 12 including the contact opening portion 12b having such a shape. As shown in FIG. 3B, in the state where the suction portion 12 is in contact with the upper surface of the electronic component P, the contact opening diameter d is larger than the size b of the resin film B as described above. The end E inside the opening 12b does not contact the resin film B. Accordingly, there is no problem that the resin film B is fixed to the suction portion 12 in such a manner that the resin film B fits inside the suction hole 12a, and the electronic component is generated even after the vacuum suction is released, which occurs when the conventional suction nozzle is used. Can be prevented from being detached from the suction nozzle, and reliable mounting can be performed.
[0022]
In the above embodiment, the lower portion of the suction hole 12a is chamfered (inner taper processing) to obtain the above-described contact opening portion shape, but other shapes such as R-shape processing may be used. Good.
[0023]
【The invention's effect】
According to the present invention, the shape of the contact hole portion where the suction hole opens and contacts the electronic component is formed, and the inner end surface of the contact hole portion is the upper surface of the chip-type electronic component during electronic component suction. Since the shape is such that it does not come into contact with the formed protective film, it is possible to prevent problems caused by the resin film on the upper surface of the electronic component getting stuck in the contact opening portion of the suction hole.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a partial cross-sectional view of a mounting head of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a partial sectional view of a suction nozzle of an electronic component according to an embodiment. FIG. 4 is an explanatory diagram of a vacuum suction state of a chip-type electronic component by a conventional suction nozzle
6 Mounting Head 10 Suction Nozzle 11 Main Body 11b Suction Hole 12 Suction Part 12a Suction Hole 12b Contact Aperture P Electronic Component B Resin Film

Claims (3)

An electronic component suction nozzle that vacuum-sucks a chip-type electronic component at the lower end by vacuum suction from a suction hole that is mounted on the mounting head of the electronic component mounting apparatus and communicates with the mounting head, and is mounted on the mounting head And a suction portion provided with a suction hole for contacting the electronic component and sucking the electronic component, wherein the suction hole is opened to contact the electronic component. the contact opening diameter of the opening portion, and larger than the size of the chip-type electronic component of the upper surface of the connection protected form cross-section shape so as to cover the range of non-terminals convex film contact opens A suction nozzle for an electronic component, wherein the inner end of the hole is sized so as not to contact the protective film, and the protective film is prevented from getting inside the suction hole. 2. The suction nozzle for an electronic component according to claim 1, wherein the lower end portion of the suction hole is internally tapered and has an obtuse angle of 120 degrees or more. An electronic component mounting apparatus for holding a chip-type electronic component by vacuum suction and mounting it on a substrate, wherein the suction nozzle is in contact with the upper surface of the electronic component and vacuum-sucked, and a mounting head on which the suction nozzle is mounted; And a moving means for moving the mounting head between the electronic component supply unit and the substrate, and a vacuum suction means for vacuum suction from the suction nozzle via the mounting head, wherein the suction nozzle comprises: An electronic component mounting apparatus, which is the suction nozzle for electronic components according to 2.

Images