JP2002120185A - Electronic component suction nozzle and electronic component mounting device - Google Patents
Electronic component suction nozzle and electronic component mounting deviceInfo
- Publication number
- JP2002120185A JP2002120185A JP2000314869A JP2000314869A JP2002120185A JP 2002120185 A JP2002120185 A JP 2002120185A JP 2000314869 A JP2000314869 A JP 2000314869A JP 2000314869 A JP2000314869 A JP 2000314869A JP 2002120185 A JP2002120185 A JP 2002120185A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- suction
- suction nozzle
- mounting head
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】
【課題】 樹脂の保護膜が形成されたチップ型の電子部
品に対しても不具合を生じることがなく、確実な実装を
行える電子部品の吸着ノズルおよびこの吸着ノズルが装
着された電子部品実装装置を提供することを目的とす
る。
【解決手段】 保護用の樹脂膜Ｂが形成されたチップ型
の電子部品Ｐを真空吸着する電子部品Ｐの吸着ノズルに
おいて、電子部品Ｐに当接して吸着する吸着部１２の下
端部の、吸着孔１２ａが開孔し電子部品Ｐと当接する当
接開孔部１２ｂの形状を、電子部品吸着時において内側
の端部Ｅが電子部品Ｐの上面の樹脂膜Ｂに接触しないよ
うな形状とする。これにより、電子部品Ｐ上面の樹脂膜
Ｂが吸着孔１２ａにはまり込むことによる不具合を防止
することができる。
(57) [Summary] [Problem] To provide a suction nozzle for an electronic component that can be securely mounted without causing any trouble even for a chip-type electronic component on which a resin protective film is formed, and to which the suction nozzle is mounted. It is an object to provide an electronic component mounting apparatus. SOLUTION: In a suction nozzle of an electronic component P for vacuum-suctioning a chip-type electronic component P on which a protective resin film B is formed, suction at a lower end portion of a suction portion 12 which comes into contact with and sucks the electronic component P. The shape of the contact opening portion 12b in which the hole 12a is opened and comes into contact with the electronic component P is such that the inner end portion E does not contact the resin film B on the upper surface of the electronic component P when the electronic component is sucked. . Thereby, it is possible to prevent a problem caused by the resin film B on the upper surface of the electronic component P getting stuck in the suction hole 12a.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を吸着す
る電子部品の吸着ノズルおよびこの吸着ノズルが装着さ
れた電子部品実装装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suction nozzle for sucking an electronic component, and an electronic component mounting apparatus equipped with the suction nozzle.
【０００２】[0002]
【従来の技術】電子部品の移載などのハンドリングの方
法として、真空吸着による方法が広く用いられている。
この方法は吸着孔が設けられた吸着ノズルを電子部品に
当接させ、吸着孔を真空吸引することにより発生する負
圧を利用して電子部品を吸着するものである。ここで用
いられる吸着ノズルは電子部品に直接当接して用いられ
るものであるため、対象の電子部品の形状やサイズに応
じて種々の形式のものが用いられる。2. Description of the Related Art As a handling method such as transfer of electronic parts, a method using vacuum suction is widely used.
In this method, a suction nozzle provided with a suction hole is brought into contact with an electronic component, and the electronic component is suctioned by utilizing a negative pressure generated by vacuum suction of the suction hole. Since the suction nozzle used here is used in direct contact with the electronic component, various types are used depending on the shape and size of the target electronic component.
【０００３】[0003]
【発明が解決しようとする課題】ところで、近年環境汚
染防止の要請から、有害金属である鉛の使用を電子部品
製造分野から極力排除しようとする各種の施策が講じら
れつつある。この一環として、抵抗などチップ型の電子
部品の上面の接続用端子以外の範囲を覆う保護膜を、従
来用いられていた鉛を成分として含むガラス膜から、エ
ポキシなどの樹脂膜に置き換える計画が進行している。In recent years, various measures have been taken to minimize the use of lead, which is a harmful metal, from the field of electronic component production in response to demands for environmental pollution prevention. As part of this, a plan is underway to replace the protective film that covers areas other than the connection terminals on the top surface of chip-type electronic components, such as resistors, from a conventionally used glass film containing lead as a component to a resin film such as epoxy. are doing.
【０００４】しかしながら上面が樹脂膜で覆われたチッ
プ型の電子部品を吸着ノズルによって実装する際には樹
脂膜の性状・形状に起因して、以下に説明するように実
装不具合が生じやすい。以下、図面を参照して説明す
る。図４は、従来の吸着ノズルによるチップ型の電子部
品の真空吸着状態の説明図である。図４（ａ）におい
て、チップ型の電子部品Ｐの両側端には、接続用の端子
Ａが上面と両側面にわたって形成されている。電子部品
Ｐの上面の端子Ａ以外の範囲には、電子部品Ｐに形成さ
れた回路層を保護するための樹脂膜Ｂが形成されてい
る。樹脂膜Ｂはエポキシ樹脂などの樹脂を塗布して固化
させたものであり、上面における厚さは一定ではなく上
に凸状の断面形状を呈している。However, when a chip-type electronic component whose upper surface is covered with a resin film is mounted by a suction nozzle, mounting defects are likely to occur as described below due to the properties and shape of the resin film. Hereinafter, description will be made with reference to the drawings. FIG. 4 is an explanatory diagram of a vacuum suction state of a chip-type electronic component by a conventional suction nozzle. In FIG. 4A, connection terminals A are formed on both sides of the chip-type electronic component P over the upper surface and both side surfaces. In a range other than the terminals A on the upper surface of the electronic component P, a resin film B for protecting a circuit layer formed on the electronic component P is formed. The resin film B is formed by applying a resin such as an epoxy resin and solidifying the resin film B. The thickness of the upper surface is not constant but has an upwardly convex cross-sectional shape.
【０００５】図４（ｂ）は、このような電子部品Ｐの上
面に、吸着孔Ｄが設けられた吸着ノズルＣを当接させて
真空吸着した状態を示している。すなわち吸着ノズルＣ
を電子部品Ｐに位置合わせして下降させ、下端部を電子
部品Ｐの上面に押し当てた状態で、吸着孔Ｄから真空吸
引する。これにより、電子部品Ｐは吸着ノズルＣの下端
部に真空吸着されて、ピックアップ可能な状態となる。
そしてこの状態で吸着ノズルＣが装着された実装ヘッド
が、基板上へ移動し電子部品Ｐを実装点に着地させた後
に真空吸引を解除することにより、電子部品Ｐは吸着ノ
ズルＣから離脱し、当該電子部品の実装が完了する。FIG. 4B shows a state in which a suction nozzle C provided with a suction hole D is brought into contact with the upper surface of such an electronic component P and vacuum suction is performed. That is, the suction nozzle C
Is moved downward while being positioned with respect to the electronic component P, and the lower end portion is pressed against the upper surface of the electronic component P while being suctioned through the suction hole D. As a result, the electronic component P is vacuum-sucked to the lower end of the suction nozzle C, and becomes ready for pickup.
Then, in this state, the mounting head to which the suction nozzle C is mounted moves on the substrate, and the electronic component P is released from the suction nozzle C by releasing the vacuum suction after landing the electronic component P at the mounting point. The mounting of the electronic component is completed.
【０００６】ところが上述のように樹脂の樹脂膜Ｂが形
成されたチップ型の電子部品Ｐでは、図４（ｂ）に示す
ように電子部品Ｐへの当接部において、上に凸状となっ
た樹脂膜Ｂが吸着孔Ｄの内側にはまり込む形で吸着孔Ｄ
の端部Ｅが樹脂膜Ｂの表面に押し付けられ、電子部品Ｐ
が吸着ノズルＣの下端部に固着状態となる場合がある。
このような場合には、真空吸引を解除しても電子部品Ｐ
は吸着ノズルＣから離脱せず、搭載ミスを生じる。However, in the chip type electronic component P on which the resin film B of the resin is formed as described above, the contact portion to the electronic component P has a convex shape as shown in FIG. The resin film B is stuck inside the suction hole D so that the suction hole D
Of the electronic component P is pressed against the surface of the resin film B.
May be fixed to the lower end of the suction nozzle C.
In such a case, the electronic components P
Does not separate from the suction nozzle C, causing a mounting error.
【０００７】このように、樹脂を保護膜として用いたチ
ップ型の電子部品に従来の吸着ノズルをそのまま適用す
ると、搭載ミスなどの不具合を生じる場合があり、確実
な実装が行える吸着ノズルが望まれていた。As described above, if the conventional suction nozzle is applied as it is to a chip-type electronic component using a resin as a protective film, a problem such as a mounting error may occur, and a suction nozzle capable of surely mounting is desired. I was
【０００８】そこで本発明は、樹脂の保護膜が形成され
たチップ型の電子部品に対しても不具合を生じることが
なく、確実な実装を行える電子部品の吸着ノズルおよび
この吸着ノズルが装着された電子部品実装装置を提供す
ることを目的とする。In view of the above, the present invention provides a suction nozzle for an electronic component capable of securely mounting without causing any trouble even for a chip-type electronic component on which a resin protective film is formed, and the suction nozzle is mounted. An object is to provide an electronic component mounting apparatus.
【０００９】[0009]
【課題を解決するための手段】請求項１記載の電子部品
の吸着ノズルは、電子部品実装装置の実装ヘッドに装着
されこの実装ヘッドと連通した吸引孔から真空吸引する
ことにより下端部にチップ型の電子部品を真空吸着する
電子部品の吸着ノズルであって、前記実装ヘッドに装着
され前記吸引孔が設けられた本体部と、電子部品に当接
してこの電子部品を吸着する吸着孔が設けられた吸着部
とを備え、前記吸着孔が開孔し電子部品と当接する当接
開孔部の当接開孔径は、前記チップ型の電子部品の上面
に形成された保護膜のサイズよりも大きい。An electronic component suction nozzle according to claim 1 is mounted on a mounting head of an electronic component mounting apparatus, and has a chip type at its lower end by vacuum suction through a suction hole communicating with the mounting head. An electronic component suction nozzle for vacuum-sucking the electronic component, wherein a main body portion mounted on the mounting head and provided with the suction hole, and a suction hole for contacting the electronic component and sucking the electronic component are provided. A contact opening diameter of the contact opening where the suction hole is opened and contacts the electronic component is larger than a size of a protective film formed on an upper surface of the chip-type electronic component. .
【００１０】請求項２記載の電子部品の吸着ノズルは、
電子部品実装装置の実装ヘッドに装着されこの実装ヘッ
ドと連通した吸引孔から真空吸引することにより下端部
にチップ型の電子部品を真空吸着する電子部品用の吸着
ノズルであって、前記実装ヘッドに装着され前記吸引孔
が設けられた本体部と、電子部品に当接してこの電子部
品を吸着する吸着孔が設けられた吸着部とを備え、前記
吸着孔が開孔し電子部品と当接する当接開孔部の内側の
端部は１２０度以上の角度の鈍角形状となっている。According to a second aspect of the invention, there is provided an electronic component suction nozzle.
A suction nozzle for an electronic component, which is mounted on a mounting head of an electronic component mounting apparatus and vacuum-suctions a chip-type electronic component at a lower end portion by vacuum suction from a suction hole communicating with the mounting head. A main body portion provided with the suction hole, and a suction portion provided with a suction hole for contacting the electronic component and sucking the electronic component, wherein the suction hole is opened to contact the electronic component. The inner end of the contact hole has an obtuse angle of 120 ° or more.
【００１１】請求項３記載の電子部品の吸着ノズルは、
電子部品実装装置の実装ヘッドに装着されこの実装ヘッ
ドと連通した吸引孔から真空吸引することにより下端部
にチップ型の電子部品を真空吸着する電子部品の吸着ノ
ズルであって、前記実装ヘッドに装着され前記吸引孔が
設けられた本体部と、電子部品に当接してこの電子部品
を吸着する吸着孔が設けられた吸着部とを備え、前記吸
着孔が開孔し電子部品と当接する当接開孔部の形状は、
電子部品吸着時において当接開孔部の内側の端部が前記
チップ型の電子部品の上面に形成された保護膜に接触し
ないような形状となっている。According to a third aspect of the present invention, there is provided an electronic component suction nozzle.
A suction nozzle for an electronic component, which is mounted on a mounting head of an electronic component mounting apparatus and vacuum-suctions a chip-type electronic component at a lower end portion by vacuum suction through a suction hole communicating with the mounting head, and is mounted on the mounting head. A main body portion provided with the suction hole, and a suction portion provided with a suction hole for contacting the electronic component and sucking the electronic component, wherein the suction hole is opened and the contact portion contacts the electronic component. The shape of the opening is
The shape is such that the inner end of the contact hole does not come into contact with the protective film formed on the upper surface of the chip-type electronic component when the electronic component is sucked.
【００１２】請求項４記載の電子部品実装装置は、チッ
プ型の電子部品を真空吸着により保持して基板に実装す
る電子部品実装装置であって、前記電子部品の上面に当
接して真空吸着する吸着ノズルと、この吸着ノズルが装
着される実装ヘッドと、実装ヘッドを電子部品の供給部
と前記基板との間で移動させる移動手段と、前記実装ヘ
ッドを介して吸着ノズルから真空吸着する真空吸引手段
とを備え、前記吸着ノズルは、請求項１乃至３のいずれ
かに記載の電子部品の吸着ノズルである。According to a fourth aspect of the present invention, there is provided an electronic component mounting apparatus for holding a chip-type electronic component by vacuum suction and mounting the electronic component on a substrate. A suction nozzle, a mounting head to which the suction nozzle is mounted, moving means for moving the mounting head between a supply unit for electronic components and the substrate, and vacuum suction for vacuum suction from the suction nozzle via the mounting head Means, wherein the suction nozzle is the suction nozzle for an electronic component according to any one of claims 1 to 3.
【００１３】本発明によれば、吸着孔が開孔し電子部品
と当接する当接開孔部の形状を、電子部品吸着時におい
て当接開孔部の内側の端面が前記チップ型の電子部品の
上面に形成された保護膜に接触しないような形状とする
ことにより、電子部品上面の樹脂膜が吸着孔の当接開孔
部へはまり込むことによる不具合を防止することができ
る。According to the present invention, the shape of the contact opening portion in which the suction hole is opened and which comes into contact with the electronic component is such that the inner end surface of the contact opening portion when the electronic component is sucked has the chip-type electronic component. By preventing the resin film on the upper surface of the electronic component from being in contact with the protective film formed on the upper surface of the electronic component, the resin film on the upper surface of the electronic component can be prevented from being fitted into the contact opening of the suction hole.
【００１４】[0014]
【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図１は本発明の一実施の形態の電子
部品実装装置の斜視図、図２は本発明の一実施の形態の
電子部品実装装置の実装ヘッドの部分断面図、図３は本
発明の一実施の形態の電子部品の吸着ノズルの部分断面
図である。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a partial cross-sectional view of a mounting head of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. It is a fragmentary sectional view of the suction nozzle of the electronic component of the form.
【００１５】まず図１を参照して電子部品の吸着ノズル
が使用される電子部品実装装置について説明する。図１
において、基台１の両端部には２つのＹ軸テーブル２
Ａ，２Ｂが並設されており、Ｙ軸テーブル２Ａ，２Ｂに
はＸ軸テーブル３が架設されている。Ｘ軸テーブル３に
は移動ブロック４が装着されており、移動ブロック４に
はカメラ５および実装ヘッド６を備えている。実装ヘッ
ド６には電子部品の吸着ノズル１０が装着される。First, an electronic component mounting apparatus in which an electronic component suction nozzle is used will be described with reference to FIG. FIG.
, Two Y-axis tables 2 are provided at both ends of the base 1.
A and 2B are arranged side by side, and an X-axis table 3 is installed on the Y-axis tables 2A and 2B. A moving block 4 is mounted on the X-axis table 3, and the moving block 4 includes a camera 5 and a mounting head 6. A suction nozzle 10 for electronic components is mounted on the mounting head 6.
【００１６】移動ブロック４はＹ軸テーブル２Ａ，２Ｂ
およびＸ軸テーブル３によって水平方向に移動し、供給
部７に配設されたテープフィーダ８から実装ヘッド６に
よって電子部品を真空吸着してピックアップし、基板９
上に搭載する。カメラ５は基板９の認識マークを認識
し、この認識結果により電子部品搭載時の移動ブロック
４の位置補正が行われる。Ｙ軸テーブル２Ａ，２Ｂおよ
びＸ軸テーブル３は、実装ヘッド６を電子部品の供給部
７と基板９との間で移動させる移動手段となっている。The moving block 4 includes Y-axis tables 2A and 2B.
Then, the electronic component is moved in the horizontal direction by the X-axis table 3 and the electronic components are vacuum-adsorbed and picked up by the mounting head 6 from the tape feeder 8 provided in the supply unit 7, and the substrate 9 is picked up.
Mount on top. The camera 5 recognizes the recognition mark on the substrate 9, and based on the recognition result, corrects the position of the moving block 4 when the electronic component is mounted. The Y-axis tables 2A and 2B and the X-axis table 3 are moving means for moving the mounting head 6 between the electronic component supply unit 7 and the substrate 9.
【００１７】次に図２を参照して実装ヘッド６に装着さ
れる電子部品の吸着ノズル１０について説明する。吸着
ノズル１０は本体部１１と本体部１１から下方に延出し
た軸状の吸着部１２により構成される。本体部１１の上
部は円錐状のテーパ部１１ａとなっており、テーパ部１
１ａを実装ヘッド６に設けられた装着部６ａに挿入する
ことにより、吸着ノズル１０は実装ヘッド６に着脱自在
に装着される。Next, the suction nozzle 10 for the electronic component mounted on the mounting head 6 will be described with reference to FIG. The suction nozzle 10 includes a main body 11 and a shaft-shaped suction portion 12 extending downward from the main body 11. The upper part of the main body 11 is a conical tapered portion 11a.
The suction nozzle 10 is detachably mounted on the mounting head 6 by inserting the mounting nozzle 6a into the mounting portion 6a provided on the mounting head 6.
【００１８】テーパ部１１ａの内部には吸引孔１１ｂが
形成されており、テーパ部１１ａを装着部６ａに装着し
た状態では、吸引孔１１ｂは装着部６ａを介して接続さ
れた真空吸引手段１４と連通する。吸引孔１１ｂは、吸
着部１２の内部に下端部まで貫通して設けられた吸着孔
１２ａと連通している。吸着ノズル１０を実装ヘッド６
に装着した状態で、真空吸引手段１４を駆動することに
より、吸着孔１２ａから真空吸引する。A suction hole 11b is formed inside the tapered portion 11a. When the tapered portion 11a is mounted on the mounting portion 6a, the suction hole 11b is connected to the vacuum suction means 14 connected via the mounting portion 6a. Communicate. The suction hole 11b communicates with a suction hole 12a provided to penetrate to the lower end inside the suction portion 12. Attach suction nozzle 10 to mounting head 6
By driving the vacuum suction means 14 in a state of being attached to the, vacuum suction is performed from the suction holes 12a.
【００１９】吸着部１２は下部がテーパ状に細径に絞ら
れた形状となっており、下端部は吸着孔１２ａが開孔し
電子部品と当接する当接開孔部１２ｂとなっている。当
接開孔部１２ｂを電子部品の上面に当接させた状態で真
空吸引手段１４を駆動することにより、電子部品は吸着
ノズル１０により吸着保持される。吸着部１２の上方に
設けられた円形の鍔部１３の下面は電子部品認識時に光
源より照射される照明光を反射する反射板となってお
り、吸着ノズル１０に保持された電子部品を反射光によ
り上方から照明する。The suction portion 12 has a lower portion tapered and narrowed to a small diameter, and a lower end portion is a contact opening portion 12b in which a suction hole 12a is opened and which contacts an electronic component. By driving the vacuum suction means 14 with the contact opening 12b in contact with the upper surface of the electronic component, the electronic component is sucked and held by the suction nozzle 10. The lower surface of the circular flange 13 provided above the suction unit 12 is a reflecting plate that reflects illumination light emitted from a light source when recognizing the electronic component. To illuminate from above.
【００２０】次に図３を参照して、吸着部１２の当接開
孔部１２ｂの詳細形状について説明する。図３（ａ）に
示すように、当接開孔部１２ｂに開孔した吸着孔１２ａ
の下端部は面取り加工（内テーパ加工）がなされてお
り、吸着部１２の下端面における開孔径を示す当接開孔
径ｄは、吸着対象のチップ型の電子部品Ｐの上面に形成
された樹脂膜Ｂのサイズｂよりも大きくなるように設定
されている。また、当接開孔部１２ｂの内側の端部Ｅの
角度αは、１２０度以上の角度の鈍角形状となってい
る。Next, referring to FIG. 3, the detailed shape of the contact opening 12b of the suction section 12 will be described. As shown in FIG. 3A, the suction hole 12a opened in the contact opening 12b.
Is chamfered (inner taper processing), and the contact opening diameter d indicating the opening diameter at the lower end surface of the suction portion 12 is determined by the resin formed on the upper surface of the chip-type electronic component P to be suctioned. The size is set to be larger than the size b of the film B. The angle α of the inner end E of the contact opening 12b is an obtuse angle of 120 ° or more.
【００２１】図３（ｂ）は、このような形状の当接開孔
部１２ｂを備えた吸着部１２を用いて、樹脂膜Ｂを備え
たチップ型の電子部品Ｐを吸着保持した状態を示してい
る。図３（ｂ）に示すように、吸着部１２を電子部品Ｐ
の上面に当接させた状態では、上述のように当接開孔径
ｄが樹脂膜Ｂのサイズｂよりも大きいことから、当接開
孔部１２ｂの内側の端部Ｅは樹脂膜Ｂに接触しない。し
たがって、樹脂膜Ｂが吸着孔１２ａの内部にはまり込む
形で吸着部１２に固着する不具合が発生せず、従来の吸
着ノズルを用いた場合に発生していた、真空吸着解除後
においても電子部品が吸着ノズルから離脱しない不具合
を防止することができ、確実な実装を行うことができ
る。FIG. 3B shows a state in which the chip-type electronic component P having the resin film B is sucked and held by using the sucking portion 12 having the contact opening portion 12b having such a shape. ing. As shown in FIG. 3B, the suction part 12 is connected to the electronic component P.
In the state of contact with the upper surface of the resin film B, since the contact opening diameter d is larger than the size b of the resin film B as described above, the inner end E of the contact opening 12b contacts the resin film B. do not do. Therefore, there is no problem that the resin film B is stuck to the suction portion 12 in such a manner that the resin film B is stuck in the suction hole 12a, and the electronic component can be generated even after the vacuum suction is released, which has occurred when the conventional suction nozzle is used. Can be prevented from being detached from the suction nozzle, and reliable mounting can be performed.
【００２２】なお、上記実施の形態では、吸着孔１２ａ
の下部を面取り加工（内テーパ加工）して上述の当接開
孔部形状を得ているが、Ｒ形状加工などこれ以外の加工
形状であってもよい。In the above embodiment, the suction holes 12a
Although the lower part of the above is chamfered (inner taper processing) to obtain the above-described contact opening shape, other processing shapes such as R-shape processing may be used.
【００２３】[0023]
【発明の効果】本発明によれば、吸着孔が開孔し電子部
品と当接する当接開孔部の形状を、電子部品吸着時にお
いて当接開孔部の内側の端面が前記チップ型の電子部品
の上面に形成された保護膜に接触しないような形状とし
たので、電子部品上面の樹脂膜が吸着孔の当接開孔部へ
はまり込むことによる不具合を防止することができる。According to the present invention, the shape of the contact opening portion in which the suction hole is opened and which comes into contact with the electronic component is changed so that the inner end face of the contact opening portion when the electronic component is sucked is the chip type. Since the shape is such that it does not come into contact with the protective film formed on the upper surface of the electronic component, it is possible to prevent a problem caused by the resin film on the upper surface of the electronic component getting stuck in the contact opening of the suction hole.
【図１】本発明の一実施の形態の電子部品実装装置の斜
視図FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.
【図２】本発明の一実施の形態の電子部品実装装置の実
装ヘッドの部分断面図FIG. 2 is a partial cross-sectional view of a mounting head of the electronic component mounting apparatus according to one embodiment of the present invention.
【図３】本発明の一実施の形態の電子部品の吸着ノズル
の部分断面図FIG. 3 is a partial cross-sectional view of a suction nozzle of the electronic component according to the embodiment of the present invention.
【図４】従来の吸着ノズルによるチップ型の電子部品の
真空吸着状態の説明図FIG. 4 is an explanatory view of a vacuum suction state of a chip-type electronic component by a conventional suction nozzle.
６ 実装ヘッド １０ 吸着ノズル １１ 本体部 １１ｂ 吸引孔 １２ 吸着部 １２ａ 吸着孔 １２ｂ 当接開孔部 Ｐ 電子部品 Ｂ 樹脂膜 6 Mounting head 10 Suction nozzle 11 Main body 11b Suction hole 12 Suction unit 12a Suction hole 12b Contact hole P Electronic component B Resin film
フロントページの続き (72)発明者 秀瀬 渡 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 姫野 素志 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 本多 義介 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 3C007 DS01 FS01 FT01 FU00 GS01 NS17 3F061 AA01 CA01 CB01 CC00 DA01 DB06 5E313 AA03 AA11 CC03 EE24 FF24 FF28 Continued on the front page (72) Inventor Wataru Hidese 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Inventor Yoshisuke Honda 1006 Kazuma, Kazuma, Osaka Pref.F-term (reference) in Matsushita Electric Industrial Co., Ltd.
Claims (4)
この実装ヘッドと連通した吸引孔から真空吸引すること
により下端部にチップ型の電子部品を真空吸着する電子
部品の吸着ノズルであって、前記実装ヘッドに装着され
前記吸引孔が設けられた本体部と、電子部品に当接して
この電子部品を吸着する吸着孔が設けられた吸着部とを
備え、前記吸着孔が開孔し電子部品と当接する当接開孔
部の当接開孔径は、前記チップ型の電子部品の上面に形
成された保護膜のサイズよりも大きいことを特徴とする
電子部品の吸着ノズル。1. A suction nozzle of an electronic component mounted on a mounting head of an electronic component mounting apparatus and vacuum-sucking a chip-type electronic component at a lower end portion by vacuum suction from a suction hole communicating with the mounting head. An electronic component comprising: a main body portion mounted on the mounting head and provided with the suction hole; and a suction portion provided with a suction hole for contacting the electronic component and sucking the electronic component, wherein the suction hole is opened. The diameter of the contact opening of the contact opening portion that is in contact with the chip-type electronic component is larger than the size of a protective film formed on the upper surface of the chip-type electronic component.
この実装ヘッドと連通した吸引孔から真空吸引すること
により下端部にチップ型の電子部品を真空吸着する電子
部品の吸着ノズルであって、前記実装ヘッドに装着され
前記吸引孔が設けられた本体部と、電子部品に当接して
この電子部品を吸着する吸着孔が設けられた吸着部とを
備え、前記吸着孔が開孔し電子部品と当接する当接開孔
部の内側の端部は１２０度以上の角度の鈍角形状となっ
ていることを特徴とする電子部品の吸着ノズル。2. A suction nozzle of an electronic component mounted on a mounting head of an electronic component mounting apparatus and vacuum-sucking a chip-type electronic component at a lower end by vacuum suction through a suction hole communicating with the mounting head. An electronic component comprising: a main body portion mounted on the mounting head and provided with the suction hole; and a suction portion provided with a suction hole for contacting the electronic component and sucking the electronic component, wherein the suction hole is opened. The inside end of the contact opening portion contacting with the contact hole has an obtuse angle of 120 degrees or more.
この実装ヘッドと連通した吸引孔から真空吸引すること
により下端部にチップ型の電子部品を真空吸着する電子
部品の吸着ノズルであって、前記実装ヘッドに装着され
前記吸引孔が設けられた本体部と、電子部品に当接して
この電子部品を吸着する吸着孔が設けられた吸着部とを
備え、前記吸着孔が開孔し電子部品と当接する当接開孔
部の形状は、電子部品吸着時において当接開孔部の内側
の端部が前記チップ型の電子部品の上面に形成された保
護膜に接触しないような形状となっていることを特徴と
する電子部品の吸着ノズル。3. A suction nozzle for an electronic component, which is mounted on a mounting head of an electronic component mounting apparatus and vacuum-suctions a chip-type electronic component at a lower end portion by vacuum suction through a suction hole communicating with the mounting head. An electronic component comprising: a main body portion mounted on the mounting head and provided with the suction hole; and a suction portion provided with a suction hole for contacting the electronic component and sucking the electronic component, wherein the suction hole is opened. The shape of the contact opening that comes into contact with the contact hole is such that the inner end of the contact opening does not contact the protective film formed on the upper surface of the chip-type electronic component when the electronic component is sucked. A suction nozzle for an electronic component.
して基板に実装する電子部品実装装置であって、前記電
子部品の上面に当接して真空吸着する吸着ノズルと、こ
の吸着ノズルが装着される実装ヘッドと、実装ヘッドを
電子部品の供給部と前記基板との間で移動させる移動手
段と、前記実装ヘッドを介して吸着ノズルから真空吸着
する真空吸引手段とを備え、前記吸着ノズルは、請求項
１乃至３のいずれかに記載の電子部品の吸着ノズルであ
ることを特徴とする電子部品実装装置。4. An electronic component mounting apparatus for mounting a chip-type electronic component on a substrate while holding the electronic component by vacuum suction, wherein the suction nozzle abuts on the upper surface of the electronic component and performs vacuum suction, and the suction nozzle is mounted. Mounting head, a moving means for moving the mounting head between the supply part of the electronic component and the substrate, and a vacuum suction means for vacuum suction from the suction nozzle via the mounting head, the suction nozzle An electronic component mounting apparatus comprising the suction nozzle for an electronic component according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000314869A JP3674494B2 (en) | 2000-10-16 | 2000-10-16 | Electronic component suction nozzle and electronic component mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000314869A JP3674494B2 (en) | 2000-10-16 | 2000-10-16 | Electronic component suction nozzle and electronic component mounting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002120185A true JP2002120185A (en) | 2002-04-23 |
| JP3674494B2 JP3674494B2 (en) | 2005-07-20 |
Family
ID=18794059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000314869A Expired - Fee Related JP3674494B2 (en) | 2000-10-16 | 2000-10-16 | Electronic component suction nozzle and electronic component mounting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3674494B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101075678B1 (en) | 2003-05-23 | 2011-10-21 | 가부시끼가이샤 히다찌 하이테크 인스트루먼츠 | Method for mounting electronic component |
-
2000
- 2000-10-16 JP JP2000314869A patent/JP3674494B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101075678B1 (en) | 2003-05-23 | 2011-10-21 | 가부시끼가이샤 히다찌 하이테크 인스트루먼츠 | Method for mounting electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3674494B2 (en) | 2005-07-20 |
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