JP3702651B2 - Electronic component mounting nozzle and electronic component mounting apparatus - Google Patents

Electronic component mounting nozzle and electronic component mounting apparatus Download PDF

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Publication number
JP3702651B2
JP3702651B2 JP15097598A JP15097598A JP3702651B2 JP 3702651 B2 JP3702651 B2 JP 3702651B2 JP 15097598 A JP15097598 A JP 15097598A JP 15097598 A JP15097598 A JP 15097598A JP 3702651 B2 JP3702651 B2 JP 3702651B2
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Japan
Prior art keywords
workpiece
nozzle
opening
electronic component
component mounting
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JP15097598A
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JPH11346092A (en
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智昭 中西
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Description

【０００１】
【発明の属する技術分野】
本発明は、開口部を有するワークをプリント基板などに実装するための電子部品実装用ノズルおよび電子部品実装装置に関するものである。
【０００２】
【従来の技術】
電子部品実装装置は、移載ヘッドのノズルでワークを真空吸着し、プリント基板などに実装するものである。ワークは一般にＩＣチップ、抵抗チップ、コンデンサチップなどであり、これらのワークの形状は箱形である。したがってこれらのワークを真空吸着するノズルとしては、単純なパイプ状のフラットノズルやワークの角部に当接するテーパ状内面を有するコレットノズルが用いられる。ワークとしては、上記ＩＣチップ、抵抗チップ、コンデンサチップ以外にも異形のワークがプリント基板などに実装される。
【０００３】
図１１は従来のワークとノズルの斜視図、図１２は同断面図である。このワーク１は枠形の異形のワークであり、プリント基板に実装されたチップを包囲するようにプリント基板に実装される。ノズル２は下端部に４角形のブロック３を有しており、ブロック３に吸着孔４が穿孔されている。このノズル２は吸着孔４でワーク１の上面を真空吸着し、プリント基板に実装する。
【０００４】
【発明が解決しようとする課題】
しかしながら上記従来のノズルは、ワークを真空吸着した状態でワークはノズルに対して水平方向に位置ずれしやすく、このためワークの実装位置精度があがらないという問題点があった。図１２において、鎖線で示すワーク１は矢印方向へ位置ずれしたものを示している。
【０００５】
したがって本発明は、図１１に示すような開口部を有する異形のワークを位置精度よくプリント基板などの実装対象物に実装できる電子部品実装用ノズルおよび電子部品実装装置を提供することを目的とする。
【０００６】
【課題を解決するための手段】
本発明は、開口部を有するワークを真空吸着する電子部品実装用ノズルであって、ブロックと、このブロックから下方へ突出して前記開口部に嵌入しかつ前記開口部の内縁部に当接するテーパ状の側面を有する突部と、前記ブロックに穿孔されて前記ワークの壁部の上面を真空吸着する吸着孔とを有し、且つ前記突部が前記開口部に嵌入して前記テーパ状の側面が前記内縁部に当接した状態で、前記ブロックの下面と前記壁部の上面の間にギャップが確保され、また前記突部のつけ根に溝を形成したことを特徴とする電子部品実装用ノズルである。
【０００８】
また本発明は、移載ヘッドのノズルで開口部を有するワークを真空吸着してピックアップし、基板に移送搭載するようにした電子部品実装装置であって、前記ノズルがブロックと、このブロックから下方へ突出して前記開口部に嵌入しかつ前記開口部の内縁部に当接するテーパ状の側面を有する突部と、前記ブロックに穿孔されて前記ワークの壁部の上面を真空吸着する吸着孔とを有し、且つ前記突部が前記開口部に嵌入して前記テーパ状の側面が前記内縁部に当接した状態で、前記ブロックの下面と前記壁部の上面の間にギャップが確保され、また前記突部のつけ根に溝を形成したことを特徴とする電子部品実装装置である。
【００１０】
上記構成において、ブロックから下方へ突出する突部をワークの開口部に嵌入させ、そのテーパ状の側面を開口部の内縁部に当接させることにより、ワークの真空吸着位置を位置決めする。したがって真空吸着されたワークが位置ずれすることはなく、位置精度よくプリント基板などに実装できる。
【００１１】
【発明の実施の形態】
（実施の形態１）
図１は本発明の実施の形態１の電子部品実装装置の斜視図、図２は同光通信ユニットの分解斜視図、図３は同ノズルの上下反転斜視図、図４は同ワークを実装中のノズルとワークの断面図である。
【００１２】
まず図１を参照して電子部品実装装置の全体構造を説明する。図１において、１０はリードフレーム３０の搬送路であり、その上方には第１の移載ヘッド１１、第２の移載ヘッド１２、ボンド塗布ヘッド１３が配設されている。第１の移載ヘッド１１、第２の移載ヘッド１２、ボンド塗布ヘッド１３は同一の可動テーブル１４に装着されており、図外の駆動手段に駆動されて搬送路１０と直交する方向へ同時に往復移動する。
【００１３】
第１の移載ヘッド１１はワーク供給部２０のトレイ２１に備えられたワーク４０（図２）をノズル１５の下端部で真空吸着してピックアップし、位置ずれ補正テーブル２２上に移載する。位置ずれ補正テーブル２２上に移載されたワーク４０には位置ずれ補正爪２３が押し当てられ、ワーク４０の位置ずれが補正される。第２の移載ヘッド１２はノズル５０の下端部で位置ずれ補正テーブル２２上のワーク４０を真空吸着してピックアップし、リードフレーム３０上に搭載されたパッケージ３２上に移載する。ボンド塗布ヘッド１３は、ノズル２４からボンド４６を吐出し、パッケージ３２に塗布する（図４）。ワーク４０は第２の移載ヘッド１２によりこのボンド４６上に搭載されてパッケージ３２に接着される。なおボンド塗布ヘッドとしては、転写ピン方式などの他の型式のものも用いられる。
【００１４】
図１において、２５はＸテーブル、２６はＹテーブルであり、搬送路１０をＸ方向やＹ方向へ移動させてその位置を調整する。２７は第１のカメラであり、トレイ２１に収納されたワーク４０を認識する。２８は第２のカメラであり、リードフレーム３０上のパッケージ３２やパッケージ３２上に搭載されたワーク４０を認識する。２９はリードフレーム３０が収納されたマガジンであり、リードフレーム３０は１枚づつマガジン２９から搬送路１０へ送り出される。
【００１５】
図２は光通信ユニットを組み立てるための素子を示している。リードフレーム３０のリード３１上にパッケージ３２が搭載されている。パッケージ３２は４角の枠形であり、その内部にレーザダイオード３３とミラー３４が実装されている。マガジン２９に収納されたリードフレーム３０には、前工程においてパッケージ３２、レーザダイオード３３、ミラー３４が予め実装されている。
【００１６】
図２において、ワーク４０は台部４１の一側部に壁部４２を突設して成り、壁部４２の中央に４角形の開口部４３を開口している。４４はレンズユニットであり、レンズ４５を有している。ワーク４０はパッケージ３２上に搭載される。またレンズユニット４４は、後工程でワーク４０上に搭載される。パッケージ３２上にワーク４０とレンズユニット４４を実装した後、リード３１は切断され、光通信ユニットは完成する。
【００１７】
次にノズル５０の構造を説明する。図３はノズル５０を上下反転して示すものであって、その下端部には角形のブロック５１が形成されている。ブロック５１の中央には角錐形の突部５２が突設されている。突部５２の側面５３は先細状のテーパ状となっている。また突部５２の両側部のつば部５４には吸着孔５５が穿孔されている（図４も参照）。突部５２のつけ根には細い溝５６が形成されている。溝５６の効用については、実施の形態４で説明する。図４に示すように、突部５２はワーク４０の開口部４３に嵌入し、テーパ状の側面５３が開口部４３の内縁部に当接し、吸着孔５５で壁部４２の上面を真空吸着する。このように突部５２を開口部４３に嵌入させてワーク４０を真空吸着することにより、真空吸着状態のワーク４０が水平方向へ位置ずれするのを防止する。またこの状態で、つば部５４と壁部４２の間にはギャップＧが確保される。このようにギャップＧを確保することにより、開口部４３に寸法誤差があっても、テーパ状の側面を開口部４３の内縁部に確実に当接させてワーク４０をしっかり真空吸着し、パッケージ３２上に位置ずれなく正確に搭載することができる。
【００１８】
（実施の形態２）
図５は本発明の実施の形態２のノズルの上下反転斜視図、図６は同プリント基板の斜視図である。
【００１９】
図５において、ノズル６０の下端部にはブロック６１が形成されている。ブロック６１の中央部には角錐形の突部６２が突設されている。突部６２の側面６３はテーパ状である。また突部６２の周囲には吸着孔６４が穿孔されている。好ましくは、実施の形態１と同様に、突部６２のつけ根に細い溝を形成する。
【００２０】
図６において、プリント基板７０上には枠形のワーク７１が搭載されており、その開口部７２には第１のチップ７３が実装されている。またワーク７１の近傍には第２のチップ７４が実装されている。７５はボンド塗布ヘッドのノズルであり、ワーク７１の内部にボンド７６を吐出し、第１のチップ７３をボンド７６で封止する。
【００２１】
ワーク７１の近傍には第２のチップ７４が実装されるので、ワーク７１は位置精度よくプリント基板７０に実装せねばならない。何故ならば、ワーク７１の位置精度が悪いと第２のチップ７４に当るからである。そこでこのワーク７１は、図４に示す実施の形態１と同様に、ノズル６０の突部６２をワーク７１の開口部７２に嵌入させ、そのテーパ状の側面６３を開口部７２の内縁部に当接させ、ワーク７１の位置ずれを防止しながらプリント基板７０に実装する。
【００２２】
（実施の形態３）
図７は本発明の実施の形態３のノズルの上下反転斜視図、図８は同ワークの斜視図、図９は同ワークを実装中のノズルとワークの断面図である。
【００２３】
図７において、ノズル８０の下端部には円板形のブロック８１が形成されており、ブロック８１の中央には円錐形の突部８２が突設されている。８３はテーパ状の側面である。またブロック８１には吸着孔８４が突部８２を取り囲むようにサークル状に穿孔されている。また好ましくは、実施の形態１と同様に、突部８２のつけ根に細い溝を形成する。
【００２４】
図８において、ワーク９０はリング状であり、開口部９１を有している。またその内縁部はテーパ状に面取りされた光反射面９２になっている。図９に示すように突部８２を開口部９１に嵌入させ、テーパ状の側面８３をワーク９０のテーパ状の内縁部９２に当接させ、ワーク９０を位置精度よくプリント基板９３に実装する。なお後工程で、ワーク９０の内部のプリント基板９３上にレーザダイオードが実装される。レーザダイオードから側方へ照射されたレーザ光は光反射面９２で上方へ反射される。すなわちこのワーク９０は、光通信ユニットの要素となるものである。
【００２５】
（実施の形態４）
図１０は本発明の実施の形態４のワークを実装中のノズルとワークの断面図である。ノズル５０の突部５２のつけ根に溝５６が形成されていない点において図４と相違しており、これ以外の他の構造は図４と同じである。突部５２のつけ根は、溝５６を形成していないことにより、わずかにアール状の曲面５７になっている。
【００２６】
ワーク４０の開口部４３のエッジＥはこの曲面５７に当接してノズル５０に真空吸着されるので、図４の場合よりも真空吸着状態におけるワーク４０の位置が微妙に狂いやすいという難点がある。これに対し、図４の例では、溝５６を形成してアール状の曲面５７が生じないようにすることにより、エッジＥをテーパ面５３に当接させてワーク４０を正しい位置に真空吸着することができる。
【００２７】
上記各実施の形態から明らかなように、ノズルの形状、特に突部の形状や吸着孔の配列は、真空吸着の対象となるワークの形状に応じて設計変更される。なお実施の形態２〜４のノズルも、図１の電子部品実装装置に適用される。
【００２８】
【発明の効果】
以上説明したように本発明は、ブロックから下方へ突出する突部をワークの開口部に嵌入させ、そのテーパ状の側面を開口部の内縁部に当接させることにより、ワークの真空吸着位置を位置決めするので、真空吸着されたワークが水平方向に位置ずれすることはなく、位置精度よくプリント基板などに実装できる。
【図面の簡単な説明】
【図１】本発明の実施の形態１の電子部品実装装置の斜視図
【図２】本発明の実施の形態１の光通信ユニットの分解斜視図
【図３】本発明の実施の形態１のノズルの上下反転斜視図
【図４】本発明の実施の形態１のワークを実装中のノズルとワークの断面図
【図５】本発明の実施の形態２のノズルの上下反転斜視図
【図６】本発明の実施の形態２のプリント基板の斜視図
【図７】本発明の実施の形態３のノズルの上下反転斜視図
【図８】本発明の実施の形態３のワークの斜視図
【図９】本発明の実施の形態３のワークを実装中のノズルとワークの断面図
【図１０】本発明の実施の形態４のワークを実装中のノズルとワークの断面図
【図１１】従来のワークとノズルの斜視図
【図１２】従来のワークとノズルの断面図
【符号の説明】
４０，７１，９０ ワーク
４３，７３，９１ 開口部
５０，６０，８０ ノズル
５１，６１，８１ ブロック
５２，６２，８２ 突部
５３，６３，８３ テーパ状の側面
５５，６４，８４ 吸着孔
５６ 溝[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting nozzle and an electronic component mounting apparatus for mounting a workpiece having an opening on a printed circuit board or the like.
[0002]
[Prior art]
The electronic component mounting apparatus vacuum mounts a work with a nozzle of a transfer head and mounts the work on a printed circuit board or the like. The workpiece is generally an IC chip, a resistor chip, a capacitor chip or the like, and the shape of these workpieces is a box shape. Therefore, a simple pipe-shaped flat nozzle or a collet nozzle having a tapered inner surface that comes into contact with a corner of the workpiece is used as a nozzle for vacuum-sucking these workpieces. In addition to the IC chip, resistor chip, and capacitor chip, an irregularly shaped work is mounted on a printed circuit board or the like as the work.
[0003]
FIG. 11 is a perspective view of a conventional workpiece and nozzle, and FIG. 12 is a cross-sectional view thereof. The workpiece 1 is a frame-shaped irregular workpiece, and is mounted on the printed circuit board so as to surround a chip mounted on the printed circuit board. The nozzle 2 has a quadrangular block 3 at the lower end, and a suction hole 4 is drilled in the block 3. The nozzle 2 vacuum-sucks the upper surface of the work 1 through the suction hole 4 and mounts it on the printed board.
[0004]
[Problems to be solved by the invention]
However, the conventional nozzle has a problem in that the workpiece is easily displaced in the horizontal direction with respect to the nozzle in a state where the workpiece is vacuum-sucked, and thus the accuracy of the mounting position of the workpiece is not improved. In FIG. 12, a work 1 indicated by a chain line shows a position shifted in the arrow direction.
[0005]
Therefore, an object of the present invention is to provide an electronic component mounting nozzle and an electronic component mounting apparatus capable of mounting an irregularly shaped workpiece having an opening as shown in FIG. 11 on a mounting object such as a printed circuit board with high positional accuracy. .
[0006]
[Means for Solving the Problems]
The present invention is a nozzle for mounting an electronic component that vacuum-sucks a workpiece having an opening, and has a taper shape that protrudes downward from the block, fits into the opening, and contacts an inner edge of the opening and the projection having a side surface, are drilled in the block have a a suction hole for vacuum chucking an upper surface of the wall portion of the workpiece, it is and said projections said tapered sides and fitted to the opening An electronic component mounting nozzle characterized in that a gap is secured between the lower surface of the block and the upper surface of the wall portion in contact with the inner edge portion, and a groove is formed at the base of the protrusion. is there.
[0008]
The present invention also relates to an electronic component mounting apparatus in which a workpiece having an opening is vacuum picked up by a nozzle of a transfer head and picked up and transferred and mounted on a substrate. A protrusion having a tapered side surface that protrudes into the opening and abuts against the inner edge of the opening, and a suction hole that is drilled in the block and vacuum-sucks the upper surface of the wall of the workpiece. Yes and, and in a state in which the projections are the tapered sides are fitted into the opening in contact with the inner edge, the gap is ensured between the upper surface of the lower surface and the wall portion of the block and In the electronic component mounting apparatus, a groove is formed at a base of the protrusion .
[0010]
In the above configuration, the vacuum projecting position of the workpiece is positioned by fitting a protrusion projecting downward from the block into the opening of the workpiece and bringing the tapered side surface into contact with the inner edge of the opening. Therefore, the workpiece that has been vacuum-sucked is not displaced and can be mounted on a printed circuit board or the like with high positional accuracy.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of the optical communication unit, FIG. 3 is a vertically inverted perspective view of the nozzle, and FIG. 4 is mounting the workpiece. It is sectional drawing of a nozzle and a workpiece | work.
[0012]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, reference numeral 10 denotes a conveyance path for the lead frame 30, and a first transfer head 11, a second transfer head 12, and a bond application head 13 are disposed above the transfer path. The first transfer head 11, the second transfer head 12, and the bond coating head 13 are mounted on the same movable table 14, and are simultaneously driven in a direction orthogonal to the conveyance path 10 by being driven by a driving means (not shown). Move back and forth.
[0013]
The first transfer head 11 picks up the workpiece 40 (FIG. 2) provided on the tray 21 of the workpiece supply unit 20 by vacuum suction at the lower end of the nozzle 15 and transfers the workpiece 40 onto the misalignment correction table 22. The position deviation correction claw 23 is pressed against the workpiece 40 transferred on the position deviation correction table 22, and the position deviation of the workpiece 40 is corrected. The second transfer head 12 vacuum-sucks and picks up the work 40 on the misregistration correction table 22 at the lower end of the nozzle 50 and transfers it onto the package 32 mounted on the lead frame 30. The bond application head 13 discharges the bond 46 from the nozzle 24 and applies it to the package 32 (FIG. 4). The workpiece 40 is mounted on the bond 46 by the second transfer head 12 and adhered to the package 32. As the bond application head, other types such as a transfer pin method may be used.
[0014]
In FIG. 1, reference numeral 25 denotes an X table, and 26 denotes a Y table. The position of the transport path 10 is adjusted by moving it in the X direction or the Y direction. Reference numeral 27 denotes a first camera that recognizes the workpiece 40 stored in the tray 21. Reference numeral 28 denotes a second camera that recognizes the package 32 on the lead frame 30 and the workpiece 40 mounted on the package 32. Reference numeral 29 denotes a magazine in which the lead frames 30 are stored, and the lead frames 30 are sent one by one from the magazine 29 to the transport path 10.
[0015]
FIG. 2 shows elements for assembling the optical communication unit. A package 32 is mounted on the lead 31 of the lead frame 30. The package 32 has a quadrangular frame shape, and a laser diode 33 and a mirror 34 are mounted therein. The lead frame 30 housed in the magazine 29 is pre-mounted with a package 32, a laser diode 33, and a mirror 34 in the previous process.
[0016]
In FIG. 2, a workpiece 40 is formed by projecting a wall 42 on one side of a base 41, and a square opening 43 is opened at the center of the wall 42. A lens unit 44 has a lens 45. The workpiece 40 is mounted on the package 32. The lens unit 44 is mounted on the workpiece 40 in a later process. After the workpiece 40 and the lens unit 44 are mounted on the package 32, the lead 31 is cut to complete the optical communication unit.
[0017]
Next, the structure of the nozzle 50 will be described. FIG. 3 shows the nozzle 50 upside down, and a rectangular block 51 is formed at the lower end thereof. A pyramidal protrusion 52 is provided at the center of the block 51. The side surface 53 of the protrusion 52 has a tapered shape. Further, suction holes 55 are formed in the flange portions 54 on both sides of the protrusion 52 (see also FIG. 4). A thin groove 56 is formed at the base of the protrusion 52. The effect of the groove 56 will be described in the fourth embodiment. As shown in FIG. 4, the protrusion 52 is fitted into the opening 43 of the workpiece 40, the tapered side surface 53 comes into contact with the inner edge of the opening 43, and the upper surface of the wall 42 is vacuum-sucked by the suction hole 55. . In this way, the protrusions 52 are fitted into the openings 43 and the workpiece 40 is vacuum-sucked, thereby preventing the workpiece 40 in the vacuum suction state from being displaced in the horizontal direction. In this state, a gap G is secured between the flange portion 54 and the wall portion 42. By ensuring the gap G in this manner, even if there is a dimensional error in the opening 43, the taper side surface is securely brought into contact with the inner edge of the opening 43, and the workpiece 40 is firmly vacuum-sucked, and the package 32 is obtained. It can be mounted accurately with no displacement.
[0018]
(Embodiment 2)
FIG. 5 is a vertically inverted perspective view of a nozzle according to Embodiment 2 of the present invention, and FIG. 6 is a perspective view of the printed circuit board.
[0019]
In FIG. 5, a block 61 is formed at the lower end of the nozzle 60. A pyramidal projection 62 projects from the center of the block 61. The side surface 63 of the protrusion 62 is tapered. An adsorption hole 64 is formed around the protrusion 62. Preferably, a narrow groove is formed at the base of the protrusion 62 as in the first embodiment.
[0020]
In FIG. 6, a frame-shaped work 71 is mounted on a printed circuit board 70, and a first chip 73 is mounted in the opening 72. A second chip 74 is mounted in the vicinity of the work 71. Reference numeral 75 denotes a nozzle of a bond application head, which discharges a bond 76 into the work 71 and seals the first chip 73 with the bond 76.
[0021]
Since the second chip 74 is mounted in the vicinity of the work 71, the work 71 must be mounted on the printed circuit board 70 with high positional accuracy. This is because if the position accuracy of the work 71 is poor, it hits the second chip 74. Therefore, as in the first embodiment shown in FIG. 4, the workpiece 71 is configured such that the protrusion 62 of the nozzle 60 is fitted into the opening 72 of the workpiece 71 and the tapered side surface 63 is abutted against the inner edge of the opening 72. The workpiece 71 is mounted on the printed circuit board 70 while preventing the work 71 from being displaced.
[0022]
(Embodiment 3)
7 is a vertically inverted perspective view of the nozzle according to the third embodiment of the present invention, FIG. 8 is a perspective view of the workpiece, and FIG. 9 is a sectional view of the nozzle and the workpiece mounting the workpiece.
[0023]
In FIG. 7, a disk-shaped block 81 is formed at the lower end portion of the nozzle 80, and a conical protrusion 82 projects from the center of the block 81. Reference numeral 83 denotes a tapered side surface. The block 81 is formed with a suction hole 84 in a circle shape so as to surround the protrusion 82. Preferably, a narrow groove is formed at the base of the protrusion 82 as in the first embodiment.
[0024]
In FIG. 8, the workpiece 90 has a ring shape and has an opening 91. The inner edge portion is a light reflecting surface 92 that is chamfered in a tapered shape. As shown in FIG. 9, the protrusion 82 is fitted into the opening 91, the tapered side 83 is brought into contact with the tapered inner edge 92 of the workpiece 90, and the workpiece 90 is mounted on the printed board 93 with high positional accuracy. In a later process, a laser diode is mounted on the printed circuit board 93 inside the work 90. The laser light irradiated sideways from the laser diode is reflected upward by the light reflecting surface 92. That is, the work 90 is an element of the optical communication unit.
[0025]
(Embodiment 4)
FIG. 10 is a cross-sectional view of the nozzle and the workpiece mounting the workpiece according to the fourth embodiment of the present invention. 4 is different from FIG. 4 in that the groove 56 is not formed at the base of the protrusion 52 of the nozzle 50, and other structures are the same as those in FIG. The root of the protrusion 52 has a slightly rounded curved surface 57 because the groove 56 is not formed.
[0026]
Since the edge E of the opening 43 of the work 40 abuts on the curved surface 57 and is vacuum-sucked by the nozzle 50, there is a problem that the position of the work 40 in the vacuum-sucking state tends to be slightly deviated compared to the case of FIG. On the other hand, in the example of FIG. 4, the groove 56 is formed so that the rounded curved surface 57 is not generated, so that the edge E is brought into contact with the tapered surface 53 and the workpiece 40 is vacuum-sucked at a correct position. be able to.
[0027]
As is apparent from the above embodiments, the shape of the nozzle, particularly the shape of the protrusion and the arrangement of the suction holes, are changed in design according to the shape of the workpiece to be vacuum suctioned. The nozzles of the second to fourth embodiments are also applied to the electronic component mounting apparatus of FIG.
[0028]
【The invention's effect】
As described above, according to the present invention, the protrusion that protrudes downward from the block is fitted into the opening of the workpiece, and the taper side surface is brought into contact with the inner edge of the opening to thereby adjust the vacuum suction position of the workpiece. Since the positioning is performed, the workpiece sucked by vacuum is not displaced in the horizontal direction and can be mounted on a printed circuit board or the like with high positional accuracy.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to Embodiment 1 of the present invention. FIG. 2 is an exploded perspective view of an optical communication unit according to Embodiment 1 of the present invention. FIG. 4 is a cross-sectional view of the nozzle and the workpiece during mounting of the workpiece according to the first embodiment of the present invention. FIG. 5 is a vertical reverse perspective view of the nozzle according to the second embodiment of the present invention. FIG. 7 is a perspective view of the printed circuit board according to the second embodiment of the present invention. FIG. 7 is a perspective view of the nozzle according to the third embodiment of the present invention. FIG. 8 is a perspective view of the workpiece according to the third embodiment of the present invention. 9 is a cross-sectional view of a nozzle and a workpiece mounting a workpiece according to a third embodiment of the present invention. FIG. 10 is a cross-sectional view of a nozzle and a workpiece while mounting a workpiece according to a fourth embodiment of the present invention. Perspective view of workpiece and nozzle [Fig. 12] Cross-sectional view of conventional workpiece and nozzle [Explanation of symbols]
40, 71, 90 Work piece 43, 73, 91 Opening part 50, 60, 80 Nozzle 51, 61, 81 Block 52, 62, 82 Projection part 53, 63, 83 Tapered side face 55, 64, 84 Adsorption hole 56 Groove

Claims (2)

開口部を有するワークを真空吸着する電子部品実装用ノズルであって、ブロックと、このブロックから下方へ突出して前記開口部に嵌入しかつ前記開口部の内縁部に当接するテーパ状の側面を有する突部と、前記ブロックに穿孔されて前記ワークの壁部の上面を真空吸着する吸着孔とを有し、且つ前記突部が前記開口部に嵌入して前記テーパ状の側面が前記内縁部に当接した状態で、前記ブロックの下面と前記壁部の上面の間にギャップが確保され、また前記突部のつけ根に溝を形成したことを特徴とする電子部品実装用ノズル。An electronic component mounting nozzle that vacuum-sucks a workpiece having an opening, and has a block and a tapered side surface that protrudes downward from the block and fits into the opening and contacts the inner edge of the opening projections and the upper surface of the wall portion of the workpiece is drilled in the block have a a suction hole for vacuum suction, and the projections on the side surface the inner edge of the tapered and fitted to the opening An electronic component mounting nozzle , wherein a gap is secured between the lower surface of the block and the upper surface of the wall portion in contact with each other, and a groove is formed at the base of the protrusion . 移載ヘッドのノズルで開口部を有するワークを真空吸着してピックアップし、基板に移送搭載するようにした電子部品実装装置であって、前記ノズルがブロックと、このブロックから下方へ突出して前記開口部に嵌入しかつ前記開口部の内縁部に当接するテーパ状の側面を有する突部と、前記ブロックに穿孔されて前記ワークの壁部の上面を真空吸着する吸着孔とを有し、且つ前記突部が前記開口部に嵌入して前記テーパ状の側面が前記内縁部に当接した状態で、前記ブロックの下面と前記壁部の上面の間にギャップが確保され、また前記突部のつけ根に溝を形成したことを特徴とする電子部品実装装置。An electronic component mounting apparatus in which a workpiece having an opening is vacuum picked up by a nozzle of a transfer head and picked up and mounted on a substrate, wherein the nozzle protrudes downward from the block and the opening and the projection having a fitting to and in contact with the tapered side surface inner edge of the opening in the part, the upper surface of the wall portion of the workpiece is drilled in the block have a a suction hole for vacuum suction, and the A gap is secured between the lower surface of the block and the upper surface of the wall portion in a state where the protruding portion is fitted into the opening and the tapered side surface is in contact with the inner edge portion, and the root of the protruding portion is also provided. An electronic component mounting apparatus, characterized in that a groove is formed on the surface.
JP15097598A 1998-06-01 1998-06-01 Electronic component mounting nozzle and electronic component mounting apparatus Expired - Fee Related JP3702651B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15097598A JP3702651B2 (en) 1998-06-01 1998-06-01 Electronic component mounting nozzle and electronic component mounting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15097598A JP3702651B2 (en) 1998-06-01 1998-06-01 Electronic component mounting nozzle and electronic component mounting apparatus

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JP3702651B2 true JP3702651B2 (en) 2005-10-05

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Publication number Priority date Publication date Assignee Title
JP5895128B2 (en) * 2012-04-02 2016-03-30 パナソニックＩｐマネジメント株式会社 Suction tool and component mounting device
JP5895127B2 (en) * 2012-04-02 2016-03-30 パナソニックＩｐマネジメント株式会社 Suction tool and component mounting device

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