JP3003300B2 - Semiconductor package transfer method and semiconductor package with rotation preventing function - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the transport of semiconductor packages.
Method and semiconductor package with anti-rotation function, especially
The present invention relates to a method of transporting a semiconductor package in which rotation has been prevented and a semiconductor package with a rotation prevention function for an automatic semiconductor package mounting machine.

[0002]

2. Description of the Related Art As shown in FIG. 10, a conventional semiconductor package has a flat surface structure. Even in the case of a semiconductor package for a semiconductor package automatic mounting machine, no special measures are taken. The surface of the package had a flat structure as before.

[0003]

This conventional semiconductor package has a flat surface, and the suction portion at the tip of the arm of a semiconductor package mounting robot that mounts the semiconductor package on a printed board is suctioned on the flat surface. Then, the semiconductor package on the tray was sucked up and carried to a predetermined position on the printed board.

[0004] However, there are large semiconductor packages exceeding a weight of 10 g or more. Further, if the arm is swung in order to increase the transport speed of the mounting robot, the weight, swing speed, suction capacity, and the like are increased. There is a problem that the semiconductor package fixed by suction due to the deviation of the position is shifted from the fixed position by the inertia of the swing.

It is an object of the present invention to provide a semiconductor package having a rotation preventing function which does not cause displacement when the semiconductor package is mounted on a printed board by a semiconductor package mounting robot.

[0006]

The feature of the present invention is that four corners are formed.
First and second packages having a square planar shape
And a concave portion having a quadrangular planar shape is disposed on the surface near the corner of the semiconductor package, and a rotation preventing claw is inserted into these concave portions to transport the package.

[0007] Alternatively, a feature of the present invention is a flat panel having four corners.
Near the first and second corners of a rectangular package .
It mutually recess geometry is different on the surface beside
And a semiconductor package carrying method in which the rotation preventing claws are inserted into these recesses to carry the package.

Another feature of the present invention is a planar shape having four corners.
On the surface in the vicinity of at least one corner of the package having a rectangular shape, a convex portion in which a pair of rectangular parallelepipeds is arranged facing each other is arranged .
In addition, no convex portion is formed on the surface of the central portion of the package.
In the semiconductor package with a rotation preventing function, which is a flat surface .

Alternatively, another feature of the invention is that it has four corners.
First and second corners of a package having a square planar shape
A convex part having a different geometric shape is
And the surface of the central part of the package is convex.
In the semiconductor package having a rotation preventing function, which has a flat surface without a portion formed .

[0010] Alternatively, another feature of the present invention is that it has four corners.
Near a first corner of a package having a square planar shape.
Arrange a concave part with a square planar shape on the surface, and
A convex portion formed by arranging a pair of rectangular parallelepipeds facing each other is disposed on a surface in the vicinity , and the surface of the central portion of the package is a convex
And a semiconductor package having a rotation preventing function which has a flat surface without a concave portion .

Another feature of the invention is that it has four corners.
Each of the corners of a package having a square planar shape.
From provided a projection which projects outwardly, is at least one anti-rotation features a semiconductor package with a plane shape projections are arranged rectangular recess of said protrusion.

[0012]

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a perspective view of a first embodiment of the present invention and a partially enlarged perspective view of a portion A. FIG.

In the first embodiment, as shown in FIGS. 1A and 1B, a plurality of rectangular parallelepiped geometric shapes are formed on the surface of a semiconductor package 1 having a rotation preventing function (hereinafter referred to as a semiconductor package). The recess 3 is arranged, and the terminal 2 is led out therearound.

FIG. 2 is a schematic diagram showing an example of a package mounting robot.

As shown in FIG. 2, a semiconductor package mounting robot 4 attaches a suction-preventing function shown in FIGS. 1 (a) and 1 (b) to a suction portion 7 provided with a rotation preventing claw at the tip of an arm 5. While sucking the package 1, the semiconductor package 1 is transported to the semiconductor package mounting position 10 of the printed board 9 on the table 8.

FIG. 3 is an enlarged perspective view of the suction portion of FIG.

As shown in FIG. 3, the anti-rotation claw 18 is attached at two places to the side wall of the adsorber 17, and the semiconductor package 1 having a plurality of anti-rotation recesses 3 at its tip. Is sucked, and the claws 18 are inserted into two of the recesses 3, whereby the semiconductor package 1 is
Can be kept completely fixed with respect to the inertial force of rotation.

FIGS. 4 (a) and 4 (b) are a perspective view of a second embodiment of the present invention and a partially enlarged perspective view of a portion B.

In the second embodiment, as shown in FIGS. 4 (a) and 4 (b), a plurality of concave portions 3 and 13 each having a different geometric shape such as a rectangle and a circle are arranged. By inserting the shape of the third claw 18 according to the shape of the concave portion,
The same effect as that of the embodiment can be obtained.

FIGS. 5A and 5B are a perspective view of a third embodiment of the present invention and a partially enlarged perspective view of a portion C.

In the third embodiment, as shown in FIGS. 5A and 5B, a combination of a rectangular parallelepiped recess and a columnar recess is used.
In the example in which the plurality of concave portions 23 are formed, by giving the directionality, even if only one concave portion 23 is formed, if the claw 18 in FIG. By inserting the claws 18 inserted into the concave portions 23, the semiconductor package 21 can be transported without wrong orientation.

FIGS. 6A and 6B are a perspective view of a fourth embodiment of the present invention and a partially enlarged perspective view of a portion D.

In the fourth embodiment, as shown in FIGS. 6A and 6B, a pair of rectangular parallelepipeds are arranged on the surface of a semiconductor package 31 so as to face each other, and a plurality of projections 33 having the same shape are formed. This is an example of forming. In this embodiment, the same effects as in the third embodiment can be obtained even when the number of the protrusions 33 is one.

FIGS. 7A and 7B are a perspective view of a fifth embodiment of the present invention and a partially enlarged perspective view of a portion E.

In the fifth embodiment, as shown in FIGS. 7A and 7B, each of the projection 33 having the shape of the fourth embodiment and the projection 43 having the cylindrical shape shown in FIG. This is an example in which two convex portions 33 and 43 having different shapes are arranged on a semiconductor package 41.

FIGS. 8 (a), 8 (b) and 8 (c) are a perspective view of a sixth embodiment of the present invention and a partially enlarged perspective view of portions F and G.

FIG. 8A, FIG. 8B, and FIG.
As shown in (c), the concave portion 3 having the shape of the first embodiment shown in FIG. 1 and the convex portion 33 having the shape of the fourth embodiment shown in FIG.

FIGS. 9A and 9B are a perspective view of a seventh embodiment of the present invention and a partially enlarged perspective view of a portion H.

In the seventh embodiment, as shown in FIGS. 9A and 9B, projections 64 are provided at four corners of a semiconductor package 61, and a part of the projections 64 at the four corners is used as the first projection shown in FIG. This is an example in which a concave portion 3 having the shape of the embodiment is provided. In this embodiment, the recess 3 is where the pawl for preventing rotation is inserted.

[0031]

As described above, the present invention provides at least one or a combination of geometrically shaped concave or convex portions on the surface of a semiconductor package, and removes the claw of a suction device of a robot for mounting a semiconductor package. , The semiconductor package can be prevented from rotating against the inertial force of the swing of the arm when transporting the semiconductor package, and the semiconductor package can be fixed at a predetermined position without displacement. .

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention and a partially enlarged perspective view of a portion A.

FIG. 2 is a schematic configuration diagram of an example of a package mounting robot.

FIG. 3 is an enlarged perspective view of the adsorber section of FIG. 2;

FIG. 4 is a perspective view of a second embodiment of the present invention and a partially enlarged perspective view of part B.

FIG. 5 is a perspective view of a third embodiment of the present invention and a partially enlarged perspective view of a portion C.

FIG. 6 is a perspective view of a fourth embodiment of the present invention and a partially enlarged perspective view of a part D.

FIG. 7 is a perspective view of a fifth embodiment of the present invention and a partially enlarged perspective view of a portion E.

FIG. 8 is a perspective view of a sixth embodiment of the present invention and a partially enlarged perspective view of portions F and G.

FIG. 9 is a perspective view of a seventh embodiment of the present invention and a partially enlarged perspective view of a portion H.

FIG. 10 is a perspective view of an example of a conventional semiconductor package.

[Explanation of symbols]

1, 11, 21, 31, 41, 51, 61, 71 Semiconductor package 2 Terminal 3, 13, 23 Concave part 33, 43 Convex part 4 Semiconductor package mounting robot 5 Arm 6 Swing direction arrow 7 Suction unit 8 Unit 9 Printed board 10 Mounting position of semiconductor package 17 Adsorber 18 Claw

Claims (6)

(57) [Claims] 1. A package having four corners and a plane shape having a square shape is formed on a surface near the first and second corners, respectively.
Arrange a concave part with a square shape, and use these to prevent rotation
Transporting the package by inserting the package into the recess. 2. A planar shape having four corners are arranged the first and second corners each other geometries are different recesses in the surface in the vicinity of the rectangular package <br/> cage, anti-rotation A method of transporting a semiconductor package, comprising inserting a nail into these recesses and transporting the package. 3. A package having a quadrangular planar shape having four corners.
On a surface near at least one corner of the cage , a pair of straight
A convex portion having a rectangular parallelepiped disposed therein , and the package
The surface of the central part is a flat surface without protrusions
A semiconductor package having a rotation preventing function. 4. A package having a quadrangular planar shape having four corners.
Geometrically on the surface near the first and second corners of the cage
Convex parts having different geometrical shapes are arranged , and
The surface at the center of the cage is flat with no projections formed.
A semiconductor package with a rotation preventing function, characterized in that: 5. A package having a quadrangular planar shape having four corners.
A concave portion having a quadrangular planar shape is arranged on a surface near the first corner of the cage, and a convex portion configured by arranging a pair of rectangular parallelepipeds on the surface near the second corner is arranged ; and Package
The surface of the central part of the page is flat without protrusions or depressions
A semiconductor package with a rotation preventing function, characterized by having a surface . 6. A package having a quadrangular planar shape having four corners.
A projection which projects outwardly from each of the corners of the cage is provided, rotation planar shape with at least one protrusion <br/> of said protrusions, characterized in that a rectangular recess Semiconductor package with prevention function.