JPH08306742A - Structure for carrier tape - Google Patents

Abstract

PURPOSE: To prevent lateral positional shift of a chip device, e.g. an IC chip, held in a carrier tape through a simple structure for preventing lateral shift of the chip device in a recess. CONSTITUTION: In a carrier tape 2 having a recess 3 for receiving a chip device 1, the carrier tape 2 is constructed such that the chip device 1 does not shift laterally in the recess 3. For example, the intersection of the bottom face 3a and the side face 3b of the recess 3, i.e., the outer edge part of the bottom face in the recess 3, is rounded 2a in the profile of carrier tape 2. Furthermore, the inner bottom face 3a of the recess, including the beveled part 2a, is made of a material having low frictional coefficient or coated with such material. With such structure, even if the chip device 1 is shifted laterally to incline temporarily, center of the chip device 1 is shifted gravitationally and aligned with the center of inside diameter of recess in the carrier tape thus recovering the state as shown on Fig. (a).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a carrier tape used for a chip mounter, etc.
The present invention relates to a structure of a carrier tape that holds many electronic components such as C.

[0002]

2. Description of the Related Art As a device for mounting a chip component on a printed circuit board at a high speed, a chip mounter is known in which the chip component is sucked and held by a component suction nozzle connected to a vacuum pump and then mounted on the printed circuit board. . A carrier tape 1 as shown in FIG. 3A as means for supplying chip components to the component suction nozzle of this chip mounter.
There is 0. The carrier tape 10 has recesses 10a for accommodating and holding chip components 12 such as ICs at predetermined intervals in the longitudinal direction. The recess 10a is made of a resin sheet such as vinyl chloride and has a box shape with one side open. The opening 10b is sealed with a film 14. Further, the inner diameter dimension D of the opening 10b is set to be a dimension obtained by adding a margin Δ to the outer dimension d of the chip component from the viewpoints of ease of taking out the chip component 12 at the time of supply and ease of packing the component in the recess.

In order to supply the IC chips and the like held by the carrier tape 10 having such a structure to the component suction nozzle of the chip mounter, the carrier tape 10 wound in a roll shape is mounted on the mounting portion of the chip mounter. After the mounting, the carrier tape pulled out from the roll is led out toward the tip of the component suction nozzle 16, and the film 14 blocking the opening 10b is peeled off at the time of supplying the component to expose the chip component 12. Generally, the component suction nozzle 16 of the chip mounter is brought close to the upper portion of the chip component 12, and vacuum suction is performed by a vacuum pump or the like (not shown).

However, as shown in FIG. 3 (b), when the carrier tape holding the chip parts is carried or when the carrier tape is mounted on the mounter and then the carrier tape is fed out to the mounter, vibrations and shocks occur. In many cases, the chip component 12 in the recess 10a shifts to one side, not to the center of the recess 10a of the carrier tape, which should be the case. As a result, the relative position between the component suction nozzle 16 and the chip component 12 is shifted during the suction, and the chip component 12 is not accurately sucked, or the component is dropped and the chip mounter is stopped when the component is transported after suction. However, there is a drawback that the manufacturing efficiency is reduced.

[0005]

SUMMARY OF THE INVENTION As described above, the present invention has the drawback of the conventional carrier tapes, that is, the chip components such as ICs housed in the recesses of the carrier tapes move laterally due to vibration, impact, etc. The carrier tape is designed to eliminate a chip component suction error or a component dropout due to a relative displacement between the component mount nozzle of the chip mounter and the chip component. It is an object of the present invention to provide a carrier tape capable of preventing lateral displacement of a chip component such as an IC held inside.

[0006]

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, claim 1
In the carrier tape according to the present invention described, by chamfering with R at the outer edge portion of the bottom surface of the carrier tape recess, which is a portion where the bottom surface member and the side surface member of the carrier tape intersect, the IC chip is formed inside the carrier tape. The feature is that it does not move horizontally. According to a second aspect of the present invention, as the bottom member of the carrier tape, the apex angles of four isosceles triangular members are abutted, and the bottom side of each triangular member is joined to a side member constituting the carrier tape. The bottom surface is in the shape of an inverted quadrangular pyramid. According to a third aspect of the present invention, as the bottom member of the carrier tape, the apex angles of a plurality of isosceles triangular members are abutted, and the bottom side of each triangular member is joined to a side member that constitutes the carrier tape. The bottom surface is in the shape of an inverted polygonal pyramid.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the drawings showing the embodiments and the experimental results. FIG. 1 (a) is a vertical sectional view showing the structure of an embodiment of the carrier tape according to the present invention. In this figure, reference numeral 1 is a chip component such as an IC, 2 is a carrier tape for holding the chip component 1, 3 is a recess for storing chip components formed at a predetermined interval on the carrier tape, and 4 is an opening of the recess 3. A film 5 provided on the carrier tape 2 for closing 3'is the tip of the suction nozzle of the chip mounter.

In the longitudinal section of the carrier tape 2, a recess 3 is formed.
A chamfer 2a having a radius R is applied to the intersection of the bottom surface 3a and the side surface 3b, that is, the outer edge portion of the bottom surface of the recess. Therefore, the IC chip 1 or the like 1 held in the recess 3 is difficult to move in the lateral direction (direction parallel to the bottom surface 3a). For example, as shown in FIG. 1B, when the IC chip or the like moves laterally in the recess 3 of the carrier tape 2, one side 1a at the lower end of the IC chip once comes into contact with the chamfer 2a and tilts. However, if the bottom surface 3a of the recess including the chamfer 2a is made of a material having a small friction coefficient or is coated with such a material, the weight of the chip component 1 will be increased immediately after the state shown in FIG. 1 (b) is reached. The center of the IC chip starts moving in a direction coinciding with the center of the inner diameter of the recess of the carrier tape, and finally the bottom surface of the carrier tape 2 and the bottom surface of the IC chip 1 come into close contact with each other (or as shown in FIG. In the contact state, the postures are changed to be in parallel with each other), and the state is returned to substantially the same state as that shown in FIG.

Therefore, the chip component 1 is always located at a predetermined position in the recess 3b during suction, and as a result, the chip component 1 and the suction nozzle 5 of the chip mounter.
It is possible to always match the relative positional relationship between the chip component and the chip component, the chip component can be reliably sucked with high positional accuracy, and the chip component can be accurately mounted at a predetermined position on the printed circuit board without stopping.

FIG. 2A is a longitudinal sectional view showing another embodiment of the carrier tape of the present invention, and FIG. 2B is a plan view thereof.
In this figure, 1 is a chip component such as an IC, 4 is a film provided on a carrier tape, 5 is a tip portion of a suction nozzle of a chip mounter, and 6 is a carrier tape which holds the IC chip 1. The difference between this embodiment and the above-described first embodiment is that the outer edge portion of the bottom surface of the recess of the carrier tape is chamfered with R in the first embodiment. In the embodiment, the bottom surface of the recess 7 of the carrier tape 2 has a shape like an inverted pyramid. That is, four members 7a to 7d each having an isosceles triangle shape
Of the triangular members 7a to 7d are joined to the side member 7e forming the carrier tape. The plane shape of the recess opening of the carrier tape 7 has a shape (rectangle) similar to the outer shape of the IC chip or the like.

Therefore, when the chip components and the like are packed in the recess 7, the lateral center of the chip component and the lateral center of the opening of the recess 7 coincide with each other. The IC chip or the like slightly vibrates up and down due to vibrations when the carrier tape holding the chips is carried or when the carrier tape is mounted on the mounter and then fed out to the mounter, but the bottom surface of the carrier tape Since the structure of the part is like a pyramid, the distances L between the four corners 1c to 1f of the chip part 1 and the four corners of the inner wall of the recess are all equal as shown in FIGS. 2 (a) and 2 (b). It becomes stable only at the position. In addition, even if the chip components are misaligned in the recessed portion of the carrier tape, the held IC chip becomes more stable due to the vibration when the carrier tape is fed to the mounter. It slightly moves so as to converge to a state, and as a result, as described above, the center of the IC chip and the center of the opening of the carrier tape are held at the same position. At least the bottom surface and the inner wall of the recess 7 may be made of a material having a low friction coefficient or may be coated with such a material.

Therefore, the relative positions of the chip component 1 and the suction nozzle 5 of the chip mounter always coincide with each other at the time of suction, and the chip component is securely sucked to stop the chip mounter without printing. It can be mounted on a substrate. Needless to say, the above-mentioned carrier tape can be applied to the case where the plane shape of the recess is rectangular as described above, and the plane shape of the recess is a polygonal tape such as hexagon or octagon. It is also applicable to carriers.

[0013]

Since the present invention is configured as described above, the position and attitude of the chip parts and the like held in the tape carrier are regulated, and the suction nozzle position of the chip mounter and the relative position of the chip parts. It is possible to maintain a constant value, prevent the chip mounter from stopping due to parts falling off, and exert a remarkable effect in improving manufacturing efficiency.

[Brief description of drawings]

1A and 1B are vertical sectional views of a first embodiment of a carrier tape according to the present invention.

2A and 2B are a vertical sectional view and a plan view of a second embodiment of a carrier tape according to the present invention.

3A and 3B are vertical cross-sectional views showing the structure of a conventional carrier tape.

[Explanation of symbols]

 1 ... Chip part 2,6 ... Carrier tape 4 ... Film 5 ... Suction nozzle tip

Claims (4)

[Claims] 1. A carrier tape structure having a recess for accommodating a chip component, wherein the chip component is configured not to move laterally in the recess. 2. The chamfer having R is provided on an outer edge portion of a bottom surface of a concave portion of a carrier tape which is a crossing portion of a bottom surface member and a side surface member forming a recess portion of the carrier tape. Carrier tape structure. 3. As the bottom member constituting the recess of the carrier tape, the apex angles of four members of an isosceles triangle are butted, and the bottom side of each triangular member is joined to the side member constituting the recess. The structure of the carrier tape according to claim 1, wherein the bottom surface of the recess has an inverted quadrangular pyramid shape. 4. A bottom member constituting the recess of the carrier tape, the apex angles of a plurality of isosceles triangular members are abutted, and the bottom side of each triangular member is joined to the side member constituting the recess. The structure of the carrier tape according to claim 1, wherein the bottom surface of the recess has an inverted polygonal pyramid shape.