JP4671258B2 - Substrate transportation jig and manufacturing method thereof - Google Patents

Description

[0001]
[Industrial application fields]
The present invention is, for example, a substrate for a BGA (Ball Grid Array), an LGA (Land Grid Array), or a PGA (Pin Grid Array), and suitable for transporting a substrate before mounting a semiconductor chip, and its It relates to a manufacturing method.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, printed circuit board manufacturers manufacture a board configured by stacking a printed circuit board on a heat spreader made of a thin metal plate, and supply it to a chip mounting manufacturer. In a chip mounting manufacturer, a semiconductor chip is mounted on a substrate supplied from a printed circuit board manufacturer, bonded, and then molded with a sealing material to assemble an integrated circuit (IC).
[0003]
Here, the substrate is supplied from a printed circuit board manufacturer in a form in which a plurality of the substrates are connected by a frame formed in a size and shape according to the specifications of the transfer line of the chip mounting device owned by the chip mounting manufacturer. It is common.
[0004]
[Problems to be solved by the invention]
However, as described above, when a plurality of substrates are connected by a frame, the heat spreader portion and the frame portion constituting the substrate are formed from a single thin metal plate. Therefore, there is a problem that the material cost is high. On the other hand, it is convenient for the chip mounting manufacturer because the supplied substrate can be placed on the transfer line of the chip mounting apparatus as it is, but on the other hand, the substrates are separated from the frame one by one at the final stage of the assembly process. An operation is required, and an operation for removing burrs generated when the substrate is separated is necessary. Further, since dust generated in the work adheres to the substrate, a cleaning work for removing the dust is also required. Furthermore, a large amount of the frame part from which the substrate has been separated is generated as waste.
[0005]
In order to solve such a problem, a method of supplying a single substrate instead of supplying a plurality of substrates connected by a frame as described above has begun to be adopted. According to this supply method, since the substrate can be manufactured alone, the material cost can be reduced. Further, in the assembling process, there is no need for a process of removing the frame. Further, since there is no frame, there is an advantage that a large amount of waste can be prevented.
[0006]
However, this supply method has the following problems. That is, since the substrate is supplied as a single unit from the printed circuit board manufacturer, the chip mounting manufacturer must prepare a carrier for transporting the substrate in order to place the substrate on the transport line of the chip mounting apparatus. In addition, since a single substrate is transported between a printed circuit board manufacturer and a chip mounting manufacturer, after the printed circuit board manufacturer houses and ships the substrate in a dedicated case for transporting the substrate, Since it is necessary to take out the substrate from the transported special case and place it on the carrier, it takes time and effort for the work.
[0007]
The present invention has been made in view of the above-described problems, and enables a substrate to be supplied alone, and can be directly transferred to a transfer line without having to transfer the transported substrate to a carrier for substrate transfer in a chip mounting apparatus. It is an object of the present invention to provide a substrate transport jig that can be placed and a method for manufacturing the same.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, the present invention according to claim 1 is a substrate transport jig used for transporting a substrate before mounting a semiconductor chip,
A substrate housing region partitioned by providing a frame portion around the inside of the metal plate;
A substrate support portion protruding inward from the frame portion at a position lower than the upper surface of the frame portion in the substrate housing region;
Holes through which positioning pins of a chip mounting device for mounting the semiconductor chip mounted on the substrate are inserted along both side edges of the metal plate at predetermined pitch intervals, respectively.
Similarly, there are provided engaging portions that are provided at predetermined pitch intervals at positions different from the holes along both side edges of the metal plate and that can be engaged with the transfer protrusions of the chip mounting device. ,
After the substrate supporting portion is formed to protrude in a direction orthogonal to the frame portion by etching, a portion in contact with the substrate at a position higher than a corner portion having a substantially arc-shaped cross section formed between the substrate supporting portion and the frame portion A substrate transporting jig is provided which is bent so as to be formed .
According to a second aspect of the present invention, at least a pair of frame portions opposed to each other with the substrate housing area interposed therebetween are formed with notch portions that are notched outwardly in a substantially U shape. A jig for transporting a substrate according to claim 1 is provided.
According to a third aspect of the present invention, in the first or second aspect, the substrate housing region is formed in a size / shape substantially along a size / shape of the substrate in a plan view. A substrate transport jig is provided.
The present invention according to claim 4 is characterized in that the substrate support portions are formed by projecting pieces having substantially the same length and width in the projecting direction, which are projected on different frame portions. The jig | tool for board | substrate transport of any one of Claims 1-3 is provided.
The present invention of claim 5, the back surface of the metal plate, according to any one of claims 1 to 4, characterized in that each substantially straight grooves along the both side edges are formed A substrate transport jig is provided.
The present invention according to claim 6 is a method for manufacturing a substrate transportation jig used for transportation of a substrate before mounting a semiconductor chip,
A substrate housing area partitioned by providing a frame portion around the inner side of the metal plate, and projecting inward from the frame section at a position lower than the upper surface of the frame section in the substrate housing area. A substrate support portion, a hole portion that is provided along each side edge of the metal plate at a predetermined pitch interval, and into which a positioning pin of a chip mounting device for mounting the semiconductor chip on the substrate can be inserted, and Etching is formed by etching along the both side edges of the metal plate at positions different from the hole portions, each of which is provided with a predetermined pitch interval and engageable with the transfer projection of the chip mounting device. Process,
Bending the substrate support portion formed in the step so that a portion in contact with the substrate is formed at a position higher than a corner portion having a substantially arc-shaped cross section formed between the frame portion and the frame portion; A method for manufacturing a substrate transporting jig is provided.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. FIG. 1 is a plan view showing a substrate transportation jig according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is a bottom view. As shown in these drawings, the substrate transport jig according to the present embodiment is composed of one metal plate 10. However, as will be described later, a structure in which two or more metal thin plates are laminated may be employed. The width, longitudinal length and thickness of the substrate transport jig, that is, the width, longitudinal length and thickness of the metal plate 10 are matched to the specifications of the chip mounting apparatus transport line owned by the chip mounting manufacturer. It is determined.
[0010]
As shown in FIG. 1, a substrate accommodation region 30 is formed on the inner side of the metal plate 10. The substrate housing region 30 is formed in a size / shape substantially in line with the size / shape of the substrate before mounting the semiconductor chip housed therein in plan view. That is, for example, if a substantially square substrate is accommodated in plan view, the length of the four sides of the substrate accommodating region 30 is substantially the same as the length of the corresponding four sides of the substrate as in the present embodiment. It is formed in a substantially rectangular shape having a thickness. Thereby, since it becomes possible to accommodate a board | substrate in the board | substrate accommodation area | region 30, without producing a clearance gap between the frame part 20 which forms the board | substrate accommodation area | region 30, and the board | substrate accommodated, The vibration can prevent the substrate from swinging vertically and horizontally in the substrate housing region 30.
[0011]
As shown in FIGS. 1 and 2, a substrate support portion 40 is provided in the substrate accommodation region 30 at a position lower than the upper surface of the frame portion 20 so as to protrude inward from the frame portion 20. It has been. As will be described later, the substrate support portion 40 is formed so as to protrude in a direction perpendicular to the frame portion 20 by half etching performed from the surface side of the metal plate 10, and then formed between the frame portion 20. Bending is performed so that a portion 40a in contact with the substrate is formed at a position higher than the corner portion 50 having a substantially arc-shaped cross section. As a result, the substrate can be accommodated in the substrate accommodating region 30 in a more stable state. That is, when the substrate support portion 40 is formed by half etching, a corner portion 50 having a substantially arc-shaped cross section is inevitably formed between the frame portion 20 (see FIG. 4A). The peripheral edge of the substrate comes into contact with the corner portion 50 and is accommodated in the substrate accommodating region 30 in an unstable state. Therefore, in this embodiment, after that, the substrate support portion 40 is bent as described above, so that the peripheral edge of the substrate 100 is prevented from coming into contact with the corner portion 50 and more than the corner portion 50. A portion 40a near the tip of the substrate support portion 40 located at a high position is in contact with the back surface of the substrate 100 so that the substrate can be stably supported (see FIG. 4B).
[0012]
Further, as shown in FIG. 1, the pair of frame portions 20 that are opposed to each other with the substrate housing region 30 interposed therebetween are each formed with a notch portion 60 that is notched in a substantially U-shape toward the outside. Yes. Since the notch 60 forms a space outside the substrate accommodation region 30, the substrate can be accommodated in the substrate accommodation region 30 while being gripped from both sides by a human hand or using a robot arm. . Further, as will be described later, when the substrate transport jig of this embodiment is used as a transport jig for transporting a substrate in a chip mounting apparatus, a robot arm for picking up a substrate on the transport line of the chip mounting apparatus It is also possible to remove the substrate from the substrate transport jig transported on the transport line. It should be noted that the cutout portion 60 may be formed on the other pair of frame portions 20 that are opposed to each other with the substrate housing region 30 therebetween.
[0013]
Further, as shown in FIG. 1, the metal plate 10 is provided with holes 70 at predetermined pitch intervals along both side edges. The holes 70 are formed in a size and shape that allow positioning pins provided on the transfer line of the chip mounting apparatus to be inserted, and the pitch interval of the holes 70 matches the pitch interval of the positioning pins. Is set.
[0014]
Similarly, the metal plate 10 is provided with engaging portions 80 that are notched in a substantially V shape at predetermined pitch intervals along the both side edges at positions different from the hole portions 70. ing. The engaging portion 80 is formed in a size and shape that can be engaged with a transfer projection provided on the transfer line of the chip mounting apparatus, and the pitch interval between the engagement portions 80 also matches the pitch interval of the transfer projection. Is set as follows. Therefore, the shape of the engaging portion 80 is not limited to the above-described shape, and may be formed in a shape such as a substantially circular shape, a substantially elliptical shape, or a substantially rectangular shape, for example.
[0015]
As described above, since the substrate transport jig of the present embodiment is configured to include the hole 70 and the engaging portion 80 described above, not only transport of the substrate but also transport for transporting the substrate in the chip mounting apparatus. It can be used as a jig. Therefore, it is possible to place the transported substrate on the transport line as it is without replacing it with the carrier for transporting the substrate in the chip mounting apparatus.
[0016]
Further, as shown in FIG. 3, substantially straight groove portions 90 are formed on the back surface of the metal plate 10 along both side edges. By forming this groove portion 90, the substrate transportation jig of this embodiment can be stably maintained in a flat state with almost no warping or distortion even if it is thin.
[0017]
Next, an example of the manufacturing method of the board | substrate transport jig | tool which concerns on this embodiment is demonstrated. First, in the first step, required portions of the front and back surfaces of the metal plate 10 formed in a predetermined size and shape are covered with an etching resistant material. Here, the material of the metal plate 10 can be appropriately selected from various metal materials, but in the present embodiment, a stainless alloy having excellent heat resistance and corrosion resistance is used. The substantially V-shaped engaging portions 80 formed along both side edges of the metal plate 10 are formed at the same time when the metal plate 10 is formed from a metal plate as a material.
[0018]
In the second step, for example, a ferric chloride etchant is used as an etchant, and the portion other than the portion covered with the etching resistant material is corroded and removed from the surface side of the metal plate 10 to remove the surroundings. The frame portion 20 is provided to form a partitioned substrate accommodation region 30, and the substrate support portion 40, the cutout portion 60, and the hole portion 70 are formed. More specifically, the substrate support portion 40 formed on the metal plate 10 is formed by half etching, and the other portion of the substrate housing region 30, the cutout portion 60, and the hole portion 70 are formed by through etching. To do.
[0019]
In the third step, the etching solution is used and the portions other than the portion covered with the etching resistant material are removed by corrosion and dissolution from the back side of the metal plate 10, thereby removing the metal plate 10 along both side edges. The substantially straight groove portions 90 are respectively formed, and then the etching resistant material attached to both surfaces of the metal plate 10 is removed.
[0020]
In the fourth step, by using a press machine or the like and pressing the substrate support portion 40 formed by the etching process from the back surface side of the metal plate 10, the portion 40 a in contact with the substrate of the substrate support portion 40 is framed. Bending is performed so as to be formed at a position higher than the corner portion 50 having a substantially arc-shaped cross section formed between the portion 20 and the portion 20. At this time, if the substrate support portions 40 protruding from the respective frame portions 20 have different lengths and widths in the protruding direction, a difference in bending condition occurs. Therefore, as shown in FIG. 1, the substrate support portion 40 of the present embodiment is configured by protruding pieces having substantially the same length and width in the protruding direction, which are protruded from different frame portions 20. . Thereby, the board | substrate support part 40 can be bent so that each protrusion piece may become a uniform bending angle by one press with a press.
[0021]
Thus, by employing etching as one means of the manufacturing method, there is a merit that generation of burrs and distortion can be eliminated and processing cost can be reduced. Of course, this is an example, and the present invention is not limited to this. For example, by half-etching from the front side and the back side of the metal plate 10 respectively, the metal plate 10 having the engaging portions 80 along both side edges is formed from the metal plate as the material, and at the same time The substrate housing region 30, the cutout portion 60, and the hole portion 70 can also be formed. Further, as shown in FIG. 5, the substrate accommodation region 30 and the substrate support 40 are formed by the metal plate 10 formed by laminating a plurality of thin metal plates 10a and 10b formed in a predetermined shape. A thing can also be adopted. Further, in the present embodiment, the substrate accommodation regions 30 are formed in a row on the metal plate 10. For example, as shown in FIG. 6, the substrate accommodation regions 30 are formed in a plurality of rows. A structure can also be adopted.
[0022]
The substrate transport jig of the present embodiment manufactured as described above is used as follows. That is, a single substrate manufactured by a printed circuit board manufacturer is accommodated in each substrate accommodating region 30 partitioned by the frame portion 20, and a chip is accommodated in such a state that a plurality of substrates are accommodated in one substrate transportation jig. Transported to the onboard manufacturer. In this transportation, by inserting a long fixing pin (not shown) through the hole portion 70, it is also possible to transport the substrate transportation jig in which the substrates are accommodated in a stacked state.
[0023]
As described above, the substrate transporting jig transported to the chip mounting manufacturer includes the hole portion 70 through which the positioning pin of the chip mounting device can be inserted, and the engaging portion 80 into which the transfer protrusion of the chip mounting device can be engaged. Therefore, it can be used as a transport jig for transporting a substrate in a chip mounting apparatus. Therefore, it is possible to place the transported substrate on the transport line as it is without replacing it with the carrier for transporting the substrate in the chip mounting apparatus. And after use, it can be reused as a jig for transporting the substrate without being discarded.
[0024]
In the above description, the case used for transporting the substrate from the printed circuit board manufacturer to the chip mounting manufacturer has been described. However, the substrate transportation jig of the present invention is used for the assembly of the printed circuit board to the assembly of an integrated circuit (IC). Of course, even in a factory that performs all of the above, it can be applied as a jig for transporting a substrate in the factory and as a transport jig used in the transport line of the chip mounting apparatus.
[0025]
【The invention's effect】
As described above, according to the substrate transport jig of the present invention, not only as a transport jig for transporting a single substrate, but also as a transport jig for transporting a substrate in a chip mounting apparatus. In addition, the substrate can be supplied alone, and the transported substrate can be directly placed on the transport line without being replaced with the carrier for transporting the substrate in the chip mounting apparatus.
Moreover, according to the manufacturing method of the board | substrate transport jig | tool of this invention, the above-mentioned useful board | substrate transport jig | tool can be provided simply and at low cost.
[Brief description of the drawings]
FIG. 1 is a plan view showing a substrate transport jig according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along a line AA in FIG.
FIG. 3 is a bottom view showing the substrate transport jig according to the embodiment.
FIG. 4 is a diagram for explaining a structure of a substrate support portion employed in the embodiment.
FIG. 5 is a partial cross-sectional view showing a substrate transport jig according to another embodiment of the present invention.
FIG. 6 is a plan view showing a substrate transporting jig according to still another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Metal plate 20 Frame part 30 Substrate accommodation area 40 Substrate support part 50 Corner part 60 Notch part 70 Hole part 80 Engagement part 90 Groove part 100 Substrate

Claims (6)

A substrate transporting jig used for transporting a substrate before mounting a semiconductor chip,
A substrate housing area partitioned by providing a frame portion around the inside of the metal plate;
A substrate support portion projecting inward from the frame portion at a position lower than the upper surface of the frame portion in the substrate accommodation region;
Holes through which positioning pins of a chip mounting device for mounting the semiconductor chip on the substrate can be inserted, respectively, at predetermined pitch intervals along both side edges of the metal plate;
Similarly, there are provided engaging portions that are provided at predetermined pitch intervals at positions different from the holes along both side edges of the metal plate and that can be engaged with the transfer protrusions of the chip mounting device. ,
After the substrate supporting portion is formed to protrude in a direction orthogonal to the frame portion by etching, a portion in contact with the substrate at a position higher than a corner portion having a substantially arc-shaped cross section formed between the substrate supporting portion and the frame portion A jig for transporting a substrate, wherein the jig is bent so as to be formed .   2. The substrate according to claim 1, wherein at least a pair of frame portions opposed to each other with the substrate housing area interposed therebetween are formed with notch portions that are notched outwardly in a substantially U shape. Transportation jig.   3. The substrate transporting jig according to claim 1, wherein the substrate housing region is formed in a size / shape substantially along a size / shape of the substrate in plan view. 4. The substrate support portion according to claim 1, wherein the substrate support portions are formed by protruding pieces having substantially the same length and width in the protruding direction. A jig for transporting a substrate according to the description. 5. The substrate transporting jig according to claim 1, wherein substantially straight groove portions are respectively formed along both side edges on the back surface of the metal plate . A method for manufacturing a substrate transport jig used for transporting a substrate before mounting a semiconductor chip,
A substrate housing area partitioned by providing a frame portion around the inner side of the metal plate, and projecting inward from the frame section at a position lower than the upper surface of the frame section in the substrate housing area. A substrate support portion, a hole portion that is provided along each side edge of the metal plate at a predetermined pitch interval, and into which a positioning pin of a chip mounting device for mounting the semiconductor chip on the substrate can be inserted, and Etching is formed by etching along the both side edges of the metal plate at positions different from the hole portions, each of which is provided with a predetermined pitch interval and engageable with the transfer projection of the chip mounting device. Process,
Bending the substrate support portion formed in the step so that a portion in contact with the substrate is formed at a position higher than a corner portion having a substantially arc-shaped cross section formed between the frame portion and the frame portion;
A method for manufacturing a substrate transporting jig , comprising :

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