CN220367894U

CN220367894U - Integrated circuit packaging product operation device

Info

Publication number: CN220367894U
Application number: CN202321539515.XU
Authority: CN
Inventors: 唐灏
Original assignee: Riyuexin Semiconductor Kunshan Co ltd
Current assignee: Riyuexin Semiconductor Kunshan Co ltd
Priority date: 2023-06-16
Filing date: 2023-06-16
Publication date: 2024-01-19
Anticipated expiration: 2033-06-16

Abstract

The embodiment of the utility model relates to an integrated circuit packaging product operation device. An exemplary working device may comprise: the support plate, and recess and the through-hole that set up on the support plate. The upper surface of the carrier plate is used for bearing the integrated circuit packaging product material strip. The grooves are crisscrossed on the carrier plate, and the through holes are positioned in at least one of the grooves. Compared with the prior art, the embodiment of the utility model solves various problems of local warpage, different colors, virtual soldering and the like of the product in the existing integrated circuit packaging process, improves the production qualification rate of the packaged product and reduces the production cost.

Description

Integrated circuit packaging product operation device

Technical Field

Embodiments of the present utility model relate to the field of integrated circuit packaging, and more particularly to an integrated circuit packaging product handling device, such as a boat (boat).

Background

In the integrated circuit packaging process, due to the differences in product structure and product size, the material strips need to use related operation devices, such as carrying devices (also called "carriers"), for example, boats, etc. to carry the product material strips, so as to realize that different types of products share one automation line for conveying. In addition, the use of the working device also protects the integrated circuit package product material from damage, so that the requirements on the working device are more strict.

For example, a single automated manufacturing line may be shared by both flip chip flat grid array (FCLGA) packages and flip chip on leadframe (FCQFN) packages. In operation, the device for carrying the product strips at least meets two major requirements: firstly, after a water washing (also called flux cleaning) operation, residual water stains on the device need to be drained as far as possible; the second step is: the device needs to be provided with an opening for sucking air to form a vacuum environment between the device and the product material strip, so that the position of the product material strip is stabilized, and abnormal problems such as cold solder joint and the like generated during reflow soldering (reflow) are avoided.

However, the conventional working devices do not satisfactorily meet the above-described requirements, and have such problems. For example, the upper surface of the carrier plate of some devices is a plane, and a plurality of small (about 0.2mm in diameter) through holes are formed in the carrier plate corresponding to the carrying area of the product strips. Because the aperture of the open pore is smaller, water stain between the product material strip and the carrier plate can not be completely discharged during water washing, and the water stain can remain on the back of the material strip. This results in discoloration of the strand, e.g. the substrate of the product, during the subsequent baking process. In addition, the upper surface of the carrier plate of some devices is also a plane, and a plurality of through holes (about 5 mm) are formed in the carrier plate corresponding to the carrying area of the product material strip. The larger openings solve the problem of water residue, but this makes it difficult to create a vacuum environment between the carrier plate and the product strip. In die bonding (die bonding) or other operations requiring vacuum environment, product bars may shake due to the fact that the device cannot be adsorbed and fixed by a machine, which is prone to abnormal soldering, and further affects the quality of the integrated circuit package product. In addition, with the trend of miniaturization of integrated circuit packaging products, product strips are thinner and thinner, and warpage is more likely to occur. These all increase the difficulty of designing the working device.

Thus, there is a need in the art for improved operating devices for integrated circuit packages that better meet the needs of efficient, high quality integrated circuit package manufacturing.

Disclosure of Invention

It is an object of the embodiments of the present utility model to provide an integrated circuit package product operation device, such as a wafer boat, which can avoid water residues in the process and ensure the realization of a vacuum environment between a machine and the operation device, thereby better meeting the manufacturing requirements of the integrated circuit package product.

According to an embodiment of the present application, an integrated circuit package product operation apparatus may include: the carrier plate is used for carrying the integrated circuit packaging product material belt on the upper surface of the carrier plate. The carrier plate further comprises a plurality of grooves and a plurality of through holes. The grooves are crisscrossed on the upper surface of the carrier plate. Each of the plurality of vias is located in at least one of the plurality of grooves.

In another embodiment of the present application, the apparatus further comprises a platen detachably mounted on the carrier plate to press-fit the integrated circuit package product tape onto the carrier plate while the carrier plate carries the integrated circuit package product tape.

In yet another embodiment of the present application, the platen has a hollowed-out structure exposing a product cell area of the integrated circuit package product tape.

In yet another embodiment of the present application, a plurality of embedded holes and magnetic members disposed in the corresponding embedded holes are disposed on the carrier.

In yet another embodiment of the present application, the apparatus further comprises a clamp clamped to the upper surface of the platen and the lower surface of the carrier plate to secure the platen and the carrier plate together.

In yet another embodiment of the present application, the apparatus further comprises a first positioning assembly for relatively fixing the platen and the carrier plate. The first positioning assembly comprises a first positioning pin and a first positioning hole, wherein the first positioning hole is correspondingly arranged on the pressing plate and the carrier plate for inserting the corresponding first positioning pin into the first positioning hole.

In yet another embodiment of the present application, the apparatus further comprises a second positioning assembly that positions the platen and carrier relative to each other, and the second positioning assembly positions the strip of integrated circuit package product as the carrier carries the strip of integrated circuit package product.

In yet another embodiment of the present application, the second positioning assembly includes a second positioning pin and a second positioning hole, and the second positioning hole is disposed on the pressing plate and the carrier plate for inserting the corresponding second positioning pin into the second positioning hole.

In yet another embodiment of the present application, the second positioning assembly includes a screw and a screw hole, wherein the screw hole is disposed on the platen and the carrier plate for the corresponding screw to be fixed in the screw hole.

In yet another embodiment of the present application, the carrier includes a carrying area and an assembling area surrounding the carrying area, and the plurality of grooves are at least located in the carrying area.

Compared with the prior art, the integrated circuit packaging product operation device provided by the embodiment of the application can completely discharge the water stain between the integrated circuit packaging product material belt and the carrier plate during water washing, so that packaging products, particularly substrate heterochromatic of the packaging products, are avoided. Meanwhile, the drainage design does not influence the vacuum suction between the machine and the operation device, and the operation stability is ensured. In addition, the integrated circuit packaging product operation device provided by the embodiment of the application can enable the product material belt to be tightly attached to the carrier plate, and even if the product material belt is thin, the product material belt can be prevented from shaking and warping on the carrier plate. In other words, the embodiment of the application solves various problems of local warpage, different colors, virtual soldering and the like of the product in the existing integrated circuit packaging process, improves the production qualification rate of the packaged product, and reduces the production cost.

Drawings

Fig. 1 is a schematic top view of a carrier of an integrated circuit package product handling device according to an embodiment of the present application.

Fig. 2 is a schematic bottom view of the carrier plate shown in fig. 1.

Fig. 3 is a schematic structural diagram of an integrated circuit package product operation device according to an embodiment of the present application.

Fig. 4 is an enlarged view of a portion of the integrated circuit package product handling device shown in fig. 3.

Detailed Description

For a better understanding of the spirit of the present application, the following description is provided in connection with some preferred embodiments of the present application.

Fig. 1 is a schematic top view of a carrier 11 of an integrated circuit package product handling device 100 according to an embodiment of the present application, and fig. 2 is a schematic bottom view of the carrier 11 shown in fig. 1.

As shown in fig. 1 and 2, the integrated circuit package product handling apparatus 100 (see fig. 3 for an overall view) may include a carrier 11 for carrying a tape of integrated circuit packages (hereinafter referred to as a product tape), such as a FCLGA tape (not shown). The carrier plate 11 is made of high temperature resistant and corrosion resistant materials, and can be prevented from being deformed easily at high temperature. The upper surface of the carrier plate 11 (the surface facing the product web to be carried, also called carrying surface, etc.) may be provided with a plurality of grooves 110 and a plurality of through holes 112. The grooves 110 may be arranged in a crisscrossed manner on the carrier plate 11. Furthermore, these recesses 110 are designed such that when the carrier plate 11 carries a product web, the respective product units on the product web are located above the respective recesses 110. Each of the vias 112 is located in at least one groove 110, such as in a single groove 110 or at the intersection of different grooves 110 (i.e., in multiple grooves 110). When the high-temperature air-dries, the grooves 110 can play a role of diversion trenches, so that sewage can be guided to the through holes 112 for rapid discharge, and water stain residues are effectively avoided.

In some more specific exemplary embodiments, the carrier plate 11 corresponds to the general shape of the product web to be carried, for example a generally rectangular flat plate. The carrier plate 11 may have a carrying region 114 (within the dashed box) for carrying the product web and a mounting region 116 surrounding the carrying region 114. The recess 110 is located at least in the carrying area 114, and may extend, for example, up to the edge of the carrying area 114 and even the mounting area 116. When the product tape is carried on the carrier plate 11, each of the grooves 110 may correspond to a corresponding product unit on the product tape. The width of the grooves 110 (substantially or substantially) is not greater than the dimension of the respective product units on the carried product web in the respective direction, while the width of the connection 111 between adjacent grooves 110 is greater than or equal to the respective width of the cut-out (connection between adjacent product units) on the product web, so that the product web can be stably supported such that the respective product units on the product web will lie over the respective grooves 110 (i.e., will not be recessed within the grooves 110). In other embodiments, the arrangement of the grooves 110 may have other forms, for example, a plurality of grooves 110 corresponding to one product unit, and it may be ensured that the corresponding product units on the product tape are located above the corresponding grooves 110. In other embodiments, the extension of the grooves 110 may be locally discontinuous or irregular, without affecting the essence of the present embodiment. As for the fitting region 116, corresponding fitting arrangements may be provided thereon according to fitting requirements, which may be described in particular in connection with other elements hereinafter.

Taking the product tape size of 90X310mm as an example, the carrier plate 11 may be designed to be substantially the same size or larger. The width of the recess 110 provided on the carrier plate 11 is required to be equal to or less than the corresponding size of the individual product (i.e., product unit) on the product material tape to support the corresponding product unit on the upper surface of the carrier plate 11. For example, when the width of the product unit is less than 1mm, the width of the grooves 110 on the carrier plate 11 is also less than 1mm and the interval between adjacent grooves 110 may be 10 to 20mm, such as 10mm or 15 mm. The through holes 112 may be located in a single groove 110 or at the intersection of different grooves 110, and the aperture may be 0.1mm to 1mm. In some cases, such as in view of the common production line or vacuum requirements with other product types, the width of the recess 110 is designed to take into account the equipment or vacuum requirements of other product types. For example, in view of the flip chip bonding (FCDB) process, the width of the recess 110 is not too small so that the through hole 112 can avoid the vacuum hole on the die bonding machine, thereby ensuring that the machine adsorbs the working device 100 (e.g., adsorbs the lower surface of the carrier 11) through the vacuum hole.

Fig. 3 is a schematic structural diagram of an integrated circuit package product handling device 100 (not carrying product tape) according to an embodiment of the present application. Fig. 4 is an enlarged view of a portion of the integrated circuit package product operation apparatus 100 shown in fig. 3. The integrated circuit package product handling apparatus 100 shown in fig. 3 may employ the same or a different carrier plate than the carrier plate 11 shown in fig. 1 and 2.

Referring to fig. 3 and 4, the integrated circuit package product handling apparatus 100 may further include a platen 13. The pressing plate 13 is detachably mounted on the carrier plate 11. For example, the pressing plate 13 is detachably fixed to the assembly area 116 of the carrier plate 11, so as to press-fix the corresponding integrated circuit package product material tape on the carrier plate 11 as required. The pressing plate 13 may be a middle hollow structure 130 corresponding to the carrying area 114 of the carrier 11, so that the product unit area of the integrated circuit package product tape is exposed to the hollow structure 130 and not damaged by pressing. The frame 132 defining the hollow structure 130 corresponds to the assembly area 116 of the carrier 11. Still taking the product web size of 90X310mm as an example, the platen 13 may be sized to: 240-260mm long and 68-98mm wide.

The detachable assembly mode between the carrier plate 11 and the pressing plate 13 may be various modes, such as magnetic fixing (for example, the pressing plate 13 is made of magnetic adsorption material such as iron), fixture fixing (for example, the pressing plate 13 and the carrier plate 11 have corresponding fixture structures), jogged fixing (for example, the pressing plate 13 and the carrier plate 11 have corresponding jogged structures), screw fixing (for example, the pressing plate 13 and the carrier plate 11 have corresponding screws and screw holes), or pin fixing (for example, the pressing plate 13 and the carrier plate 11 are relatively fixed, and the positioning assembly comprises positioning pins and positioning holes, wherein the positioning holes are correspondingly arranged on the pressing plate 13 and the carrier plate 11 so that the corresponding positioning pins can be inserted into the positioning holes), and the like. Different assembly and fixation modes can be used singly or in combination. The specific assembly described below is merely illustrative.

Referring to fig. 1-4, a plurality of insert holes 118 may be disposed in the mounting region 116 of the carrier 11, and a magnetic member 120, such as a magnet, is inserted into each insert hole 118. Thus, when the pressing plate 13 is made of magnetic adsorption material such as iron, the pressing plate 13 can be magnetically adsorbed to the carrier plate 11, so that the pressing plate 13 is pressed on the carrier plate 11. For example, the embedded holes 118 may be respectively disposed around the assembling area 116 of the carrier 11 to provide magnetism at a plurality of positions uniformly, so as to ensure a relatively uniform suction force with the pressing plate 13 and further ensure a pressing effect. The magnetic member 120 may be a magnetic pillar or other shaped magnetic material. In some embodiments, the dimensions of the magnetic element 120, such as the outer diameter of the magnetic pillar, should be slightly smaller than the inner diameter of the embedded hole 118 to prevent deformation of the carrier 11 caused by thermal expansion and contraction during reflow soldering.

The integrated circuit package product handling device 100 may further comprise a positioning component 15 (not limited to the aforementioned fixing between the carrier 11 and the platen 13).

The positioning assembly 15 has a plurality of functions, for example, the pressing plate 11 and/or the product material belt can be accurately positioned to the corresponding position on the carrier plate 11 during assembly, so as to realize the relative positioning in the horizontal and/or vertical directions. The positioning assembly 15 may take a variety of forms. The different positioning modes can be used singly or in combination.

For example, the positioning assembly 15 may be provided as a combination of a positioning pin 150 and a positioning hole 152. The positioning pin 150 may be made of alloy and is not easily deformed in a high-temperature working environment. The positioning holes 152 may be formed in the carrier 11 (e.g., the mounting region 116) and the platen 13, so as to fit the positioning pins 152 into the positioning holes 152. The positioning assembly 15 can enable the pressing plate 13 to correspond to the carrier plate 11 in both the transverse position and the longitudinal position, and can assist in fixing the product tape to the upper surface of the carrier plate 11.

For another example, the positioning assembly 15 may be configured as a combination of screws and threaded holes (including but not limited to various screw fixation means such as nuts and nuts). Screw holes are provided in the carrier plate 11 (e.g., the mounting region 116) and the pressing plate 13, and corresponding screws can be screwed into the screw holes. Similarly, the screw may be made of an alloy material and is not easily deformed in a high-temperature working environment. During assembly, the pressing plate 11 and the product material belt can be accurately positioned to corresponding positions on the carrier plate 11 through the screw holes, and the pressing plate 11 and the product material belt are further fixed on the carrier plate 11 through the screws.

In summary, the operation device provided in the embodiments of the present application can significantly improve the abnormal problems in the integrated circuit package product manufacturing process, especially in the die bonding and the water washing operation. For example, by providing the carrier plate 11 with the grooves 110 (e.g., extending over the entire carrying area 114) and the through holes 112 located in the grooves 110, the water spot can be completely drained after washing. Meanwhile, the position of the through hole 112 can perfectly avoid the vacuum hole of the die bonding machine, and the vacuum suction of the machine is not influenced, so that the device and a product material belt on the device are ensured to be stable and not to shake in the operation process. In addition, the multiple fixing and positioning modes between the pressing plate and the carrier plate can ensure that the product material belt is tightly attached to the carrier plate during operation, prevent the product material belt from warping, prevent the product material belt from shaking and the like. Finally, the operation device provided by the embodiment of the application also has the advantages of reasonable structural design, lower cost and the like.

The technical content and technical features of the present application have been disclosed above, however, those skilled in the art may make various substitutions and modifications based on the teachings and disclosure of the present application without departing from the spirit of the present application. Accordingly, the scope of protection of the present application should not be limited to what is disclosed in the embodiments, but should include various alternatives and modifications without departing from the application, and is covered by the claims of the present application.

Some embodiments of the present application have been described in detail hereinabove. Throughout the specification, identical or similar components and components having identical or similar functions are denoted by identical or similar reference numerals. The embodiments described herein with respect to the drawings are of illustrative nature, of diagrammatic nature and are used to provide a basic understanding of the present application. The examples of the present application should not be construed as limiting the present application.

As used herein, the terms "about," "substantially" are used to describe and illustrate minor variations. When used in connection with an event or situation, the term may refer to instances in which the event or situation occurs precisely and instances in which the event or situation occurs very nearly. For example, when used in reference to a bonding value, the term may refer to a range of variation of less than or equal to ±10% of the value, such as less than or equal to ±5%, less than or equal to ±0.5%, or less than or equal to ±0.05%. For example, two values may be considered "substantially" identical if the difference between the two values is less than or equal to ±10% of the average of the values.

In this application, unless specified or limited otherwise, terms such as "configured," "connected," "coupled," "fixed," and the like are used broadly and will be understood by those skilled in the art to be in the light of the above-described terms as being, for example, a software and hardware configuration, a mechanical arrangement, a fixed connection, a removable connection, or an integrated connection; it may also be a mechanical or electrical connection; it may also be a direct connection or an indirect connection through intervening structures; but also internal communication of the two components.

Claims

1. An integrated circuit package product handling device, comprising: a carrier plate for carrying the integrated circuit package product tape on the upper surface thereof; the carrier plate is characterized by further comprising:

a plurality of grooves are crisscrossed on the upper surface; and

a number of through holes, each of the number of through holes located in at least one of the number of grooves.

2. The integrated circuit package product handling apparatus of claim 1, wherein: the device further comprises a pressing plate which is detachably assembled on the carrier plate, so that the integrated circuit packaging product material belt is pressed and fixed on the carrier plate when the carrier plate bears the integrated circuit packaging product material belt.

3. The integrated circuit package product handling apparatus of claim 2, wherein: the pressing plate is provided with a hollowed-out structure, and the hollowed-out structure exposes a product unit area of the integrated circuit packaging product material belt.

4. The integrated circuit package product handling apparatus of claim 2, wherein: the carrier plate is provided with a plurality of embedded holes and magnetic pieces arranged in the corresponding embedded holes.

5. The integrated circuit package product handling apparatus of claim 2, wherein: the device further comprises a clamp clamped on the upper surface of the pressing plate and the lower surface of the carrier plate to fix the pressing plate and the carrier plate together.

6. The integrated circuit package product handling apparatus of claim 2, wherein: the device further comprises a first positioning assembly for enabling the pressing plate and the carrier plate to be relatively fixed, wherein the first positioning assembly comprises a first positioning pin and a first positioning hole, and the first positioning hole is correspondingly arranged on the pressing plate and the carrier plate for the corresponding first positioning pin to be inserted into the first positioning hole.

7. The integrated circuit package product handling apparatus of claim 2, wherein: the apparatus further includes a second positioning assembly that relatively positions the platen and carrier, and the second positioning assembly positions the strip of integrated circuit package product as the carrier carries the strip of integrated circuit package product.

8. The integrated circuit package product handling apparatus of claim 7, wherein: the second positioning assembly comprises a second positioning pin and a second positioning hole, wherein the second positioning hole is arranged on the pressing plate and the carrier plate for the corresponding second positioning pin to be inserted into the second positioning hole.

9. The integrated circuit package product handling apparatus of claim 7, wherein: the second positioning assembly comprises screws and screw holes, wherein the screw holes are formed in the pressing plate and the carrier plate so that the corresponding screws can be fixed in the screw holes.

10. The integrated circuit package product handling apparatus of claim 1, wherein: the carrier plate comprises a bearing area and an assembly area surrounding the bearing area, wherein the grooves are at least positioned in the bearing area.