JP3476311B2 - Electronic component holding device in mounting device and electronic component holding method in mounting device - Google Patents
Electronic component holding device in mounting device and electronic component holding method in mounting deviceInfo
- Publication number
- JP3476311B2 JP3476311B2 JP20402496A JP20402496A JP3476311B2 JP 3476311 B2 JP3476311 B2 JP 3476311B2 JP 20402496 A JP20402496 A JP 20402496A JP 20402496 A JP20402496 A JP 20402496A JP 3476311 B2 JP3476311 B2 JP 3476311B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- plate
- carrier plate
- support block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、実装装置における
電子部品保持装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component holding device in a mounting device.
【０００２】[0002]
【従来の技術】従来、固片基板や固片ＩＣチップなどの
電子部品に実装を実施する実装装置は、図２または図３
に示すようにして電子部品が実装装置に供給されてい
る。2. Description of the Related Art Conventionally, a mounting apparatus for mounting electronic components such as a solid substrate and a solid IC chip has been shown in FIG.
The electronic components are supplied to the mounting apparatus as shown in FIG.
【０００３】図２に示す実装装置の場合には、実装装置
の固定サポートブロック１の近傍位置へ専用トレイ２に
入れて電子部品３を搬送し、実装装置の移載用ツール４
で専用トレイ２の上の電子部品３を吸着して図２の
（ａ）（ｂ）に示すように固定サポートブロック１の上
に供給している。移載用ツール４は（ｃ）に示すように
専用トレイ２に戻って上記の移載作業を繰り返す。In the case of the mounting apparatus shown in FIG. 2, the electronic component 3 is conveyed to the position near the fixed support block 1 of the mounting apparatus in the dedicated tray 2, and the transfer tool 4 of the mounting apparatus 4
Then, the electronic component 3 on the dedicated tray 2 is sucked and supplied onto the fixed support block 1 as shown in FIGS. The transfer tool 4 returns to the dedicated tray 2 as shown in (c) and repeats the above transfer operation.
【０００４】固定サポートブロック１の上面１ａは平行
度が保たれており、固定サポートブロック１に移載され
た各電子部品３は、吸着して固定されている。図３に示
す実装装置の場合には、上記のような移載用ツール４で
電子部品ごとの移載作業を実施せずに、図３の（ａ）に
示すように電子部品３が入れられた搬送プレート５を、
図３の（ｂ）に示すように固定サポートブロック１の上
に直接に供給されている。固定サポートブロック１の各
連通孔１ｂは吸着装置（図示せず）に連通されて矢印Ａ
で示すように吸引されており、電子部品は搬送プレート
５に穿設された貫通孔５ａを介して搬送プレート５に吸
着されている。The parallelism is maintained on the upper surface 1a of the fixed support block 1, and the electronic components 3 transferred to the fixed support block 1 are adsorbed and fixed. In the case of the mounting apparatus shown in FIG. 3, the electronic component 3 is inserted as shown in FIG. 3A without carrying out the transfer work for each electronic component with the transfer tool 4 as described above. The transport plate 5
It is directly supplied onto the fixed support block 1 as shown in FIG. Each communication hole 1b of the fixed support block 1 is communicated with an adsorption device (not shown), and is indicated by an arrow A.
As indicated by, the electronic components are sucked to the transport plate 5 through the through holes 5a formed in the transport plate 5.
【０００５】[0005]
【発明が解決しようとする課題】図２に示した構成で
は、専用トレイ２より固定サポートブロック１へ移載し
なくてはならないため作業性が悪い。これに対して図３
に示すように搬送プレート５で一気に固定サポートブロ
ック１に供給した場合には、作業性が良好であるけれど
も、搬送プレート５としては電子部品の姿勢の平行度を
出すために高度な加工精度が要求される。なお、実装装
置を実際に稼働させるためには高度な加工精度の多数の
搬送プレート５を用意しなければならないため、コスト
が高くなる問題がある。In the configuration shown in FIG. 2, workability is poor because the special tray 2 must be transferred to the fixed support block 1. On the other hand, Fig. 3
As shown in FIG. 3, when the carrier plate 5 is supplied to the fixed support block 1 all at once, the workability is good, but the carrier plate 5 requires a high processing accuracy in order to obtain the parallelism of the postures of the electronic components. To be done. In addition, in order to actually operate the mounting apparatus, it is necessary to prepare a large number of transport plates 5 with high processing accuracy, which causes a problem of high cost.
【０００６】本発明は、電子部品の供給の作業性が良好
で、しかも搬送プレート５の加工精度に左右されずに必
要な平行度が得られる電子部品保持装置を提供すること
を目的とする。It is an object of the present invention to provide an electronic component holding device which has a good workability of supplying electronic components and which can obtain a required parallelism regardless of the processing accuracy of the transport plate 5.
【０００７】[0007]
【課題を解決するための手段】本発明の実装装置におけ
る電子部品保持装置は、電子部品の収容位置に対応して
貫通孔が穿設された搬送プレートの前記貫通孔を通して
突出して収容位置に載置されている電子部品を搬送プレ
ートから持ち上げる凸部を有するサポートブロックを設
け、前記凸部の支持面の平行度を前記搬送プレートの前
記電子部品の載置面よりも良好にしたものである。The electronic component holding device in the mounting apparatus of the present invention corresponds to the housing position of the electronic component.
Through the through hole of the transport plate with a through hole
The electronic components that protrude and are placed in the storage position
Support block that has a convex
The parallelism of the support surface of the convex portion in front of the transport plate.
This is better than the mounting surface of the electronic component .
【０００８】この本発明によれば、電子部品の供給の作
業性が良好で、しかも搬送プレートの加工精度に左右さ
れずに必要な平行度が得られる。According to the present invention, the workability of supplying the electronic components is good, and the required parallelism can be obtained without being affected by the processing accuracy of the carrier plate.
【０００９】[0009]
【発明の実施の形態】本発明の請求項１に記載の発明
は、実装を受ける電子部品が載置される収容位置に対応
して貫通孔が穿設された搬送プレートと、搬送プレート
の前記貫通孔を通して突出して収容位置に載置されてい
る電子部品を搬送プレートから持ち上げる凸部を有し、
前記凸部に吸着のための吸引装置に接続された通路を有
するサポートブロックとを設け、前記電子部品を支持す
る前記凸部の支持面の平行度を前記搬送プレートの前記
電子部品の載置面よりも良好にしたことを特徴とし、サ
ポートブロックの先端の平行度を出しておくだけで要求
される平行度が得られる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is a transport plate having through holes formed therein corresponding to the accommodation positions where electronic components to be mounted are mounted, and a transport plate.
Is projected through the through hole and is placed in the accommodation position.
Has a convex part that lifts the electronic components
The protrusion has a passage connected to a suction device for suction.
And a support block for supporting the electronic components.
The parallelism of the support surface of the convex portion
It is characterized in that it is better than the mounting surface of the electronic component, and the required parallelism can be obtained only by providing the parallelism of the tips of the support blocks.
【００１０】 本発明の請求項２に記載の発明は、請求
項１において、前記サポートブロックには、実装を受け
る電子部品を支持する複数の凸部を形成したことを特徴
とし、電子部品がサポートブロックで持ち上げられた状
態において電子部品はサポートブロックの先端に吸着固
定される。According to a second aspect of the present invention, in the first aspect, the support block is formed with a plurality of convex portions for supporting electronic components to be mounted. The electronic component is sucked and fixed to the tip of the support block in a state of being lifted by the block.
【００１１】 本発明の請求項３に記載の実装装置にお
ける電子部品保持方法は、電子部品に実装を実施する実
装装置に、前記電子部品を搬送プレートに載置して搬入
して前記電子部品を保持するに際し、前記電子部品が載
置される収容位置に対応して貫通孔が穿設された搬送プ
レートに前記電子部品を載置して前記実装装置に供給
し、吸着のための吸引装置に接続された通路を有し、か
つ前記搬送プレートの前記電子部品の載置面よりも平行
度が良好な凸部を、搬送プレートの前記貫通孔を通して
突出させて前記搬送プレートに収容位置に載置されてい
た電子部品を搬送プレートから持ち上げて吸着保持する
ことを特徴とする。 In the mounting apparatus according to claim 3 of the present invention,
The electronic component holding method is the actual mounting method for electronic components.
Place the electronic component on the carrier plate and carry it into the mounting device.
When holding the electronic component, the electronic component
Conveyor holes with through holes corresponding to the storage position
Place the electronic component on the plate and supply it to the mounting device
And has a passage connected to the suction device for adsorption,
Parallel to the mounting surface of the electronic component of the carrier plate
Through the through hole of the carrier plate
It is projected and placed on the carrying plate at the accommodation position.
Lifted electronic components from the carrier plate and hold them by suction
It is characterized by
【００１２】以下、本発明の実施の形態について、図１
を用いて説明する。図１の（ａ）は搬送プレート６を実
装装置Ｂの所定位置に搬入した状態を示している。搬送
プレート６には各電子部品３を収容する複数の凹部６ａ
が形成されており、凹部の底部の中央には電子部品３よ
りも小さな貫通孔６ｂが形成されている。FIG. 1 shows an embodiment of the present invention.
Will be explained. FIG. 1A shows a state in which the carrier plate 6 is carried into a predetermined position of the mounting apparatus B. The transport plate 6 has a plurality of recesses 6 a for accommodating the electronic components 3.
Is formed, and a through hole 6b smaller than the electronic component 3 is formed in the center of the bottom of the recess.
【００１３】実装装置Ｂには、図１の（ａ）に示すよう
に下降位置と図１の（ｂ）に示すように上昇位置とに昇
降自在のサポートブロック７が設けられている。このサ
ポートブロック７には、実装装置Ｂに搬入された搬送プ
レート６の前記貫通孔６ｂに対応して凸部７ｃが形成さ
れている。The mounting apparatus B is provided with a vertically movable support block 7 at a lowered position as shown in FIG. 1A and a raised position as shown in FIG. 1B. The support block 7 is provided with a convex portion 7c corresponding to the through hole 6b of the transport plate 6 carried into the mounting apparatus B.
【００１４】サポートブロック７が図１の（ａ）に示す
ように下降位置にある状態では凸部７ｃの先端は搬送プ
レート６の凹部６ａの底面６ｃの上には突出していな
い。この状態では電子部品３は搬送プレート６の各凹部
６ａの底面上に支持されている。When the support block 7 is in the lowered position as shown in FIG. 1A, the tip of the convex portion 7c does not project above the bottom surface 6c of the concave portion 6a of the transport plate 6. In this state, the electronic component 3 is supported on the bottom surface of each recess 6a of the transport plate 6.
【００１５】サポートブロック７が図１の（ｂ）に示す
ように上昇すると、凸部７ｃの先端が搬送プレート６の
凹部６ａの底面６ｃの上には突出して、電子部品３は搬
送プレート６の凹部６ａの底面から持ち上げられてサポ
ートブロック７の先端で支持される。When the support block 7 rises as shown in FIG. 1 (b), the tip of the convex portion 7c projects above the bottom surface 6c of the concave portion 6a of the transport plate 6, and the electronic component 3 of the transport plate 6 moves. It is lifted from the bottom surface of the recess 6 a and supported by the tip of the support block 7.
【００１６】なお、サポートブロック７の内部には一端
が吸引装置（図示せず）に接続され他端が凸部７ｃの各
先端７ｄで開口する通路７ｅが形成されており、図１の
（ｂ）に示す状態ではサポートブロック７の先端で支持
された各電子部品３は、サポートブロック７の先端に真
空吸着されている。Inside the support block 7, there is formed a passage 7e, one end of which is connected to a suction device (not shown) and the other end of which is open at each tip 7d of the convex portion 7c. In the state shown in (), each electronic component 3 supported by the tip of the support block 7 is vacuum-sucked to the tip of the support block 7.
【００１７】このように構成したため、サポートブロッ
ク７の先端７ｄの平行度を出しておくだけで実装を受け
る際の電子部品の姿勢を平行にすることができ、搬送プ
レート６の各凹部の底面の平行度は要求されない。With this configuration, the posture of the electronic component can be made parallel when receiving the mounting by simply providing the parallelism of the tip 7d of the support block 7, and the bottom surface of each concave portion of the transport plate 6 can be made. Parallelism is not required.
【００１８】搬送プレート６で搬入された全ての電子部
品３に対する実装が終了すると、サポートブロック７は
図１の（ａ）に示すように下降位置に移動し、実装の終
了した電子部品３が搬送プレート６の凹部６ａに戻さ
れ、その後に搬送プレート６が実装装置Ｂから持ち上げ
られるか、または実装が終了した図１の（ｂ）に示す状
態で搬送プレート６が実装装置Ｂから持ち上げられて実
装の終了した電子部品３が搬送プレート６の凹部６ａに
戻され、これと共にサポートブロック７が下降位置に移
動する。When the mounting of all the electronic parts 3 carried in by the carrying plate 6 is completed, the support block 7 is moved to the lowered position as shown in FIG. 1 (a), and the mounted electronic parts 3 are carried. The carrier plate 6 is returned to the recess 6a of the plate 6, and then the carrier plate 6 is lifted from the mounting apparatus B, or the carrier plate 6 is lifted from the mounting apparatus B and mounted in the state shown in FIG. The completed electronic component 3 is returned to the concave portion 6a of the transport plate 6, and the support block 7 is moved to the lowered position.
【００１９】上記の実施の形態の電子部品３としては、
具体的には、小形固片基板、固片ＩＣチップなどを挙げ
ることができる。上記の実施の形態では、図１の（ａ）
から図１の（ｂ）へ搬送プレート６を固定側にしてサポ
ートブロック７を上昇させたが、サポートブロック７を
固定側にして搬送プレート６を下降させるようにしても
同様であって、搬送プレート６とサポートブロック７
は、先端が搬送プレートの貫通孔６ｂを通して突出して
収容位置に載置されている電子部品３を搬送プレート６
から持ち上げる第１の位置と、先端が収容位置から後退
した第２の位置とにわたって相対移動可能であれば良
い。As the electronic component 3 of the above embodiment,
Specifically, a small solid piece substrate, a solid piece IC chip, etc. can be mentioned. In the above-described embodiment, (a) of FIG.
1 to FIG. 1B, the support plate 7 is raised with the carrier plate 6 fixed, but the same applies when the carrier plate 6 is lowered with the support block 7 fixed. 6 and support block 7
Conveys the electronic component 3 whose leading end protrudes through the through hole 6b of the conveyance plate and is placed at the accommodation position.
It suffices if the tip can be relatively moved between the first position where it is lifted from the first position and the second position where the tip is retracted from the storage position.
【００２０】[0020]
【発明の効果】以上のように本発明によれば、実装を受
ける電子部品が載置される収容位置に対応して貫通孔が
穿設された搬送プレートと、先端が搬送プレートの前記
貫通孔を通して突出して収容位置に載置されている電子
部品を搬送プレートから持ち上げる第１の位置と、先端
が収容位置から後退した第２の位置とにわたって搬送プ
レートに対して相対移動可能なサポートブロックとを設
けたため、搬送トレイからサポートブロックへ移載する
ことなく、かつ搬送プレート毎の加工精度に左右される
ことなく、サポートブロックに保持固定させることが可
能であり、高作業性かつ低コストに小形固片基板固片Ｉ
Ｃチップを搬送供給できるものである。As described above, according to the present invention, a carrier plate having a through hole corresponding to the housing position where an electronic component to be mounted is placed, and the through hole having a carrier plate at the tip. A support block that is movable relative to the transport plate over a first position in which the electronic component that protrudes through and is lifted from the transport plate is lifted from the transport plate, and a second position in which the tip is retracted from the storage position. Since it is provided, it can be held and fixed to the support block without being transferred from the transfer tray to the support block and without being affected by the processing accuracy of each transfer plate, which is highly workable and low-cost and compact. One board solid piece I
The C chip can be transported and supplied.
【図１】本発明の実施の形態の電子部品保持装置の断面
図FIG. 1 is a sectional view of an electronic component holding device according to an embodiment of the present invention.
【図２】従来の電子部品保持装置の移載工程の説明図FIG. 2 is an explanatory view of a transfer process of a conventional electronic component holding device.
【図３】従来の別の電子部品保持装置の移載工程の説明
図FIG. 3 is an explanatory view of a transfer process of another conventional electronic component holding device.
Ｂ 実装装置 ３ 電子部品 ６ 搬送プレート ６ａ 凹部 ６ｂ 貫通孔 ６ｃ 底面 ７ サポートブロック ７ｃ 凸部 ７ｄ 先端 ７ｅ 通路 B mounting device 3 electronic components 6 Transport plate 6a recess 6b through hole 6c bottom 7 Support block 7c convex part 7d tip 7e passage
フロントページの続き (72)発明者 清村 浩之 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 西野 賢一 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平５−286568（ＪＰ，Ａ) 特開 昭63−101214（ＪＰ，Ａ) 特開 昭63−101215（ＪＰ，Ａ) 特開 昭63−101216（ＪＰ，Ａ) 特開 昭63−285946（ＪＰ，Ａ) 実開 平２−96737（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/50 H01L 21/68 Front page continued (72) Inventor Hiroyuki Kiyomura 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Kenichi Nishino 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 56) References JP-A 5-286568 (JP, A) JP-A 63-101214 (JP, A) JP-A 63-101215 (JP, A) JP-A 63-101216 (JP, A) JP Showa 63-285946 (JP, A) Actual Kaihei 2-96737 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/50 H01L 21/68
Claims (3)
置に対応して貫通孔が穿設された搬送プレートと、搬送プレートの前記貫通孔を通して突出して収容位置に
載置されている電子部品を搬送プレートから持ち上げる
凸部を有し、前記凸部に吸着のための吸引装置に接続さ
れた通路を有するサポートブロックと を設け、前記電子部品を支持する前記凸部の支持面の平
行度を前記搬送プレートの前記電子部品の載置面よりも
良好にした 実装装置における電子部品保持装置。1. A carrier plate having a through hole corresponding to a housing position where an electronic component to be mounted is mounted, and a housing plate protruding through the through hole of the carrier plate to a housing position.
Lift the mounted electronic components from the carrier plate
It has a convex part and is connected to a suction device for adsorption to the convex part.
A support block having a closed passage, and a flat support surface of the convex portion for supporting the electronic component.
Than the mounting surface of the electronic component of the carrier plate
Electronic component holding device in a good mounting device.
電子部品を支持する複数の凸部を形成した請求項１記載
の実装装置における電子部品保持装置。2. The support block is mounted.
The electronic component holding device in the mounting apparatus according to claim 1 , wherein a plurality of convex portions that support the electronic component are formed .
記電子部品を搬送プレートに載置して搬入して前記電子
部品を保持するに際し、 前記電子部品が載置される収容位置に対応して貫通孔が
穿設された搬送プレートに前記電子部品を載置して前記
実装装置に供給し、 吸着のための吸引装置に接続された通路を有し、かつ前
記搬送プレートの前記電子部品の載置面よりも平行度が
良好な凸部を、搬送プレートの前記貫通孔を通して突出
させて前記搬送プレートに収容位置に載置されていた電
子部品を搬送プレートから持ち上げて吸着保持する実装
装置における電子部品保持方法。 3. A mounting device for mounting electronic components, comprising :
The electronic parts are placed on the carrier plate and carried in to carry
When holding a component, a through hole is formed corresponding to the storage position where the electronic component is placed.
The electronic component is placed on the punched transport plate and
Has a passage connected to the suction device for suction , which supplies the mounting device , and
The parallelism of the carrying plate is higher than that of the mounting surface of the electronic component.
Good projections project through the through holes in the transport plate
The carrier plate that was placed in the storage position.
Mounting that picks up child parts from the transfer plate and holds them by suction
Method for holding electronic component in device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20402496A JP3476311B2 (en) | 1996-08-02 | 1996-08-02 | Electronic component holding device in mounting device and electronic component holding method in mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20402496A JP3476311B2 (en) | 1996-08-02 | 1996-08-02 | Electronic component holding device in mounting device and electronic component holding method in mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1050732A JPH1050732A (en) | 1998-02-20 |
| JP3476311B2 true JP3476311B2 (en) | 2003-12-10 |
Family
ID=16483505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20402496A Expired - Fee Related JP3476311B2 (en) | 1996-08-02 | 1996-08-02 | Electronic component holding device in mounting device and electronic component holding method in mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3476311B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001296253A (en) * | 2000-04-12 | 2001-10-26 | Mitsubishi Electric Corp | Inspection device for semiconductor device, and inspection method of semiconductor device |
| JP4878109B2 (en) * | 2004-08-24 | 2012-02-15 | 株式会社アルバック | Substrate transfer system and substrate transfer method |
| JP2022132717A (en) * | 2021-03-01 | 2022-09-13 | 東レエンジニアリング株式会社 | Chip tray, chip holding device, and visual inspection device |
-
1996
- 1996-08-02 JP JP20402496A patent/JP3476311B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1050732A (en) | 1998-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3771214B2 (en) | Electronic component mounting method | |
| JP3476311B2 (en) | Electronic component holding device in mounting device and electronic component holding method in mounting device | |
| JP2001015988A (en) | Device and method for mounting electronic component | |
| JPH10256713A (en) | Method of mounting ic package | |
| JPH10100026A (en) | Carrying device of electronic parts, and electronic parts mounting machine using it | |
| US8210357B2 (en) | Taped component and method of mounting product using the same | |
| JP4627643B2 (en) | Device for supplying electronic components for mounting | |
| JPH08264996A (en) | Tool for flexible substrate | |
| JP4013860B2 (en) | Screen printing apparatus and screen printing method | |
| JPH0715199Y2 (en) | Jig for transferring double-sided mounting board | |
| JP3552574B2 (en) | Apparatus and method for mounting conductive ball | |
| JPH05243375A (en) | Die picking-up method and collet | |
| JP2002043353A (en) | Suction tool for bga element and suction method | |
| JP2000269239A (en) | Ic chip transfer system, ic chip mounting system, ic chip transfer method and ic chip mounting method | |
| JP4671258B2 (en) | Substrate transportation jig and manufacturing method thereof | |
| JPH1022699A (en) | Board mounting method | |
| JPH01183899A (en) | Board holding apparatus | |
| JP2592027Y2 (en) | Hybrid integrated circuit components | |
| JPS60106751A (en) | Printed board positioning device | |
| JPS63299300A (en) | Mounting of component on printed board | |
| JPH03251391A (en) | Dividing of ceramic base plate | |
| US20020063370A1 (en) | Chuck for microscopic contacts | |
| JPS62123793A (en) | Printed circuit board aligner | |
| JPH0242736A (en) | Bonding of ic-chip loading type flexible printed-circuit board | |
| JPH1092548A (en) | Connector supplying machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080926 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080926 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090926 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090926 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100926 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110926 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120926 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130926 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |