JPS62123793A - Printed circuit board aligner - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a positioning device for a circuit board, and more particularly to a positioning device for positioning a circuit board at a predetermined position for printing.

KSummary of the Invention The present invention includes means for positioning using a reference hole of a circuit board and means for positioning using an outer edge of the circuit board. The present invention relates to a positioning device that selectively uses positioning means.

K PRIOR ART When forming a predetermined circuit device, a circuit element is mounted on a circuit board, and the electrodes of the circuit element are connected to a wiring pattern on the circuit board by a connecting means. In order to streamline the manufacturing of such circuit devices, various chemicals such as solder resist, solder cream, adhesives, etc. are applied onto the circuit board by printing methods, such as screen printing techniques. is now being applied. Therefore, it is possible to apply various chemicals onto circuit boards using this printing method.
When using the circuit board, it is necessary to position the circuit board correctly in advance.

[Means for Solving the Problems] The method for positioning the circuit board differs depending on the material of the circuit board. In general, it is difficult to form reference holes in ceramic substrates, and the accuracy of the reference holes cannot be improved. Therefore, the outer edge of the ceramic substrate is used for positioning. On the other hand, for circuit boards made of organic materials, positioning is performed by inserting a bottle into the reference hole. Therefore, in the past, various drugs were printed using different printing devices having different positioning means depending on the type of circuit board. Therefore, conventional printing apparatuses lack versatility, require the use of many types of printing machines, require large amounts of capital investment, and have the drawbacks of poor operating rates.

The present invention has been made in view of these problems, and it is an object of the present invention to provide a circuit board positioning device that can be used universally for circuit boards with different types of positioning means. .

Means for Solving K Problems The present invention provides an apparatus for positioning a circuit board at a predetermined position and printing, and the present invention provides a means for positioning using a reference hole in the circuit board, and a circuit board. The circuit board is provided with means for positioning using the outer edge of the circuit board, and two types of positioning means are selected and used depending on the type of circuit board.

K effect] Therefore, according to the present invention, it is possible to select and use two types of positioning means, whereby the organic material substrate is positioned using the reference hole, and the organic material substrate is positioned using the outer edge. It becomes possible to provide a printing device that can be used for general purpose ceramic substrates.

“Example 1 The present invention will be explained below with reference to an illustrated embodiment.

3 and 4 show the entirety of a printing device having a positioning device according to an embodiment of the present invention, and this printing device is equipped with a base 10, on which a fixed frame is mounted. 11 are provided. A printing head 12 is movably supported by this fixed frame 11. That is, the printing head 12 includes a frame 14 supported by the fixed frame 11 via a support 13, and this frame 14 is connected to the rod 1.
5 is now supported. A carriage 16 is supported by the rod 15 so as to be able to vibrate.

The carriage 16 supports a squeegee 18 via a support 17, and the carriage 16 is connected to an actuator 19 for lateral movement and an actuator 20 for movement in the height direction. Therefore, by actuating these actuators 19 and 20, the squeegee 18
is adapted to move on a screen 22 stretched over a support frame 21, thereby applying a predetermined chemical. A circuit board for this coating is supplied to the lower part of the screen 22, and a conveying device 23 for this purpose is provided. Furthermore, a positioning device @24 is provided between the conveyance devices 23.

As shown in FIGS. 1 and 2, the conveyance device 23 is
In addition to being equipped with a transport frame 25, this frame 2
A conveyor belt 26 is supported by 5. In FIG. 1, a pair of reference Okawa positioning bins 27 and 28 are arranged close to one of the belts 26. These bins 27.28 actuators 29.30
It is movable in the vertical direction, and is positioned by engaging with reference holes 43 and 44 of an organic material base number 42, which will be described later.

On the other hand, one side of the ceramic substrate 41 is positioned by fixed positioning pins 31, 32. Furthermore, the ceramic substrate 41 is positioned by X-axis positioning pins 33,34. These bins 33, 34 are adapted to be moved by actuators 35, 36.

Furthermore, this positioning device has a bin 37 for clamping in the Y-axis direction.
, and is adapted to be moved in the Y-axis direction by an actuator 38.

To explain the principle of the positioning device 24 of the printing apparatus as described above, when positioning the ceramic substrate 41, as shown in FIG.
32 and a positioning bin 33 in the X-axis direction as a reference.

That is, regarding the ceramic substrate 41, since the accuracy of forming the reference hole is low, or even if the reference hole is formed, the positioning is performed by the outer edge.

On the other hand, when positioning the organic material substrate 42, as shown in FIG. Reference hole 43.4
Positioning is performed by engaging each of the four. Of the pair of reference holes 43 and 44,
The reference hole 44 is a circular hole and positioning is performed using this hole as a reference, and the reference hole 43 is an elongated hole to absorb dimensional errors in the Y-axis direction.

Furthermore, the ceramic substrate 41 can be positioned on its front and back surfaces respectively. To explain this operation, when printing on the surface of the ceramic substrate 41, positioning is performed using the fixed bins 31 and 32 and the left bin 33 as shown in FIG. While pushing the board 41 in the X-axis direction by the direction bottle 34,
The substrate 41 is pushed in the axial direction by the bottle 37. On the other hand, when printing on the back side of the substrate 41, positioning is performed using fixing bins 31, 32 and positioning bins 34 in the In response, the bottle 33 pushes in the X-axis direction, and the bottle 37 pushes in the Y-axis direction.

Moreover, for positioning when printing on the front and back sides of the ceramic substrate 41, the ceramic substrate 41 is supplied after being reversed so that the left and right sides are reversed. 31.3
2 are in contact with each other. In other words, when positioning in the X-axis direction using the bins 34 or 33, for the front side, the distance between the bins 33 and 31 is set as a, and for the back side, the distance between the bins 34 and 32 is set as a. There is. Similarly, when positioning the front side, the distance between the bins 34 and 32 is b, whereas for the back side, the distance between the bins 33 and 31 is b. It has become so.

Therefore, by making the dimensions in the pushing direction equal to each other in this way, the same position on the outer edge of the ceramic substrate 41 is positioned by the positioning pins 31 and 32, and even if the edge of the ceramic substrate 41 has unevenness, It becomes possible to perform positioning with precision. Furthermore, 75
In the ceramic substrate 41 of mu x 75 mm, dimensions a and b are 13.5 mm and 1, respectively.
It is now set to 1.5am.

Next, the positioning operation by this positioning device 24 will be explained. This positioning is controlled by a microcomputer, and the actuators 29, 30, 3 are controlled by control signals from the microcomputer.
Positioning is performed by V-controlling 5.36.38. This operation will be explained based on the flowchart shown in FIG. First, supply the circuit board.

Then, it is determined whether the supplied circuit board is to be positioned based on the hole or the outer shape, and if the position is based on the hole, the actuators 29, 30 move the bins 27, 28 upward. Once the predetermined positioning is achieved, these bins 27, 28 are lowered.

Next, in the case of positioning based on the external shape, the substrate 41
Determine whether it is the front or back side. In the case of the back side, the bin 34 is raised and the bin 37 is moved by the actuator 38, and clamping is first performed in the Y-axis direction. Next, the bin 33 is moved by the actuator 35 and clamped in the X-axis direction. Once properly clamped in this manner, these clamps are then released.

In this stage of positioning, since the components are mounted on the back side of the circuit board 41, the components mounted on the circuit board 41 must be positioned in advance before the circuit board 41 is received by the jig, so that the components mounted on the circuit board 41 come into contact with the jig. After this, using the bins 31, 32, and 34 as a reference again, clamping in the Y-axis direction is performed by the bin 37, and clamping in the X @ force direction is performed by the bin 33, and positioning for printing is performed. I try to do this.

Next, when positioning the ceramic substrate 41 based on the external shape and positioning the surface of the substrate 41, the positioning bin 34 in the X-axis direction is raised, and the bin 37 is moved by the actuator 38. The substrate 41 is clamped in the Y-axis direction. Next, the bottle 34 is moved by the actuator 36, and the narrow end of the substrate 41 is brought into contact with the bottle 33, thereby
Perform direction clamping. After performing such positioning, the squeegee 18 is moved over the screen 22 to apply, for example, cream solder, and predetermined printing is performed.

Further, in the printing apparatus according to this embodiment, the support frame 21 supporting the screen 22 or the printing head 12 is moved in the X-axis direction and the Y-axis direction depending on the size of the circuit board 41, 42. This makes it possible to print substrates of various sizes with the same device.

In other words, when printing a small size substrate 41,
As shown in FIG. 10, point the edge of the substrate 41 at the origin
If o and Yo, the reference positions of the support frame 21 of the screen 22 are X+ and Y+. On the other hand, when printing is performed on a large ceramic substrate 41, the reference position of the support frame 21 becomes x2, Y2, assuming that the origin is XQ N Y o as shown in FIG. That is, the printing position of the screen 22 must be changed depending on the size of the substrate 410.

However, since the setting positions Xo and YO of the substrate 41 cannot be changed, the support frame 21 supporting the screen 22 or the printing head 12 is moved as a whole, and in this case, as shown in FIG. According to the change in the size of the board 41, X+-X2 in the X-axis direction.
, are moved across Y+-Y in the Y-axis direction. Therefore, with such a configuration, it is possible to print circuit boards of various sizes using the same device.

As described above, according to the printing apparatus according to the present embodiment, the positioning device has a means for positioning using the reference holes 43 and 44 of the circuit board 42 and a means for positioning using the outer edge of the circuit board 41. Because of this, it becomes possible to commonly print on two types of circuit boards 41 and 42, and it becomes possible to increase versatility. Furthermore, the bin 3 for positioning the ceramic substrate 41 in the X-axis direction
3 can be used as a stopper bin when supplying the aiso material substrate 42. Furthermore, by configuring the two bins 33, 34 in the X-axis direction for external reference to be movable by actuators 35, 36,
It becomes possible to position the ceramic substrate 41 on its front and back surfaces, and it becomes possible to support double-sided printing. Furthermore, since the ceramic substrate 41 is printed while being chucked by the positioning bins 31 to 34, 37, 1ff41 is used during printing.
will stay in place. Since the printing head 12 is roughly movable in the X-axis direction and the Y-axis direction, it is possible to print on substrates 41 and 42 of various sizes.

[Effects of the Invention] As described above, the present invention includes a means for positioning using the reference hole of a circuit board and a means for positioning using the outer edge of the circuit board, and is suitable for various types of circuit boards. Accordingly, two types of positioning means are selected and used. Therefore, with this configuration, it is possible to provide a printing device that can be commonly used for two types of circuit boards that require different positioning methods.

[Brief explanation of drawings]

Fig. 1 is a plan view showing the circuit board positioning device, Fig. 2 is a front view thereof, Fig. 3 is a plan view showing the overall structure of the printing device, Fig. 4 is a front view thereof, and Fig. 5 is an external view. FIG. 6 is a plan view showing the positioning operation using a hole reference. FIG. 7 is a plan view showing the positioning operation on the front surface based on the outer shape. FIG. 8 is a plan view showing the positioning operation on the back surface using the outer shape reference. FIG. 9 is a flowchart 1-1 showing the operation of the positioning device. FIG. 10 is a plan view showing the position of the support frame in the case of a small board. FIG. 11 is a plan view showing the position of the support frame in the case of a large board. FIG. 12 is a plan view showing the operation of changing the position of the support frame. In addition, in the codes used in the drawings, 27.28...2 standard Okawa positioning bins, 30...
・Actuator 31.32...Fixed positioning bin 33.34...X-axis direction positioning bin 35.36...
- Actuator 37... Y-axis direction clamping bottle 38... Actuator 41... Ceramic substrate 42... Organic material substrate 43, 44... Reference hole.

Claims (1)

[Claims] An apparatus for positioning a circuit board at a predetermined position for printing, comprising a means for positioning using a reference hole of the circuit board and a means for positioning using an outer edge of the circuit board. A circuit board positioning device characterized in that two types of positioning means are selected and used depending on the type of circuit board.