JPH082085A - Paste coating method - Google Patents

Abstract

PURPOSE:To efficiently apply solder paste to a surface mounting printed circuit board in a predetermined pattern with high precision. CONSTITUTION:A plurality of printed circuit boards 1-1-1-3 are held on the board holding parts 2-1-2-3, held in a movable state by respective drivers 3-1-3-3, and the positions of them are detected at the time of printing by a position detector 5 and the drivers 3-1-3-3 are controlled corresponding to the detection result by a control device 4 to correct the misregistration of the printed circuit boards 1-1-1-3 with respect to a printing mask 6 to apply the printing of solder paste to a plurality of the printed circuit boards 1-1-1-3 by the single printing mask 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste application method, and more particularly to a paste application method for applying a solder paste to a surface mount printed circuit board in a predetermined pattern.

In recent years, surface mount printed circuit boards have come to be used more and more due to their thinness and good assemblability, and therefore, it is required to assemble the surface mount printed circuit boards at a higher speed.

Assembly of a surface-mounted printed circuit board mainly includes steps of mounting printed electronic components of solder paste and solder reflow. In the assembly of a surface-mounting printed circuit board, the speeding up of solder paste printing has attracted attention as the mounting speed of electronic components increases.

[0004]

2. Description of the Related Art FIG. 4 shows a flowchart of a basic process for assembling a surface mount printed circuit board. When Assembling a Surface Mounted Printed Circuit Board First, a solder paste is printed on a printed circuit board on which a predetermined pattern is formed by soldering using a print mask and a squeegee (step S1-
1).

Next, electronic parts such as an IC and a capacitor are mounted on the printed board coated with the solder paste (step S1-2).

Next, solder reflow is performed on the printed circuit board on which the electronic component is mounted to solder the electronic component to the printed circuit board (step S1-3).

Although the basic assembly process of the surface mount printed circuit board has been described above, the process that controls the assembly of the surface mount printed circuit board is generally the component mounting process of (step S1-2), but this process is currently performed. The mounting speed is increasing due to the improvement of the mounting device. On the other hand (step S1-1), in the solder paste printing process, extremely high speed is difficult due to the nature of the solder paste (higher viscosity than ink or emulsion), and the printing process is rate-determining depending on the number of parts. Is coming.

[0008]

However, a conventional printing apparatus for applying a solder paste or the like to a printed board in a predetermined pattern has only a single positioning / position correcting apparatus for a single printing mask. Therefore, if you try to print or apply solder paste to multiple printed circuit boards with a single print mask, if you correct the misalignment of one printed circuit board, the misalignment of other printed circuit boards will occur. It is difficult to correct the positional deviation for all the printed circuit boards. Therefore, it is necessary to print / apply the solder paste one by one, and it is difficult to increase the speed. It was

Further, when printing is performed on a plurality of printed circuit boards at a time with a single print mask, the plurality of printed circuit boards are printed as one unit at the time of printing.
Although a method of separation has been considered, there are problems that a separation step is required, speedup becomes difficult, and edges and patterns are damaged during separation.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a paste coating method capable of performing paste coating with high accuracy and efficiency.

[0011]

According to a first aspect of the present invention, there is provided a paste application method, wherein a paste material is placed on a printing mask, and the paste material is applied to the printing mask by a squeegee to press the paste material onto the printing mask. A plurality of print targets are held by a plurality of holding units that are movably supported with respect to the print mask, a positional shift of each of the plurality of print targets with respect to the print mask is detected, and the plurality of the plurality of print targets detected by the detection unit are detected. The plurality of holding units are corrected and moved in accordance with the positional deviation of each of the print targets with respect to the print mask to position the plurality of print targets with respect to the print mask, and then the paste material is applied.

According to a second aspect of the present invention, when printing is performed on a single print target, the print mask is moved with respect to the single print target, and Perform positioning.

According to a third aspect of the present invention, when printing is performed on a single print target, the single print target is moved with respect to the print mask by synchronously moving the plurality of holding units. Positioning of the single print target with respect to the print mask.

[0014]

According to the first aspect of the present invention, the plurality of print objects are respectively held by the holding means so as to be movable with respect to the print mask, and the holding means for holding the print objects are held on the print mask by the driving means provided respectively. Be moved. Further, the detecting unit detects the positional displacement of each of the plurality of print targets with respect to the print mask, and the positional displacement amount detected by the detecting unit is supplied to the control unit. The control unit controls the drive unit according to the amount of positional deviation of each print target detected by the detection unit,
The displacement of each of the plurality of print targets with respect to the print mask is corrected.

As described above, since each of the plurality of print objects can correct the positional deviation with respect to the print mask, it is possible to simultaneously print the plurality of print objects with high positional accuracy using a single print mask.

According to the second aspect, by moving the print mask by the print mask moving means, it is possible to easily perform positioning with respect to a single print target, so that the versatility of the apparatus can be improved.

According to the third aspect, since the plurality of holding units are integrally driven and positioned by controlling the plurality of driving units in synchronization with each other, a single print target is held in the plurality of holding units. A single print object can be easily positioned with respect to the mask even when it is held astride.

[0018]

1 and 2 are block diagrams showing an embodiment of the present invention. In the figure, 1 _-1 to 1 _-3 PCB 2 _-1 to 2 _-3 substrate holder, 3 _-1 to 3 _-3 driving device 4 control unit, 5
Is a position detection device, 6 is a print mask, 7 is a print mask holding unit, 8 is a print mask drive device, 9 is a squeegee, 10 is a squeegee drive device, and 11 is a solder paste supply device.

The wiring of pre-designed pattern in accordance with the circuit to be configured has been made on the printed circuit board 1 _-1 to 1 _-3.

The printed circuit board 1 _-1 to 1 _-3 substrate holder 2 _-1
Each of the solder pastes is held at 2 to ₃ and solder paste is printed.

Substrate holding unit 2_-1~ 2_-3To the holding part 2a
Substrate 1_-1~ 1_-3Hold. In addition, the substrate holder 2_-1
~ 2_-3Drive unit 3_-1~ 3_-3Are connected and drive
Set 3 _-1~ 3_-2Moves in the X, Y, and θ directions by
It is said that.

The drive units 3 _{-1 to} 3 _-3 are composed of motors and the like, and are mechanically coupled to the substrate holding units 2 _-1 to 2 _-3 .
The substrate holders 2 _-1 to 2 _-3 are electrically connected to the control device 4 respectively, and move the substrate holding parts 2 _-1 to 2 _-3 in the directions of arrows X, Y and θ in accordance with the control signal supplied from the control device 4.

The position detecting device 5 is disposed above the substrate holder 2 _-1 to 2 _-3, by detecting the positioning mark M1~M3 formed on the printed board 1 _-1 to 1 _-3, printing The respective positions of the substrates 1 _-1 to 1 _-3 are detected. The position information detected by the position detection device 5 is supplied to the control device 4.

The control device in advance the position information of the detected printed board 1 _-1 to 1 _-3 by the position detecting device 5, 4, compared with the position information of the printing mask 6 which has been stored printed board 1 _-1 ~ _1-3 Detects the amount of misalignment with respect to each print mask 6.

For example, each printed circuit board 1 of the print mask 6
A position corresponding to the mark M1~M3 _-1 to 1 _-3 may be provided the same mark M _S1 ~M _S3, by comparing the position coordinates of the mark M _S1 ~M _S3 the position coordinates of the marks M1~M3 The positional deviation in the X and Y directions is detected, and the rotational deviation in the θ direction is detected by comparing the lengths of the marks M1 to M3 in the X direction with the lengths of the marks M _{S1 to} M _{S3 in} the X direction.

The control device 4 controls the positional deviations x _{1 to} x ₃ , y ₁
~y _3, theta ₁ generates a control signal in response to the through? _3, and supplies to the drive unit 3 _-1 to 3 _-3, drive 3 _-1 to 3 _-3 controlled to a printed circuit board 1 _-1 aligning the ~ 1 _-3 and the printing mask 6.

The print mask 6 has printed circuit boards 1 _-1 to 1 _-3.
The hole 6a at a portion corresponding to the portion performing the soldering is formed in the wiring pattern, the solder paste through the hole 6a is supplied to the printed circuit board 1 _-1 to 1 _-3.
The print mask 6 is held by the print mask holding unit 7. The print mask holding unit 7 holds the print mask 6 rotatably in the directions of arrows C, D, and E, and is connected to the print mask driving device 8.
The print mask driving device 8 is configured to be driven in the directions of arrows C, D, and E.

The print mask driving device 8 is connected to the control device 4 and is supplied with a control signal from the control device 4 in accordance with a printing procedure described later to rotate the print mask holding portion 7.
When printing is performed on a single substrate, the printing mask 6 is driven to move in the directions of arrows D and E to position the printing mask 6 on the substrate.

The squeegee 9 is driven by a squeegee driving device 10 and slides on the upper surface of the printing mask 6 to press the solder paste onto the printing mask 6. The squeegee driving device 10 is connected to the control device 4, is supplied with a control signal from the control device 4 according to a printing procedure described later, is coupled with the squeegee 9 according to the control signal, and moves the squeegee 9 in the direction of arrow D, The upper surface of the print mask 6 is slid.

The solder paste supply device 10 is connected to the control device 4, and a control signal is supplied from the control device 4 in accordance with a printing procedure described later, and the solder paste is applied to the upper surface side of the print mask 6 in accordance with the supplied control signal. Supply.

Next, the printing operation will be described. FIG. 3 shows a printing operation flowchart of the control device 4.

[0032] First, when printing solder paste on the printed circuit board 1 _-1 to 1 _-3, feeder (not shown) by the substrate holding portion printed board 1 _-1 to 1 _-3 conveyed to the printing device 2 attached to _-1 to 2 _-3 (step S2-1).

The control unit 4 is the substrate holder 2 _-1 to 2 when _-3 PCB 1 _-1 to 1 _-3 is mounted, the printed board 1 _-1 to 1 _-3 mark M1 by the position detecting device 5 ~ M3 detects (step S2-2).

Next, the positional deviation between the mark of the control device 4 pre-detected mark and the printed circuit board 1 of the printing mask 6 had been _-1 to 1 _-3 x, y-direction displacement and, in the x-direction The rotation angle θ is detected as an error according to the length (step S
2-3).

[0035] controls the drive unit 3 _-1 to 3 _-3 in accordance with the position deviation detected in step S2-3, to correct the positional deviation of the printed circuit board 1 _-1 to 1 _-3 printing mask 6 (step S2-4).

[0036] Then the printing mask 6 is controlled to a printing mask driving device 8 is rotated in the arrow C ₁ direction, adhering the printing mask 6 on the printed circuit board 1 _-1 to 1 _-3 (step S2-
Five).

The control device 4 controls the squeegee driving device 10 so that the squeegee 9 slides on the printing mask 6 to uniformly spread the solder paste previously supplied by the solder paste supplying device 11 on the upper surface of the printing mask 6. (Step S2-6).

As described above, the solder paste is used as the printing mask 6.
Printed circuit board 1 _-1 to 1 through the pattern of
_-Supplied over ₃ .

[0039] Next, the control unit 4 rotates the printing mask 6 controls the printing mask driving device 7 in the arrow C ₂ direction to separate the printing mask 6 from the printed circuit board 1 _-1 to 1 _-3 (step S2 -7).

[0040] Then the printed circuit board 1 _-1 to 1 _-3 transferring from the substrate holder 2 _-1 to 2 _-3 removable electronic component mounting apparatus (step S2-8).

[0041] Thus application of solder paste to a soldering portion of the printed circuit board 1 _-1 to 1 _-3 is completed.

[0042] According to this embodiment, since performed to correct the positional deviation of the printing mask 6 in each of the plurality of printed circuit board 1 _-1 to 1 _-3 husband, a plurality of printed circuit boards in a single printing step 1 _- It can be performed accurately in the solder paste application with respect to ₁ to 1 _-3. Therefore, printing efficiency can be improved.

In this embodiment, one print mask 6 is used for a plurality of print masks.
Printed circuit board 1_-1~ 1_-3For solder paste printing
I explained the configuration to do, but in order to have versatility
Solder pace for a single substrate with a single print mask 6
The printing may be controlled to be performed. Mark of this embodiment
Printing solder paste on a single board with a printing machine
In this case, two control methods can be considered. One way
Is the substrate holder 2_-1~ 2 _-3Keep a single board across
Hold and position the control mask 6 with the position detection device 5.
Marks and corresponding positioning marks on the board
So that both marks are matched by the control device 4
Drive device 3_-1~ 3_-3By driving in synchronization,
Substrate holding unit 2_-1~ 2_-3To move in the same direction at the same time.
Position a single substrate with and. Also, the second
The substrate holding unit 2_-1~ 2 _-3Straddle over
Hold one substrate and use the positioning detector 5 to print
Alignment mark of 6 and correspondingly provided on the board
Detected by the control device 4 and the printing mark is detected.
Move the disc moving device 8 so that both positioning marks are aligned.
Positioning is performed by controlling movement in the D and E directions.
U At this time, the drive device 3_-1~ 3_-3Is fixed. Since
A single group can be obtained by using either of the above two methods in combination.
It can also be applied to plates and can improve versatility
It

[0044]

As described above, according to claim 1 of the present invention, it is possible to correct the positional deviation with respect to the print mask of each of a plurality of print objects, so that it is possible to perform higher positioning with a single print mask for a plurality of print objects. It has the features that it can print at the same time with high accuracy and can print efficiently.

According to the second aspect, by moving the print mask by the print mask moving means, it is possible to easily perform positioning with respect to a single print target, so that the versatility of the apparatus can be improved. Has features.

According to the third aspect of the present invention, by synchronously driving the plurality of driving means, it is possible to easily perform positioning for a single printing object arranged over a plurality of holding portions, and therefore the apparatus can be easily positioned. It has features such as improved versatility.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a configuration diagram of one embodiment of the present invention.

FIG. 3 is an operation flowchart at the time of printing according to the embodiment of this invention.

FIG. 4 is an operation flowchart when assembling a surface mount printed circuit board.

[Explanation of symbols]

1 _-1 to 1 _-3 Printed circuit board 2 _-1 to 2 _-3 Board holding unit 3 _{-1 to} 3 _-3 Driving device 4 Control device 5 Position detecting device 6 Printing mask 7 Printing mask holding unit 8 Printing mask driving unit 9 Squeegee 10 Squeegee drive device 11 Solder paste supply device

Claims (3)

[Claims] 1. A paste material is placed on a print mask (6).
The paste material with the squeegee (9)
Pace of applying the paste material by pressing it on
In the method of applying a coating layer, a plurality of layers are movably supported with respect to the printing mask (6).
Number holding means (2_-1~ 2_-3) Multiple print targets (1_-1~
1_-3), The plurality of print targets (1_-1~ 1_-3) Each of the printing masses
(6) The positional deviation with respect to (6) is detected, and the plurality of print targets detected by the detection means (5)
(1_-1~ 1_-3) Position for each said print mask (6)
The plurality of holding means (2_-1~ 2_-3)Respectively
Is corrected and moved to adjust the print mask (6)
Number of print targets (1 _-1~ 1_-3) After positioning
Of the paste characterized by applying the paste material
Application method. 2. When performing printing on a single print target, the print mask (6) is moved with respect to the single print target, and the print mask (6) for the single print target is moved. ) Is positioned.
How to apply the described paste. Wherein the printing the single printed by moving synchronously said plurality of holding means (2 _-1 to 2 _-3) in the case of performing printing on a single printed The paste application method according to claim 1, wherein the paste is moved with respect to the mask (6) to position the single print target with respect to the print mask (6).