JP2000037846A - Solder paste printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a cream solder coating time and a snapping-off time in a solder paste printer, and also shorten a tact time. SOLUTION: First and second XYθ tables 14 and 16 are disposed in series along the base carrying direction of a base carrying device 12 in a solder paste printer 10. The positions of carrying-in first and second bases 18 and 20 are adjusted respectively in the XYθdirection of a machine 22, and cream solder is applied to the bases 18 and 20 simultaneously by one mask 22 and snapped off.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste printing machine for applying cream solder to a surface of a substrate or the like on which electronic component chips are mounted by a screen printing method.

[0002]

2. Description of the Related Art As shown in FIG. 10, a conventional solder paste printing machine 1 transports a substrate 3 in one direction (X direction) by a substrate transport device 2, and the substrate 3 is formed in a predetermined pattern. When the substrate 3 reaches the XYθ table 6 arranged below the mask 5 having the
By adjusting the relative positional relationship between the X direction, the Y direction, and the axis (the θ direction) orthogonal to the substrate transfer surface, positioning with respect to the mask 5, and further raising the substrate 3 in the mask 5 direction, The cream solder on the mask 5 is pushed into the opening 4 by a squeegee 7, and the cream solder is applied onto the substrate 3 in the same pattern as the pattern of the opening 4.

[0003] The substrate 3 after applying the cream solder has an XYθ
After the plate is slowly lowered by the table 6 and separated from the mask 5, it is carried out by the outgoing substrate transfer device 2.

[0004]

The process of applying the cream solder on the mask 5 to the substrate 3 by the squeegee 7 and the process of separating the substrate 3 from the mask 5 after applying the cream solder are performed during the printing takt time. However, these steps cannot be shortened for accurate and reliable printing.

[0005] For this reason, conventionally, in order to increase the production amount (printing amount), only a method of increasing the production amount by increasing a plurality of rows of substrate transfer devices in parallel has been used.

Therefore, there is a problem that the tact time per solder paste printing machine cannot be shortened.

The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a solder paste printing machine capable of shortening the tact time.

[0008]

SUMMARY OF THE INVENTION The present invention provides a transfer device for sequentially transferring a plurality of substrates along a horizontal transfer surface and stopping the plurality of substrates in series in the transfer direction. An XYθ table for holding the substrate and adjusting the relative positional relationship between the transport direction of the substrate, a direction perpendicular thereto, and a rotation angle about an axis perpendicular to the transport surface, and a predetermined table corresponding to the plurality of substrates. A solder paste printing machine comprising: a mask having an opening, and a squeegee that moves on the mask aligned with the substrate and prints cream solder on the substrate through the opening of the mask. To achieve.

According to another aspect of the present invention, there is provided a transfer device for sequentially transferring a plurality of substrates along a transfer surface and stopping the plurality of substrates in series in the transfer direction, and a substrate transferred by the transfer device. Transport direction in the transport plane between the mask and the mask,
An XYθ table for adjusting a relative position relationship between a direction orthogonal to this direction and a rotation angle about an axis orthogonal to the transfer surface; a mask having predetermined openings corresponding to the plurality of substrates; A squeegee for applying the cream solder on the combined mask to the mask and pushing it into the opening, wherein the XYθ table separates the plurality of substrates from the mask simultaneously after applying the cream solder. The above object is achieved by a solder paste printing machine characterized in that it is configured to perform the following.

In the solder paste printing machine, a plurality of the XYθ tables are arranged, and at least one of the XYθ tables is arranged.
The original XYθ table may be mounted on another XYθ table.

In the above solder paste printing machine,
A plurality of the XYθ tables may be arranged, and the relationship between the substrate and the mask may be independently adjusted.

Further, in the solder paste printing machine, the XYθ table may include means for simultaneously mounting a plurality of substrates and positioning these in the substrate transport direction.

[0013] In the solder paste printing machine,
A plurality of substrates positioned by the positioning means on the one XYθ table are regarded as one substrate, and recognition means for recognizing the position in the XYθ direction is provided. Based on the recognized position, the one The relative positional relationship between the plurality of substrates and the mask may be simultaneously adjusted using an XYθ table.

According to the present invention, there is provided a transfer device for sequentially transferring a substrate in one direction along a transfer surface, a mask having a predetermined opening for printing cream solder on a plurality of substrates,
With respect to the opening with the mask, the substrate can be placed at a corresponding position, and positioning means for mechanically positioning the plurality of substrates at the corresponding position is provided. An XYθ table for simultaneously adjusting the relative positional relationship between the mask and the X direction parallel to the substrate transfer direction in the transfer surface, the Y direction orthogonal thereto, and the θ direction around an axis orthogonal to the transfer surface; XYθ
The plurality of substrates positioned on the table are regarded as one substrate, and recognition means for recognizing the position in the XYθ direction, and cream solder on the mask aligned with the substrate are applied to the mask. And a squeegee to be pushed into the opening. Based on the position obtained by the recognizing means, the XYθ table performs position correction of the plurality of substrates in the XYθ direction,
The .theta. table achieves the above object by a solder paste printing machine characterized in that a plurality of substrates after applying the cream solder are simultaneously separated from the mask.

In the solder paste printing machine, the XYθ table is set on the substrate and the mask is set on the X
It may be driven in the Yθ direction.

Further, in the solder paste printing machine, the squeegee may be configured to apply cream solder in the Y direction.

According to the present invention, the cream solder is simultaneously applied in a state where a plurality of substrates are arranged in series in the transport direction, and at the same time, the substrate is separated from the mask. Can significantly reduce the tact time.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

A solder paste printing machine 10 according to an embodiment of the present invention includes a substrate transfer device 12 and an unloading unit along a substrate transfer surface between an unloading unit 12A and a loading unit 12B of the substrate transfer device 12. Printing on the first and second XYθ tables 14 and 16 arranged in series from the 12A side, and on the first and second substrates 18 and 20 positioned on the first and second XYθ tables 14 and 16 One mask 22 having openings 18A and 20A of a pattern to be formed
And the substrate transfer device 1 along the upper surface of the mask 22.
A squeegee 24 that moves in the Y direction orthogonal to the substrate transfer direction (X direction) along the transfer surface in 2 and pushes the cream solder on the mask 22 into the openings 18A and 20A;
The substrate mark 18 of the first and second substrates 18 and 20 stopped on the first and first XYθ tables 14 and 16
B, 20B, the first and second substrates 18, 2
0 in the XYθ direction, and based on the detected value, the first and second substrates 18 and 20 are aligned with the openings 18A and 20A in the mask 22,
And a recognition device 26 that generates a signal for performing a correction operation of the first and second XYθ tables 14 and 16.

Reference numerals 14A and 16A in FIG.
Tables 14, 16 show substrate holders for horizontally transporting and supporting substrates.

The first and second XYθ tables 14,
A stopper 28A and a stopper 28 for stopping and positioning the first substrate 18 and the second substrate 20, which are sequentially conveyed from the carry-in section 12B, at predetermined positions in the conveyance direction, respectively.
8B are provided.

These stoppers 28A and 28B are on standby below the substrate transfer surface of the substrate transfer device 12, and when the first substrate 18 is loaded onto the first XYθ table 14, the stoppers 28A and 28B Protrudes to the substrate transfer surface, and after passing through the first substrate 18, the second substrate 20
When the XYθ table 16 approaches the XYθ table 16, the stopper 28B
Are projected to stop and position the second substrate 20.

The first and second XYθ tables 14, 1
6, the substrate transport device 12, the stoppers 28A and 28B, and the squeegee 24 are controlled by a control device 30 as shown in FIG. 2, and the control device 30 recognizes the substrate marks 18B and 20B from the recognition device 26. A signal is input.

Next, a process of printing cream solder on a substrate by the solder paste printing machine 10 will be described.

The first substrate 18 is transported from the carry-in section 12B of the substrate transport device 12 to the first XYθ table 14 beyond the second XYθ table 16.

Stopper 28 of first XYθ table 14
A projects to the height of the substrate transfer surface before the first substrate 18 is carried in, and comes into contact with the first substrate 18 being conveyed, thereby stopping and positioning the first substrate 18. At this time, the stopper 28B of the second XYθ table 16 is kept on standby from the substrate transfer surface.

Following the first substrate 18, a second substrate 20 is carried into the second XYθ table 16 from the carry-in section 12B. The stopper 28B is protruded from the substrate transfer surface after the first substrate 18 has passed, and is brought into contact with the leading end of the second substrate 20 that is carried in, thereby causing the second X 20 to move.
Stop and position on the Yθ table 16.

Next, by the recognition device 26, the substrate marks 18B on the first substrate 18 and the second substrate 20,
20B, the first and second substrates 18, 20 are read.
Is detected in the XYθ direction, and the signal is transmitted to the control device 3.
Output to 0.

The control device 30 controls the first and second substrates 18 and 18 based on the substrate position signal from the recognition device 26.
The first and second XYθ tables 14, 1, 20 correspond to the corresponding openings 18 A, 20 A of the mask 22.
6 in the XYθ directions to adjust the position.

Next, the first and second XYθ tables 1
4 and 16 and the first and second substrates 18 and 20 are
2 until it contacts the back surface.

In this state, the cream solder supplied onto the mask 22 is pushed into the openings 18A and 20A by operating the squeegee 24 in the Y direction.

Next, the first and second XYθ tables 1
By slowly lowering the first and second substrates 18 and 20 by 4 and 16, the plates are separated from the mask 22 and then unloaded from the unloading section 12A.

The solder paste printer 10 according to the embodiment of the present invention applies cream solder to two substrates at the same time and simultaneously separates the plate from the mask. The number of sheets per sheet is half that of the conventional case, and the tact time of solder paste printing can be greatly reduced.

In the solder paste printing machine 10,
The first and second substrates 18 and 20 are placed and positioned on first and second XYθ tables 14 and 16 arranged in series independently of each other. The present invention is not limited to this. A plurality of substrates can be loaded in series, and each of them can be positioned substantially in the XYθ directions, and the application of cream solder and the separation of the plate can be performed simultaneously. I just need.

Therefore, the configuration of the XYθ table and the relative arrangement of the substrate in the XYθ direction with respect to the mask are shown in FIGS.
As shown in FIG. 9, there are various forms.

In the embodiment shown in FIG. 3, a second XYθ table 34 is placed on a first XYθ table 32,
After the position of the first substrate 18 on the XYθ table 32 is adjusted in the XYθ direction, the position of the second substrate 20 is adjusted by the second XYθ table 34. FIG.
Reference numerals 32A and 34A indicate substrate holding parts.

In the embodiment shown in FIG. 4, cream solder is applied to three substrates 36A to 36C which are carried in series at the same time, and the plate is separated.
tables, which can be independently adjusted in the XYθ direction, similarly to the θ tables 14 and 16.
３８38C. In the example of this embodiment, the time for applying the cream solder and removing the plate per substrate can be reduced to 1/3 of the conventional time.

The configuration shown in FIG. 5 is composed of first and second Xs.
Two substrates 4 on each of the Yθ tables 40A and 40B
2, 43, 44 and 45 are connected to a pair of stoppers 42A, 42B, 43A, 43B, 44A, 44
B, 45A, and 45B, respectively, and then, after this positioning, XYθ
The positions of the tables 40A and 40B are corrected in the XYθ directions, so that the tables 40A and 40B can be aligned with a mask (not shown).

The configuration shown in FIG. 6 has the same configuration as that of FIG. 5 and further includes the substrate transport direction among the substrates 42 to 45 mechanically positioned on the XYθ tables 40A and 40B by stoppers 42A to 45B. The first and second substrates 42 and 43 of FIG.
The substrate marks 42C and 43C on the reference numerals 2 and 43 are recognized by a recognition device (not shown) similar to the recognition device 26,
Thereby, the position of the XYθ table 40A is adjusted,
Similarly, the third and fourth substrates 4 on the XYθ table 40B
Regarding 4 and 45, the board marks 44C and 45C are recognized by the recognition device, and these are regarded as one board.
Table BB is adjusted with respect to a mask (not shown).

In the embodiment shown in FIGS. 5 and 6, the time for applying the cream solder and releasing the plate per substrate can be reduced to 1/4 of the conventional time.

In each of the above embodiments, XYθ
Although there are a plurality of tables, the present invention is not limited to this. For example, as shown in FIG. 7, on one XYθ table 46, as in the embodiment of FIG. The two substrates 47 and 48 are connected to stoppers 47A and 47B.
And mechanically positioned by 48A and 48B, and recognizes the substrate mark 47C on the substrate 47 and the substrate mark 48C on the substrate 48 as one substrate (not shown).
And the position of the XYθ table 46 may be adjusted in the XYθ direction with respect to a mask (not shown).

Further, in each of the embodiments shown in FIGS. 1 and 3 to 7, the substrate transport apparatus is for one row, but the number of rows may be two or three or more. Good.
For example, as shown in FIG. 8, the XYθ tables in the example of the embodiment shown in FIG.

Further, in each of the above embodiments, the position of the substrate is adjusted with respect to the mask by using the XYθ table. However, the present invention is not limited to this. Thus, the position may be adjusted in the XYθ directions.

For example, as shown in FIG. 9, a fixed printing table 50 is used instead of the second XYθ table 16 in the embodiment of FIG. First substrate 18 on one XYθ table 14
Is adjusted in the XYθ direction with respect to the second substrate 20 whose position is fixed, and then the mask 22A for applying cream solder to the first and second substrates 18 and 20 at the same time is moved to the XYθ.
The driving device 52 adjusts the position of the first and second substrates 18 and 20 in the XYθ directions.

In the masks 22, 22A, etc., the squeegee 24 is driven in the Y direction.
This may be driven in the X direction. Where X
When the squeegee is driven in the direction, more time is required for the application time (printing time) than when the squeegee is driven in the Y direction.

[0046]

Since the present invention is constructed as described above, the steps of applying cream solder to a plurality of substrates and releasing the substrate from the mask after the application are simultaneously performed. It has an excellent effect that the printing tact time per hit can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of a solder paste printing machine according to the present invention.

FIG. 2 is a block diagram showing a control system in the solder paste printing machine.

FIG. 3 is a plan view showing a second example of the embodiment according to the present invention.

FIG. 4 is a plan view showing a third example of the embodiment.

FIG. 5 is a plan view showing a fourth example of the embodiment.

FIG. 6 is a plan view showing a fifth example of the embodiment.

FIG. 7 is a plan view showing a sixth example of the embodiment.

FIG. 8 is a plan view showing a seventh example of the embodiment.

FIG. 9 is a plan view showing an eighth example of the embodiment.

FIG. 10 is a perspective view showing a main part of a conventional solder paste printing machine.

[Explanation of symbols]

10, 32: solder paste printing machine 12: substrate transfer device 12A: carry-in part 12B: carry-out part 14, 32, 36A, 40A: first XYθ table 16, 34, 36B, 40B: second XYθ table 18: second 1 substrate 20 ... second substrate 18A, 20A ... opening 18B, 20B ... substrate mark 22, 22A ... mask 24 ... squeegee 26 ... recognition device 28, 28B ... stopper 30 ... control device 36C ... third XYθ table 38A 38C ... first to third substrates 42 to 45 ... substrates 42A, 42B, 43A, 43B, 44A, 44B, 4
5A, 45B, 42C, 43C, 44C, 45C, 47
A, 47B, 48A, 48B ... stopper 50 ... XYθ driving device

Claims (9)

[Claims] A transport device for sequentially transporting a plurality of substrates along a horizontal transport surface and stopping the plurality of substrates in series in a transport direction; and a holding device for holding the plurality of substrates. X to adjust the relative positional relationship between the transport direction, the direction perpendicular to the transport direction, and the rotation angle about the axis perpendicular to the transport surface.
A Yθ table, a mask having a predetermined opening corresponding to the plurality of substrates, and a squeegee moving on the mask aligned with the substrate and printing cream solder on the substrate through the openings of the mask. , Comprising a solder paste printing machine. 2. A transfer device for sequentially transferring a plurality of substrates along a transfer surface and stopping the plurality of substrates in series in the transfer direction, and a transfer device for transferring the plurality of substrates and a mask transferred by the transfer device. An XYθ table for adjusting the relative positional relationship between the transport direction in the transport plane, the direction orthogonal thereto, and the rotation angle about an axis orthogonal to the transport plane, and a predetermined opening corresponding to the plurality of substrates A mask and a squeegee for applying cream solder on the mask aligned with the substrate to the mask and pressing the squeegee into the opening, wherein the XYθ table comprises: A solder paste printing machine characterized in that it is configured to be simultaneously separated from a mask after coating. 3. The XYθ table according to claim 1, wherein a plurality of the XYθ tables are arranged, and at least one of the XYθ tables is arranged.
A solder paste printing machine wherein the θ table is placed on another XYθ table. 4. The XYθ according to claim 1, 2 or 3,
A solder paste printing machine, wherein a plurality of tables are arranged, and the relationship between the substrate and the mask is adjusted independently of each other. 5. The XYθ according to claim 1, 2 or 3,
A solder paste printing machine, characterized in that the table has a means on which a plurality of substrates can be placed at the same time and which has means for positioning them in the substrate transport direction. 6. A recognizing means according to claim 5, wherein a plurality of substrates positioned by said positioning means on said one XYθ table are regarded as one substrate, and a recognizing means for recognizing the position in the XYθ direction is provided. Based on the recognized location,
A solder paste printing machine wherein the relative positional relationship between the plurality of substrates and the mask is simultaneously adjusted by the one XYθ table. 7. A transfer device for sequentially transferring substrates in one direction along a transfer surface, a mask having a predetermined opening for printing cream solder on a plurality of substrates in series in the transfer direction, and the mask With respect to the opening, the substrate can be placed at a corresponding position, and positioning means for mechanically positioning the plurality of substrates at the corresponding position is provided. An XYθ table for simultaneously adjusting a relative positional relationship in the X direction parallel to the substrate transfer direction in the transfer surface, the Y direction orthogonal thereto, and the θ direction around an axis orthogonal to the transfer surface;
The plurality of substrates positioned on the Yθ table are regarded as one substrate, and recognition means for recognizing the position in the XYθ direction, and cream solder on the mask aligned with the substrate are applied to the mask. And a squeegee that is pushed into the opening. The XYθ table performs position correction of the plurality of substrates in the XYθ direction based on the position obtained by the recognition unit. A solder paste printing machine characterized in that a plurality of substrates after applying the cream solder are simultaneously separated from the mask. 8. The XYθ table according to claim 1, wherein the XYθ table sets the mask to X with respect to the substrate.
A solder paste printing machine driven in the Yθ direction. 9. A solder paste printing machine according to claim 1, wherein said squeegee is configured to apply cream solder in a Y direction.