WO2020147355A1

WO2020147355A1 - Mother-child platform printing machine and method for adjusting printing

Info

Publication number: WO2020147355A1
Application number: PCT/CN2019/112494
Authority: WO
Inventors: 邱国良
Original assignee: 东莞市凯格精密机械有限公司
Priority date: 2019-01-14
Filing date: 2019-10-22
Publication date: 2020-07-23

Abstract

A mother-child platform printing machine, comprising a mother platform (1), a child platform (2) and a CCD module (3). The CCD module simultaneously or successively locates position identification points of a substrate and a steel mesh on the mother platform and the child platform, and then the mother platform and the child platform simultaneously or successively adjusts the coincidence of the substrate and the steel mesh. The child platform and the mother platform may be completely independent of each other, and the child platform may also be embedded in the mother platform. The mother platform and the child platform may successively adjust the coincidence of the position identification points of the substrate and the steel mesh, and the coincidence of the position identification points of the substrate and the steel mesh on the mother platform may also be independently controlled. Such a printer may simultaneously print a plurality of substrates, and each substrate may be the same or different, which thereby improves printing efficiency.

Description

Mother-child platform printing machine and adjusting printing method

This application requires that it be submitted to the Chinese Patent Office on January 14, 2019, the application number is 201910032188.0, the name of the invention is "a kind of mother-and-child platform printing machine and the adjustment printing method" and the Chinese Patent Office is filed on the same day, the application number is 201920056537.8, the name of the invention The priority of the two Chinese patent applications for "a kind of mother-child platform printer and adjustment printing method", the entire contents of which are incorporated into this application by reference.

Technical field

The invention relates to a circuit board printer, in particular to a mother-child platform printer and a method for adjusting printing.

Background technique

At present, in the solder paste printing of circuit boards, the most critical part of the process is the overlap of the position identification points of the stencil and the substrate. In order to find the overlap points, multiple alignments are required to achieve the best printing effect. However, existing printers are generally only suitable for printing a single substrate or the same kind of substrate. Can not complete the printing of different types of substrates.

Summary of the invention

The purpose of the present invention is to provide a mother-and-child platform printer and a method for adjusting printing in response to the above-mentioned defects of the prior art.

In order to solve the above-mentioned shortcomings of the prior art, the technical solution provided by the present invention is: a mother-child platform printer, including a mother platform, a child platform and a CCD module, the CCD module sequentially or simultaneously positioning the mother platform and the child platform The position of the base plate and the steel mesh is identified, and then the mother platform and the sub platform adjust the overlap of the base plate and the steel mesh.

As an improvement of the sub-platform printer of the present invention, the sub-platform is provided with a suction cavity jig. When the sub-platform is an independent platform, the CCD module simultaneously positions the substrate and the steel on the mother platform and the sub-platform. The net position identifies the point, and then the mother platform and the sub-platform adjust the overlap of the substrate and the steel net at the same time.

As an improvement of the mother-and-child platform printer of the present invention, the child platform is embedded in the mother platform, and the CCD module sequentially locates the position identification points of the substrate and steel mesh on the mother platform and the child platform, and then the mother platform and the child platform The platform adjusts the overlap of the base plate and the steel mesh in turn.

As an improvement of the mother platform printer of the present invention, the CCD module is arranged above the mother platform and the child platform.

As an improvement of the child-mother platform printer of the present invention, it also includes two transport rails for transporting substrate jigs, the suction cavity jig is located between the two transport rails, and the transport rails are located Above the mother platform, the transport guide rail transports the jig carrying the substrate to the center position of the printer, the mother platform is lifted to the image capturing position, the suction cavity jig absorbs the substrate, and the CCD module is positioned The position identification points of the base plate and steel mesh on the mother platform and the sub platform, the mother platform and the sub platform adjust the overlap of the base plate and the steel mesh.

As an improvement of the parent platform printer of the present invention, when there are two or more child platforms, the CCD module sequentially or simultaneously locates the position identification points of the substrate and steel mesh on the parent platform and the child platform, The platform and the sub-platform adjust the overlap of the base plate and the steel mesh sequentially or simultaneously.

As an improvement of the parent platform printer of the present invention, when there is one child platform, the CCD module separately locates the position recognition point of the substrate and the steel mesh on the mother platform, and the mother platform adjusts the overlap of the substrate and the steel mesh. The sub-platform remains stationary.

Compared with the prior art, the advantages of the present invention are: the present invention adopts a sub-platform and a parent platform. The sub-platform and the parent platform can be completely independent, and the sub-platform can also be embedded in the parent platform. The parent platform and the sub-platform can adjust the overlap of the substrate and the stencil position identification point in turn, and can also control the substrate and the stencil on the parent platform separately Coincidence of position identification points. Multiple substrates can be printed at the same time, and each substrate can be the same or different substrates can be selected; improve printing efficiency.

Another object of the present invention is to provide a method for adjusting the printing of the mother and child platform. A child platform, a mother platform and a CCD module are arranged on the printing frame, and the child platform is embedded in the mother platform, including the following steps:

(1) Substrate transport: transport the jig loaded with two substrates or more than two substrates to the center of the printing machine through the transport rail, and the vacuum pump is turned on;

(2) The MARK point coincides and aligns; the platform module is lifted by the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module locates the substrate on the mother platform and the steel mesh MARK Point, the mother platform adjusts the base plate to coincide with the steel mesh; the platform module includes the child platform and the mother platform;

(3) Then the CCD module locates the MARK point of the substrate and the steel mesh on the sub-platform, and the sub-platform adjusts the substrate to coincide with the steel mesh;

(4) After the adjustment of multiple substrates is completed, the platform module rises to the printing position, and multiple substrates are printed at the same time. After the multiple substrates are printed, the platform is lowered, and the jigs loaded with substrates are transported out of the printer through the transportation rail;

(5) The sub-platform and the parent platform can be compensated separately.

Another object of the present invention is to provide a method for adjusting the printing of the mother and child platform. A child platform, a mother platform and a CCD module are arranged on the printing frame, and the child platform and the mother platform are independent, including the following steps:

(2) The MARK point coincides and aligns; the platform module is lifted from the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module locates the substrate on the sub-platform and the mother platform at the same time At the same time as the MARK point of the steel mesh, the sub-platform and the mother platform adjust the overlap of the substrate and the steel mesh; the platform module includes the sub-platform and the mother platform;

(3) After the adjustment of multiple substrates is completed, the platform module rises to the printing position, and multiple substrates are printed at the same time. After the printing is completed, the platform module descends, and the jig loaded with multiple substrates is transported out of the printer through the transportation rail;

(4) The sub-platform and the parent platform can be compensated separately.

Another object of the present invention is to provide a method for adjusting the printing of the mother and child platform. A child platform, a mother platform and a CCD module are arranged on the printing frame, and the child platform and the mother platform are integrated, including the following steps:

(1) Substrate transportation: transport the jig loaded with a single substrate to the center of the printing machine through the transport rail, and the vacuum pump is turned on;

(2) The MARK point coincides and aligns; the platform module is lifted by the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module separately positions the substrate and the steel mesh on the mother platform MARK point, the mother platform adjusts the substrate to coincide with the steel mesh, and the child platform does not move; the platform module includes the child platform and the mother platform;

(3) After the substrate positioning is completed, the platform module rises to the printing position, and the substrate is printed. After the printing is completed, the platform module descends, and the jig loaded with a single substrate is transported out of the printer through the transportation rail.

BRIEF DESCRIPTION

The present invention and its beneficial technical effects will be further described in detail below based on the drawings and specific embodiments, in which:

Figure 1 is a schematic diagram of the three-dimensional structure of the present invention.

Figure 2 is a schematic diagram of the CCD module structure.

Reference signs name: 1. Mother platform 2. Sub platform 3. CCD module 4. Suction cavity fixture 5. Transportation rail.

detailed description

The following further describes the present invention based on the drawings and specific embodiments, but the implementation of the present invention is not limited thereto.

Embodiment 1: As shown in FIG. 1 and FIG. 2, a mother-child platform printer includes a mother platform 1, a child platform 2 and a CCD module 3. When printing multiple substrates at the same time, the sub-platform 2 also has two or more. Each sub-platform 2 and the mother platform 1 are independent. The CCD module 3 positions and adjusts the substrates on the mother platform 1 and each sub-platform 2 at the same time. The coincidence of the identification points of the steel mesh position. In detail, the CCD module 3 simultaneously locates the position identification points of the substrate and the steel mesh on the mother platform 1 and each sub platform 2 so that the mother platform 1 and each sub platform 2 adjust the overlap of the substrate and the steel mesh.

The sub-platform 2 is provided with a suction cavity fixture 4. The suction cavity fixture 4 is used to adsorb the substrate on the fixture.

Preferably, the CCD module 3 is arranged above the mother platform 1 and the sub platform 2.

It also includes two transport rails 5 for transporting substrate jigs. The suction cavity jig 4 is located between the two transport rails 5, the transport rail 5 is above the mother platform 1, and the transport rail 5 will carry the substrate jigs Convey to the center of the printer, the mother platform 1 is lifted to the image capturing position, the suction cavity fixture 4 absorbs the substrate, and the CCD module 3 locates the identification points of the substrate and steel mesh on the mother platform 1 and the sub platform 2.

The CCD module 3 has an X-axis moving device 31 and a Y-axis moving device 32. The X-axis moving device 31 is equipped with a CCD33, the X-axis moving device 31 is controlled by the Y-axis moving device 32, and the CCD33 is controlled by the X-axis moving device 31. . Find the position identification point and the position of the substrate and steel mesh through CCD33.

The printing steps of this embodiment:

(3) After the adjustment of the multiple substrates is completed, the platform module rises to the printing position, and multiple substrates are printed at the same time. After the printing is completed, the platform module descends, and the jig loaded with multiple substrates is transported out of the printer through the transportation rail.

(4) The sub-platform and the parent platform can be compensated separately.

The second embodiment: a mother-child platform printer, including a mother platform 1, a child platform 2 and a CCD module 3. The sub-platform 2 also has two or more. Each sub-platform is adsorbed with a substrate. A plurality of sub-platforms 2 are embedded in the mother platform 1. The CCD module 3 positions and adjusts the substrates on the mother platform 1 and the child platform 2 in turn. The coincidence of the identification points of the steel mesh position. In detail, the CCD module 3 sequentially locates the position identification points of the substrate and the steel mesh on the mother platform 1 and the sub platform 2 so that the mother platform 1 and the sub platform 2 adjust the overlap of the substrate and the steel mesh.

The printing steps of this embodiment:

(5) The sub-platform and the parent platform can be compensated separately.

The third embodiment: a mother-child platform printer, including mother platform 1, child platform 2, and CCD module 3. There is one sub-platform 2, and each sub-platform has a substrate adsorbed on it. The sub-platform 2 is embedded in the mother platform 1. The CCD module 3 separately adjusts the overlap between the substrate on the mother platform 1 and the position identification point of the steel mesh. In detail, the CCD module 3 separately locates the position identification points of the substrate and the steel mesh on the mother platform 1 so that the mother platform 1 adjusts the overlap of the substrate and the steel mesh.

A method for adjusting and printing on a sub-platform. A sub-platform, a mother platform and a CCD module are arranged on a printing frame. The sub-platform and the mother platform are integrated and include the following steps:

(3) After the substrate adjustment is completed, the platform module rises to the printing position, and the substrate is printed. After the printing is completed, the platform module descends, and the jig loaded with a single substrate is transported out of the printer through the transportation rail.

The invention adopts a sub-platform and a parent platform. The sub-platform and the parent platform can be completely independent, and the sub-platform can also be embedded in the parent platform. The parent platform and the sub-platform can simultaneously adjust the overlap of the substrate and the steel mesh position identification point, or can independently control and adjust the parent platform or the sub-platform. The overlap of the base plate and the identification point of the steel mesh. Multiple substrates can be printed at the same time, and each substrate can be the same or different; improving printing efficiency.

Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, and substitutions can be made to these embodiments without departing from the principle and structure of the present invention. And variations, the scope of the present invention is defined by the appended claims and their equivalents.

Claims

A mother-and-child platform printer, which is characterized by comprising a mother platform, a child platform, and a CCD module. The CCD module sequentially or simultaneously locates the position recognition points of the substrate and steel mesh on the mother platform and the child platform. The mother platform and the child platform are adjusted The overlap of the substrate and the steel mesh.
The mother-and-child platform printing press of claim 1, wherein a suction cavity fixture is provided on the child platform, and when the child platform is an independent platform, the CCD module is positioned on both the mother platform and the child platform. The position identification point of the base plate and the steel mesh, the mother platform and the sub-platform simultaneously adjust the overlap of the base plate and the steel mesh.
The mother-and-child platform printing machine according to claim 1, wherein the child platform is embedded in the mother platform, and the CCD module sequentially locates the position identification points of the substrate and the steel mesh on the mother platform and the child platform, The mother platform and the child platform sequentially adjust the overlap of the base plate and the steel mesh.
4. The mother-child platform printer of claim 1, wherein the CCD module is arranged above the mother platform and the child platform.
The mother-and-child platform printing machine according to claim 2, further comprising two transport rails for transporting substrate jigs, and the suction cavity jig is located between the two transport rails. The transportation guide rail is located above the mother platform, the transportation guide rail transports the jig carrying the substrate to the center position of the printer, the mother platform is lifted to the image capturing position, the suction cavity jig absorbs the substrate, the The CCD module locates the position identification points of the substrate and the steel mesh on the mother platform and the sub platform, and the mother platform and the sub platform adjust the overlap of the substrate and the steel mesh.
The mother-and-child platform printer according to claim 1, wherein when the number of child platforms is two or more, the CCD module simultaneously or sequentially locates the positions of the substrate and the steel mesh on the mother platform and the child platform To identify the point, the mother platform and the child platform adjust the overlap of the substrate and the steel mesh in turn.
The parent-child platform printer according to claim 1, wherein when the number of the child platform is one, the CCD module and the parent platform are separately positioned to adjust the overlap between the substrate and the steel mesh position identification point, and the child platform stay still.
A method for adjusting and printing of a mother-and-child platform. A child platform, a mother platform and a CCD module are arranged on a printing frame, and the child platform is embedded in the mother platform. The method is characterized in that it comprises the following steps:

(1) Substrate transport: transport the jig loaded with two substrates or more than two substrates to the center of the printing machine through the transport rail, and the vacuum pump is turned on;

(2) The MARK point coincides and aligns; the platform module is lifted by the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module locates the substrate on the mother platform and the steel mesh MARK Point, the mother platform adjusts the base plate to coincide with the steel mesh; the platform module includes the child platform and the mother platform;

(3) Then the CCD module locates the MARK point of the substrate and the steel mesh on the sub-platform, and the sub-platform adjusts the substrate to coincide with the steel mesh;

(4) After the multiple substrates are adjusted and adjusted, the platform module rises to the printing position, and multiple substrates are printed at the same time. After the multiple substrates are printed, the platform is lowered, and the jig loaded with the substrate is transported out of the printer through the transportation rail;

(5) The sub-platform and the parent platform can be compensated separately.
A method for adjusting and printing on a sub-mother platform. A sub-platform, a mother platform and a CCD module are arranged on a printing frame. The sub-platform and the mother platform are independent, and are characterized in that they include the following steps:

(1) Substrate transport: transport the jig loaded with two substrates or more than two substrates to the center of the printing machine through the transport rail, and the vacuum pump is turned on;

(2) The MARK point coincides and aligns; the platform module is lifted by the lifting device to the image capturing position, the suction cavity fixture on the sub-platform sucks the substrate, and the CCD module positions the substrate and the substrate on the sub-platform and the mother platform at the same time. The steel mesh MARK point, and then the sub-platform and the mother platform simultaneously adjust the substrate to coincide with the steel mesh; the platform module includes the sub-platform and the mother platform;

(3) After the adjustment of multiple substrates is completed, the platform module rises to the printing position, and multiple substrates are printed at the same time. After the printing is completed, the platform module descends, and the jig loaded with multiple substrates is transported out of the printer through the transportation rail;

(4) The sub-platform and the parent platform can be compensated separately.
A method for adjusting and printing of a sub-platform. A sub-platform, a mother platform and a CCD module are arranged on a printing frame. The sub-platform and the mother platform are integrated. The method is characterized in that it comprises the following steps:

(1) Substrate transportation: transport the jig loaded with a single substrate to the center of the printing machine through the transport rail, and the vacuum pump is turned on;

(2) The MARK point coincides and aligns; the platform module is lifted by the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module separately positions the substrate and the steel mesh on the mother platform MARK point, then the mother platform adjusts the substrate to overlap with the steel mesh, and the child platform does not move; the platform module includes the child platform and the mother platform;

(3) After the substrate positioning is completed, the platform module rises to the printing position, the substrate is printed, and the platform module descends after the printing is completed, and the jig loaded with a single substrate is transported out of the printer through the transport rail.