CN208421518U

CN208421518U - Automatic aligning exposure machine

Info

Publication number: CN208421518U
Application number: CN201821161874.5U
Authority: CN
Inventors: 程新安
Original assignee: Shenzhen Sanword Automation Equipment Co Ltd
Current assignee: Shenzhen Sanword Automation Equipment Co Ltd
Priority date: 2018-07-20
Filing date: 2018-07-20
Publication date: 2019-01-22
Anticipated expiration: 2028-07-20

Abstract

The utility model relates to a kind of automatic aligning exposure machines, it includes upper Exposing Lamp, lower Exposing Lamp, on to bit platform, under to bit platform, locating platform and CCD photographing module, the CCD photographing module is before upper Exposing Lamp and lower Exposing Lamp expose for the first time, capture is carried out to the predetermined reference point on upper film and lower film, position adjustment is carried out to bit platform with lower to bit platform on promoting, film is completely coincident with the predetermined reference point on lower film in realization, after the completion of the upper Exposing Lamp and lower Exposing Lamp expose every time, figure can be formed on substrate and for providing the exposure reference point that upper film and lower film and substrate are aligned next time, save the process in substrate secondary operation reference point, improve production efficiency, promote the quality and yields of product, save cost.

Description

Automatic aligning exposure machine

Technical field

It is right the utility model relates to a kind of exposure machine more particularly to a kind of automatic aligning exposure machine with to bit platform Bit platform for realizing film and substrate contraposition.

Background technique

Exposure machine is widely applied on motor sci-tech product, is mainly used for the graph copying that will be supported on film transfer Onto substrate, for the yield for guaranteeing product, film must be aligned with substrate, and otherwise the deviation of substrate appearance position can shadow Ring the molding to figure on substrate.

PCB (printed circuit board) figure, the exposure production of welding resistance process at present, mainly take craft between film and substrate Contraposition, operating personnel according to the location hole drilled out on the set location hole and substrate on film, visually by film with Substrate is overlapped, and then the two is bonded together by adhesive tape, realizes the purpose of contraposition.But this manual mode exist with Lower defect: it is big to think that factor influences in manual alignment, be easy to cause product differentiation and fault；Manual alignment requires operating personnel special Industry technical ability is high, and production efficiency is low；Due to using adhesive tape gluing, it is easy to fall off, shifts in operation.

Thus, it is necessary to design the new exposure machine of one kind to solve the above technical problems.

Utility model content

The purpose of this utility model is to provide a kind of automatic aligning exposure machines for saving substrate secondary operation reference point.

To realize foregoing purpose, the utility model adopts the following technical solution: a kind of automatic aligning exposure machine comprising on Exposing Lamp, lower Exposing Lamp, to place film on one on to bit platform, on to below bit platform to place The lower locating platform and an at least CCD photographing module to bit platform, for placing substrate of film, an at least CCD take the photograph Picture module clicks through the predetermined reference on upper film and lower film before upper Exposing Lamp and lower Exposing Lamp expose for the first time Row capture, promote on to bit platform and it is lower position adjustment is carried out to bit platform, the upper film of realizations makes a reservation for on lower film Reference point is completely coincident, and after the completion of the upper Exposing Lamp and lower Exposing Lamp expose every time, figure and use can be formed on substrate In the offer exposure reference point that upper film and lower film and substrate are aligned next time.

Further, film is driven to be bonded after moving down with substrate before exposure to bit platform on described, Upper film is driven to move up after the completion of exposure.

Further, the automatic aligning exposure machine includes the first, second CCD photographing module, first, second CCD Photographing module exposes molding exposure reference point for the last time on capture substrate, is easy to implement the exposure reference point and upper phenanthrene The predetermined reference point exactitude position of forest tract, lower film.

Further, the automatic aligning exposure machine also includes the 3rd CCD photographing module, the 3rd CCD photographing module The predetermined reference point progress position reinspection of film, lower film in capture.

The utility model automatic aligning exposure machine exposes each time automatically generate confession after once upper film and lower film The exposure reference point aligned with substrate, the process that the secondary operation reference point on substrate is omitted, it is easier to manufacture, improve Production efficiency promotes the quality and yields of product, saves cost.

Detailed description of the invention

Fig. 1 is the stereoscopic schematic diagram of the utility model automatic aligning exposure machine.

Fig. 2 is stereoscopic schematic diagram when the utility model automatic aligning exposure machine works.

Fig. 3 is the stereoscopic schematic diagram of another angle of Fig. 2.

Fig. 4 is the schematic diagram of film and substrate.

Specific embodiment

Shown in please referring to Fig.1 to Fig.4, the utility model automatic aligning exposure machine 100, including upper Exposing Lamp 11, lower exposure Machine 12, on to bit platform 21, on to the lower section of bit platform 21 it is lower to bit platform 22, be located to bit platform 21 and lower contraposition Locating platform 30 between platform 22, on to the first, second, third CCD photographing module 41,42,43 on bit platform 21.

Upper Exposing Lamp 11 is located at the top to bit platform 21, and lower Exposing Lamp 12 is located at the lower lower section to bit platform 22.

On to bit platform 21 for placing and position film 51 on one, horizontal movement and can move up and down, level fortune Dynamic includes to rotate horizontally and move horizontally.

Under to bit platform 22 for placing and position film 52, also being capable of horizontal movement.

Locating platform 30 is for placing and positioning substrate 60, by the light-illuminating of upper Exposing Lamp 11, by upper film 51 On graph copying be transferred to 60 upper surface of substrate；By the light-illuminating of lower Exposing Lamp 12, by the figure on lower film 52 Duplication is transferred to 60 lower surface of substrate, and final 60 upper and lower surface of substrate has been separately formed figure.

100 working method of the utility model automatic aligning exposure machine, includes the following steps:

Firstly, place upper film 51 upper on bit platform 21, lower film 52 lower on bit platform 22, first, Predetermined reference point on 41,42,43 pairs of second, third CCD photographing module upper films 51 and lower film 52 carries out capture.

Position adjustment is carried out to bit platform 22 with lower to bit platform 21 on secondly, promotes upper film 51 and lower film 52 predetermined reference point is completely coincident.

Then, place substrate 60 on locating platform 30, on bit platform 21 is declined, be bonded with substrate 60, upper Exposing Lamp 11 expose for the first time with lower exposure machine 12, and 60 upper and lower surface of substrate forms figure and for the first time exposure reference point, and certainly, this first Secondary exposure reference point can be a part of figure, after exposing for the first time, on bit platform 21 is risen, while moving substrate 60, Substrate 60 it is mobile in place after, the first, second CCD photographing module 41,42 captures exposure reference point for the first time, on to bit platform 21, Under to bit platform 22 move, promote upper film 51, lower film 52 predetermined reference point and substrate 60 first time exposure join According to exactitude position to theoretical position, the predetermined reference point of film 51, lower film 52 in 43 capture of the 3rd CCD photographing module Carry out position reinspection.

Bit platform 21 is declined again on finally, and is bonded with substrate 60, upper Exposing Lamp 11, lower exposure machine 12 carry out second Exposure forms figure and second exposure reference point, after second exposes, on bit platform 21 is risen, substrate 60 is mobile, with this Analogize, exposure each time automatically generates the exposure that once upper film 51 and lower film 52 and substrate 60 are aligned after confession and joins Examination point, the process for eliminating secondary operation reference point improve production efficiency, reduce production cost.

The utility model automatic aligning exposure machine 100, which is directed to, needs substrate 60 that is secondary and needing to process more than two times, on It is accurately positioned between film 51 and lower film 52 and substrate 60 using the exposure reference point that preceding single exposure comes out, Since exposure reference point automatically forms in preceding single exposure, the process that the secondary operation reference point on substrate 60 is omitted, more It is easily fabricated, production efficiency is improved, the quality and yields of product is promoted, saves cost.

Although for illustrative purposes, preferred embodiments of the present invention are had been disclosed, but the common skill of this field Art personnel will realize the situation of the scope of the utility model and spirit disclosed in not departing from by appended claims Under, various improvements, additions and substitutions are possible.

Claims

1. a kind of automatic aligning exposure machine comprising upper Exposing Lamp, lower Exposing Lamp, the upper contraposition to place film on one are flat Platform, on to below bit platform to place film lower locating platform to bit platform, for placing substrate and An at least CCD photographing module, the locating platform are located to bit platform and lower between bit platform, it is characterised in that: described An at least CCD photographing module is before upper Exposing Lamp and lower Exposing Lamp expose for the first time, on upper film and lower film Predetermined reference point carries out capture, promote on to bit platform and it is lower position adjustment is carried out to bit platform, film and lower phenanthrene in realizations Predetermined reference point on forest tract is completely coincident, can be on substrate after the completion of the upper Exposing Lamp and lower Exposing Lamp expose every time Form figure and for providing the exposure reference point that upper film, lower film and substrate are aligned next time.

2. automatic aligning exposure machine according to claim 1, it is characterised in that: to bit platform band before exposure on described Dynamic upper film is bonded after moving down with substrate, and upper film is driven to move up after completion of the exposure.

3. automatic aligning exposure machine according to claim 1, it is characterised in that: the automatic aligning exposure machine includes the One, the 2nd CCD photographing module, the first, second CCD photographing module expose molding exposure for the last time on capture substrate Optical reference point is easy to implement the predetermined reference point exactitude position of the exposure reference point and upper film, lower film.

4. automatic aligning exposure machine according to claim 3, it is characterised in that: the automatic aligning exposure machine also includes Three CCD photographing modules, predetermined reference point progress position of the 3rd CCD photographing module for film, lower film in capture Set reinspection.