CN108258158A - A kind of jig for backplane, backplane device and method - Google Patents
A kind of jig for backplane, backplane device and method Download PDFInfo
- Publication number
- CN108258158A CN108258158A CN201810086670.8A CN201810086670A CN108258158A CN 108258158 A CN108258158 A CN 108258158A CN 201810086670 A CN201810086670 A CN 201810086670A CN 108258158 A CN108258158 A CN 108258158A
- Authority
- CN
- China
- Prior art keywords
- groove
- backboard
- fit
- hole
- negative pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
This application discloses a kind of jigs for backplane, backplane device and method, the jig includes at least one fitting template, the fitting template surface is recessed to form adjacent the first groove and the second groove, second bottom portion of groove is recessed to form third groove, first groove is used to place the backboard of display module display area, second groove is used to place the flexible substrate of outer lead fit area, third groove is used to place backboard to be fit, so that when backboard to be fit is positioned over third groove, backboard to be fit does not protrude the bottom of the second groove towards the surface of the second groove；Wherein, fitting template corresponds to third recess region and is formed with first through hole, first through hole connection third groove and the external world, and the flexible substrate is attached to generate negative pressure backboard to be fit by the first through hole.By the above-mentioned means, the application can be to avoid the damage of pair of rollers fit area.
Description
Technical field
This application involves display fabrication techniques fields, are pasted more particularly to a kind of for jig, the backboard of backplane
Close device and method.
Background technology
With the development of display industry, people are to showing that the screen accounting of equipment pursues higher and higher, traditional LC D (Liquid
Crystal Display, liquid crystal display) display screen, due to screen lower end OLB (Outer Lead Bonding, outer lead patch
Close) presence in region, whole accounting of shielding is caused not promoted further.With flexible OLED (Organic Light
Emitting Display, organic light emitting display) development, by by the OLB regions of panel be folded to back side of panel (referred to as
Pad bending technologies) so that screen lower frame further reduces, and whole accounting of shielding improves.For using pad bending
The panel of technology, in order to enable the OLB regions of panel are more advantageous to bending, BP (Back Plate, the back of the body below display base plate
Plate) layer must use sectional design, i.e., there was only flexible base board in the part of bending.Because the sectional design of BP so that BP
Fitting needs to carry out in two times, and the BP below display screen AA (Active Area, effective display area domain) area can pass through biography
The idler wheel laminating type of system is bonded, but the strip BP below OLB regions, due to the fit area of panel
(bonding regions) and it is attached at the COF (Chip On Film, chip on film) in bonding regions or FPC (Flexible
Printed Circuit, flexible PCB) presence, when being bonded using pair of rollers BP, idler wheel can be to bonding regions
It causes to damage.
Apply for content
The application is mainly solving the technical problems that provide a kind of for the jig of backplane, backplane equipment and side
Method can solve the problems, such as easily to damage bonding regions using idler wheel fitting backboard.
In order to solve the above technical problems, the technical solution that the application uses is：It provides a kind of for backplane
Jig, including：At least one fitting template, the recessed formation of the fitting template surface adjacent the first groove and the second groove, second
Bottom portion of groove is recessed to form third groove, and the first groove is used to place the backboard of display module display area, and the second groove is used
In the flexible substrate for placing outer lead fit area, third groove is for placing backboard to be fit, so that backboard to be fit is put
When being placed in third groove, backboard to be fit does not protrude the bottom of the second groove towards the surface of the second groove；Wherein, it is bonded template
Corresponding third recess region is formed with first through hole, first through hole connection third groove and the external world, to be produced by the first through hole
Raw negative pressure causes backboard to be fit to be attached at the flexible substrate.
In order to solve the above technical problems, another technical solution that the application uses is：A kind of backplane equipment is provided,
Including at least jig as described above and negative pressure adsorption equipment；The jig is used to place backboard to be fit and display module；Negative pressure
Adsorbent equipment is used for the flexible substrate for generating negative pressure backboard to be fit by first through hole and being attached at outer lead fit area
Surface.
In order to solve the above technical problems, another technical solution that the application uses is：A kind of backplane method is provided,
The backplane method is applied to backplane equipment as described above, which includes：Backboard to be fit is put
It is placed in third groove；Display module is positioned over fitting template, so that the backboard of display module display area is positioned over first
Groove, outer lead fit area are positioned over the second groove；Negative pressure is generated by first through hole using negative pressure adsorption equipment, so that
Backboard to be fit is attached at the flexible substrate surface of outer lead fit area.
The advantageous effect of the application is：The situation of the prior art is different from, in the section Example of the application, for backboard
The jig of fitting includes at least one fitting template, and the fitting template surface is recessed to form adjacent the first groove and the second groove,
Second bottom portion of groove is recessed to form third groove, and the first groove is used to place the backboard of display module display area, and second is recessed
Slot is used to place the flexible substrate of outer lead fit area, and third groove is for placing backboard to be fit, so that the back of the body to be fit
When plate is positioned over third groove, backboard to be fit does not protrude the bottom of the second groove towards the surface of the second groove；Wherein, it is bonded
Template corresponds to third recess region and is formed with first through hole, first through hole connection third groove and the external world, with first logical by this
Hole generates negative pressure and backboard to be fit is caused to be attached at the flexible substrate.It is pasted by the above-mentioned means, the application is used for backboard using this
The jig of conjunction can place backboard to be fit and display module, and the third recess region for placing the backboard to be fit is formed with
One through-hole can generate negative pressure using the first through hole so that and the backboard to be fit is attached at the flexible substrate, without
It is bonded using idler wheel mode, it can be to avoid the damage of pair of rollers fit area.
Description of the drawings
Fig. 1 is structure diagram of the application for the jig first embodiment of backplane；
Fig. 2 is the structure diagram of display module and backboard to be fit；
Fig. 3 is the cross section structure schematic diagram that display module is bonded after backboard to be fit；
Fig. 4 is the structure diagram that the second through-hole is formed on backboard to be fit；
Fig. 5 is that display module is bonded backboard to be fit and carries out the cross section structure schematic diagram after panel bending technique；
Fig. 6 is structure diagram of the application for the jig second embodiment of backplane；
Fig. 7 is the structure diagram of one embodiment of the application backplane equipment；
Fig. 8 is the flow diagram of one embodiment of the application backplane method.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, the technical solution in the embodiment of the present application is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the application, instead of all the embodiments.It is based on
Embodiment in the application, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall in the protection scope of this application.
As shown in Figure 1, the application includes for the jig first embodiment of backplane：At least one fitting template 40, should
It is bonded that template 40 surface is recessed to form adjacent the first groove 41 and the second groove 42,42 bottom of the second groove is recessed to form the
Three grooves 43, the first groove 41 are used to place the backboard of display module display area, and the second groove 42 pastes for placing outer lead
The flexible substrate in region is closed, third groove 43 is for placing backboard to be fit, so that backboard to be fit is positioned over third groove
When 43, backboard to be fit does not protrude the bottom of the second groove 42 towards the surface of the second groove 42；
Wherein, fitting template 40 corresponds to 43 region of third groove and is formed with first through hole 431, the connection of first through hole 431 the
Three grooves 43 and the external world are attached at outer lead fit area to generate negative pressure backboard to be fit by first through hole 431
Flexible substrate.
In the present embodiment, the jig can include it is multiple fitting templates 40, so as to using it is multiple fitting templates 40 simultaneously into
Row backplane improves fitting efficiency.Wherein, the size for being bonded each groove in template 40 can be according to display module and waiting to paste
The size setting of backboard is closed, is not specifically limited herein.It is illustrated so that one is bonded template 40 as an example below.
Specifically, which can be formed in the bottom (431a in such as Fig. 1) of third groove 43, can also
43 side of third groove (431b in such as Fig. 1) is formed in, it is of course also possible to be formed simultaneously in the bottom of third groove 43 and side
Face.
In an application examples, with reference to shown in Fig. 2 and Fig. 3, which includes the back of the body of display area stacked gradually
Flexible substrate PI, polaroid POL, touch panel TP and the packaging film of plate BP1, covering display area and outer lead fit area
The CW and chip on film COF or flexible PCB FPC (20 in such as Fig. 2) for being attached at PI outer leads fit area.
In the fitting template 40, the first groove 41 is used to place the backboard BP1 of display area 10, and the second groove 42 is used to put
The flexible substrate PI of outer lead fit area 11 is put, third groove 43 is used to place backboard 30 to be fit.Carrying out backplane
When, the protective film on 30 1 surface of backboard to be fit is removed, and after the viscose glue of exposing surface, is placed in third groove 43,
At this point, the backboard 30 to be fit towards the surface of the second groove 42, i.e., the surface that viscose glue exposes cannot protrude second groove 42
Bottom, that is to say, that the depth of the third groove 43 is not less than the thickness of the backboard 43 to be fit.For example, the third groove 43
Size can be consistent with the size of backboard 30 to be fit, which is positioned in the third groove 43, with
Anawgy accuracy is improved in follow-up fitting.Then, display module is positioned in the fitting template 40, at this point, display area 10
Backboard BP1 be placed in the first groove 41, the flexible substrate PI of outer lead fit area 11 is placed on the second groove 42,
To position the display module using the first groove 41 and the second groove 42.Size and backboard 30 to be fit when third groove 43
When size is consistent, when which is positioned in fitting template 40, the viscose glue on 30 surface of backboard to be fit can contact outside
The surface of the flexible substrate PI of lead fit area 11, at this point, the first through hole by 43 bottom of third groove and/or side
431 when the air in the third groove 43 is extracted out, which can generate negative pressure, so as to the flexible liner
Bottom PI surfaces and the backboard 30 to be fit apply pressure towards the surface of flexible substrate PI, finally so that the backboard 30 to be fit pastes
Invest the surface of the flexible substrate PI of outer lead fit area.
It, can be only when the size of third groove 43 is consistent with the size of backboard 30 to be fit further combined with shown in Fig. 4
Multiple first through hole 431a are formed in the bottom of the third groove 43, it is logical which is formed with multiple second
Hole 31, which runs through the backboard 30 to be fit, when backboard 30 to be fit is positioned over third groove 43, at least partly
First through hole 431a is be overlapped with the second through-hole 31 of backboard 30 to be fit, that is, the first through hole 431a and the second through-hole 31 being overlapped connect
Logical third groove 43 and the external world, after display module is positioned over fitting template 40, pass through the first through hole 431a of overlapping and second
Through-hole 31 can extract the air between backboard 30 to be fit and flexible substrate PI out, by not be overlapped with first through hole 431a
The second through-hole 31, the air between 43 bottom of backboard 30 and third groove to be fit can be extracted out, so as to generate negative pressure,
So that 30 bottom of backboard to be fit is pressed in 43 bottom of third groove, but since 30 bottom of backboard to be fit is pasted with protective film,
30 bottom of backboard to be fit will not adhere to 43 bottom of third groove, and negative pressure can cause the flexibility of outer lead fit area 11
Substrate PI presses downwards the backboard 30 to be fit, so that the viscose glue on 30 surface of backboard to be fit can adhere to the flexible liner
Bottom PI surfaces, most backboard 30 to be fit is attached at flexible substrate PI surfaces at last.
In another application examples, 43 bottom of third groove is formed at least one first through hole 431a, and side is formed with
At least one first through hole 431b, the depth of the third groove 43 can be more than the thickness of the backboard 30 to be fit, this is to be fit
Backboard 30 is positioned over the third groove 43, and when the flexible substrate PI of outer lead fit area 11 is positioned over the second groove 42, this is treated
The viscose glue on 30 surface of fitting backboard does not contact flexible substrate PI surfaces, at this point it is possible to wait to paste by this by first through hole 431b
The air extraction between backboard 30 and flexible substrate PI is closed, then external air pressure is more than third groove inner air pressure, generates
Negative pressure, so as to apply the pressure of the second groove 42 of direction to backboard 30 to be fit by first through hole 431a, ambient pressure is outside
The flexible substrate PI of lead fit area 11 applies the pressure towards third groove 43, so that backboard to be fit 30 is attached at
The flexible substrate PI surfaces of outer lead fit area 11.
Certainly, in other application example, can first through hole 431, the back of the body to be fit only be formed in the side of third groove 43
30 surface of plate can not also form the second through-hole 31, will be in third groove 43 by the first through hole 431 when being bonded
Air is extracted out, forms negative pressure so that backboard 30 to be fit is attached at the flexible substrate PI surfaces of outer lead fit area 11.
The jig of the present embodiment is used to the backboard (BP2 in 30 or Fig. 3 in such as Fig. 2) to be fit being attached at outer draw
The flexible substrate PI surfaces of line fit area 11, ultimately form panel construction as shown in Figure 3.Then panel bending may be used
(Pad Bending) technology, the region that outer lead fit area is not bonded to backboard are bent, and form Bending regions, and
Increase by a stiffening plate Stiff between the backboard BP1 of display area and the backboard BP2 of outer lead fit area fitting after bending,
To form display panel structure as shown in Figure 5.
In the present embodiment, backboard to be fit and display module can be placed using the jig, and places the backboard to be fit
Third recess region be formed with first through hole, negative pressure can be generated using the first through hole so that the backboard to be fit attaches
It, can be to avoid the damage of pair of rollers fit area without being bonded using idler wheel mode in the flexible substrate.
In other embodiments, which can also be formed with the 4th groove, and outer lead conformable region is attached at for placing
The COF or FPC in domain.
Specifically as shown in fig. 6, the application pastes for the jig second embodiment 50 of backplane with the application for backboard
The structure of the jig first embodiment of conjunction is similar, and the difference lies in the jig 50 of, the present embodiment, to be formed further with the 4th recessed
Slot 44, the 4th groove 44 is adjacent with the second groove 42, for place be attached at outer lead fit area chip on film COF or
Flexible PCB FPC.
Wherein, the 4th groove 44 can be connected with second groove 42, and the size of the 4th groove 44 is not less than draws outside
The size of the chip on film COF or flexible PCB FPC of line fit area, for example, can be consistent with the size of COF or FPC, from
And realize the positioning of COF or FPC so that the fitting template can limit the moving range of the display module during fitting backboard, into
And improve backplane precision.
Optionally, Fig. 6 is further regarded to, the bottom which corresponds to the first groove 41 is formed with third through-hole
411, when attaching backboard to be fit, negative pressure is generated to fix the backboard of display module display area using third through-hole 411,
So that the backboard of the display area is adsorbed on 41 bottom of the first groove, will not arbitrarily move, so as to subsequently through third
When the first through hole in 43 region of groove generates negative pressure attaching backboard to be fit, which is positioned at each of the fitting template 50
In a groove, Anawgy accuracy is further improved.
As shown in fig. 7, one embodiment 70 of the application backplane equipment includes：For the jig 701 of backplane and negative
Press adsorbent equipment 702.
Wherein, which can refer to structure of the application for the jig first or second embodiments of backplane,
It is not repeated herein.It is illustrated so that the application is for the structure of the jig second embodiment of backplane as an example below.
The jig 701 is used to place backboard to be fit and display module；The negative pressure adsorption equipment 702 is used for through the jig
The generation of first through hole 431 negative pressure in 43 region of third groove causes backboard to be fit to be attached at outer lead fit area in 701
Flexible substrate surface.
Wherein, which can be the device that vacuum pump etc. can generate negative pressure.
Specifically, in an application examples, which is formed with first through hole 431, negative pressure adsorption equipment
702 can be set to 43 bottom of third groove, when carrying out backplane, pass through the first through hole 431, negative pressure adsorption equipment
702 extract the air in third groove 43 out, so that ambient pressure is more than the air pressure in third groove 43, ambient pressure will
The flexible substrate of the outer lead fit area and backboard to be fit are pushed to 43 bottom of third groove, and back plate surface to be fit is glued
Glue is close to the flexible substrate surface, and then backboard to be fit is attached to the flexible substrate surface of outer lead fit area.
Optionally, as shown in fig. 7, the negative pressure adsorption equipment 702 can include first pipe 7021, the first pipe 7021
First through hole 431 is connected, with when carrying out backplane, negative pressure adsorption equipment 702 passes through first pipe 7021, first through hole
431 extract the air in third groove 43 out.
Wherein, when being formed with the second through-hole on backboard to be fit, when which is positioned over third groove 43, the
One through-hole 431 and the second through-hole are least partially overlapped.
Wherein, pass through first through hole 431 or the first through hole 431 and second for passing through overlapping using negative pressure adsorption equipment 702
Through-hole, content of the application for the jig first embodiment of backplane can be referred to by carrying out the detailed process of backplane,
It is not repeated herein.
Optionally, Fig. 7 is further regarded to, negative pressure adsorption equipment 702 further comprises：Second pipe 7022, connection fitting
Template corresponds to the third through-hole 411 that the first groove 41 bottom is formed, with by second pipe 7022 and third through-hole 411 by first
Air extraction in groove 41, to generate negative pressure so that the backboard of display module display area is fixed in the first groove 41.
Wherein it is possible to using negative pressure adsorption equipment 702 by first pipe 7021 and second pipe 7022 simultaneously by third
Air extraction in 43 and first groove 41 of groove can also take out the air in the first groove 41 to by second pipe 7022
Go out, then extracted out the air in third groove 43 by first pipe 7021.
The detailed process of backplane is carried out by first through hole 431 and third through-hole 411 using negative pressure adsorption equipment 702
Content of the application for the jig second embodiment of backplane can be referred to, is not repeated herein.
In other embodiments, which can also place backboard to be fit and display mould including mechanical arm etc.
The discharging device of group, to realize automatic attaching backboard.It is of course also possible to further comprise feeding device, this will be fitted with and treated
The display module for being bonded backboard is taken out to carry out next step processing from fitting template.
As shown in figure 8, one embodiment of the application backplane method is applied to backplane equipment, the backplane equipment
The structure of one embodiment of the application backplane equipment can be referred to, this is not repeated.The present embodiment backplane method packet
It includes：
S120：Negative pressure is generated by the first through hole of third recess region using negative pressure adsorption equipment, so as to be fit
Backboard is attached at the flexible substrate surface of outer lead fit area.
Wherein, which is positioned in the third groove, and the flexible substrate of outer lead fit area is positioned over
Two grooves.
The backboard to be fit and display module can be positioned over backplane by discharging devices such as manually or mechanically arms and set
Standby fitting template.
Optionally, when the backplane equipment includes the discharging device for placing backboard to be fit and display module,
Before step S120, further comprise：
S111：Backboard to be fit is positioned over third groove；
S112：Display module is positioned over fitting template, so that the backboard of display module display area is positioned over first
Groove, the flexible substrate of outer lead fit area are positioned over the second groove；
Wherein it is possible to place the backboard to be fit and display module using discharging device.The discharging device can be machinery
Arm or vacuum absorption device etc..
Optionally, it before step S120, further includes：
S113：The air in the first groove is extracted out by third through-hole using negative pressure adsorption equipment, is made with generating negative pressure
The backboard for obtaining display module display area is fixed in the first groove.
In the present embodiment, the specific implementation process of above-mentioned steps can refer to the jig first that the application is used for backplane
Or the content of second embodiment, it is not repeated herein.
The foregoing is merely presently filed embodiments, not thereby limit the scope of the claims of the application, every to utilize this
It is relevant to be directly or indirectly used in other for the equivalent structure or equivalent flow shift that application specification and accompanying drawing content are made
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of jig for backplane, which is characterized in that including：At least one fitting template, the fitting template surface
Recessed to form adjacent the first groove and the second groove, second bottom portion of groove is recessed to form third groove, and described first
Groove is used to place the backboard of display module display area, and second groove is used to place the flexible liner of outer lead fit area
Bottom, the third groove are used to place backboard to be fit, so that when the backboard to be fit is positioned over the third groove, institute
The surface for stating backboard to be fit towards second groove does not protrude the bottom of second groove；
Wherein, the fitting template corresponds to the third recess region and is formed with first through hole, described in the first through hole connects
Third groove and the external world are attached at the flexible liner to generate the negative pressure backboard to be fit by the first through hole
Bottom.
2. jig according to claim 1, which is characterized in that the bottom of the third groove and/or side are formed
First through hole is stated, the air in the third groove is extracted out by the first through hole.
3. jig according to claim 2, which is characterized in that it is logical that the third bottom portion of groove is formed with multiple described first
Hole so that when the backboard to be fit is positioned over the third groove, at least partly described first through hole with it is described to be fit
The second through-hole overlapping on backboard.
4. according to claim 1-3 any one of them jigs, which is characterized in that the fitting template is formed further with and institute
The 4th adjacent groove of the second groove is stated, for placing the chip on film/flexible circuit for being attached at the outer lead fit area
Plate.
5. according to claim 1-3 any one of them jigs, which is characterized in that the fitting template corresponds to first groove
Bottom be formed with third through-hole, with when attaching the backboard to be fit, negative pressure is generated with fixation using the third through-hole
The backboard of the display module display area.
6. a kind of backplane equipment, which is characterized in that including at least such as claim 1-5 any one of them jig and negative pressure
Adsorbent equipment；
The jig is used to place backboard to be fit and display module；
The negative pressure adsorption equipment is used to be attached at by the first through hole generation negative pressure backboard to be fit described
The flexible substrate surface of outer lead fit area.
7. backplane equipment according to claim 6, which is characterized in that the negative pressure adsorption equipment includes：First pipe
Road connects the first through hole, so that the negative pressure adsorption equipment is by the first pipe, the first through hole and waits to paste
The second through-hole closed on backboard extracts the air in the third groove out；
Wherein, when the backboard to be fit is positioned over the third groove, the first through hole and second through-hole are at least
It partly overlaps.
8. backplane equipment according to claim 7, which is characterized in that the negative pressure adsorption equipment further comprises：
Second pipe connects the fitting template and corresponds to the third through-hole that first bottom portion of groove is formed, to be managed by described second
Road and third through-hole extract the air in first groove out, to generate the back of the body that negative pressure causes the display module display area
Plate is fixed in first groove.
A kind of 9. backplane method, which is characterized in that the backplane method is applied to such as any one of claim 6-8 institutes
The backplane equipment stated, the backplane method include：
Negative pressure is generated by the first through hole using negative pressure adsorption equipment, so that the backboard to be fit is attached at outside described
The flexible substrate surface of lead fit area；
Wherein, the backboard to be fit is positioned over third groove, and the backboard of display module display area is positioned over the first groove, institute
The flexible substrate for stating outer lead fit area is positioned over the second groove.
10. backplane method according to claim 9, which is characterized in that it is recessed that the fitting template corresponds to described first
The bottom of slot is formed with third through-hole, described to generate negative pressure by the first through hole using negative pressure adsorption equipment, so that institute
It states backboard to be fit to be attached at before the flexible substrate surface of the outer lead fit area, further comprise：
The air in first groove is extracted out by the third through-hole using the negative pressure adsorption equipment, to generate negative pressure
So that the backboard of the display module display area is fixed in first groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810086670.8A CN108258158B (en) | 2018-01-29 | 2018-01-29 | Jig for back plate attaching, back plate attaching equipment and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810086670.8A CN108258158B (en) | 2018-01-29 | 2018-01-29 | Jig for back plate attaching, back plate attaching equipment and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108258158A true CN108258158A (en) | 2018-07-06 |
| CN108258158B CN108258158B (en) | 2020-02-07 |
Family
ID=62742788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810086670.8A Active CN108258158B (en) | 2018-01-29 | 2018-01-29 | Jig for back plate attaching, back plate attaching equipment and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108258158B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244126A (en) * | 2020-01-20 | 2020-06-05 | 深圳市华星光电半导体显示技术有限公司 | Miniature display panel, manufacturing method and spliced display panel |
| CN113345918A (en) * | 2021-05-25 | 2021-09-03 | 武汉华星光电半导体显示技术有限公司 | Optically transparent flexible backboard, display device and manufacturing method of display device |
| CN115100958A (en) * | 2022-06-17 | 2022-09-23 | 合肥维信诺科技有限公司 | Laminating device and laminating method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203726958U (en) * | 2014-02-17 | 2014-07-23 | 苏州市健邦触摸屏技术有限公司 | Protective film attaching jig |
| KR20160043190A (en) * | 2014-10-10 | 2016-04-21 | 엘지디스플레이 주식회사 | Chip-On-Film Circuit and Flexible Display Device having the same |
| CN105989783A (en) * | 2015-03-17 | 2016-10-05 | 乐金显示有限公司 | Back plate member for flexible display, display apparatus including the same, and method of manufacturing the same |
| CN106910428A (en) * | 2017-03-02 | 2017-06-30 | 京东方科技集团股份有限公司 | The preparation method and flexible display apparatus of bending type flexible base board |
| CN107006088A (en) * | 2014-12-10 | 2017-08-01 | 乐金显示有限公司 | Flexible display apparatus with a variety of micro- coatings |
| CN206579245U (en) * | 2017-03-08 | 2017-10-24 | 东莞市凯运机械科技有限公司 | A kind of full joint tool |
-
2018
- 2018-01-29 CN CN201810086670.8A patent/CN108258158B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203726958U (en) * | 2014-02-17 | 2014-07-23 | 苏州市健邦触摸屏技术有限公司 | Protective film attaching jig |
| KR20160043190A (en) * | 2014-10-10 | 2016-04-21 | 엘지디스플레이 주식회사 | Chip-On-Film Circuit and Flexible Display Device having the same |
| CN107006088A (en) * | 2014-12-10 | 2017-08-01 | 乐金显示有限公司 | Flexible display apparatus with a variety of micro- coatings |
| CN105989783A (en) * | 2015-03-17 | 2016-10-05 | 乐金显示有限公司 | Back plate member for flexible display, display apparatus including the same, and method of manufacturing the same |
| CN106910428A (en) * | 2017-03-02 | 2017-06-30 | 京东方科技集团股份有限公司 | The preparation method and flexible display apparatus of bending type flexible base board |
| CN206579245U (en) * | 2017-03-08 | 2017-10-24 | 东莞市凯运机械科技有限公司 | A kind of full joint tool |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244126A (en) * | 2020-01-20 | 2020-06-05 | 深圳市华星光电半导体显示技术有限公司 | Miniature display panel, manufacturing method and spliced display panel |
| CN113345918A (en) * | 2021-05-25 | 2021-09-03 | 武汉华星光电半导体显示技术有限公司 | Optically transparent flexible backboard, display device and manufacturing method of display device |
| CN113345918B (en) * | 2021-05-25 | 2022-07-29 | 武汉华星光电半导体显示技术有限公司 | Optically transparent flexible backboard, display device and manufacturing method of display device |
| CN115100958A (en) * | 2022-06-17 | 2022-09-23 | 合肥维信诺科技有限公司 | Laminating device and laminating method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108258158B (en) | 2020-02-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109272874B (en) | Display device and manufacturing method thereof | |
| US9345131B2 (en) | Flexible electronic device | |
| CN108258158A (en) | A kind of jig for backplane, backplane device and method | |
| KR101456382B1 (en) | An electronic device and fabricating method thereof | |
| CN109065589A (en) | Display panel | |
| CN106409724B (en) | A kind of automatic stacking system of PoP and method | |
| CN109757034B (en) | Circuit board structure and preparation method thereof, display panel and preparation method thereof | |
| TWI718688B (en) | Attaching apparatus, intermediary mechansim thereof, and attaching method | |
| US20160359137A1 (en) | Flexible display panel, method for fabricating the same, and apparatus for forming the same | |
| KR101978595B1 (en) | Flexible Display Module Joining Method | |
| TW201429720A (en) | Flexible electronic device | |
| JP2011199056A (en) | Assembling device for fpd module | |
| CN113099711A (en) | Carrier film, flexible circuit board bending device and bending method | |
| CN106328575A (en) | Peeling method and apparatus of flexible display panel | |
| CN101634809A (en) | Method for exposing single-sided flexible circuit board | |
| CN215121773U (en) | Carrier film and flexible circuit board bending device | |
| US8961718B2 (en) | Apparatus and method for laminating anisotropic conductive film on flat display panel | |
| CN107231761B (en) | Method for connecting sensor and printed circuit board by using conductive adhesive | |
| JP2006135082A (en) | Electronic component mounting apparatus and method therefor | |
| CN103645579B (en) | The assemble method of backlight | |
| CN107209407B (en) | Binding method of flexible display module | |
| WO2020206749A1 (en) | Display module and manufacturing method therefor | |
| JP7500616B2 (en) | Method for manufacturing a circuit for a display device substrate | |
| CN110780474B (en) | Conductive adhesive attaching carrying platform, attaching device and attaching method | |
| CN110461131B (en) | Heat dissipation plate assembly, display module and assembling method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |