CN215121773U - Carrier film and flexible circuit board bending device - Google Patents
Carrier film and flexible circuit board bending device Download PDFInfo
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- CN215121773U CN215121773U CN202120671799.2U CN202120671799U CN215121773U CN 215121773 U CN215121773 U CN 215121773U CN 202120671799 U CN202120671799 U CN 202120671799U CN 215121773 U CN215121773 U CN 215121773U
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- circuit board
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- 238000005452 bending Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000010410 layer Substances 0.000 claims description 36
- 239000012790 adhesive layer Substances 0.000 claims description 32
- 230000007246 mechanism Effects 0.000 claims description 15
- 239000011241 protective layer Substances 0.000 claims description 13
- 230000009471 action Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000001788 irregular Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
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Abstract
The utility model provides a carrier film and flexible line way board device of buckling belongs to and shows technical field, and it can solve current flexible line way board and display module group and bind when being connected, adsorbs planar area less, and vacuum suction nozzle is difficult to adsorb the flexible line way board, influences product yield and production efficiency's problem. The carrier film of this disclosure for bear flexible line way board, the carrier film has the clamping area of bearing the weight of district and setting in bearing the weight of the district both sides, and the carrier film includes: the clamping device comprises a substrate, a bonding layer positioned on the substrate and arranged in a bearing area, and a clamping part positioned on the substrate and arranged in a clamping area; the bonding layer is used for attaching the flexible circuit board; the clamping part is used for being adsorbed by fixture, when the flexible line way board binds with the display module assembly and is connected for the basement is buckled in order to drive the flexible line way board towards the lateral buckling who deviates from the display module assembly display surface.
Description
Technical Field
The utility model belongs to the technical field of show, concretely relates to carrier film and flexible line way board device of buckling.
Background
At present, the display module makes and uses the great Flexible line way board of size (FPC) usually, buckles (buckling) the FPC back, can occupy great space at the display module back, and display module back residual space is little, has influenced the designable space at the display module back. In order to solve the problem that the FPC occupies a large space, a smaller-sized FPC can be adopted at present, the occupied space after bonding is carried out on the FPC is smaller, and the requirements of users can be met.
In the prior art, after a vacuum suction nozzle is generally used for sucking the FPC, the bonding operation is carried out on the FPC. However, in order to reduce the size of the FPC, the routing density of the FPC is relatively large, and meanwhile, after the size of the FPC is reduced, the shape of the FPC is irregular, the adsorbable area of the vacuum suction nozzle is very small, and the vacuum suction nozzle is difficult to adsorb the FPC, so that the bonding process of the small-size FPC by the existing process is not easy to realize, and the product yield and the production efficiency are affected.
SUMMERY OF THE UTILITY MODEL
The present disclosure is directed to at least one of the technical problems in the prior art, and provides a carrier film and a flexible printed circuit bending apparatus.
In a first aspect, the present disclosure provides a carrier film for carrying a flexible printed circuit board, the carrier film has a carrying region and clamping regions disposed on two sides of the carrying region, the carrier film includes: the clamping device comprises a substrate, a bonding layer positioned on the substrate and arranged in the bearing area, and a clamping part positioned on the substrate and arranged in the clamping area;
the bonding layer is used for attaching the flexible circuit board; the clamping part is used for being adsorbed by a clamping mechanism, and when the flexible circuit board is bound and connected with the display module, the substrate is bent to drive the flexible circuit board to bend towards one side departing from the display surface of the display module.
Optionally, the carrier film further has alignment regions disposed at two sides of the clamping region; the carrier film further includes: the alignment hole is arranged in the alignment area and penetrates through the substrate;
the alignment hole is used for aligning the bonding layer with the flexible circuit board.
Optionally, the carrier film further has handle regions disposed at both sides of the alignment region; the carrier film further includes: a handle located on the base and disposed in the handle region;
the handle is used for aligning the bonding layer with the flexible circuit board under the action of external force or stripping the bonding layer from the flexible circuit board.
Optionally, the adhesive layer is provided with a plurality of hollowed-out openings; a plurality of electrical devices are arranged on the flexible circuit board;
when the flexible circuit board is bound and connected with the display module, the orthographic projection of the hollowed-out opening on the substrate completely covers the orthographic projection of the electrical device on the substrate.
Optionally, the bonding layer comprises: ultraviolet visbreaking adhesive layer.
Optionally, the carrier film further comprises: a protective layer;
the protective layer is positioned on the side of the bonding layer, which faces away from the substrate.
Optionally, the protective layer comprises: and (4) a release film.
In a second aspect, the present disclosure provides a flexible printed circuit board bending apparatus, including: placing a platform; the placing platform is used for placing the flexible circuit board and the bearing film.
Optionally, the flexible printed circuit board bending apparatus further includes: a clamping mechanism;
the clamping mechanism is used for clamping the clamping part of the bearing film, and when the flexible circuit board is bound and connected with the display module, the bearing film is bent to drive the flexible circuit board to bend towards one side deviating from the display surface of the display module.
Drawings
Fig. 1 is a schematic structural diagram of a bonding connection between a flexible printed circuit board and a display module in the related art;
FIG. 2 is a schematic view of another bonding structure of a flexible printed circuit and a display module in the related art;
fig. 3 is a schematic plan view of a carrier film according to an embodiment of the disclosure;
fig. 4 is a schematic perspective view of a carrier film according to an embodiment of the disclosure;
FIG. 5 is a schematic cross-sectional view taken along line A-A' of FIG. 3;
fig. 6 is a schematic structural view illustrating attachment of a carrier film and a flexible circuit board according to an embodiment of the disclosure;
fig. 7 is a schematic flow chart of a carrier film bending method according to an embodiment of the disclosure.
Detailed Description
For a better understanding of the technical aspects of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Fig. 1 is a schematic structural diagram of a flexible printed circuit board and a display module in a binding connection in the related art, and as shown in fig. 1, the flexible printed circuit board may be bound and connected with the display module so as to input a data signal to a display unit in the display module through the flexible printed circuit board, thereby implementing a display function. In practical application, in order to reduce the frame of display module assembly, improve the screen of display module assembly and account for the ratio, generally buckle flexible line circuit board for flexible line circuit board buckles to the one side that display module assembly deviates from the display surface, display module assembly's back promptly. At present, the great flexible line way board of size is used usually to display module assembly manufacturing, buckles (Bending) the back to the flexible line way board, can occupy great space at the display module assembly back, and display module assembly back residual space is little, has influenced the designable space at the display module assembly back. In order to solve the problem that the flexible circuit board occupies a large space, a small-sized FPC can be adopted at present, the occupied space after bonding is carried out on the FPC is small, and the requirements of users can be met.
Fig. 2 is a schematic structural diagram of another bonding connection between a flexible printed circuit and a display module in the related art, which is different from the structure shown in fig. 1 in that, as shown in fig. 2, in the structure shown in fig. 2, the size of the flexible printed circuit is significantly reduced, and meanwhile, the routing density in the flexible printed circuit is relatively large and the shape of the flexible printed circuit is more irregular.
When the flexible circuit board is bound with the display module, the vacuum suction nozzle is generally adopted to adsorb the flexible circuit board, so that the flexible circuit board is bent to the back of the display module. For the flexible circuit board shown in fig. 1, because the size of the flexible circuit board is large, a large-area adsorption plane can be reserved for the vacuum suction nozzle to adsorb, and therefore, the vacuum suction nozzle can directly adsorb the flexible circuit board so as to bend the flexible circuit board to the back of the display module by using external force. However, for the flexible printed circuit shown in fig. 2, since the size of the flexible printed circuit is small, the routing density is large, and the shape is irregular, the area of the adsorption plane that can be reserved in the flexible printed circuit is small, so that the vacuum suction nozzle is difficult to directly adsorb the flexible printed circuit, and the flexible printed circuit is difficult to bend to the back of the display module, which affects the yield and production efficiency of the product.
In order to solve at least one of the above technical problems in the related art, the present disclosure provides a carrier film and a flexible printed circuit board bending apparatus, which will be described in further detail with reference to the following detailed description and accompanying drawings.
In a first aspect, an embodiment of the present disclosure provides a carrier film, where fig. 3 is a schematic plane structure diagram of a carrier film provided in an embodiment of the present disclosure, fig. 4 is a schematic perspective structure diagram of a carrier film provided in an embodiment of the present disclosure, and fig. 5 is a schematic cross-sectional structure diagram of fig. 3 in a-a' direction, as shown in fig. 3, fig. 4 and fig. 5, the carrier film is used for carrying a flexible circuit board, the carrier film has a carrying region and clamping regions disposed at two sides of the carrying region, and the carrier film includes: a substrate 101, an adhesive layer 102 disposed on the substrate 101 and disposed in the carrying region, and a clamping portion 103 disposed on the substrate 101 and disposed in the clamping region; the bonding layer 102 is used for attaching a flexible circuit board; the clamping portion 103 is used for being clamped by the clamping mechanism, and when the flexible printed circuit board is bound with the display module and connected, the carrier film is bent to drive the flexible printed circuit board to bend towards one side departing from the display surface of the display module.
The substrate 101 may be a flexible substrate, and the material of the flexible substrate may include flexible materials such as polyimide, polyethylene terephthalate, or polyethylene, so as to improve the flexibility of the entire carrier film, so that the entire carrier film may have properties such as being bendable, and the like, but is not limited thereto, and the material of the substrate 101 may also be other materials, which are not listed here. When the flexible printed circuit board is bound with the display module and connected, the substrate 101 can be bent along the stress direction to drive the flexible printed circuit board to bend towards the side deviating from the display surface of the display module, i.e. the flexible printed circuit board is bent to the back of the display module.
The adhesive layer 102 may be disposed on the substrate 101 and disposed in the carrying region, and may be attached to a flexible circuit board, such that the flexible circuit board and the substrate 101 may be integrated. When the flexible printed circuit board is bound to the display module, the substrate 101 may drive the flexible printed circuit board to bend to the back of the display module through the adhesive layer 102. After the flexible circuit board and the display module are bound and connected, the bonding performance of the bonding layer 102 can be reduced, so that the bonding layer 102 and the flexible circuit board are peeled off, and then other preparation processes of the display module are carried out.
The clamping portion 103 can be disposed in the clamping areas on the two sides of the carrying area where the bonding layer 102 is located on the substrate 101, and the clamping portion 103 can be integrated with the substrate 101 and can be adsorbed by the clamping mechanism to apply stress to the substrate 101, so that the substrate 101 is bent to drive the flexible circuit board to be bent to the back of the display module. Because the whole area of the bearing film is far larger than that of the flexible circuit board, the clamping mechanism does not need to directly clamp the flexible circuit board.
In the carrier film provided by the embodiment of the disclosure, firstly, the flexible circuit board can be attached to the substrate 101 through the bonding layer 102, so that the flexible circuit board can be covered by the carrier film, and the electrical device on the flexible circuit board is prevented from being damaged by external force in the transportation and display module binding connection processes of the flexible circuit board, and thus the flexible circuit board can be protected. Secondly, the area of carrier film generally is far greater than the area of flexible line way board, and clamping part 103 wherein can provide the absorption plane of great area, works as when flexible line way board and display module group bind to be connected, clamping structure can adsorb clamping part 103 in the carrier film, can not necessarily adsorb the flexible line way board, like this, no matter flexible line way size of a plate, or whether the shape is regular, all do not influence fixture's adsorption effect, consequently be favorable to the flexible line way board to buckle to the back of display module group to can improve product yield and production efficiency. Furthermore, because the carrier film can be adopted to bear the flexible circuit board, the flexible circuit board with a smaller size can be adopted in the preparation process of the display module, and the flexible circuit board can occupy a smaller space on the back of the display module after being bent to the back of the display module so as to reserve a larger space for design, thereby meeting the requirements of users on the flexible circuit board with a small size.
In some embodiments, the carrier film further has alignment regions disposed at both sides of the clamping region; the carrier film further includes: a registration hole 104 disposed in the registration region and penetrating the substrate 101; the alignment hole 104 is used for aligning the adhesive layer 102 with the flexible circuit board.
Because the size of flexible line board is less and the shape is irregular, when flexible line board and tie coat 102 in the carrier film attached, need utilize the tool to support the flexible line board, have in the tool with counterpoint hole 104 one-to-one's protruding structure, can counterpoint the protruding structure in counterpoint hole 104 and the tool, counterpoint tie coat 102 in with the carrier film and flexible line board, guarantee the attached position of flexible line board, in order to do benefit to being connected of binding of flexible line board and display module assembly. In practical application, the number of the alignment holes 104 can be multiple, and the multiple alignment holes 104 can be distributed in a row or can be distributed according to other rules, so as to ensure accurate alignment of the adhesive layer 104 in the carrier film and the flexible circuit board.
In some embodiments, the carrier film further has handle regions disposed at both sides of the alignment region; the carrier film further includes: a handle 105 disposed on the substrate 101 and disposed in the handle region; the handle 105 is used to align the adhesive layer 102 with the flexible wiring board or to peel off the adhesive layer 102 from the flexible wiring board by an external force.
When the flexible printed circuit board is bound with the display module and connected, the direction and the position of the whole carrier film can be adjusted through the handle 105 in the handheld handle area, so that the alignment holes 104 in the alignment area correspond to the protruding structures in the jig one by one, and the bonding layer 102 and the flexible printed circuit board are accurately aligned. After the flexible circuit board and the display module are bound and connected, the bonding performance of the bonding layer 102 can be reduced, the bonding layer 102 and the flexible circuit board are peeled off by holding the handle in the handle area, and then other preparation processes of the display module are carried out.
In some embodiments, adhesive layer 102 is provided with a plurality of hollowed-out openings; a plurality of electrical devices are arranged on the flexible circuit board; when the flexible circuit board is bound with the display module, the orthographic projection of the hollow opening on the substrate 101 completely covers the orthographic projection of the electrical device on the substrate 101.
Except that being provided with the signal transmission line that is used for transmitting data signal among the flexible line way board, still be provided with electrical components generally, can set up a plurality of fretwork openings that correspond with electrical components in tie coat 102, like this, when flexible line way board and display module group bind and are connected, electrical components among the flexible line way board can be avoided to tie coat 102 to prevent that tie coat 102 from bonding electrical components, influence electrical components's performance, and prevent to cause the damage at the lift-off in-process of tie coat 102 to electrical components. Fig. 6 is a schematic structural view of the attachment of the carrier film and the flexible circuit board according to the embodiment of the disclosure, and as shown in fig. 6, the hollow openings may include a first sub-hollow opening located in the center of the adhesive layer 102 and in a closed shape and a second sub-hollow opening located at the edge of the adhesive layer 102 and in an open shape. Generally can set up fingerprint identification sensor under the screen in the display module assembly, fingerprint identification sensor can be for optics fingerprint identification sensor, specifically can be the PIN structure. First sub fretwork opening can be corresponding with fingerprint identification sensor place region to first sub fretwork open-ended area is greater than or equal to the area of fingerprint identification sensor place region, has good light transmissivity in order to guarantee that fingerprint identification sensor place region, and avoids the existence of tie coat 102 to influence fingerprint identification sensor's performance. A device area may be provided in the flexible wiring board in which electrical devices such as test PINs are disposed. The second sub-hollowed-out opening can correspond to a device area on the flexible circuit board, and the area of the second sub-hollowed-out opening is larger than the area of the device area, specifically, the area of the second sub-hollowed-out opening can be not larger than 1.2 times of the area of the device area, so that a certain avoiding area is reserved between the second sub-hollowed-out opening and the electrical device, and the influence of the bonding layer 102 on the performance of the electrical device on the flexible circuit board is avoided. It can be understood that other signal transmission lines can be further disposed in the device region of the flexible circuit board, and the second sub-hollow opening can also prevent the adhesive layer 102 from affecting the signal transmission line on the flexible circuit board. In some embodiments, bonding layer 102 comprises: ultraviolet visbreaking adhesive layer.
When the flexible circuit board is bound with the display module and connected, the ultraviolet visbreaking glue layer has good bonding performance, and can ensure the overall bonding effect of the flexible circuit board and the carrier film, so that the substrate 101 can drive the flexible circuit board to be bent to the back of the display module through the bonding layer 102. After the bonding connection of the flexible circuit board and the display module is completed, the ultraviolet light can be used for irradiating the ultraviolet visbreaking layer, so that the bonding performance of the bonding layer 102 can be reduced, the bonding layer 102 is peeled off from the flexible circuit board, and then other preparation processes of the display module are carried out. It is understood that the adhesive layer 102 may also include: heating the anti-tack layer, or other type of anti-tack layer. Under normal conditions, the good bonding performance of the adhesive can ensure the overall bonding effect of the flexible circuit board and the carrier film, and after the flexible circuit board and the carrier film are treated by heating or other methods, the bonding effect is reduced, so that the flexible circuit board and the bonding layer 102 can be peeled off.
In some embodiments, the carrier film further comprises: a protective layer 106; the protective layer 106 is located on the side of the adhesive layer 102 facing away from the substrate 101.
The protection layer 106 can cover the surface of the adhesive layer 102 to prevent impurities such as dust from falling on the surface of the adhesive layer 102, thereby reducing the adhesion effect of the adhesive layer 102. In the using process, the protective layer 106 can be peeled off from the surface of the bonding layer 102, so that the bonding layer 102 can be effectively attached to the flexible circuit board, and the substrate 101 drives the flexible circuit board to be bent to the back of the display module. Specifically, the protective layer 106 may include a release film. The handle 105 in the carrier film may also be formed by covering the release film with an adhesive layer 102.
In a second aspect, an embodiment of the present disclosure provides a flexible printed circuit board bending apparatus, including: placing a platform; the placing platform is used for placing the flexible circuit board and the carrier film provided by any one of the above embodiments.
The area of carrier film generally is far greater than the area of flexible line way board, and clamping part 103 wherein can provide the absorption plane of great area, works as when flexible line way board and display module group bind to be connected, clamping structure can adsorb clamping part 103 in the carrier film, can not necessarily adsorb the flexible line way board, like this, no matter flexible line way size of a plate, or whether the shape is regular, all do not influence fixture's adsorption effect, consequently be favorable to the flexible line way board to buckle to the back of display module group to can improve product yield and production efficiency.
In some embodiments, the flexible circuit board bending apparatus further comprises: a clamping mechanism; the clamping mechanism is used for clamping the clamping part 103 of the carrier film, and when the flexible circuit board is bound with the display module and connected, the carrier film is bent to drive the flexible circuit board to bend towards one side departing from the display surface of the display module.
Fixture specifically can be vacuum suction nozzle, and when flexible line way board and display module assembly bound to be connected, vacuum suction nozzle can adsorb the clamping part 103 in bearing the weight of the rete, can not necessarily adsorb the flexible line way board, like this, no matter flexible line way board size, or whether the shape is regular, all do not influence fixture's adsorption effect, consequently be favorable to the flexible line way board to buckle to the back of display module assembly to can improve product yield and production efficiency. It is understood that the clamping structure may be other types of mechanisms for clamping the clamping portion 103, which are not listed here.
In a third aspect, an embodiment of the present disclosure provides a flexible printed circuit board bending method, fig. 7 is a schematic flow chart of the flexible printed circuit board bending method provided in the embodiment of the present disclosure, and as shown in fig. 7, the flexible printed circuit board bending method includes the following steps:
and step S701, transferring the bearing film through the handle of the bearing film, and aligning the bonding layer of the bearing film and the flexible circuit board by using a jig.
In above-mentioned step S701, at first can prepare the carrier film that suits with the flexible circuit board size, later can hand the handle of carrier film, adjust the holistic direction and the position of carrier film, and utilize the tool to support the flexible circuit board, have the protruding structure with counterpoint hole 104 one-to-one in the tool, can counterpoint hole 104 and the protruding structure in the tool, counterpoint with tie coat 102 and the flexible circuit board in the carrier film, guarantee the attached position of flexible circuit board, in order to do benefit to the flexible circuit board and be connected with binding of display module assembly.
Step S702, stripping the protective layer of the carrier film from the adhesive layer, and attaching the flexible circuit board to the adhesive layer of the carrier film.
In the step S702, the protection layer 106 can cover the surface of the adhesive layer 102 to prevent impurities such as dust from falling on the surface of the adhesive layer 102, thereby reducing the adhesive effect of the adhesive layer 102. During use, the protective layer 106 can be peeled off the surface of the adhesive layer 102 so that the adhesive layer 102 can be effectively attached to the flexible wiring board. Specifically, the protective layer 106 may include a release film.
Step S703, the clamping mechanism is used to adsorb the clamping portion of the carrier film, so that the substrate of the carrier film is bent to drive the flexible printed circuit board to bend toward the side away from the display surface of the display module.
In step S703, a clamping mechanism, such as a vacuum nozzle, may be used to absorb the clamping portion 103 of the carrier film, so as to apply an acting force to the carrier film as a whole, so that the substrate 101 of the carrier film drives the flexible printed circuit board to bend to the back of the display module.
Step S704, stripping the adhesive layer of the carrier film from the flexible circuit board.
In the step S704, after the flexible printed circuit board and the display module are bound and connected, the handle 107 of the carrier film may be held by hand, and the adhesive layer 102 of the carrier film is peeled off from the flexible printed circuit board, so as to perform other processes of the display module.
In the flexible circuit board bending method provided by the embodiment of the disclosure, the carrier film can be utilized to carry the flexible circuit board, the area of the carrier film is generally far larger than that of the flexible circuit board, when the flexible circuit board is bound with the display module and connected, the clamping structure can adsorb the clamping part 103 in the carrier film, so that the carrier film is bent to drive the flexible circuit board to bend towards one side deviating from the display surface of the display module, thus, the flexible circuit board does not need to be adsorbed, no matter the size of the flexible circuit board, or whether the shape is regular, the adsorption effect of the clamping mechanism is not affected, and the flexible circuit board is favorably bent to the back of the display module, thereby improving the product yield and the production efficiency.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present disclosure, and that the present disclosure is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.
Claims (9)
1. A carrier film for carrying a flexible printed circuit board, the carrier film having a carrying region and clamping regions disposed on both sides of the carrying region, the carrier film comprising: the clamping device comprises a substrate, a bonding layer positioned on the substrate and arranged in the bearing area, and a clamping part positioned on the substrate and arranged in the clamping area;
the bonding layer is used for attaching the flexible circuit board; the clamping part is used for being adsorbed by a clamping mechanism, and when the flexible circuit board is bound and connected with the display module, the substrate is bent to drive the flexible circuit board to bend towards one side departing from the display surface of the display module.
2. The carrier film of claim 1, further comprising alignment regions disposed on both sides of the clamping region; the carrier film further includes: the alignment hole is arranged in the alignment area and penetrates through the substrate;
the alignment hole is used for aligning the bonding layer with the flexible circuit board.
3. The carrier film of claim 2, further comprising handle regions disposed on both sides of the alignment region; the carrier film further includes: a handle located on the base and disposed in the handle region;
the handle is used for aligning the bonding layer with the flexible circuit board under the action of external force or stripping the bonding layer from the flexible circuit board.
4. The carrier film of claim 1, wherein the adhesive layer is provided with a plurality of hollowed-out openings; a plurality of electrical devices are arranged on the flexible circuit board;
when the flexible circuit board is bound and connected with the display module, the orthographic projection of the hollowed-out opening on the substrate completely covers the orthographic projection of the electrical device on the substrate.
5. The carrier film of claim 1, wherein the adhesive layer comprises: ultraviolet visbreaking adhesive layer.
6. The carrier film of claim 5, further comprising: a protective layer;
the protective layer is positioned on the side of the bonding layer, which faces away from the substrate.
7. The carrier film of claim 6, wherein the protective layer comprises: and (4) a release film.
8. The utility model provides a flexible line way board device of buckling which characterized in that, flexible line way board device of buckling includes: placing a platform; the placing platform is used for placing the flexible circuit board and the carrier film as claimed in any one of claims 1 to 7.
9. The flexible wiring board bending apparatus according to claim 8, further comprising: a clamping mechanism;
the clamping mechanism is used for clamping the clamping part of the bearing film, and when the flexible circuit board is bound and connected with the display module, the bearing film is bent to drive the flexible circuit board to bend towards one side deviating from the display surface of the display module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120671799.2U CN215121773U (en) | 2021-04-01 | 2021-04-01 | Carrier film and flexible circuit board bending device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120671799.2U CN215121773U (en) | 2021-04-01 | 2021-04-01 | Carrier film and flexible circuit board bending device |
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| Publication Number | Publication Date |
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| CN215121773U true CN215121773U (en) | 2021-12-10 |
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| CN202120671799.2U Expired - Fee Related CN215121773U (en) | 2021-04-01 | 2021-04-01 | Carrier film and flexible circuit board bending device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113099711A (en) * | 2021-04-01 | 2021-07-09 | 京东方科技集团股份有限公司 | Carrier film, flexible circuit board bending device and bending method |
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2021
- 2021-04-01 CN CN202120671799.2U patent/CN215121773U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113099711A (en) * | 2021-04-01 | 2021-07-09 | 京东方科技集团股份有限公司 | Carrier film, flexible circuit board bending device and bending method |
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Granted publication date: 20211210 |