JP4552503B2 - Method for manufacturing flexible wiring board with reinforcing plate - Google Patents
Method for manufacturing flexible wiring board with reinforcing plate Download PDFInfo
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- JP4552503B2 JP4552503B2 JP2004141199A JP2004141199A JP4552503B2 JP 4552503 B2 JP4552503 B2 JP 4552503B2 JP 2004141199 A JP2004141199 A JP 2004141199A JP 2004141199 A JP2004141199 A JP 2004141199A JP 4552503 B2 JP4552503 B2 JP 4552503B2
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Description
本発明は、半導体等の素子を搭載する補強板付きフレキシブル配線板の製造方法に関する。 The present invention relates to a method for manufacturing a flexible wiring board with a reinforcing plate on which an element such as a semiconductor is mounted.
半導体などのチップを含む半導体装置において、その小型化・薄型化を計るために、リードフレームなどの金属製配線に代わって樹脂上に銅配線を形成したフレキシブル配線板が使用されている。フレキシブル配線板は、半導体素子を実装できるように単列状あるいは格子状等に配線が配置されている。
各々の配線板がつながったコイル状態のままで配線板を使用しようとすると、従来の所定長さに揃えられた主にリードフレームを使用する前提の製造装置は、そのまま使用することは出来ない。従って、フレキシブル配線板を各ユニット毎の所定の形状（多くは、正方形、長方形など）にプレス等で打ち抜く等して切り揃えたものを、接着剤を介してリードフレーム状の補強板（金属板、または変形の少ない樹脂板）に１ユニットごと貼り付ける必要があった。
In a semiconductor device including a chip such as a semiconductor, a flexible wiring board in which a copper wiring is formed on a resin is used in place of a metal wiring such as a lead frame in order to reduce the size and thickness of the semiconductor device. In the flexible wiring board, wirings are arranged in a single row or grid so that semiconductor elements can be mounted.
If it is going to use a wiring board in the state of the coil with which each wiring board was connected, the conventional manufacturing apparatus of the premise which mainly uses a lead frame arranged in the predetermined length cannot be used as it is. Therefore, a lead frame-shaped reinforcing plate (metal plate) is formed by punching a flexible wiring board into a predetermined shape (many squares, rectangles, etc.) for each unit with a press or the like. , Or a resin plate with little deformation).
また、素子の組立工程におけるチップマウント、ワイヤーボンディング、樹脂封止などでは、配線板との相対位置精度が要求されるため、一般的には、フレキシブル配線板をリードフレーム状の補強板へ貼り付ける装置としては、画像認識装置を含も比較的高価な装置を用意する必要があった。 Also, since chip mount, wire bonding, resin sealing, etc. in the element assembly process require relative positional accuracy with the wiring board, in general, a flexible wiring board is affixed to a lead frame-shaped reinforcing plate. As a device, it was necessary to prepare a relatively expensive device including an image recognition device.
従って、樹脂上に銅配線を形成したフレキシブル配線板をリードフレームのような形状をした補強板（金属板、または変形の少ない樹脂板）に貼り付ける際、該フレキシブル配線板がコイル状態で、１ユニット毎をそれぞれ所定の形状に加工し、それぞれの貼り合わせに比較的高度な位置精度が要求される場合には、一般的には、画像認識装置を備えた組立装置を導入するなど高額の投資が必要であった。 Therefore, when a flexible wiring board in which copper wiring is formed on a resin is attached to a reinforcing plate (a metal plate or a resin plate with little deformation) shaped like a lead frame, the flexible wiring board is in a coiled state. When each unit is processed into a predetermined shape and a relatively high level of positional accuracy is required for each bonding, generally an expensive investment such as the introduction of an assembly device equipped with an image recognition device Was necessary.
本発明は、上記の実情に鑑みてなされたものであり、その目的とするところは、従来の如き高額な投資を必要とすることなしに用意することができ、貼り合わせ作業も容易な、補強板付きフレキシブル配線板の製造方法を提供することにある。 The present invention has been made in view of the above circumstances, and the object of the present invention is to provide a reinforcing material that can be prepared without requiring a high-cost investment as in the prior art and that can be easily bonded. It is providing the manufacturing method of a flexible wiring board with a board.
上記目的を達成するため、本発明による補強板付きフレキシブル配線板の製造方法は、裏面側に接着剤層を有するコイル状に形成されたフレキシブル配線板を用いて、樹脂または金属と樹脂の複合体からなる補強板を位置精度良く貼り付けて固定する、補強板付きフレキシブル配線板の製造方法において、
前記フレキシブル配線板の表面側（配線側）に微粘着フィルムを貼り付け、次いで前記微粘着フィルムをキャリアとして、前記フレキシブル配線板の裏面側からハーフカットを施すことにより、前記微粘着フィルムまでは切断しないで前記接着剤層と前記フレキシブル配線板を所定の形状に切断加工するとともに、同時に位置決め用のガイドホールを打ち抜いた後、前記フレキシブル配線板の不要部分を前記接着剤層とともに取り除いて、前記フレキシブル配線板の各ユニットがそれぞれ単独でキャリアである前記微粘着フィルム上に乗った状態とし、次いで前記補強板と前記フレキシブル配線板を位置合わせ用ジグにより重ねた状態で、前記補強板の上から、前記微粘着フィルムが貼り付けられた前記フレキシブル配線板を前記接着剤層が前記補強板に向き合うようにして前記ガイドホールを前記位置合わせ用ジグのピンに差し込み仮固定した後、前記位置合わせ用ジグを取り除き、該仮固定の状態の前記補強板とフレキシブル配線板を圧着するようにしたことを特徴とする。In order to achieve the above object, a method of manufacturing a flexible wiring board with a reinforcing plate according to the present invention uses a flexible wiring board formed in a coil shape having an adhesive layer on the back surface side, and a resin or a composite of a metal and a resin. In the method of manufacturing a flexible wiring board with a reinforcing plate, which fixes and fixes a reinforcing plate made of
By sticking a slightly adhesive film on the front surface side (wiring side) of the flexible wiring board , and then using the slightly adhesive film as a carrier, by performing a half cut from the back surface side of the flexible wiring board, the fine adhesive film is cut. Without cutting the adhesive layer and the flexible wiring board into a predetermined shape, and simultaneously punching the positioning guide hole, the unnecessary portion of the flexible wiring board is removed together with the adhesive layer, the flexible layer Each unit of the wiring board is in a state of being ridden on the slightly adhesive film, which is a carrier, and then, with the reinforcing board and the flexible wiring board being overlapped by an alignment jig , from above the reinforcing board, The adhesive layer is attached to the flexible wiring board to which the slightly adhesive film is attached. After as opposed to serial reinforcing plate temporarily fixed plug the guide holes in the pins of the jig for the positioning, removing the jig for the positioning, crimping the reinforcing plate and the flexible wiring board in a state of the temporary fixing It is characterized by doing so.
本発明によれば、前記補強板を、前記補強板の外周を基準に固定可能に形成された補強板固定用ジグに固定し、前記補強板固定用ジグに固定された前記補強板に前記微粘着フィルム上に所定形状の単独ユニットとなるように形成されたフレキシブル配線板を貼り付けるようにしたことを特徴とする。 According to the present invention, the reinforcing plate is fixed to a reinforcing plate fixing jig that can be fixed with respect to the outer periphery of the reinforcing plate, and the fine plate is fixed to the reinforcing plate fixed to the reinforcing plate fixing jig. The flexible wiring board formed so that it may become a single unit of a predetermined shape on an adhesive film was affixed .
また、本発明によれば、前記微粘着フィルムと前記補強板固定用ジグにそれぞれガイドホールを形成するとともに前記位置合わせ用ジグにピンを立設し、前記微粘着フィルムに形成されたガイドホールと前記補強板固定用ジグに形成されたガイドホールに前記位置合わせ用ジグに立設された前記ピンを挿入して仮固定するようにしたことを特徴とする。 According to the present invention, a guide hole is formed in each of the slightly adhesive film and the reinforcing plate fixing jig, and a pin is erected on the positioning jig, and the guide hole formed in the slightly adhesive film is The pin erected on the positioning jig is inserted into a guide hole formed in the reinforcing plate fixing jig and temporarily fixed .
また、本発明によれば、裏面側に熱硬化性の接着剤層を有するコイル状に形成されたフレキシブル配線板を、前記接着剤層を介して、樹脂または金属と樹脂の複合体からなる補強板を位置精度良く貼り付けて固定する、補強板付きフレキシブル配線板の製造方法であって、少なくとも下記の工程を順次経ることを特徴とする。
（１）フレキシブル配線板の表面側（配線側）に微粘着フィルムを貼り付ける工程。
（２）前記微粘着フィルムをキャリアとして、前記フレキシブル配線板の裏面側からハーフカットを施すことにより、前記微粘着フィルムまでは切断しないで前記接着剤層と前記フレキシブル配線板を所定の形状に切断加工するとともに、同時に位置決め用のガイドホールを打ち抜く工程。
（３）前記フレキシブル配線板の不要部分を前記接着剤層とともに取り除いて、前記フレキシブル配線板の各ユニットがそれぞれ単独でキャリアである前記微粘着フィルム上に乗った状態とする工程。
（４）ガイドホールが形成され補強板の外周を基準に固定可能に形成された補強板固定用ジグに前記補強板を固定する工程。
（５）前記補強板固定用ジグの前記ガイドホールを位置合わせ用ジグのピンに差し込み固定する工程。
（６）前記補強板の上から、前記微粘着フィルムが貼り付けられた前記フレキシブル配線板を前記接着剤層が前記補強板に向き合うようにして前記ガイドホールを前記位置合わせ用ジグの前記ピンに差し込み仮固定する工程。
（７）前記位置合わせ用ジグを取り除く工程。
（８）前記補強板固定用ジグ，前記補強板，前記接着剤層，前記フレキシブル配線板，前記微粘着フィルムが層状に重なった状態で、シートラミネーターにより前記補強板と前記フレキシブル配線板を、前記接着剤層を介して熱圧着する工程。
（９）前記補強板固定用ジグと前記微粘着フィルムを取り除き、補強板付きフレキシブル配線板を完成させる工程。
Further, according to the present invention, a flexible wiring board formed in a coil shape having a thermosetting adhesive layer on the back side is reinforced with a resin or a composite of a metal and a resin via the adhesive layer. A method for manufacturing a flexible wiring board with a reinforcing plate, in which a board is attached and fixed with high positional accuracy, and is characterized in that at least the following steps are sequentially performed .
(1) A step of attaching a slightly adhesive film to the surface side (wiring side) of the flexible wiring board.
(2) The adhesive layer and the flexible wiring board are cut into a predetermined shape without cutting the fine adhesive film by performing a half cut from the back side of the flexible wiring board using the fine adhesive film as a carrier. The process of punching a guide hole for positioning at the same time as processing.
(3) The process of removing the unnecessary part of the said flexible wiring board with the said adhesive bond layer, and setting each unit of the said flexible wiring board on the said slightly adhesive film which is a carrier each independently.
(4) A step of fixing the reinforcing plate to a reinforcing plate fixing jig formed so that the guide hole is formed and fixed on the outer periphery of the reinforcing plate.
(5) A step of inserting and fixing the guide hole of the reinforcing plate fixing jig to the pin of the positioning jig.
(6) From above the reinforcing plate, the flexible wiring board to which the slightly adhesive film is attached is placed on the pin of the positioning jig so that the adhesive layer faces the reinforcing plate. The process of inserting and temporarily fixing.
(7) A step of removing the positioning jig.
(8) In a state where the reinforcing plate fixing jig, the reinforcing plate, the adhesive layer, the flexible wiring board, and the slightly adhesive film are layered, the reinforcing plate and the flexible wiring board are connected by a sheet laminator, The process of thermocompression bonding through an adhesive layer.
(9) A step of removing the reinforcing plate fixing jig and the slightly adhesive film to complete a flexible wiring board with a reinforcing plate.
本発明方法によれば、フレキシブル配線板へ微粘着性のフィルムを貼り、フレキシブル配線板を所定の形状に加工する段階で同時にフィルム側に位置決め手段を形成するようにしたから、フレキシブル配線板の形状によらず後工程で位置決めを行なうことが可能である。また、フレキシブル配線板のハーフカット時に、可能な領域に補強板の同等の領域部分を貼り合わせることが可能であり、１ユニット毎に位置合わせを行なう必要がない。さらに、画像認識を含む位置合わせ機能を保有する等の比較的高価な装置を導入することなしに、比較的安価かつ容易に実用上十分な位置精度を保持した製品を製造することができる。 According to the method of the present invention, a slightly adhesive film is applied to the flexible wiring board, and the positioning means is formed on the film side at the same time that the flexible wiring board is processed into a predetermined shape. Regardless of this, positioning can be performed in a subsequent process. Further, when the flexible wiring board is half-cut, an equivalent region portion of the reinforcing plate can be bonded to a possible region, and it is not necessary to align each unit. Furthermore, it is possible to manufacture a product that is relatively inexpensive and easily retains practically sufficient positional accuracy without introducing a relatively expensive device such as having an alignment function including image recognition.
以下、本発明の実施の形態を図示した実施例に基づき説明する。
図１はコイル状のフレキシブル配線板の一部を示す斜視図である。本発明方法の実施に当たり、先ず、図１に示したようなコイル状で表面側に各配線ユニット１が単列に並んだ状態のフレキシブル配線板（TABテープ）２を用意する。このフレキシブル配線板２は、その配線面を表面側として裏面側（一般的にはポリイミド側）に、予め熱硬化性等の厚み数十ミクロン〜１００ミクロン程度の接着剤が貼り付けられている。各配線ユニットは、マトリックス状に並べられても良い。
Hereinafter, embodiments of the present invention will be described based on illustrated examples.
FIG. 1 is a perspective view showing a part of a coiled flexible wiring board. In carrying out the method of the present invention, first, a flexible wiring board (TAB tape) 2 having a coil shape as shown in FIG. 1 in which the wiring units 1 are arranged in a single row on the surface side is prepared. The flexible wiring board 2 has an adhesive having a thickness of several tens to 100 microns, such as thermosetting, attached in advance to the back side (generally the polyimide side) with the wiring side as the front side. Each wiring unit may be arranged in a matrix.
このようにして用意されたフレキシブル配線板２の表面側（配線側）に、図２に示すような微粘着フィルム（片面に粘着性を持たせたPET)３を貼り付ける。次に、この微粘着フィルム３をキャリアとして、フレキシブル配線板２の裏面側から図示しない彫刻刃金型により、フレキシブル配線板２の切断加工（この場合、微粘着フィルム３までは切断しないので、ハーフカットと呼ぶ）と、微粘着フィルム３のガイドホール４（図３），フレキシブル配線板２のデバイス設置部分の必要な貫通孔５及び各配線ユニット１毎の外形カットライン６の打ち抜き加工とを行ない、図３に示すような形状に加工する。 On the surface side (wiring side) of the flexible wiring board 2 prepared in this manner, a slightly adhesive film (PET having adhesiveness on one side) 3 as shown in FIG. 2 is attached. Next, using this slightly adhesive film 3 as a carrier, the flexible wiring board 2 is cut from the back side of the flexible wiring board 2 by an engraving blade mold (not shown). And a punching process of the guide hole 4 (FIG. 3) of the slightly adhesive film 3, the necessary through hole 5 in the device installation portion of the flexible wiring board 2, and the outer cut line 6 for each wiring unit 1. Then, it is processed into a shape as shown in FIG.
次に、図４に符号７で示すようにフレキシブル配線板２の不要部分を取り除いて、フレキシブル配線板２の各ユニットがそれぞれ単独でキャリアである微粘着フィルム３上に乗った状態となし、その後のジグによる貼り付けを行ない易いように、図５に示すような短冊状に切断する。その後、図６に示すような予め準備された樹脂または金属と樹脂の複合体からなる補強板８を、図７に示すような補強板固定用ジグ９に補強板８の外周を基準として固定し、さらに、その補強板固定用ジグ９を図８に示すような位置合わせ用ジグ１０のピンに差し込んで固定する。そして、その上から図５に示すフレキシブル配線板を同じく位置合わせ用ジグ１０のピンに差し込みつつ重ね合わせて固定する（図９）。 Next, as shown by reference numeral 7 in FIG. 4, the unnecessary portion of the flexible wiring board 2 is removed, and each unit of the flexible wiring board 2 is put on the slightly adhesive film 3 as a carrier, and thereafter 5 is cut into strips as shown in FIG. Thereafter, a reinforcing plate 8 made of a resin or a metal-resin composite prepared in advance as shown in FIG. 6 is fixed to a reinforcing plate fixing jig 9 as shown in FIG. 7 with the outer periphery of the reinforcing plate 8 as a reference. Further, the reinforcing plate fixing jig 9 is inserted into and fixed to the pins of the positioning jig 10 as shown in FIG. Then, the flexible wiring board shown in FIG. 5 is overlapped and fixed to the pins of the positioning jig 10 from above (FIG. 9).
その後、図９の状態から図８に示す位置合わせ用ジグ１０のみを取り除き、残りの重合体をそのままシートラミネーター等の図示しない熱圧着装置に挿入し、短冊状の微粘着フィルム付きフレキシブル配線板７と補強板８を接着剤を介した形で熱圧着させ、最後に補強板固定用ジグ９と微粘着フィルム３を取り除いて、補強板付きフレキシブル配線板を完成する。 Thereafter, only the alignment jig 10 shown in FIG. 8 is removed from the state shown in FIG. 9, and the remaining polymer is inserted as it is into a thermocompression bonding apparatus (not shown) such as a sheet laminator, so that the flexible wiring board 7 with a strip-like slightly adhesive film is provided. The reinforcing plate 8 is thermocompression bonded in the form of an adhesive, and finally the reinforcing plate fixing jig 9 and the slightly adhesive film 3 are removed to complete the flexible wiring board with the reinforcing plate.
１ フレキシブル配線板上の配線ユニット
２ フレキシブル配線板
３ 微粘着フィルム
４ ガイドホール
５ 貫通孔
６ フレキシブル配線板の各ユニットの外形カットライン
７ フレキシブル配線板の各ユニットが微粘着フィルム上に乗った状態
８ 補強板
９ 補強板固定用ジグ
１０ 位置合わせ用ジグ
DESCRIPTION OF SYMBOLS 1 Wiring unit on flexible wiring board 2 Flexible wiring board 3 Slight adhesive film 4 Guide hole 5 Through-hole 6 Outline cut line of each unit of flexible wiring board 7 State where each unit of flexible wiring board got on fine adhesive film 8 Reinforcement plate 9 Retaining plate fixing jig
10 positioning jig
Claims (4)
前記フレキシブル配線板の表面側（配線側）に微粘着フィルムを貼り付け、次いで前記微粘着フィルムをキャリアとして、前記フレキシブル配線板の裏面側からハーフカットを施すことにより、前記微粘着フィルムまでは切断しないで前記接着剤層と前記フレキシブル配線板を所定の形状に切断加工するとともに、同時に位置決め用のガイドホールを打ち抜いた後、前記フレキシブル配線板の不要部分を前記接着剤層とともに取り除いて、前記フレキシブル配線板の各ユニットがそれぞれ単独でキャリアである前記微粘着フィルム上に乗った状態とし、次いで前記補強板と前記フレキシブル配線板を位置合わせ用ジグにより重ねた状態で、前記補強板の上から、前記微粘着フィルムが貼り付けられた前記フレキシブル配線板を前記接着剤層が前記補強板に向き合うようにして前記ガイドホールを前記位置合わせ用ジグのピンに差し込み仮固定した後、前記位置合わせ用ジグを取り除き、該仮固定の状態の前記補強板とフレキシブル配線板を圧着するようにしたことを特徴とする補強板付きフレキシブル配線板の製造方法。A flexible wiring board with a reinforcing plate, which uses a flexible wiring board formed in a coil shape having an adhesive layer on the back surface side, and affixes and fixes a reinforcing plate made of a resin or a composite of a metal and a resin with high positional accuracy. In the manufacturing method,
By sticking a slightly adhesive film on the front surface side (wiring side) of the flexible wiring board , and then using the slightly adhesive film as a carrier, by performing a half cut from the back surface side of the flexible wiring board, the fine adhesive film is cut. Without cutting the adhesive layer and the flexible wiring board into a predetermined shape, and simultaneously punching the positioning guide hole, the unnecessary portion of the flexible wiring board is removed together with the adhesive layer, the flexible layer Each unit of the wiring board is in a state of being ridden on the slightly adhesive film, which is a carrier, and then, with the reinforcing board and the flexible wiring board being overlapped by an alignment jig , from above the reinforcing board, The adhesive layer is attached to the flexible wiring board to which the slightly adhesive film is attached. After as opposed to serial reinforcing plate temporarily fixed plug the guide holes in the pins of the jig for the positioning, removing the jig for the positioning, crimping the reinforcing plate and the flexible wiring board in a state of the temporary fixing A manufacturing method of a flexible wiring board with a reinforcing plate, characterized in that it is made.
（１）フレキシブル配線板の表面側（配線側）に微粘着フィルムを貼り付ける工程。
（２）前記微粘着フィルムをキャリアとして、前記フレキシブル配線板の裏面側からハーフカットを施すことにより、前記微粘着フィルムまでは切断しないで前記接着剤層と前記フレキシブル配線板を所定の形状に切断加工するとともに、同時に位置決め用のガイドホールを打ち抜く工程。
（３）前記フレキシブル配線板の不要部分を前記接着剤層とともに取り除いて、前記フレキシブル配線板の各ユニットがそれぞれ単独でキャリアである前記微粘着フィルム上に乗った状態とする工程。
（４）ガイドホールが形成され補強板の外周を基準に固定可能に形成された補強板固定用ジグに前記補強板を固定する工程。
（５）前記補強板固定用ジグの前記ガイドホールを位置合わせ用ジグのピンに差し込み固定する工程。
（６）前記補強板の上から、前記微粘着フィルムが貼り付けられた前記フレキシブル配線板を前記接着剤層が前記補強板に向き合うようにして前記ガイドホールを前記位置合わせ用ジグの前記ピンに差し込み仮固定する工程。
（７）前記位置合わせ用ジグを取り除く工程。
（８）前記補強板固定用ジグ，前記補強板，前記接着剤層，前記フレキシブル配線板，前記微粘着フィルムが層状に重なった状態で、シートラミネーターにより前記補強板と前記フレキシブル配線板を、前記接着剤層を介して熱圧着する工程。
（９）前記補強板固定用ジグと前記微粘着フィルムを取り除き、補強板付きフレキシブル配線板を完成させる工程。 Reinforcing and fixing a flexible wiring board formed in a coil shape having an adhesive layer on the back surface side, with a reinforcing plate made of resin or a composite of a metal and a resin attached thereto with high positional accuracy via the adhesive layer A manufacturing method of a flexible wiring board with a board, wherein the manufacturing method of the flexible wiring board with a reinforcing board is characterized by sequentially performing at least the following steps.
(1) A step of attaching a slightly adhesive film to the surface side (wiring side) of the flexible wiring board.
(2) The adhesive layer and the flexible wiring board are cut into a predetermined shape without cutting the fine adhesive film by performing a half cut from the back side of the flexible wiring board using the fine adhesive film as a carrier. The process of punching a guide hole for positioning at the same time as processing.
(3) The process of removing the unnecessary part of the said flexible wiring board with the said adhesive bond layer, and setting each unit of the said flexible wiring board on the said slightly adhesive film which is a carrier each independently.
(4) A step of fixing the reinforcing plate to a reinforcing plate fixing jig formed so that the guide hole is formed and fixed on the outer periphery of the reinforcing plate.
(5) A step of inserting and fixing the guide hole of the reinforcing plate fixing jig to the pin of the positioning jig.
(6) From above the reinforcing plate, the flexible wiring board to which the slightly adhesive film is attached is placed on the pin of the positioning jig so that the adhesive layer faces the reinforcing plate. The process of inserting and temporarily fixing.
(7) A step of removing the positioning jig.
(8) In a state where the reinforcing plate fixing jig, the reinforcing plate, the adhesive layer, the flexible wiring board, and the slightly adhesive film are layered, the reinforcing plate and the flexible wiring board are connected by a sheet laminator, The process of thermocompression bonding through an adhesive layer.
(9) A step of removing the reinforcing plate fixing jig and the slightly adhesive film to complete a flexible wiring board with a reinforcing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004141199A JP4552503B2 (en) | 2004-05-11 | 2004-05-11 | Method for manufacturing flexible wiring board with reinforcing plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004141199A JP4552503B2 (en) | 2004-05-11 | 2004-05-11 | Method for manufacturing flexible wiring board with reinforcing plate |
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| Publication Number | Publication Date |
|---|---|
| JP2005322838A JP2005322838A (en) | 2005-11-17 |
| JP4552503B2 true JP4552503B2 (en) | 2010-09-29 |
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| JP2004141199A Expired - Fee Related JP4552503B2 (en) | 2004-05-11 | 2004-05-11 | Method for manufacturing flexible wiring board with reinforcing plate |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009076630A (en) * | 2007-09-20 | 2009-04-09 | Unitech Printed Circuit Board Corp | Method for pasting paste member to various electric circuit board areas |
| JP5365204B2 (en) * | 2009-01-14 | 2013-12-11 | 凸版印刷株式会社 | Wiring board manufacturing method |
| WO2014185218A1 (en) * | 2013-05-16 | 2014-11-20 | 株式会社村田製作所 | Method for producing resinous multilayer substrate |
| CN103338585B (en) * | 2013-06-19 | 2016-12-07 | 无锡积捷光电材料有限公司 | Reinforcing paster |
| CN103957666B (en) * | 2014-04-30 | 2017-05-31 | 上海美维电子有限公司 | Wiring board reinforcing paster attaching tool, the support plate of wiring board reinforcing paster attaching |
| CN105430909B (en) * | 2015-11-17 | 2018-04-24 | 深圳崇达多层线路板有限公司 | A kind of production method of coil plate |
| CN109051026A (en) * | 2018-06-27 | 2018-12-21 | 无锡积捷光电材料有限公司 | Stiffening plate precision sticking patch jig |
| CN108848614A (en) * | 2018-07-02 | 2018-11-20 | 广州美维电子有限公司 | A kind of reinforcing material method of drawing material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223795A (en) * | 1999-02-03 | 2000-08-11 | Casio Comput Co Ltd | Flexible wiring board and its manufacture |
| JP2003283094A (en) * | 2002-03-25 | 2003-10-03 | Sumitomo Bakelite Co Ltd | Method for manufacturing flexible printed wiring board with reinforcing sheet |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3014173B2 (en) * | 1991-07-26 | 2000-02-28 | シャープ株式会社 | Manufacturing method of flexible printed wiring board |
| JPH08204309A (en) * | 1995-01-26 | 1996-08-09 | Sumitomo Electric Ind Ltd | Manufacture of flexible printed wiring board |
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- 2004-05-11 JP JP2004141199A patent/JP4552503B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223795A (en) * | 1999-02-03 | 2000-08-11 | Casio Comput Co Ltd | Flexible wiring board and its manufacture |
| JP2003283094A (en) * | 2002-03-25 | 2003-10-03 | Sumitomo Bakelite Co Ltd | Method for manufacturing flexible printed wiring board with reinforcing sheet |
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| JP2005322838A (en) | 2005-11-17 |
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