JPH0446868B2 - - Google Patents

Info

Publication number
JPH0446868B2
JPH0446868B2 JP58212738A JP21273883A JPH0446868B2 JP H0446868 B2 JPH0446868 B2 JP H0446868B2 JP 58212738 A JP58212738 A JP 58212738A JP 21273883 A JP21273883 A JP 21273883A JP H0446868 B2 JPH0446868 B2 JP H0446868B2
Authority
JP
Japan
Prior art keywords
pallet
printed circuit
circuit board
hole
base body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58212738A
Other languages
Japanese (ja)
Other versions
JPS60106751A (en
Inventor
Masayuki Seno
Yoshihiko Misawa
Yoshinobu Hashiguchi
Yoshinobu Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58212738A priority Critical patent/JPS60106751A/en
Publication of JPS60106751A publication Critical patent/JPS60106751A/en
Publication of JPH0446868B2 publication Critical patent/JPH0446868B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H9/00Registering, e.g. orientating, articles; Devices therefor
    • B65H9/08Holding devices, e.g. finger, needle, suction, for retaining articles in registered position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • B41F15/20Supports for workpieces with suction-operated elements

Description

【発明の詳細な説明】 産業上の利用分野 本発明は外形が複雑であるもの又は材質が軟ら
かく、搬送しにくいプリント基板へチツプ型電子
部品を実装する際の電子部品実装装置に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting chip-type electronic components onto a printed circuit board that has a complicated external shape or is made of soft material and is difficult to transport.

従来例の構成とその問題点 従来、複雑な形状の基板やフレキシブルプリン
ト基板(以下基板と呼ぶ)にチツプ型電子部品を
実装する際の基板の位置決めは第1図と第2図に
その具体例を示すような方法で行なわれていた。
第1図の1は基板2のパターン面にクリーム半田
を印刷する印刷機であり、基板2は印刷機1のマ
スク3のパターンに合せて位置決めされ、ベース
4にあけられた穴5より真空吸着により固定され
印刷される。第2図の6は電子部品実装機であ
り、印刷機1より取りはずされた基板2をパレツ
ト7に載せマグネツト8等で固定し、X−Yテー
ブル9で位置決めしながらチツプ型電子部品10
を実装する。
Conventional configurations and their problems Figures 1 and 2 show specific examples of conventional board positioning when mounting chip-type electronic components on a complex-shaped board or flexible printed circuit board (hereinafter referred to as a board). It was done in a way that showed that.
1 in FIG. 1 is a printing machine that prints cream solder on the patterned surface of a substrate 2. The substrate 2 is positioned according to the pattern of the mask 3 of the printing machine 1, and is vacuum-suctioned through a hole 5 made in the base 4. Fixed and printed. Reference numeral 6 in FIG. 2 is an electronic component mounting machine, which places the board 2 removed from the printing machine 1 on a pallet 7, fixes it with a magnet 8, etc., and positions it with an X-Y table 9 while mounting the chip-shaped electronic component 10.
Implement.

しかしながら、上記のような構成では、基板2
の位置決め方法が印刷機1と実装機6と異なり、
印刷機1と電子部品実装機6をラインシステムで
構成することができないという欠点を有してい
た。
However, in the above configuration, the substrate 2
The positioning method is different between printing machine 1 and mounting machine 6,
This has the disadvantage that the printing machine 1 and the electronic component mounting machine 6 cannot be configured as a line system.

発明の目的 本発明は上記欠点に艦み、ラインを構成する機
器の用途に応じた、プリント基板の位置決めの統
一化を図り、実装工程の自動化を容易にする電子
部品実装装置を提供するものである。
Purpose of the Invention The present invention addresses the above-mentioned drawbacks and provides an electronic component mounting apparatus that unifies the positioning of printed circuit boards and facilitates automation of the mounting process in accordance with the intended use of the equipment that makes up the line. be.

発明の構成 本発明はその上面に載置されるプリント基板と
当接する範囲内に上下方向に貫通する貫通穴を有
しており、プリント基板を所定位置に保持し、一
体的に移送可能なパレツトの下面と面接触する平
面部と、前記パレツトの貫通穴の下方側開口部と
ほぼ同一位置に一方の開口部を持つ貫通穴とを有
しており、かつ上下動可能な少なくとも二つのベ
ース体と、各ベース体の貫通穴の他方の開口部と
連結され、ベース体の貫通穴およびパレツトの貫
通穴を通じてプリント基板を真空吸着する真空発
生器と、各ベース体間でパレツトを搬送するコン
ベアと、前記コンベアにより搬送されるパレツト
をパレツトとベース体間の貫通穴が一致する位置
で停止するストツパとからなり、各ベース体にお
いてパレツト上に載置されたプリント基板を吸着
固定した状態でプリント基板に対し所望の作業が
行われるよう構成したことにより、プリント基板
を保持し搬送するパレツトを所定位置に真空吸着
により固定位置決めが可能となりまたこれによ
り、前記プリント基板もパレツトを介して、位置
決めされ、したがつて加工目的の異なる装置(例
えば、印刷機と電子部品実装機)のプリント基板
位置決めを統一化でき、プリント基板をパレツト
に載せたまま移送できるのでラインシステムの自
動化を容易にできるという特有の効果を有する。
Structure of the Invention The present invention has a through hole that penetrates vertically within the range where it comes into contact with a printed circuit board placed on the upper surface, and a pallet that can hold the printed circuit board in a predetermined position and transport it integrally. At least two base bodies each having a flat surface in surface contact with the lower surface and a through hole having one opening at approximately the same position as the lower opening of the through hole of the pallet, and which are movable up and down. a vacuum generator connected to the other opening of the through hole of each base body and vacuum suctioning the printed circuit board through the through hole of the base body and the through hole of the pallet; and a conveyor that conveys the pallet between each base body. , a stopper that stops the pallet conveyed by the conveyor at a position where the through holes between the pallet and the base body coincide, and the printed circuit board placed on the pallet is fixed by suction in each base body. By configuring the pallet to carry out the desired work on the pallet, it is possible to fix the pallet that holds and transports the printed circuit board in a predetermined position by vacuum suction, and the printed circuit board is also positioned via the pallet. Therefore, it is possible to unify the positioning of printed circuit boards for equipment with different processing purposes (for example, a printing machine and an electronic component mounting machine), and the unique feature of this method is that it is possible to easily automate the line system because printed circuit boards can be transferred while being placed on a pallet. have an effect.

実施例の説明 以下本発明の一実施例について、図面を参照し
ながら説明する。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第3図は本発明の一実施例における電子部品実
装装置の構成を示す概念図である。
FIG. 3 is a conceptual diagram showing the configuration of an electronic component mounting apparatus in an embodiment of the present invention.

11はマガジン式プリント基板ストツク装置で
あり、基板2を載せたパレツト12を棚状のラツ
クに収納する。1は印刷機であり、6は電子部品
実装機である。13はリフロー炉であり、クリー
ム半田を溶融、固化し、プリント基板2にチツプ
型電子部品10を半田付けするものである。14
は完成したプリント基板2を収納するマガジン式
プリント基板ストツク装置であり、パレツト12
に載せられた基板2はコンベア15により各装置
に順次送られるようシステムを構成されている。
Reference numeral 11 denotes a magazine type printed circuit board storage device, which stores a pallet 12 on which circuit boards 2 are placed on a shelf-like rack. 1 is a printing machine, and 6 is an electronic component mounting machine. Reference numeral 13 denotes a reflow oven, which melts and solidifies cream solder to solder the chip-type electronic component 10 to the printed circuit board 2. 14
is a magazine-type printed circuit board storage device that stores completed printed circuit boards 2, and a pallet 12
The system is configured such that the substrates 2 placed on the substrates 2 are sequentially sent to each device by a conveyor 15.

第4図はパレツト12の具体例を示す斜視図で
ある。パレツト12には穴16が設けられてお
り、下面より真空吸着されることにより穴16が
真空経路となり、基板2を固定する。17はピン
であり、水平方向に基板2がずれることを防ぎ、
かつ基板2の厚さより低くなつており印刷の際に
第1図に示すマスク3に当接しない。
FIG. 4 is a perspective view showing a specific example of the pallet 12. The pallet 12 is provided with holes 16, and by vacuum suction from the bottom surface, the holes 16 become vacuum paths and the substrates 2 are fixed. 17 is a pin that prevents the board 2 from shifting in the horizontal direction;
Moreover, it is lower than the thickness of the substrate 2, and does not come into contact with the mask 3 shown in FIG. 1 during printing.

第5図は印刷機1においてパレツト12を位置
決めする例である。ベース4はシリンダ18によ
り上下に躍動可能で、ストツパAで止められたパ
レツト12をコンベア15より持ち上げ、印刷機
1のマスク3に当接させ、かつ流路19と真空発
生器(図示せず)により、パレツト12を介して
基板2を吸着固定する。
FIG. 5 shows an example of positioning the pallet 12 in the printing press 1. The base 4 can move up and down by a cylinder 18, lifts the pallet 12 stopped by the stopper A from the conveyor 15, brings it into contact with the mask 3 of the printing machine 1, and connects the flow path 19 and vacuum generator (not shown). As a result, the substrate 2 is suctioned and fixed via the pallet 12.

第6図は電子部品実装機6におけるパレツト1
2の位置決めの例である。電子部品実装機6のX
−Yテーブル9には印刷機1と同一のベース4を
備えており、同様の動作により基板2をパレツト
12を介して吸着固定する。
Figure 6 shows pallet 1 in electronic component mounting machine 6.
2 is an example of positioning. Electronic component mounting machine 6
-The Y table 9 is equipped with the same base 4 as the printing machine 1, and the substrate 2 is suctioned and fixed via the pallet 12 by the same operation.

以上のように、本実施例によれば、穴を設けた
パレツトにより印刷機、電子部品実装機におい
て、同一のパレツトで基板を吸着位置決めでき、
かつコンベアで各装置を結ぶことによりラインシ
ステムができ、生産の効率化・省力化に効果を有
する。
As described above, according to this embodiment, it is possible to suction and position a board using the same pallet in a printing machine or an electronic component mounting machine using a pallet provided with holes.
In addition, by connecting each device with a conveyor, a line system is created, which is effective in increasing production efficiency and saving labor.

発明の効果 以下のように本発明は、その上面に載置される
プリント基板と当接する範囲内に、上下方向に貫
通する貫通穴を有しており、プリント基板を所定
位置に保持し、一体的に移送可能なパレツトと、
前記パレツトの下面と面接触する平面部と、前記
パレツトの貫通穴の下方側開口部とほぼ同一位置
に一方の開口部を持つ貫通穴とを有しており、か
つ上下動可能な少なくとも二つのベース体と、各
ベース体の貫通穴の他方の開口部と連結され、ベ
ース体の貫通穴およびパレツトの貫通穴を通じて
プリント基板を真空吸着する真空発生器と、各ベ
ース体間でパレツトを搬送するコンベアと、前記
コンベアにより搬送されるパレツトをパレツトと
ベース体間の貫通穴が一致する位置で停止するス
トツパとからなり、各ベース体においてパレツト
上に載置されたプリント基板を吸着固定した状態
でプリント基板に対し所望の作業が行われるよう
構成したことにより、印刷機、および電子部品実
装機等の装置を、各々コンベアで接続することに
よりパレツト上の基板に対し電子部品実装工程の
ライン化がはかれ、その効果は大なるものがあ
る。
Effects of the Invention As described below, the present invention has a through hole that penetrates in the vertical direction within the range that contacts the printed circuit board placed on the upper surface, and holds the printed circuit board in a predetermined position and is integrated. physically transportable pallets;
The pallet has at least two flat parts that are in surface contact with the lower surface of the pallet, and a through hole that has one opening at approximately the same position as the lower opening of the through hole of the pallet, and that is movable up and down. A vacuum generator is connected to the other opening of the through-hole of each base body and vacuum-chucks the printed circuit board through the through-hole of the base body and the through-hole of the pallet, and the pallet is conveyed between each base body. It consists of a conveyor and a stopper that stops the pallet conveyed by the conveyor at a position where the through holes between the pallet and the base body coincide, and the printed circuit board placed on the pallet is fixed by suction on each base body. By configuring the system so that the desired work can be performed on printed circuit boards, the electronic component mounting process can be performed in line by connecting devices such as a printing machine and an electronic component mounting machine using conveyors. Yes, the effect is great.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のプリント基板位置決め方法によ
る印刷機の断面図、第2図は従来のプリント基板
位置決め方法による実装機の側面図、第3図は本
発明の一実施例におけるプリント基板位置決め装
置を利用したラインシステムの一構成例を示す概
念図、第4図は本発明の一実施例における電子部
品実装装置のパレツトの斜視図、第5図は本発明
の一実施例における電子部品実装装置を利用した
印刷機の断面図、第6図は本発明の一実施例にお
ける電子部品実装装置を利用した電子部品実装機
の断面図である。 1……印刷機、2……プリント基板、4……ベ
ース、5……穴、6……電子部品実装機、7……
パレツト、8……マグネツト、12……パレツ
ト、15……コンベア、16……穴、17……ピ
ン、18……シリンダ、19……流路。
FIG. 1 is a sectional view of a printing machine using a conventional printed circuit board positioning method, FIG. 2 is a side view of a mounting machine using a conventional printed circuit board positioning method, and FIG. 3 is a printed circuit board positioning apparatus according to an embodiment of the present invention. FIG. 4 is a conceptual diagram showing an example of the configuration of a line system used, FIG. 4 is a perspective view of a pallet of an electronic component mounting apparatus in an embodiment of the present invention, and FIG. 5 is a diagram showing an electronic component mounting apparatus in an embodiment of the present invention. FIG. 6 is a sectional view of an electronic component mounting machine using an electronic component mounting apparatus according to an embodiment of the present invention. 1... Printing machine, 2... Printed circuit board, 4... Base, 5... Hole, 6... Electronic component mounting machine, 7...
Pallet, 8... Magnet, 12... Pallet, 15... Conveyor, 16... Hole, 17... Pin, 18... Cylinder, 19... Channel.

Claims (1)

【特許請求の範囲】 1 その上面に載置されるプリント基板と当接す
る範囲内に、上下方向に貫通する貫通穴を有して
おり、プリント基板を所定位置に保持し、一体的
に移送可能なパレツトと、 前記パレツトの下面と面接触する平面部と、前
記パレツトの貫通穴の下方側開口部とほぼ同一位
置に一方の開口部を持つ貫通穴とを有しており、
かつ、上下動可能な少なくとも二つのベース体
と、 各ベース体の貫通穴の他方の開口部と連結さ
れ、ベース体の貫通穴およびパレツトの貫通穴を
通じてプリント基板を真空吸着する真空発生器
と、 各ベース体間でパレツトを搬送するコンベア
と、 前記コンベアにより搬送されるパレツトをパレ
ツトとベース体間の貫通穴が一致する位置で停止
するストツパとからなり、 各ベース体においてパレツト上に載置されたプ
リント基板を吸着固定した状態でプリント基板に
対し所望の作業が行われるよう構成した電子部品
実装装置。
[Claims] 1. It has a through hole that penetrates in the vertical direction within the range where it comes into contact with the printed circuit board placed on its upper surface, so that the printed circuit board can be held in a predetermined position and transferred as one unit. a pallet, a flat portion in surface contact with the lower surface of the pallet, and a through hole having one opening at approximately the same position as the lower opening of the through hole of the pallet,
and at least two base bodies that are movable up and down; a vacuum generator that is connected to the opening of the other of the through holes in each base body and vacuum-sucks a printed circuit board through the through holes in the base bodies and the through holes in the pallet; It consists of a conveyor that conveys the pallet between each base body, and a stopper that stops the pallet conveyed by the conveyor at a position where the through holes between the pallet and the base body coincide, and the pallet is placed on the pallet in each base body. An electronic component mounting apparatus configured to perform desired work on a printed circuit board while the printed circuit board is suctioned and fixed.
JP58212738A 1983-11-11 1983-11-11 Printed board positioning device Granted JPS60106751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58212738A JPS60106751A (en) 1983-11-11 1983-11-11 Printed board positioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58212738A JPS60106751A (en) 1983-11-11 1983-11-11 Printed board positioning device

Publications (2)

Publication Number Publication Date
JPS60106751A JPS60106751A (en) 1985-06-12
JPH0446868B2 true JPH0446868B2 (en) 1992-07-31

Family

ID=16627609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58212738A Granted JPS60106751A (en) 1983-11-11 1983-11-11 Printed board positioning device

Country Status (1)

Country Link
JP (1) JPS60106751A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825669B2 (en) * 1987-08-14 1996-03-13 株式会社日立製作所 Sheet positioning method
KR101572119B1 (en) * 2015-04-30 2015-11-26 주식회사 오라컴 Vaccum Zig For FPCB

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1595367A (en) * 1977-07-04 1981-08-12 Cii Honeywell Bull Method and apparatus for positioning articles such as electrical or electronic components in relation to a carrier

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126152U (en) * 1973-02-26 1974-10-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1595367A (en) * 1977-07-04 1981-08-12 Cii Honeywell Bull Method and apparatus for positioning articles such as electrical or electronic components in relation to a carrier

Also Published As

Publication number Publication date
JPS60106751A (en) 1985-06-12

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