JPH05102699A - Apparatus for conveying and assembling circuit board - Google Patents

Apparatus for conveying and assembling circuit board

Info

Publication number
JPH05102699A
JPH05102699A JP3283625A JP28362591A JPH05102699A JP H05102699 A JPH05102699 A JP H05102699A JP 3283625 A JP3283625 A JP 3283625A JP 28362591 A JP28362591 A JP 28362591A JP H05102699 A JPH05102699 A JP H05102699A
Authority
JP
Japan
Prior art keywords
circuit board
positioning
circuit
positioning member
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3283625A
Other languages
Japanese (ja)
Inventor
Mitsuo Hirasawa
光男 平沢
Shizunori Mitsuma
志津憲 三間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Priority to JP3283625A priority Critical patent/JPH05102699A/en
Publication of JPH05102699A publication Critical patent/JPH05102699A/en
Pending legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To provide an apparatus for conveying and assembling a circuit board which can improve the quantity of products by improving productivity, eliminate a main board to simplify a facility and reduce a product cost. CONSTITUTION:A positioning member 15 for simultaneously positioning a plurality of circuit boards 20 to be simultaneously conveyed and formed with positioned parts at predetermined positions is provided, and a circuit component is placed on the board 20 positioned by the member 15. The plurality of boards 20 positioned by the member 15 can be conveyed as one unit and assembled.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、生産工程の合理化を図
ることができる回路基板の搬送組立装置に関するもの
で、例えば表面実装回路基板等の組み立てに適用可能な
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board transporting and assembling apparatus capable of rationalizing a production process, and is applicable to, for example, assembling a surface mount circuit board or the like.

【0002】[0002]

【従来の技術】例えば表面実装回路基板あるいはディス
クリート混載回路基板等を生産する場合の設備として、
基板供給機、クリーム半田印刷機、接着剤印刷機、クリ
ーム半田塗布機、接着剤塗布機、標準チップ装着機、異
形部品装着機、ロボット型装着機、ビーム半田付け機、
エアソルダーリフローUV照射機、外観検査機、回路組
収納機、等があり、これらを組合せて生産している。こ
のような設備を用いて回路基板を組み立てる場合、回路
基板を各設備間で搬送し、各設備においてそれぞれが分
担した作業を行うことになるが、従来一般に行われてい
る回路基板の搬送、組み立ては、各設備において1個の
基板を1サイクルとして生産するものである。すなわ
ち、1個の回路基板を1単位で搬送しながら各設備にお
いて1個の回路基板ごとに所定の作業を行うものであ
る。
2. Description of the Related Art For example, as equipment for producing a surface mount circuit board or a discrete mixed circuit board,
Substrate supply machine, cream solder printing machine, adhesive printing machine, cream solder coating machine, adhesive coating machine, standard chip mounting machine, odd-shaped component mounting machine, robot type mounting machine, beam soldering machine,
There is an air solder reflow UV irradiator, a visual inspection machine, a circuit group storage machine, etc., and these are manufactured in combination. When assembling a circuit board using such equipment, the circuit board is transported between each equipment, and the work shared by each equipment is performed by each equipment. Is for producing one substrate in each facility as one cycle. That is, a predetermined work is performed for each circuit board in each facility while transporting one circuit board as a unit.

【0003】また、回路基板の搬送、組み立ての別の従
来例として、回路基板が小さい場合には、図11に示す
ように、メインボード40を用い、このメインボード4
0上に複数個の回路基板20を取付け、メインボード4
0ごと複数の回路基板20を搬送しながら各設備で所定
の作業を行うようにしたものもある。
As another conventional example of carrying and assembling a circuit board, when the circuit board is small, a main board 40 is used as shown in FIG.
A plurality of circuit boards 20 are mounted on the main board 4
There is also one in which a plurality of circuit boards 20 are transported by 0 and a predetermined work is performed in each facility.

【0004】[0004]

【発明が解決しようとする課題】1個の基板を1サイク
ルとして生産するものにおいては、実装部品点数の少な
い回路基板の場合、部品装着に要する時間よりも基板の
搬送に要する時間の方が長くなり、設備能力に対する生
産性が悪いという問題がある。
In the case where one board is produced in one cycle, in the case of a circuit board having a small number of mounted components, the time required to carry the board is longer than the time required to mount the components. Therefore, there is a problem that productivity is poor with respect to equipment capacity.

【0005】また、図11に示すようなメインボードを
用いて複数の基板を同時に搬送しながらで組み立てる例
によれば、生産性は向上するが、メインボード及びメイ
ンボード回収設備が必要であり、メインボード取付け代
が発生し、製品コストが高くなるという問題があった。
According to the example of assembling a plurality of substrates while simultaneously transporting a plurality of substrates by using the main board as shown in FIG. 11, productivity is improved, but a main board and a main board recovery facility are required, There is a problem that the main board mounting cost is generated and the product cost is increased.

【0006】本発明は、このような問題点を解消するた
めになされたもので、生産性を向上させて生産数量の増
加を図ると共に、メインボードを不要にして設備の簡略
化を図り、もって製品コストの低廉化を図ることができ
る回路基板の搬送組立装置を提供することを目的とす
る。
The present invention has been made in order to solve such a problem, and improves productivity to increase the production quantity and simplifies the equipment by eliminating the need for a main board. It is an object of the present invention to provide a circuit board transfer / assembly apparatus capable of reducing the product cost.

【0007】[0007]

【課題を解決するための手段】本発明は、同時に搬送さ
れると共に所定個所に位置決め部が形成された複数の回
路基板を同時に位置決めする位置決め部材を有し、位置
決め部材によって位置決めされた複数の回路基板上に回
路部品を搭載することを特徴とする。
SUMMARY OF THE INVENTION The present invention has a positioning member for simultaneously positioning a plurality of circuit boards that are simultaneously conveyed and have a positioning portion formed at a predetermined position, and a plurality of circuits positioned by the positioning member. It is characterized in that circuit components are mounted on the substrate.

【0008】[0008]

【作用】位置決め部材は、複数の回路基板をそれぞれの
回路基板の位置決め部を利用して位置決めする。位置決
めされた回路基板は位置決めされた状態のまま各設備に
搬送され、各設備では、位置決めされて搬送されてくる
一つ一つの回路基板に対して所定の作業を行い、回路基
板を組み立てる。
The positioning member positions the plurality of circuit boards by using the positioning portions of the respective circuit boards. The positioned circuit board is transported to each facility while being positioned, and each facility performs a predetermined operation on each of the positioned and transported circuit boards to assemble the circuit boards.

【0009】[0009]

【実施例】以下、図1ないし図10を参照しながら本発
明にかかる回路基板の搬送組立装置の実施例について説
明する。図1において、平行に配置された一対のベルト
14,14はそれぞれプーリ12,13間に掛け渡され
ており、プーリ13,13の回転駆動によってベルト1
4,14の上側が矢印で示すように図の左下から右上に
向かって移送されるようになっている。上記一対のベル
ト14,14は、これらのベルト14,14にまたがっ
て載置された複数の回路基板20を同時に搬送する。複
数の回路基板20は同一仕様のものであっても、それぞ
れ異なる仕様のものであっても差し支えない。ただし、
各回路基板14には、図2に示すように位置決め部とし
ての透孔21が回路基板14の仕様の如何にかかわらず
所定の2ヵ所に形成されている。回路基板14の用途は
特に限定されないが、例えばモータの回路基板などに適
用することができる。回路基板14の素材も特に限定さ
れるものではなく、例えば、鉄板基板としてこの表面に
絶縁層を介して回路パターンを形成したものでもよい。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a circuit board transfer and assembling apparatus according to the present invention will be described below with reference to FIGS. In FIG. 1, a pair of belts 14 and 14 arranged in parallel are suspended between pulleys 12 and 13, respectively.
The upper side of 4, 14 is transferred from the lower left to the upper right of the figure as shown by the arrow. The pair of belts 14 and 14 simultaneously convey the plurality of circuit boards 20 placed on the belts 14 and 14. The plurality of circuit boards 20 may have the same specifications or different specifications. However,
As shown in FIG. 2, through holes 21 as positioning portions are formed in each circuit board 14 at predetermined two positions regardless of the specifications of the circuit board 14. The use of the circuit board 14 is not particularly limited, but it can be applied to, for example, a circuit board of a motor. The material of the circuit board 14 is not particularly limited, and may be, for example, an iron plate board having a circuit pattern formed on its surface through an insulating layer.

【0010】図1、図8、図9において、ベルト14,
14による回路基板20の搬送経路の途中には、ベルト
14,14を外側から挾み込むようにして、かつ、ベル
ト14,14と平行にサイドガイド11,11が固定さ
れている。サイドガイド11,11は、上部に相対向す
る庇状の突出縁部11a,11aを有している。ベルト
14,14によって搬送されてくる回路基板20はサイ
ドガイド11,11の上記突出縁部11a,11aの下
面とこの突出縁部11a,11aに続くサイドガイド1
1,11の相対向する面とによってガイドされながら搬
送される。サイドガイド11,11配置部の下方には、
複数の回路基板20を同時に位置決めするための位置決
め部材15が配置されている。位置決め部材15には、
複数個(図示の例では4個)の回路基板20を同時に位
置決めすることができるように、各回路基板20の透孔
21に嵌まるべき基板位置決めピン27が所定の相対位
置関係をもって固植されている。なお、各回路基板20
を位置決めすべき一対の基板位置決めピン27の位置関
係は、回路基板20に形成される対をなす透孔の位置関
係に応じて設定される。ちなみに、図1と図8とでは、
対をなす基板位置決めピン27の相対位置関係が異なっ
たものが示されている。
In FIGS. 1, 8 and 9, the belt 14,
Side guides 11 are fixed in parallel with the belts 14 and 14 so that the belts 14 and 14 are sandwiched from the outside in the middle of the conveyance path of the circuit board 20 by the belt 14. The side guides 11, 11 have eave-shaped protruding edge portions 11a, 11a facing each other at the upper part. The circuit board 20 conveyed by the belts 14, 14 includes the lower surface of the protruding edge portions 11a, 11a of the side guides 11, 11 and the side guide 1 continuing to the protruding edge portions 11a, 11a.
The sheets are conveyed while being guided by the surfaces of 1, 1 facing each other. Below the side guides 11, 11 arrangement part,
Positioning members 15 for simultaneously positioning the plurality of circuit boards 20 are arranged. The positioning member 15 includes
Substrate positioning pins 27 to be fitted into the through holes 21 of each circuit board 20 are fixedly planted in a predetermined relative positional relationship so that a plurality of (four in the illustrated example) circuit boards 20 can be positioned at the same time. ing. In addition, each circuit board 20
The positional relationship between the pair of board positioning pins 27 to be positioned is set in accordance with the positional relationship between the pair of through holes formed in the circuit board 20. By the way, in FIG. 1 and FIG.
It is shown that the relative positional relationship between the pair of substrate positioning pins 27 is different.

【0011】図8、図9に示すように、位置決め部材1
5はベース板30上に取付けられている。位置決め部材
15には位置決めピン19が下向きに突設されていて、
この位置決めピン19がベース板30の位置決め孔に嵌
合されることにより位置決め部材15はベース板30上
に位置決めされて取付けられている。ベース板30は油
圧シリンダ又は適宜の駆動手段に連結されていて、この
駆動手段よってベース板30及びこれと一体の位置決め
部材15が上下方向に駆動されるようになっている。位
置決め部材15が図9に破線で示すように上昇したと
き、前記ベルト14,14によって搬送されてきた複数
の回路基板20の各透孔21に位置決めピン27が嵌ま
り、複数の回路基板20を同時に位置決めするようにな
っている。
As shown in FIGS. 8 and 9, the positioning member 1
5 is mounted on the base plate 30. A positioning pin 19 is provided on the positioning member 15 so as to project downward,
The positioning member 15 is positioned and mounted on the base plate 30 by fitting the positioning pin 19 into the positioning hole of the base plate 30. The base plate 30 is connected to a hydraulic cylinder or an appropriate drive means, and the drive means drives the base plate 30 and the positioning member 15 integrated with the base plate 30 in the vertical direction. When the positioning member 15 is lifted as shown by the broken line in FIG. 9, the positioning pins 27 are fitted into the through holes 21 of the circuit boards 20 conveyed by the belts 14 and 14, so that the circuit boards 20 are secured. It is designed to be positioned at the same time.

【0012】位置決め部材15に隣接し、かつ、回路基
板20の搬送方向において位置決め部材15よりも下流
側には、一対のストッパ28,28がストッパ支持体3
7に固植されて配置されている。ストッパ支持体37は
油圧シリンダ又は適宜の駆動手段に連結されていて、こ
の駆動手段よってストッパ支持体37及びこれと一体の
ストッパ28,28が上下方向に駆動されるようになっ
ている。ストッパ28,28は、図9に破線で示すよう
に上昇したとき、前記ベルト14,14によって搬送さ
れてきた回路基板20の通路上に進出し、連続して搬送
されてくる複数の回路基板20のうちの先頭の回路基板
20を阻止してこれを位置決めするようになっている。
A pair of stoppers 28, 28 are provided adjacent to the positioning member 15 and on the downstream side of the positioning member 15 in the transport direction of the circuit board 20.
It is planted in 7 and arranged. The stopper support body 37 is connected to a hydraulic cylinder or an appropriate drive means, and the drive means drives the stopper support body 37 and the stoppers 28, 28 integral with the stopper support body 37 in the vertical direction. When the stoppers 28, 28 are raised as shown by the broken lines in FIG. 9, the stoppers 28, 28 advance to the passages of the circuit board 20 conveyed by the belts 14, 14 and are continuously conveyed. The first circuit board 20 is blocked and positioned.

【0013】次に、上記実施例の動作を説明する。図2
(a),図8に示すように、一対のベルト14,14に
よって搬送される回路基板20の通路上にストッパ28
を進出させ、先頭の回路基板20をストッパ28に当接
させてその回路基板20及び後続の回路基板20をベル
ト14,14上で位置決めする。この状態で図2(b)
に示すように、また、図9に破線で示すように位置決め
部材15を上昇させ、複数の回路基板20の各透孔21
に位置決めピン27を嵌め、複数の回路基板20を同時
に位置決めする。このようにして位置決めされた複数の
回路基板20は、位置決めされた状態のままベルト1
4,14で各設備に搬送され、各設備においてそれぞれ
の回路基板20上に回路部品を搭載し、半田付けを行う
など、各設備それぞれの作業が行われる。
Next, the operation of the above embodiment will be described. Figure 2
(A) As shown in FIG. 8, a stopper 28 is provided on the path of the circuit board 20 conveyed by the pair of belts 14, 14.
Is advanced to bring the leading circuit board 20 into contact with the stopper 28 to position the circuit board 20 and the succeeding circuit board 20 on the belts 14, 14. 2 (b) in this state
9 and by raising the positioning member 15 as shown by the broken line in FIG. 9, each through hole 21 of the plurality of circuit boards 20.
The positioning pins 27 are fitted to the positions to position the plurality of circuit boards 20 at the same time. The plurality of circuit boards 20 thus positioned are positioned in the belt 1 while being positioned.
4 and 14, the equipment is carried to each equipment, and the work of each equipment is performed, such as mounting the circuit component on each circuit board 20 and soldering in each equipment.

【0014】ちなみに、位置決めされた各回路基板20
に対し各設備で行われる作業工程の例を図10に示す。
図10において、基板供給機とは、上記実施例について
説明したような複数の回路基板20を同時に位置決めし
て同時に搬送する装置のことである。この基板供給機で
搬送された複数の回路基板20に対してクリーム半田印
刷機及び接着剤印刷機でクリーム半田印刷及び接着剤印
刷が行われ、次に、接着剤塗布機及びクリーム半田塗布
機で接着剤塗布及びクリーム半田塗布行われる。次に、
標準チップ装着機で標準チップ部品が装着され、さら
に、異形部品装着機又はロボット型装着機で異形部品が
装着される。部品が装着された回路基板は次にエアソル
ダーリフロー赤外線照射機によってリフロー半田付けが
行われ、さらにビーム半田付け機で半田付けが行われ、
そのあと外観検査機で外観が検査され、合格品は回路組
収納機で所定の製品収納部に収納する。このようにし
て、複数個の回路基板を同時に搬送しながら1サイクル
の作業が行われる。
By the way, each of the positioned circuit boards 20
On the other hand, FIG. 10 shows an example of the work process performed in each facility.
In FIG. 10, the board feeder is an apparatus for simultaneously positioning and simultaneously carrying a plurality of circuit boards 20 as described in the above embodiment. Cream solder printing and adhesive printing are performed on a plurality of circuit boards 20 conveyed by this board supply machine by a cream solder printing machine and an adhesive printing machine, and then by an adhesive application machine and a cream solder application machine. Adhesive application and cream solder application are performed. next,
The standard chip mounter mounts the standard chip parts, and the odd-shaped part mounter or the robot-type mounter mounts the odd-shaped parts. The circuit board on which the parts are mounted is then reflow-soldered by an air solder reflow infrared irradiator, and further soldered by a beam solderer.
After that, the appearance is inspected by the appearance inspection machine, and the accepted products are stored in a predetermined product storage portion by the circuit set storage machine. In this way, one cycle of work is performed while simultaneously transporting a plurality of circuit boards.

【0015】上記実施例によれば、所定個所に位置決め
部としての透孔21を形成した複数の回路基板20を同
時に位置決めする位置決め部材15を設け、位置決めさ
れたそれぞれの回路基板上に回路部品を搭載するように
したため、同時に位置決めされる複数の回路基板20を
1単位として搬送し、かつ、各設備において所定の作業
を行うことが可能になり、回路基板1個あたりの搬送時
間が削減されて設備能力に対する生産性が向上する。ま
た、位置決め部材15はベルト14,14などの搬送手
段上において複数の回路基板20を繰返し位置決めする
だけであり、従来のように複数の回路基板20を保持し
た状態で各設備に搬送するためのメインボードを用いる
必要はないから、メインボードはもとより、メインボー
ド回収設備が不要であり、さらに、搬送手段及び各設備
にメインボード組み付け代を設ける必要もなく、製品コ
ストを大幅に低廉化することができる。
According to the above-described embodiment, the positioning member 15 for simultaneously positioning the plurality of circuit boards 20 having the through holes 21 as the positioning portions at the predetermined positions is provided, and the circuit component is placed on each of the positioned circuit boards. Since the circuit boards 20 are mounted, it is possible to carry a plurality of simultaneously positioned circuit boards 20 as a unit and perform a predetermined work in each facility, and the carrying time per circuit board is reduced. Productivity for equipment capacity is improved. Further, the positioning member 15 only repeatedly positions the plurality of circuit boards 20 on the carrying means such as the belts 14 and 14, and carries the plurality of circuit boards 20 to each facility while holding the plurality of circuit boards 20 as in the conventional case. Since there is no need to use the main board, not only the main board, but also the main board recovery equipment is not required, and there is no need to provide a main board assembly allowance for the transportation means and each equipment, and the product cost can be significantly reduced. You can

【0016】さらに、回路基板20の位置決め部として
の前記透孔21は、回路基板20の形状その他の仕様が
異なっても所定位置に形成することにより、共通の位置
決め部材15を使用することができ、回路基板20の仕
様が異なるごとに位置決め部材15を取り換えるという
ような面倒な作業が不要になるため、段取りが簡単にな
ってこの点からも生産効率が高くなると共に、コストの
低廉化を図ることができる。
Further, by forming the through hole 21 as a positioning portion of the circuit board 20 at a predetermined position even if the shape and other specifications of the circuit board 20 are different, a common positioning member 15 can be used. Since the troublesome work of replacing the positioning member 15 each time the specifications of the circuit board 20 are different is eliminated, the setup is simplified, and the production efficiency is improved from this point as well, and the cost is reduced. be able to.

【0017】なお、各回路基板に形成する位置決め部は
透孔に限られるものではない。図3(a)は、上記実施
例と同様に、位置決め部材15の位置決めピン27を基
準としてこれに回路基板20の透孔21を嵌めるように
したものであるが、このような位置決め手段に限定され
るものではなく、図3(b)に示すように、回路基板2
0の端面を基準にし、その両端の対角位置にある角偶部
を位置決め部材15に設けたL字形の位置決め片31に
押し当てて位置決めするようにしてもよい。
The positioning portion formed on each circuit board is not limited to the through hole. In FIG. 3A, similar to the above embodiment, the positioning pin 27 of the positioning member 15 is used as a reference and the through hole 21 of the circuit board 20 is fitted therein, but the positioning means is limited to such a positioning means. However, as shown in FIG. 3B, the circuit board 2
It is also possible to use the end surface of 0 as a reference and press the corner parts at diagonal positions on both ends thereof against the L-shaped positioning piece 31 provided on the positioning member 15 for positioning.

【0018】図4ないし図6は、位置決め部材15とベ
ース板30とを位置決めして結合する手段の各種の例を
示す。図4の例は、ベース板30側に位置決めピン32
を立て、この位置決めピン32に位置決め部材15の位
置決め孔18を嵌合させることにより位置決めして結合
したものである。図5の例は前記実施例と同様に、位置
決め部材15に下向きに固植した位置決めピン19をベ
ース板30の位置決め孔33に嵌合させることにより位
置決めして結合したものである。図6の例はベース板3
0の一端から位置決め板34を立ち上がらせ、この位置
決め板34に位置決め部材15の一端を押し当てて位置
決めし、この状態で位置決め部材15とベース板30と
を結合したものである。
4 to 6 show various examples of means for positioning and connecting the positioning member 15 and the base plate 30. In the example of FIG. 4, the positioning pin 32 is provided on the base plate 30 side.
And the positioning pin 18 is positioned and joined by fitting the positioning hole 18 of the positioning member 15 into the positioning pin 32. In the example of FIG. 5, similarly to the above-described embodiment, the positioning pin 19 fixed to the positioning member 15 downward is fitted into the positioning hole 33 of the base plate 30 for positioning and coupling. The example of FIG. 6 is the base plate 3
The positioning plate 34 is raised from one end of 0, one end of the positioning member 15 is pressed against the positioning plate 34 for positioning, and the positioning member 15 and the base plate 30 are joined in this state.

【0019】以上説明した各例では、位置決め部材とベ
ース板とが別の部材となっていたが、位置決め部材とベ
ース板とを一つの部材として形成してもよい。図7はそ
の例を示すもので、位置決め部材を兼ねたベース板35
の一端から位置決め板36を立ち上がらせ、この位置決
め板36に回路基板20の一端を押し当てることにより
回路基板20をベース板35上において位置決めするよ
うにしたものである。
In each of the examples described above, the positioning member and the base plate are separate members, but the positioning member and the base plate may be formed as one member. FIG. 7 shows such an example, and the base plate 35 also serving as a positioning member.
The positioning plate 36 is raised from one end and the one end of the circuit board 20 is pressed against the positioning plate 36 to position the circuit board 20 on the base plate 35.

【0020】[0020]

【発明の効果】本発明によれば、所定個所に位置決め部
を形成した複数の回路基板を同時に位置決めする位置決
め部材を設け、位置決めされたそれぞれの回路基板上に
回路部品を搭載するようにしたため、同時に位置決めさ
れる複数の回路基板を1単位として搬送し、かつ、各設
備において所定の作業を行うことが可能になり、回路基
板1個あたりの搬送時間が削減されて設備能力に対する
生産性が向上する。また、位置決め部材は回路基板を複
数個ずつ繰返し位置決めするだけであり、従来のように
複数の回路基板を保持した状態で各設備に搬送するため
のメインボードを用いる必要はないから、メインボード
はもとより、メインボード回収設備が不要であり、さら
に、搬送手段及び各設備にメインボード組み付け代を設
ける必要もなく、製品コストを大幅に低廉化することが
できる。
According to the present invention, a positioning member for simultaneously positioning a plurality of circuit boards having positioning portions formed at predetermined locations is provided, and the circuit components are mounted on each of the positioned circuit boards. It is possible to transfer multiple circuit boards that are positioned at the same time as one unit and perform a predetermined work in each equipment, and the transfer time per circuit board is reduced, improving productivity for equipment capacity. To do. Further, since the positioning member only repeatedly positions a plurality of circuit boards one by one, there is no need to use a main board for transporting to each facility while holding a plurality of circuit boards as in the conventional case. Needless to say, no main board recovery equipment is required, and further, it is not necessary to provide a main board assembling allowance for the transportation means and each equipment, and the product cost can be significantly reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明にかかる回路基板の搬送組立装置の実施
例の概略を示す斜視図。
FIG. 1 is a perspective view showing the outline of an embodiment of a circuit board transporting and assembling apparatus according to the present invention.

【図2】同情実施例の動作の概略を順に示す斜視図。FIG. 2 is a perspective view sequentially showing the outline of the operation of the compassion example.

【図3】本発明に適用可能な回路基板位置決め手段の各
種の例を示す斜視図。
FIG. 3 is a perspective view showing various examples of circuit board positioning means applicable to the present invention.

【図4】本発明に適用可能な位置決め部材とベース板と
の結合手段の例を示す正面図。
FIG. 4 is a front view showing an example of coupling means for a positioning member and a base plate applicable to the present invention.

【図5】本発明に適用可能な位置決め部材とベース板と
の結合手段の別の例を示す正面図。
FIG. 5 is a front view showing another example of the coupling means for the positioning member and the base plate applicable to the present invention.

【図6】本発明に適用可能な位置決め部材とベース板と
の結合手段のさらに別の例を示す正面図。
FIG. 6 is a front view showing still another example of a coupling means for a positioning member and a base plate applicable to the present invention.

【図7】本発明に適用可能な回路基板位置決め手段の別
の例を示す斜視図。
FIG. 7 is a perspective view showing another example of the circuit board positioning means applicable to the present invention.

【図8】本発明にかかる上記実施例の平面図。FIG. 8 is a plan view of the above embodiment according to the present invention.

【図9】同上正面図。FIG. 9 is a front view of the same.

【図10】本発明に適用可能な回路基板組立工程の例を
示す工程図。
FIG. 10 is a process drawing showing an example of a circuit board assembling process applicable to the present invention.

【図11】従来の回路基板の搬送組立装置に用いられる
メインボードの例を示す斜視図。
FIG. 11 is a perspective view showing an example of a main board used in a conventional circuit board transporting and assembling apparatus.

【符号の説明】[Explanation of symbols]

15 位置決め部材 20 回路基板 21 位置決め部 15 Positioning member 20 Circuit board 21 Positioning part

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 同時に搬送されると共に所定個所に位置
決め部が形成された複数の回路基板を同時に位置決めす
る位置決め部材を有してなり、位置決め部材によって位
置決めされたそれぞれの回路基板上に回路部品を搭載す
ることを特徴とする回路基板の搬送組立装置。
1. A positioning member for simultaneously positioning a plurality of circuit boards that are simultaneously conveyed and have a positioning portion formed at a predetermined position, and a circuit component is positioned on each circuit board positioned by the positioning member. A circuit board transfer and assembling device characterized by being mounted.
JP3283625A 1991-10-03 1991-10-03 Apparatus for conveying and assembling circuit board Pending JPH05102699A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3283625A JPH05102699A (en) 1991-10-03 1991-10-03 Apparatus for conveying and assembling circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3283625A JPH05102699A (en) 1991-10-03 1991-10-03 Apparatus for conveying and assembling circuit board

Publications (1)

Publication Number Publication Date
JPH05102699A true JPH05102699A (en) 1993-04-23

Family

ID=17667939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3283625A Pending JPH05102699A (en) 1991-10-03 1991-10-03 Apparatus for conveying and assembling circuit board

Country Status (1)

Country Link
JP (1) JPH05102699A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294571A (en) * 2006-04-24 2007-11-08 Shin Etsu Polymer Co Ltd Conveying tool for thin substrate
JP2008218654A (en) * 2007-03-02 2008-09-18 Yamaha Motor Co Ltd Substrate carrying method and apparatus, and surface mounting apparatus
US8789265B2 (en) 2007-08-23 2014-07-29 Panasonic Corporation Electronic component mounting method providing a substrate standby area
JP2015085402A (en) * 2013-10-28 2015-05-07 富士電機機器制御株式会社 Electronic-substrate-lead cutting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181500A (en) * 1988-01-11 1989-07-19 Sanyo Electric Co Ltd Assembly device for electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181500A (en) * 1988-01-11 1989-07-19 Sanyo Electric Co Ltd Assembly device for electronic part

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294571A (en) * 2006-04-24 2007-11-08 Shin Etsu Polymer Co Ltd Conveying tool for thin substrate
JP2008218654A (en) * 2007-03-02 2008-09-18 Yamaha Motor Co Ltd Substrate carrying method and apparatus, and surface mounting apparatus
US8789265B2 (en) 2007-08-23 2014-07-29 Panasonic Corporation Electronic component mounting method providing a substrate standby area
JP2015085402A (en) * 2013-10-28 2015-05-07 富士電機機器制御株式会社 Electronic-substrate-lead cutting device

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