JPH03221262A - Soldering device - Google Patents

Abstract

PURPOSE:To package electronic parts to a mounting substrate and to allow the simultaneous execution of soldering by mounting a laser emitting part in such a manner that the terminal parts supplied with solder of the electronic parts attracted to a chuck body are irradiated. CONSTITUTION:The electronic parts 10 are attracted and held to a vacuum nozzle 8 in a taking-out position and the lead terminals 19 are irradiated with the laser beam and are thereby preheated while the electronic parts 10 are moved up to the packaging position of a mounting substrate 21 by a robot. A piston descends when the air pressure in an air inflow port is dropped. While a slider 15 is pulled by a spring 17, the slider descends and a retainer 16 at the front end of the slider 15 presses and fixeds the lead terminals 19 of the parts body 10 to the mounting substrate 21. The soldering part is irradiated with the laser beam from the laser emitting part 5 and the soldering is executed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a soldering device for mounting and soldering electronic components on a printed circuit board.

In automatic machines that surface-mount and solder electronic components with conventional mosquito lead terminals onto mounting boards, the mounting equipment and soldering equipment, and the mounting board after the electronic components are mounted, are generally supplied to the soldering equipment. Mounting and soldering are performed at separate locations.

Problems to be Solved by the Invention In such an automatic machine, in addition to the time required for mounting and soldering, there is also the time required to transport the mounting board from the mounting equipment to the soldering equipment, and the time spent on the heat source and soldering in the soldering equipment. Soldering requires time for positioning the parts, and if the electronic components are moved on the mounting board during transportation, soldering may result in defects.

In view of the above problems, the present invention eliminates the transportation process which is a waste of time and causes misalignment after mounting electronic components, and simultaneously completes the positioning of the heat source for soldering for the mounting process. It provides equipment.

Means for Solving the Problem In order to solve this problem, the technical means of the present invention includes a fixed block fixed to the upper part of a vertically movable shaft provided on a movable robot arm, and a fixed block fixed to the lower part of this shaft. and a chuck body that vacuum-chucks electronic components to be surface-mounted on the mounting board to the bracket, and a laser beam irradiated to the fixing block picks up the solder of the electronic components that are attracted to the chuck body. It consists of a laser emitting section attached to irradiate the supplied terminal island.

action The effect of this technical means is as follows.

That is, the electronic component to be mounted and soldered is sucked and held by the chuck body, transported and mounted by the robot at a fixed position 1 on the mounting board, and at the same time as being mounted, the terminal part presses the terminal of the electronic component from above, Furthermore, a laser beam is irradiated from the laser emitting part to the solder-supplied terminal part of the electronic component, so that soldering can be performed.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings. 1 and 2, a robot arm 1 is provided with a shaft 2 at its tip that can rotate up and down and rotate, a fixed block 3 is fixed to the upper part of this shaft 2, and a frame 4 is attached to this fixed block 3. A laser emitting section 5 is attached via. A placket 6 is fixed to the lower part of the shaft 2,
A chuck body 7 is attached to this placket 6, and as shown in FIGS. is provided, and the electronic component 10 is sucked and held by vacuum suction from the vacuum port 9. There is an air inlet 11 in the upper part of the chuck body 7, and a piston 12 is attached to the tip of the inlet 11 so as to be able to slide up and down, and a slider 15 having a shaft 1314 is attached to the tip of the piston 12. are in contact with each other, and both ends of the chuck body 7 are slidably attached to the shafts 13 and 14. Further, one end of the shaft 13 of the slider 16 has an electronic component 1 to be soldered.
The presser foot 16 that presses and fixes the lead terminal 19 of No. 0 onto the mounting board 21 is used for mounting. The slider 16 and the chuck body 7 are tensioned by a spring 17.

Next, the soldering operation will be explained.

In FIGS. 3a and 3b, the laser beam 18 is emitted from the laser emitting section 6.
19 is a lead terminal of the electronic component 10, 20 is solder which has been soldered to the lead terminal 19 in advance, and 21 is a mounting board.

The electronic component 10 is sucked and held by the vacuum nozzle 8 at the extraction position, and is preheated by irradiating the lead terminal 19 with a laser beam 18 as shown in FIG. 4 while being moved by the robot to the mounting position 1 of the mounting board 21. do. When the air pressure in the air inlet 11 is reduced, the piston 12 descends, and as the piston 12 descends, the slider 16 moves against the spring 1.
The slider 16 moves downward while being pulled by the slider 16, and the presser foot 16 at the tip of the slider 16 presses and fixes the lead terminals 19 of the component body 10 against the mounting board 21. Even in the state shown in FIG. 3a, the laser beam 18 is irradiated from the laser emitting section 6 to the soldering part, and soldering is performed.

Effects of the Invention As described above, according to the present invention, the laser emitting part is installed so that the laser beam is irradiated to the solder-supplied terminal part of the electronic part while the electronic part is suctioned and held on the chuck body. By being.

Electronic components can be mounted on a mounting board and soldered at the same time. Also, when soldering, hold down the lead terminals of the component body so that there is a gap of 1 inch on the land of the mounting board.
Since soldering can be carried out in a pressed state, soldering can be carried out without lifting or shifting of the lead terminals, which can cause defects. Furthermore, by providing the chuck part and the laser emitting part in the same head, the laser beam is irradiated onto the lead terminal and the solder sandwiched between the lead terminals and the solder to preheat the solder during transportation from the take-out position to the mounting position. It becomes possible to shorten the time required for the process, and its practical effects are significant.

[Brief explanation of drawings]

Figure 1 is a perspective view of essential parts of an embodiment of the present invention, Figures 2a and b
are a front view and a side view showing details of the chuck part, Figure 3a
, b are a side view and a front view showing the soldering state, and FIG. 4 is a side view showing the conveying state. 1...Robot arm, 2...Axis, 3...
...Fixed block, 4...Frame, 6...
... Laser emission part, 6 ... Placket, 7.
... Chuck body, 8 ... Vacuum nozzle, 9 ...
Vacuum port, 10... Part body. 11... Air inlet, 12... Piston, 13゜14゛ shaft, 16... Slider 1
6...Presser, 1...Spring, 18...Laser light, 19...Lead terminal, 20...Solder, 21
...Mounting board.

Claims (2)

[Claims] (1) A fixed block fixed to the upper part of a vertically movable shaft provided on a movable robot arm, a placket fixed to the lower part of this shaft, and an electronic component surface-mounted on the board mounted on this placket. a chuck body that vacuum-chucks the solder, and a laser emitting part that is attached so that the laser beam irradiated to the fixed block is irradiated to the solder-supplied terminal part of the electronic component that is sucked to the chuck body. attached device. (2) The soldering apparatus according to claim 1, wherein a terminal holder is attached to the chuck body so as to be movable up and down, which presses the terminal of the electronic component from above when the terminal is brought into contact with the mounting board.