KR100270763B1 - Device for mounting chip component - Google Patents

Abstract

An object of the present invention is to reduce the number of templates by arranging chip parts from a hopper to a template, improving the operation rate of the component mounting apparatus to be mounted on a printed board again.

In the present invention, a conveyance conveyor includes a component supply stage for supplying chip parts from a hopper to a template, a mount stage for transferring a template from a template to a printed circuit board, on a XY table 11 that forms a fixed portion of a two-dimensional linear motor. The substrate supply / distribution stage which is picked up from the base is installed, the different parts are moved between the component supply stage and the mount stage, and the chip parts are conveyed in an aligned state by the two carriers 12 and 13 on which the template is fixed. A printed board is conveyed to the conveyance base 14 which moves between a stage and a board | substrate distribution stage. The carriers 12 and 13 vibrate minutely in the middle of the movement, vibrate the chip components, and accurately align the template.

Description

Chip Component Mounting Device {DEVICE FOR MOUNTING CHIP COMPONENT}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a chip component mounting apparatus for installing a chip component having no lead wire such as a resistor or a capacitor at a predetermined position on a printed circuit board. It relates to a chip component mounting apparatus called.

7 and 8 illustrate a conventional example of a chip component mounting apparatus of this kind, and are disclosed in Japanese Patent Application Laid-Open No. 3-15835. As shown in Fig. 7, a plurality of hoppers 1 are arranged in the component supply stage of the chip component mounting apparatus, and a plurality of chip components 2 are housed in each hopper 1. Each hopper 1 is connected to the positioning plate 4 via the guide pipe 3, and the template 5 is disposed below the positioning plate 4. The template 5 consists of a guide plate 5a and a base plate 5b integrated with each other, and a plurality of retaining holes 6 are formed in the upper guide plate 5a. In addition, the template 5 is movable up and down by a drive source (not shown), and is conveyed to a mount stage by a conveyance belt (not shown), and as shown in FIG. An adsorption unit having a nozzle 7 is provided.

In the chip component mounting apparatus configured as described above, first, the template 5 is lifted by the driving source at the component supply stage and overlapped with each other on the alignment plate 4, and in this state, the template 5 is moved from the hopper 1 to the guide pipe 3. By sending out the chip component 2, the chip component 2 falls into the holding hole 6 of the template 5 via the alignment plate 4. In this manner, after the chip component 2 falls into each of the holding holes 6 of the template 5, the template 5 is placed on the conveying belt (not shown) and conveyed to the mount stage, and the template 5 is also in the middle of the conveying. By vibrating, the chip component 2 falls to the side in the holding hole 6. Next, at the mount stage, each chip component 2 is sucked up from the holding hole 6 of the template 5 by the suction nozzle 7, and immediately below the suction nozzle 7 as shown in FIG. By supplying the printed board 8, each chip component 2 is temporarily fixed on the pull-shaped solder 9 applied in advance to a predetermined position of the printed board 8. As a result, the chip component 2 is transferred from the template 5 to the printed circuit board 8, and thereafter, the printed circuit board 8 is heated in a reflow furnace to form a full solder ( 9) is melted and the electrode of the chip component 2 is soldered to the land of the printed circuit board 8.

Therefore, according to the chip component mounting apparatus configured as described above, after dropping the chip component 2 into each holding hole 6 of the template 5 in the component supply stage, the template 5 is mounted by the conveyance belt to the mounting stage. Since the chip parts 2 can be transferred to the printed circuit board 8 from the holding holes 6 of the template 5 in this mount stage, the chip parts 2 provided on the printed board 8 can be transferred. When the holding holes 6 corresponding to the number and positions of the holes are formed in the template 5, a plurality of chip parts 2 can be mounted on the printed board 8 simultaneously in one operation.

By the way, in this type of chip component mounting apparatus in which the chip component 2 accommodated in the hopper 1 is installed on the printed board 8 via the template 5, the template 5 is mounted from the component supply stage to the mount stage. The template 5 is also vibrated during transportation to the side, and the chip component 2 must be knocked out in the holding hole 6 sideways, and the holding hole 6 of the chip component 2 including such a horizontal fall. Since the alignment in the frame must be confirmed using an image recognition device, a vibration stage and an image recognition stage for performing these operations are required.

However, in the conventional chip component mounting apparatus described above, since the template 5 is conveyed from the component supply stage to the mount stage by the endless transfer belt, as shown in FIG. It is necessary to send the template 5 at the same time in the direction of the arrow. In other words, when the chip component 2 is dropped onto an arbitrary template 5 in the component supply stage, the other vibration stage, the image recognition stage, and the mount stage allow each of the different templates 5 to perform a desired operation. At the same time, the empty template 5 from which the chip component 2 is drawn is collected from the mounting stage to the component supply stage, and then each template 5 is sent to the next stage in turn by rotating the conveying belt a predetermined amount in the direction of the arrow. It is supposed to be.

For this reason, for example, when a defect is found in the alignment state of the chip component 2 in the image recognition stage, the movement of all the templates 5 must be stopped while correcting the defect, and the operation rate of the mounting apparatus is lowered. There is a problem to say. In addition, since the number of templates 5 corresponding to each stage is necessary, and especially the chip component 2 must be reliably knocked down in the holding hole 6, it is possible to use a template ( It is necessary to sequentially apply vibrations having different amplitudes to 5), and the template 5 required in the vibration stage is 2 to 3 sheets, and also about 3 to 4 sheets of the empty template 5 for recovery are needed. As a whole, dozens of templates 5 have to be prepared, which leads to a problem in that the manufacturing cost increases.

1 is a front view of a chip component mounting apparatus according to an embodiment of the present invention;

2 is a side view of the mounting apparatus;

3 is a plan view schematically showing a movement path of a carrier table provided in the mounting apparatus;

4 is a cross-sectional view illustrating an operation principle of the carrier table;

5 is a plan view of a template placed on the carrier;

6 is a sectional view showing the main portion of the template and the carrier;

7 is an explanatory diagram showing an operation of dropping a chip component onto a template provided in a conventional chip component mounting apparatus;

8 is an explanatory diagram showing an operation of mounting a chip component on a printed board from the template of FIG. 7;

9 is an explanatory diagram showing a conveyance path of the template of FIG.

※ Explanation of code for main part of drawing

11: XY table 12: first carrier

13: 2nd Carrier 14: 3rd Carrier

15: Hopper 16: Guide pipe

17: Arrangement board 18: Suction unit

19: imaging camera 20: conveying conveyor

21: printed circuit board 22: stator

24: mover 25: magnet core

26: coil 27: template

27a: retaining hole 28: chip part

S1: parts supply stage S2: mount stage

S3: Image Recognition Stage S4: Substrate Distribution Stage

The present invention includes the first to third carriers constituting the movable part of the two-dimensional linear motor, and a template is placed on the first and second carriers of the carriers, respectively, so that the parts supply stage and the mount stage are different from each other. By moving, it is assumed that the operation of conveying the printed board between the mount stage and the conveying conveyor is imposed on the third conveying table. Thus, if two templates are moved to different circulation paths by the 1st conveyance platform and the 2nd conveyance platform, when the one of the 1st and 2nd conveyance stands is stopped and the alignment of chip parts is performed, the other conveyance stand is carried out. Since the chip parts can be mounted on the printed board by operating the third carrier table, the operation rate can be improved, and the number of templates required can be significantly reduced, thereby reducing the manufacturing cost.

In the chip component mounting apparatus of the present invention, an XY table constituting a fixed portion of a two-dimensional linear motor, first to third carriers constituting a movable portion of a two-dimensional linear motor, and chip components housed in a plurality of hoppers A component supply means for dropping in a predetermined arrangement from the supply stage, a suction unit for adsorbing the dropped and aligned chip components by means of a suction nozzle on a mount stage, and mounting the printed component on a printed circuit board; And templates for holding the chip components on the first and second carriers, respectively, and the first and second carriers move between different parts of the component supply stage and the mount stage in different circulation paths, and the third The conveyer was to convey the printed board between the mount stage and the conveyer.

In addition to the above configuration, the first and second carriers are moved in small reciprocation in the XY direction so that the dropped chip parts are vibrated and aligned.

Moreover, the 1st and 2nd conveyance boards were made to move through the image recognition stage which confirms the alignment state of a chip component, respectively.

1 is a front view of a chip component mounting apparatus according to an embodiment, FIG. 2 is a side view of the mounting apparatus, and FIG. 3 is a schematic diagram illustrating a movement path of a carrier table provided in the mounting apparatus. 4 is a cross-sectional view illustrating the principle of operation of the carrier table, FIG. 5 is a plan view of a template placed on the carrier table, and FIG. 6 is a cross-sectional view showing main parts of the template and the carrier table.

1 to 3, the XY table 11 is fixed on the temporary table 10 of the chip component mounting apparatus, and the first to third carrier tables 12, 13, and 14 are mounted on the XY table 11. ) Is put on. The hopper 15 is arrange | positioned above the XY table 11, and the chip component is accommodated in these hoppers 15. As shown in FIG. Each hopper 15 is connected to the arrangement board 17 installed in the temporary table 10 via the guide pipe 16, and just below the arrangement board 17 constituting the component supply means is a component supply stage S1. ) The temporary table 10 is provided with the adsorption unit 18 and a pair of imaging cameras 19, and just below the adsorption unit 18 is a mount stage S2. Immediately below both imaging cameras 19 is an image recognition stage S3, and these image recognition stages S3 sandwich a straight line connecting the component supply stage S1 and the mount stage S2. It is in a symmetrical position. However, in FIG. 1, the adsorption unit 18 is shown shifted to the right according to the illustration, and the imaging camera 19 on the right side is abbreviate | omitted. Moreover, two conveyance conveyors 20 are provided just in front of the XY table 11, and the printed circuit board 21 is conveyed by this conveyance conveyor 20. Between two conveyance conveyors 20, it becomes the board | substrate distribution stage S4.

As shown in Fig. 4, the XY table 11 constitutes a fixed portion of a two-dimensional linear motor, and a plurality of convex portions 22a are formed in the stator 22 made of high permeability material such as pure iron, for example. It is formed in a rectangular shape at a pitch of 1 mm, and the surface of the stator 22 is covered with the resin coat 23. On the other hand, the first to third carriers 12, 13, 14 constitute a movable part of a two-dimensional linear motor, and have a plurality of magnets having a comb-shaped end surface on the movable member 24 made of a nonmagnetic material such as aluminum. The core 25 is assembled, and these comb-shaped end faces oppose each convex portion 22a of the stator 22 with a slight phase difference. A coil 26 is wound around each magnet core 25, and the first to third carrier tables 12, 13, and 14 are controlled by the XY table 11 by controlling the direction and magnitude of the current supplied to these coils 26. ) Can be freely moved in a two-dimensional direction, for example, at 0.01 mm pitch intervals. In addition, since the high pressure air which forms an air gap between the stator 22 and the mover 24 is blown out, the 1st to 3rd carriers 12, 13, and 14 carry the XY table 11 on the upper surface. Move smoothly.

The template 27 is fixed on the 1st conveyance stand 12 and the 2nd conveyance stand 13, respectively, and the 1st conveyance stand 12 circulates the circulation paths 1 thru | or 4 of the left half of FIG. Reference numeral 13 reciprocates the circulation paths ⑤ to ⑧ of the right half of FIG. Moreover, the printed board 21 is mounted on the 3rd conveyance base 14, and this 3rd conveyance base 14 reciprocates between the mount stage S2 and the board | substrate supply stage S4 of FIG. As shown in Fig. 5 and Fig. 6, the template 27 is provided with a plurality of retaining holes 27a, and the retaining holes 27a are mounted on the component parts of the chip component 28 mounted on the printed board 21. It is formed corresponding to the position.

Next, the operation of the chip component mounting apparatus constructed as described above will be described. First, prior to the start of work, the first and second carrier tables 12 and 13 are respectively positioned at predetermined positions of the XY table 11, for example, FIG. It moves to the upper left corner and upper right corner of 3, and positions the origin of the 1st and 2nd conveyance tables 12 and 13. Then, the 1st conveyance stand 12 is moved to the component supply stage S1, and in each holding hole 27a of the template 27 fixed on the 1st conveyance stand 12 in this component supply stage S1. The chip component 28 contained in the hopper 15 falls through the guide pipe 16 and the arrangement board 17. At this time, the 2nd conveyance stand 13 is waiting in the origin position mentioned above.

In this manner, after the chip component 28 is dropped onto the template 27 on the first carrier 12, the first carrier 12 is image-recognized by the component supply stage S1 via the circulation path ① in FIG. 3. It moves to the stage S3, and then returns to the component supply stage S1 via the circulation paths ②, ③, and ④, and then circulates the circulation paths 1 to ④. Moreover, when the 1st conveyance stand 12 moves from the component supply stage S1 to the image recognition stage S3, the 2nd conveyance stand 13 will replace the 1st conveyance stand 12 from the origin position, and will supply the parts supply stage S1. The chip parts 28 housed in the hopper 15 are dropped in the holding holes 27a of the template 27 fixed on the second carrier table 13. Thereafter, the second carrier 13 reciprocates the circulation paths ⑤ to ⑧ of FIG. 3 with a delay of 1 to 3 steps with respect to the first carrier 12, and the templates on the first and second carriers 12 and 13. For 27, a predetermined operation is performed at each stage.

That is, when the 1st conveyance stand 12 moves from the component supply stage S1 to the image recognition stage S3, it will move microreciprocally here in an XY direction, and the holding hole of the template 27 on the 1st conveyance stand 12 will be The chip component 28 vibrates within 27a). At this time, by controlling the direction and magnitude of the current supplied to the coil 26, the first carrier 12 can be reciprocated in various patterns having different amplitudes or accelerations. Therefore, the chip parts 28 also vibrate in various patterns in the holding holes 27a of the template 27 and fall sideways, so that the misalignment of the chip parts 28 is almost eliminated. Thereafter, the chip component 28 including the presence or absence of the chip component 28 in each of the holding holes 27a by the imaging camera 19 in the image recognition stage S3, and the fall of the side thereof. ) Is recognized.

Next, when the first carrier table 12 moves from the image recognition stage S3 to the mount stage S2, the chip components 28 on the template 27 are moved to the suction unit 18 in this mount stage S2. Is sucked by the suction nozzle, not shown, and is drawn out from the holding hole 27a. Then, the first conveyance table 12 is returned to the image recognition stage S3, the presence or absence of the withdrawal defect of the chip component 28 is image recognized, and if there is no defect, the first conveyance table 12 is returned to the component supply stage S1, and the template ( The chip component 28 falls in each holding hole 27a of the 27.

On the other hand, after receiving the printed board 21 from the conveyance conveyor 20 in the board | substrate distribution stage S4, the 3rd conveyance base 14 moves to the mount stage S2, and the adsorption unit in this mount stage S2 is carried out. Each of the chip parts 28 on the side 18 is temporarily fixed by using the pool-shaped solder not shown at a predetermined position on the printed board 21. Thereafter, the third conveyance table 14 moves from the mount stage S2 to the substrate dispensing stage S4, and in this substrate dispensing stage S4, the printed circuit board 21 on which the chip parts 28 are installed is the third substrate. It discharges to the conveyance conveyor 20 from the conveyance stand 14.

Exactly the same operation is performed at each stage with respect to the template 27 on the second carrier table 13, but as described above, the second carrier table 13 is delayed by one to three steps with respect to the first carrier table 12. When the 1st conveyance stand 12 moves to the components supply stage S1 by carrying out the circulation path ⑤ thru | or ⑧ different from the 1st conveyance stand, for example, the 1st conveyance stand 12 moves the circulation path ④, The circulation path ⑦ is moved to face the image recognition stage S3. Therefore, for example, when the misalignment of the chip components 28 with respect to the template 27 on the 2nd conveyance stand 13 is found, only the 2nd conveyance stand 13 on the XY table 11 is an image recognition stage. While moving from S3 to correction stage S5 (refer FIG. 3), and stopping and correcting the 2nd conveyance stand 13 in this correction stage S5, the 1st conveyance stand 12 and the 3rd conveyance stand ( When 14) is moved as described above, the chip component 28 can be mounted on the printed board 21. On the contrary, while the 1st conveyance stand 13 and the 3rd conveyance stand 14 are moved as mentioned above, while the 1st conveyance stand 12 is stopped, the chip component 28 is attached to the printed circuit board 21. FIG. You can.

The present invention is implemented in the form as described above, and exhibits the effects as described below.

The XY table constituting the fixed portion of the two-dimensional linear motor, the first to third carriers constituting the movable portion of the two-dimensional linear motor, and the chip parts stored in the hoppers are dropped in a predetermined arrangement in the component supply stage. And a conveying conveyor for conveying the printed circuit board, and a conveying unit for conveying the printed circuit board, including a component supply means, a detached chip component adsorbed by a suction nozzle at a mount stage, and mounted on a printed circuit board. The templates holding the chip components are placed, respectively, and these first and second carriers move in different circulation paths between the parts supply stage and the mount stage, and the third carrier is mounted on the printed board. Since it was made to convey between a stage and the said conveying conveyor, when one side of a 1st and a 2nd conveyance stand is stopped, When the chip parts are aligned and modified, the other carriers and the third carriers can be operated to mount the chip parts on the printed board, thereby improving the operation rate and the number of templates required. Significantly fewer manufacturing costs can be reduced.

In addition, it is easy to vibrate the dropped chip parts by various patterns having different amplitudes or accelerations by moving the first and second carriers in the XY direction, and reliably eliminate the misalignment by vibrating and arranging the chip parts. can do.

In addition to the above configuration, since the first and second carriers are moved through the image recognition stage, respectively, the alignment state of the chip components held on the template can be confirmed in this image recognition stage.

Claims (3)

XY table 11 constituting the fixed portion of the two-dimensional linear motor, the first to third carriers 12, 13, 14 constituting the movable portion of the two-dimensional linear motor, and the plurality of hoppers 15 The component supply means for dropping the chip component 28 in a predetermined arrangement from the component supply stage S1, and the dropped and aligned chip component 28 are sucked by the adsorption nozzle in the mount stage S2 to print the substrate 21. Adsorption unit (18) to be installed in the) and a conveying conveyor (20) for conveying the printed board (21), The templates 27 holding the chip components are placed on the first and second carriers 12 and 13, respectively, and the first and second carriers 12 and 13 are connected to the component supply stage S1. Move between the mount stages S2 in different circulation paths, And said third conveying table (14) conveys said printed board (21) between said mounting stage (S2) and said conveying conveyor (20). The method of claim 1, The first and second carriers (12, 13) is a small component reciprocating movement in the XY direction, it is possible to vibrate and arrange the chip component (28), characterized in that the chip component mounting apparatus. The method according to claim 1 or 2, And an image recognition stage S3 for confirming the alignment of the chip components 28 held on the template 27, wherein the first and second carriers 12 and 13 are respectively the image recognition stage S3. Chip component mounting apparatus, characterized in that to move through.