GB2326981B - Chip mounting apparatus - Google Patents

Chip mounting apparatus

Info

Publication number
GB2326981B
GB2326981B GB9810319A GB9810319A GB2326981B GB 2326981 B GB2326981 B GB 2326981B GB 9810319 A GB9810319 A GB 9810319A GB 9810319 A GB9810319 A GB 9810319A GB 2326981 B GB2326981 B GB 2326981B
Authority
GB
United Kingdom
Prior art keywords
mounting apparatus
chip mounting
chip
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9810319A
Other versions
GB2326981A (en
GB9810319D0 (en
Inventor
Shuichi Munakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB9810319D0 publication Critical patent/GB9810319D0/en
Publication of GB2326981A publication Critical patent/GB2326981A/en
Application granted granted Critical
Publication of GB2326981B publication Critical patent/GB2326981B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
GB9810319A 1997-07-01 1998-05-15 Chip mounting apparatus Expired - Fee Related GB2326981B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17592797A JP3400929B2 (en) 1997-07-01 1997-07-01 Chip component mounting device

Publications (3)

Publication Number Publication Date
GB9810319D0 GB9810319D0 (en) 1998-07-15
GB2326981A GB2326981A (en) 1999-01-06
GB2326981B true GB2326981B (en) 2002-01-16

Family

ID=16004690

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9810319A Expired - Fee Related GB2326981B (en) 1997-07-01 1998-05-15 Chip mounting apparatus

Country Status (5)

Country Link
JP (1) JP3400929B2 (en)
KR (1) KR100270763B1 (en)
CN (1) CN1110235C (en)
GB (1) GB2326981B (en)
MY (1) MY120158A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020041481A1 (en) 2000-09-28 2002-04-11 Yoshinori Kano Linear motor and electronic component feeding apparatus
JP4282018B2 (en) * 2004-09-30 2009-06-17 東京エレクトロン株式会社 Substrate transfer device
CN109060307B (en) * 2018-09-18 2021-02-09 罗昕明 Flip LED chip detection device
JPWO2022230157A1 (en) * 2021-04-29 2022-11-03

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
US5511651A (en) * 1993-11-05 1996-04-30 U.S. Philips Corporation Arrangement for the transport of printed circuit boards

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3636739B2 (en) * 1993-12-06 2005-04-06 ジューキ株式会社 Chip component mounting machine
JPH09214177A (en) * 1996-01-30 1997-08-15 Matsushita Electric Ind Co Ltd Supply method of chip
JP3284050B2 (en) * 1996-06-18 2002-05-20 ティーディーケイ株式会社 Chip component supply device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
US5511651A (en) * 1993-11-05 1996-04-30 U.S. Philips Corporation Arrangement for the transport of printed circuit boards

Also Published As

Publication number Publication date
GB2326981A (en) 1999-01-06
CN1204942A (en) 1999-01-13
JP3400929B2 (en) 2003-04-28
KR19990013479A (en) 1999-02-25
CN1110235C (en) 2003-05-28
KR100270763B1 (en) 2001-01-15
GB9810319D0 (en) 1998-07-15
JPH1126988A (en) 1999-01-29
MY120158A (en) 2005-09-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20070515