JPH11289156A - Solder ball mounting method and rotary solder ball feeding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder ball mounting method with which solder balls can be efficiently mounted on a work. SOLUTION: Three processes, in which solder balls 65 are adsorbed for mounting on the printed substrate 66 as a work using a divice 1, the adsorbed state of the solder balls is inspected and the solder balls are mounted on the printed substrate, are successively performed in this solder ball mounting method. At this point, the device 1 is provided with a rotary stand 59, a plurality of arms 57 and a plurality of mounting heads 51 to 54, having a solder ball adsorbing adsorption part. When the solder balls are mounted, the second mounting head 53 performs the inspection of the solder balls, the third mounting head 54 performd the mounting of the solder balls while the first mounting heads 51 and 52 performs an adsorbing function, and the three processes are performed successively on the mounting heads 51 to 54 by having the rotary stand 59, rotated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting solder balls on a work such as a printed circuit board by using a plurality of mounting heads to efficiently mount the solder balls on the work.

[0002]

2. Description of the Related Art Conventionally, as an apparatus for mounting a solder ball on a work such as a printed circuit board for a ball grid array,
For example, the following solder ball mounting device is used.
That is, as shown in FIG.
Is a solder ball supply device 931 for accommodating and supplying the solder balls, a mounting head 95 for mounting the solder balls 65 on a printed circuit board 66 as a work, and an inspection for inspecting the suction of the solder balls 65 to the mounting head 95. Machine 93
3, a belt conveyor 8 for transporting the printed circuit board 66.

[0003] A large amount of solder balls 65 are placed in the housing portion of the solder ball feeder 931. The mounting head 95 has a movement control device 959 that moves between the solder ball feeder 91 and the belt conveyor 8, and a support 957 that supports the mounting head 95.

Next, a solder ball mounting method using the solder ball mounting device 9 will be described. First, as shown in FIG. 6, the belt conveyor 8 transfers the printed board 66 mounted on the transfer jig 67 to the solder ball feeder 931.
To the front of Then, it waits until the solder ball 65 is mounted.

During this time, the mounting head 95 descends as shown in FIG. 6 until it faces the upper surface of a large number of solder balls 65 housed in the solder ball feeder 931. Next, the mounting head 95 sucks the air while vibrating to suck the solder balls 65. Next, it rises while adsorbing the solder ball 65 and horizontally moves in the direction of arrow X to above the inspection machine 933. Next, the inspection machine 9
33, the solder balls 65 are mounted on the mounting head 9.
It is checked whether or not 5 is correctly adsorbed.

Next, as shown in FIG. 6, the mounting head 95 horizontally moves in the direction of arrow Y to above the belt conveyor 8. Then, it descends onto the printed circuit board 66 to release the suction of the solder balls 65. Thus, the solder balls 65 are mounted on the printed board 66. Then, the belt conveyor 8 conveys the printed circuit board 66 on which the solder balls 65 are mounted while being mounted on the conveyance jig 67. On the other hand, as shown in FIG.
It returns to the above-mentioned solder ball feeder 931 linearly in the direction of arrow Z, and the mounting of the solder balls 65 is repeated again as described above.

[0007] In the solder ball mounting method using the mounting head 95 of the solder ball mounting apparatus 9, as shown in FIG. 7, the suction of the solder balls 65, the inspection of the solder ball suction state, and the mounting on the printed board 66 are performed. Solder ball 6
The three steps consisting of the mounting of No. 5 are repeated.

[0008]

However, the solder ball mounting method using the conventional solder ball mounting apparatus 9 has the following problems. That is, the mounting head 95 is 1
And moving it linearly. Therefore, the belt conveyor 8 must be kept on standby during the above-mentioned suction and inspection processes. Therefore, the mounting of the solder balls 65 on the mounting head 5 is inefficient.

SUMMARY OF THE INVENTION The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a solder ball mounting method capable of efficiently mounting a solder ball on a work and a rotary supply device used therefor. It is.

[0010]

According to the first aspect of the present invention, in order to mount a solder ball on a work placed on a mounting machine, suction of the solder ball, inspection of the solder ball suction state, What is claimed is: 1. A method of mounting a solder ball, comprising sequentially repeating three steps of mounting a solder ball on a work, wherein the rotary supply device includes: a rotary table; at least three arms extending outward from the rotary table; A mounting head provided on each of the arms, each of the mounting heads having a suction portion for suctioning a solder ball to be mounted on the work; While the first mounting head sucks the solder balls, the second mounting head checks whether or not the solder balls are correctly sucked. A parallel process for mounting the solder balls on the work is performed. In the parallel process, the suction, inspection, and mounting processes are sequentially performed on the mounting heads by rotating the rotary supply device. And a solder ball mounting method characterized in that the method is performed.

In the present invention, it is most remarkable that a plurality of mounting heads of the rotary supply device perform solder ball mounting, inspection of the solder ball suction state, and mounting of the solder ball on the work when mounting the solder ball. This is performed simultaneously, and each mounting head sequentially performs the three steps of the suction, the inspection, and the mounting.

In the rotary supply device, the arm is provided radially from the turntable. Each of the mounting heads is fixed to the distal end of the arm with the solder ball suction portion facing downward. Further, when the rotary table moves the position of the arm, for example, to the right, the first mounting head, the second mounting head, and the third mounting head are arranged clockwise in this order. A plurality of the first, second, and third mounting heads can be provided as necessary.

Further, the rotary supply device has a solder ball supply device for supplying solder balls to the mounting head, and an inspection device for inspecting whether or not the solder balls are correctly attracted. I have. The solder ball supply device includes a solder ball storage tray, and the inspection device includes an image processing device.

Next, the operation of the present invention will be described. In the rotary supply device, the turntable has a lifting function for raising and lowering the arm and a recirculation function for rotating the position of the arm, for example, to the right.

First, the turntable lowers the arm supporting the first mounting head and the third mounting head. Then, the first mounting head suctions the solder ball to the suction portion. The third mounting head mounts a solder ball on the work. On the other hand, for the second mounting head, an inspection is performed by the above-described inspection machine to determine whether or not the solder balls are correctly attracted.

Then, the turntable raises the arms supporting the first mounting head and the third mounting head, and rotates the position of each arm, for example, clockwise to the position of the next arm. That is, the first mounting head is sent to the position of the second mounting head, the second mounting head is sent to the position of the third mounting head, and the third mounting head is sent to the position of the first mounting head.

Next, the turntable lowers the arm supporting the forwarded third mounting head and the second mounting head to attract the third mounting head and cause the second mounting head to absorb. Make the installation. On the other hand, the first mounting head is inspected. Thus, the turntable repeats the lifting and lowering and the rotational movement of the arm.

In the solder ball mounting method using the rotary supply device, each mounting head goes through at least three steps including suction of a solder ball, inspection of a solder ball suction state, and mounting of a solder ball on a work. The solder balls are mounted on the work on the mounting machine.

First, the first mounting head is lowered onto the solder ball feeder together with the arm of the rotary table, and suctions the solder ball to the suction portion by air suction or the like. Then, it rises together with the arm while adsorbing the solder ball. Then, as described above, the position of the first mounting head is rotationally moved.

Next, an inspection is performed on the first mounting head to determine whether or not the solder balls are correctly attracted. Then, it is rotated and moved again. Next, the first mounting head descends onto the work together with the arm, releases the air suction, and mounts the solder ball on the work. The first mounting head that has completed the solder ball mounting moves up with the arm of the turntable. Then, it is rotated and moved again.

Also, the second mounting head and the third mounting head have the same timing as the first mounting head at the timing different from that of the first mounting head.
Repeat the two steps. That is, all the mounting heads sequentially repeat a series of operations, and all the mounting heads simultaneously perform different operations. Therefore, according to the present invention, the three steps of suction, inspection, and mounting can be performed in parallel. Therefore, the solder balls can be efficiently mounted on the work without any time loss.

Next, as in the second aspect of the present invention, the suction portion may be an air suction port or an electrostatic suction device.

Next, a third aspect of the present invention is a rotary feeder which sequentially repeats three steps of suction of a solder ball, inspection of a solder ball suction state, and mounting of a solder ball on a work. The rotary supply device has a turntable, at least three arms extending outward from the turntable, and mounting heads respectively provided on the arms, each of which has a solder ball mounted on the work. A rotary supply device for mounting a solder ball, characterized in that the rotary supply device has a suction portion for suctioning the solder ball. The rotary supply device according to the present invention is an apparatus used in the above-mentioned solder ball mounting method.

According to the above-mentioned rotary supply device, as described above, the three steps of mounting, inspection, and mounting for mounting the solder balls can be performed in parallel. Therefore, the solder balls can be efficiently mounted on the work without any time loss.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment A solder ball mounting method according to an embodiment of the present invention and a rotary supply device used for the method will be described with reference to FIGS. The rotary supply device of this example is a rotary supply device for mounting the solder balls 65 on a printed board 66 as a work placed on the mounting table 7 of the mounting machine 70.

As shown in FIGS. 1 to 5, the rotary feeder 1 includes a turntable 59, four arms 57 extending outward from the turntable 59, and a first arm 57 provided on each of the arms 57. Mounting heads 51, 52, second mounting head 53, third
And a mounting head 54. Further, each mounting head has a suction portion 50 as an air suction port for sucking the solder ball 65 mounted on the printed board 66.

The reference numeral 10 in FIG.
1 shows an entire solder ball mounting apparatus including a mounting portion on which a printed circuit board 66 on which is mounted, and a supply portion for supplying solder balls 65 to the mounting portion.

Hereinafter, a supply portion and a mounting portion of the solder ball mounting device 10 will be described. First, as shown in FIG. 1, the rotary supply device 1 serving as the supply portion has a turntable 59 for rotating the positions of the four arms 57 rightward and moving the arms 57 up and down. ing. The arm 57 is disposed radially from the turntable 59. Further, the first mounting heads 51, 5
2, the second mounting head 53 and the third mounting head 54 are arranged in a clockwise order.

As shown in FIGS. 3 and 4, the first mounting head 51 has a state in which a suction device 56 provided with a large number of suction portions 50 for solder balls 65 is directed downward at the tip end of the arm 57. And is fixed. The first mounting head 51 has two adsorbers 56 so that the solder balls 65 can be mounted on two printed boards 66 at the same time. The other mounting heads are also fixed in the same state to the arms 57 that support them.

As shown in FIGS. 4 and 5, the suction portion 50 is disposed at a position corresponding to a soldering pad 661 (FIG. 5) provided on the printed circuit board 66. Further, the suction unit 50 has a suction hole 560 penetrating the suction device 56, and the suction hole 560 is provided with a suction machine (not shown) for depressurizing and sucking the solder ball 65 through the flexible tube 340. Are connected.

Further, as shown in FIG. 1, the rotary supply device 1 includes the first, second, and third mounting heads 51-54.
Ball supply machine 31 for supplying solder balls 65 to the
And an inspection device 33 for inspecting whether or not the solder ball 65 is correctly sucked.

As shown in FIG. 4, a large amount of solder balls 65 are placed in the housing 310 of the solder ball feeder 31, and a filter 3 is provided below the housing 310.
11 is provided, and a hollow portion 312 is provided below the filter 311. A large amount of solder balls 65
Is in a state of being smoothed with a brush or the like.

Next, as the mounting portion, as shown in FIG. 1, the mounting machine 70 provided beside the rotary feeder 1 corresponds to this. The mounting machine 70 includes a rotary mounting table 7 on which a printed board 66 is mounted, and a printed board 66 before the solder balls 65 are mounted on the mounting table 7.
And a carry-in machine 75 on which the is mounted. The carry-in machine 75
Is an unloader that unloads the printed board 66 after the solder balls 65 are mounted.

Next, the mounting table 7 is a circular rotary table, and as shown in FIG.
Are mounted in a circular shape. A solder pad 661 (FIG. 5) is provided on the printed board 66.

On the mounting table 7, a printed circuit board 66 is rotated clockwise corresponding to the position of the transfer jig 67.
Detector 71 for checking misalignment of solder, flux transfer machine 72, re-inspection machine 7 for checking alignment of solder balls 65
3. A defective product discharger 74 is provided. Note that the carry-in device 75 is disposed between the detector 71 and the defective product discharger 74.

Next, regarding the above-mentioned solder ball mounting method,
An outline will be described with reference to FIG. The solder ball mounting method includes the first suction of the solder ball 65 (suction 1), the second suction of the solder ball 65 (suction 2), the inspection of the suction state of the solder ball 65, and the solder ball 65 on the printed board 66.
This is a mounting method in which four steps consisting of mounting are sequentially and repeatedly performed.

In mounting the solder balls 65, as shown in FIG. 2, while the first mounting heads 51 and 52 are holding the solder balls 65, the second mounting head 53 is used. About the above solder ball 6
An inspection is performed to determine whether or not 5 is correctly sucked, and the third mounting head 54 performs a parallel process of mounting the solder balls 65 on the printed circuit board 66. In addition, the parallel processing is performed by rotating the turntable 59 of the rotary supply device 1 so that the mounting heads 1 are attached to the mounting heads.
The four processes of suction 2, inspection, and mounting are sequentially performed.

Next, a method of mounting a solder ball using the rotary supply device 1 will be described in detail with reference to FIG. In the solder ball mounting method using the rotary supply device 1, each mounting head passes through the above four steps,
The solder balls 65 are mounted on the printed board 66 on the mounting table 7 of the mounting machine 70.

First, as shown in FIG. 2, the first mounting head 51 sucks the solder ball 65 by air suction in the suction 1 step. Next, the first mounting head 51
In the step of suction 2, as described above, the solder ball 65 is sucked by the suction portion 50 where the solder ball 65 has not been sucked again, and the solder ball 65 is
To adsorb.

Next, the first mounting head 51 is inspected in the inspection step to determine whether the solder balls 65 are correctly attracted. Next, in the mounting step, the first mounting head 51 releases the air suction and the like and places the solder balls 6 on the printed circuit board 66.
5 is mounted.

As shown in FIG. 2, each of the first mounting head 52, the second mounting head 53, and the third mounting head 54 performs the preceding step one by one. FIG. 2 shows in chronological order how the first, second, and third mounting heads 51 to 54 are simultaneously performing each process. Note that reference numerals a to d in the figure correspond to arrows a to d in FIG.

Next, the operation of each mounting head of the rotary supply device 1 in the circle 1 in FIG. 2 will be described in detail with reference to FIGS. The turntable 59 of the rotary feeder 1 is
As shown in FIG. 4, the arm 57 supporting the first mounting heads 51 and 52 is attached to the suction unit 50 of each mounting head.
Is lowered until it faces the upper surface of the solder ball 65 in the solder ball feeder 31. Then, the suction device (not shown) sucks air from the suction holes 560 of the suction device 56, so that the first mounting heads 51 and 52 move the solder balls to the suction portions 50 as shown in FIG. Adsorb 65.

The solder ball feeder 31 feeds a gas such as nitrogen from the hollow portion 312 to the accommodating portion 310 to blow up the solder balls 65 and assist the suction of the solder balls 65.

Next, for the second mounting head 53, an inspection is performed by the inspection device 33 to determine whether or not the solder balls 65 before mounting are accurately attracted. Solder ball 65
When the suction is performed accurately, the mounting head that has sucked the solder ball 65 is rotated to the mounting table 7. When the solder balls 65 are insufficient or are not correctly sucked, the mounting of the solder balls 65 on the mounting table 7 is passed, and the solder balls 65 are again supplied from the solder ball supplying device 31. And other measures are taken.

Next, the turntable 59 of the rotary feeder 1 will be described.
As shown in FIG. 5, the arm 57 supporting the third mounting head 54 is lowered onto the printed board 66 mounted on the transfer jig 67. Then, the third mounting head 54 releases the air suction and mounts the solder balls 65 on the soldering pads 661 of the printed circuit board 66, as shown in FIG. The third mounting head 54 that has completed the solder ball mounting moves up together with the arm 57.
The soldering pad 661 is coated with a flux described later.

The positions where the above four steps are performed are circumferentially arranged as shown in FIG. Then, as shown in FIG. 1, the positions of the respective arms 57 provided with the respective mounting heads are indicated by arrows a to d by the rotating table 59 of the rotary supply device 1.
The above four steps are sequentially performed by rotating 90 degrees in the direction of.

That is, the first mounting head 51 that has performed the above-described suction 1 process is, as shown by the arrow d, the first mounting head 5.
It is forwarded to position 2. Further, the first mounting head 52 that has performed the process of the suction 2 is sent to the position of the second mounting head 53 as shown by an arrow a. Further, the second mounting head 53 that has performed the above-described inspection process, as shown by the arrow b,
It is sent to the position of the third mounting head 54. Further, the third mounting head 54 that has performed the mounting process is sent to the position of the first mounting head 51 as shown by an arrow c.

Further, as shown in FIG. 1, the mounting head fed in the direction of the arrow b rotates on a transfer jig 67 located between the flux transfer machine 72 and the re-inspection machine 73 on the mounting table 7. Be moved. At this time, the mounting head holds the solder ball 65 in a state of being sucked. The above is the description of the flow until the solder ball 65 is mounted.

The flow before and after the mounting of the printed board 66 on which the solder balls 65 are mounted will be described with reference to FIG. First, the printed board 66 on which the solder balls are not mounted is mounted on the transfer jig 67 from the return conveyor 81 shown in the lower part of FIG.
After that, it is conveyed to the carry-in machine 75 of the mounting machine 70.

Next, the carry-in machine 75 operates the transfer jig 67 on which the printed board 66 on which the solder balls are not mounted is mounted.
Is placed (loaded) on the mounting table 7 from the jig transport conveyor 82. Before or after that, the transport jig 67 on which the printed board 66 on which the solder balls 65 are already mounted is carried out from the mounting table 7 to the jig transport conveyor 82.

Next, the detector 71 of the mounting table 7 is used.
Is a printed circuit board 6 at a predetermined position on the mounting table 7.
It is checked whether or not 6 is correctly placed. If the printed board 66 is misaligned, measures such as stopping automatic operation are taken. If the printed board 66 is correctly mounted, the mounting table 7 Rotates clockwise.

Next, the flux transfer device 72 transfers the flux to a predetermined position on the printed board 66. Next, the transfer jig 67 mounted with the printed board 66 to which the flux has been transferred is sent to a position close to the rotary supply device 1 and the solder balls 65 are mounted as described above. Next, in order to finally confirm the mounting state of the solder ball 65 after the mounting, the inspection machine 73 checks whether or not the mounting of the solder ball 65 is correctly performed.

Then, the printed board 66 on which the solder balls 65 are accurately mounted is carried out to the jig carrying conveyor 82 by the carry-in machine 75. On the other hand, the defective product is carried out to the defective product discharge conveyor 84 by the defective product discharger 74.

On the other hand, in the rotary feeder 1,
As shown in FIG. 2, different operations are simultaneously performed on four mounting heads, and a series of operations are sequentially repeated on each mounting head. Therefore, one of the four mounting heads
The individual pieces can be prepared for solder ball mounting in advance. Therefore, the solder balls 65 can be efficiently and quickly mounted on the printed circuit board 66 without any time loss.

By providing the solder ball 65 suction step twice, the solder ball 65 suction step
This has the effect of reducing the problem of shortage of the solder balls 65.

[0056]

As described above, according to the present invention, it is possible to provide a solder ball mounting method capable of efficiently mounting a solder ball on a work, and a rotary supply device used therefor.

[Brief description of the drawings]

FIG. 1 is a plan view of a rotary supply device according to an embodiment.

FIG. 2 is an explanatory diagram of a solder ball mounting method using a rotary supply device according to the embodiment;

FIG. 3 is a bottom view of the rotary supply device according to the embodiment;

FIG. 4 is an explanatory side view of the embodiment at the time of solder ball suction;

FIG. 5 is an explanatory side view of the embodiment when a solder ball is mounted.

FIG. 6 is a plan view of a solder ball mounting device according to a conventional example.

FIG. 7 is an explanatory view of a solder ball mounting method using a solder ball mounting apparatus according to a conventional example.

[Explanation of symbols]

 1. . . 9. rotary feeder, . . 30. solder ball mounting device . . Solder ball feeder, 33. . . Inspection machine, 51, 52. . . First mounting head, 53. . . Second mounting head, 54. . . Third mounting head, 57. . . Arm, 59. . . Turntable, 65. . . Solder ball, 66. . . Printed circuit board, 661. . . Soldering pad, 67. . . 6. Transfer jig, . . Mounting table, 71. . . Detector, 72. . . Flux transfer machine, 73. . . Inspection machine, 74. . . Defective product discharger, 75. . . Carry-in machine, 81. . . Return conveyor, 82. . . Jig conveyor,

Claims (3)

[Claims] 1. A method for mounting a solder ball on a work placed on a mounting machine by using a rotary feeder to attract a solder ball, inspect a solder ball suction state, and mount a solder ball on a work. A solder ball mounting method for sequentially repeating the following three steps, wherein the rotary supply device comprises: a rotary table, at least three arms extending outward from the rotary table, and mounting heads respectively provided on the arms. Each of the mounting heads has an adsorbing portion for adsorbing the solder balls to be mounted on the work. When mounting the solder balls, the first mounting head among the mounting heads has a solder ball. During the suction, the second mounting head is inspected to determine whether or not the solder balls are correctly sucked, and the third mounting head is mounted on the work. Parallel processing for mounting the tool, wherein the parallel processing causes the respective mounting heads to sequentially perform the three processes of suction, inspection, and mounting by rotating the rotary supply device. Solder ball mounting method. 2. The solder ball mounting method according to claim 1, wherein the suction unit is an air suction port or an electrostatic suction device. 3. A rotary supply device for sequentially and repeatedly performing three steps of solder ball suction, inspection of a solder ball suction state, and mounting of a solder ball on a work. And at least three arms extending outward from the turntable, and mounting heads respectively provided on the arms, each of the mounting heads having a suction portion for suctioning a solder ball mounted on the work. A rotary supply device for mounting a solder ball, comprising: