JPH03289197A - Electronic component mounting apparatus - Google Patents

Abstract

PURPOSE:To mount an electronic component on a board at a high speed by providing optical means moving laterally to cross the moving direction of a transfer head between an electronic component supply unit and a board positioning unit, and observing the component to be transferred to the board at an intersection point. CONSTITUTION:Since a transfer head 6 moved on a predetermined component feeder 3 of an electronic component supply unit 1 to suck an electronic component P passes above a light source 12 on the way of feeding the component P to a board 5, the light of the source 12 is emitted from below to the component P at its intersection point, the silhouette of the component P is clearly observed by a camera B to detect its positional deviation. The deviations in X and Y directions are corrected by regulating X and Y direction strokes of a transfer head 6 by X-Y tables 10, 11, and the positional deviation in a thetadirection is corrected by driving a motor M and rotating a nozzle 7 around its axial center. Accordingly, time required for observing the component is eliminated, and a mounting speed can be accelerated.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an electronic component mounting apparatus, and more specifically, it is a method for mounting electronic components that are attracted to a nozzle of a transfer head and transferred to a board.
This invention relates to a means for observing during the transfer.

(Prior art) IC, LSI. Electronic component mounting equipment, which mounts electronic components such as resistor chips and capacitor chips on boards, picks up electronic components from parts feeders such as trays and tape feeders to the nozzles of the transfer head, and corrects positional deviations in the XYθ directions. Then, it is mounted on a board positioned by a positioning section.

As shown in FIG. 5, as a positional deviation correction means in the XYθ directions, a positional deviation correction stage 104 for electronic components P is provided between an electronic component supply section 101 such as a tape feeder or a tray and a positioning section 103 for the board 102. It is known that there is a

To explain the operation, first, the sub transfer head 105 transfers the electronic component P from the electronic component supply section 101 to the correction stage 104.
The CCD installed on this correction stage 104
The positional shift of the electronic component P in the xyθ directions is observed using the camera 106. Next, the nozzle 108 of the transfer hand 107 lands on the center of this electronic component P, and the electronic component P
Tick up. The positional deviation of the electronic component P in the XY force direction is caused by the stroke of the transfer head 107 in the XY direction.
This is corrected by adding a correction value based on the positional deviation in the XY force direction, and the positional deviation in the θ direction is corrected by moving the nozzle 108 in the θ direction (
The correction is made by rotating the nozzle 108 in the direction of rotation about the axis of the nozzle 108.

(Problems to be Solved by the Invention) However, such a positional deviation correction means is such that the electronic component P is once placed on the correction stage 104 by the sub-transfer head 105, and then observed by the camera 106. Since it is necessary to tick up after 10 ma, the time required for observation results in lost time, and the mounting efficiency is not improved.

Therefore, it is an object of the present invention to solve the problems of the conventional means as described above and to provide an electronic component mounting apparatus that can mount electronic components on a board at high speed.

(Means for Solving the Problems) For this purpose, the present invention provides an electronic component supply section in which parts feeders are arranged in parallel in the horizontal direction, a board positioning section, and a space between the electronic component supply section and the board positioning section. In an electronic component mounting apparatus equipped with a transfer pad that moves the electronic components of the parts feeder to a nozzle, and transfers and mounts the electronic components on the board, there is a space between the electronic component supply section and the board positioning section. An optical means that moves in a lateral direction intersecting the moving direction of the transfer head is provided, and the electronic component transferred to the substrate by the transfer head is observed at the intersection.

(Function) At the bottom of the tank, the transfer head that has adsorbed the electronic components of the parts feeder to the nozzle transfers the electronic components to the substrate positioned in the positioning section. By moving laterally between the positioning sections, it intersects with the movement path of the transfer head, so at this intersection, the electronic components adsorbed by the nozzles of the transfer head are observed and their positional deviations are detected. To detect.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view of the electronic component mounting apparatus, and FIG. 2 is a side view of the same, in which 1 is an electronic component supply section, and a table 2 includes a tape unit, a tube feeder, and a tray equipped with electronic components P. A large number of parts feeders 3 are arranged in parallel in the horizontal direction (X direction).

Reference numeral 4 denotes a positioning section for the substrate 5, which clamps both sides of the substrate 5 for positioning. Reference numeral 6 denotes a transfer head, which includes a nozzle 7 for sucking the electronic component P, a camera 8 for observing the electronic component P sucked by the nozzle 7 from above, and a motor M for rotating the nozzle 7 by θ around its axis. I am prepared. 10
11 is an XY child table for moving the transfer head 6 in the XY force directions. The transfer head 6 moves between the electronic component supply section 1 and the positioning section 4 of the board 5, picks up the electronic component P of the parts feeder 3 onto the nozzle 7, and transfers and mounts the electronic component P on the board 5.

Reference numeral 12 denotes a light source as an optical means, and by the means described below, the electronic component supply section 2 and the positioning section 4 of the board 5 are connected.
Move in the horizontal direction (X direction) between. 13.14 is
A timing belt and a motor serve as lateral movement means. This timing belt 13 is disposed laterally between the electronic component supply section 1 and the positioning section 4 of the base Fi5. A pedestal 15 is attached to the upper part of the pedestal 15, and the light source 12 is provided on the support plate 9 attached to the upper part of the rod 16 erected on the pedestal 15.

In FIG. 2, a cylinder 18 is disposed on the platform 15. As shown in FIG. An engager 24 is attached to the loft 19 of the cylinder 18 .

25 is a slider provided on the back surface of the standing plate 17, and 26 is a guide rail that guides the slider 25 in the X direction.

At the tip of the parts feeder 3, a waterwheel 22 is provided as a means for pitch-feeding the electronic component encapsulating tape 21. 23 is a pitch feed lever. When the motor 14 is driven, the timing belt 13 rotates, and the light source 12 and cylinder 18 on the platform 15 move integrally in the lateral direction intersecting the moving direction of the transfer head 6, and the above-mentioned engager 24
engages with the engaging portion 20 at the lower end of the lever 23. In this state, when the rod 19 of the cylinder 18 as a driving means for the water wheel 22 is lowered, the lever 23 rotates clockwise against the spring force of the spring 27, and the water wheel 22 also rotates in the same direction, causing the tape 21 is pitch-fed, and the electronic component P is sent to the pick-up position by the nozzle 7. Also, this base part 15
is provided with a cutting means 29 having a fixed blade 29a and a movable blade 29b, and cuts the empty tape 21 hanging down from the water wheel 22 by the pitch feeding described above.

This device has the above-mentioned configuration, and the operation will be explained next.

In FIG. 1, the transfer head 6 arrives on a predetermined parts feeder 3 of the electronic component supply section 1, is pitch-fed in advance by the cylinder 18, and transfers the electronic component P waiting at the pick-up position to the lower end of the nozzle 7. adsorbs on the part. Next, the transfer head 6 moves toward the substrate 5 in order to transfer and mount the electronic component P onto the substrate 5. At the same time, the light source 12 is moved laterally by the motor 14 being driven. Wait in advance directly below the moving path of the loading head 6.
(See the chain line in Figure 1).

Then, since the transfer head 6 that has picked up the electronic component P as described above passes above the light source 12 during the transfer to the electronic component Pfc group Fj, 5, the light source 12 is Light is irradiated onto the electronic component P from below, and the silhouette of the electronic component P is clearly observed by the camera 8 to detect any positional deviation or the like. And XY
Positional deviation in the force direction is corrected by adjusting the stroke of the transfer head 6 in the XY direction using the XY table 10.11, and positional deviation in the θ direction is corrected by driving the motor M to center the nozzle 7 on its axis. Correct by rotating.

In this means, the light source 12 is provided on the same platform 15 as the cylinder 18 and the cutting means 29, which are driving means for the water wheel 22 which is the means for pitch feeding the tape 21, so the lateral movement means 13 is the same as these. .14, light source 12
can be moved laterally, simplifying the structure.

(Embodiment 2) In FIG. 3, numeral 30 is a bracket provided on the support plate 9 in place of the light source 12, and 31 is a light source that irradiates light toward the mirror 30.

In this case as well, the mirror 30 moves laterally, waits at the intersection of the moving path of the transfer handle, and faces the transfer head 6 that moves above the board 5 in order to transfer and mount the electronic component P onto the board 5. , the silhouette of the electronic component P is observed with the camera 8 by reflecting the illumination light emitted from the light source 31 upward. Note that the light source 31 may be lit all the time, or may be lit in pulses like a strobe, so that it is lit only at the moment of observation by the camera 8.

(Embodiment 3) In FIG. 4, 32 is a camera provided on the support plate 9 instead of the light source 12, and 33 is a light source provided at the lower part of the transfer head 6. In this case as well, the camera 32 moves laterally and observes the electronic component P being transferred by the transfer handle from below.

(Effects of the Invention) As explained above, the present invention includes an electronic component supply section in which parts feeders are arranged in parallel in the horizontal direction, a board positioning section,
Move between this electronic component supply section and the board positioning section,
In an electronic component mounting apparatus equipped with a transfer head that sucks the electronic components of the parts feeder into a nozzle and transfers and mounts them onto the board, the transfer head is provided between the electronic component supply section and the board positioning section. An optical means is provided that moves in a lateral direction that intersects with the moving direction of The electronic components can be observed while being transported, so the time required to observe the electronic components is not required, and the mounting speed can be increased accordingly. Further, the structure can be simplified by moving the optical means in the lateral direction by the same lateral moving means as the driving means of the pitch feeding means.

[Brief explanation of the drawing]

The figures show embodiments of the present invention, in which Fig. 1 is a plan view of an electronic component mounting apparatus, Fig. 2 is a side view, Fig. 3 is a side view of another embodiment, and Fig. 4 is a plan view of an electronic component mounting apparatus. A side view of another embodiment, and FIG. 5 is a plan view of the conventional means. 1... Electronic component supply section 3... Parts feeder 4... Board positioning section 5... Board 6... Transfer head 7... Nozzle 12, 30, 32... Optical means 13 .14... Lateral movement means 18... Drive means for pitch feeding means 22... Pitch feeding means

Claims (2)

[Claims] (1) A parts feeder moves between an electronic component supply section and a board positioning section that are arranged in parallel in the horizontal direction, and between the electronic component supply section and the board positioning section, and transfers the electronic components of the parts feeder to the nozzle. In an electronic component mounting apparatus equipped with a transfer head that adsorbs and transfers and mounts the board onto the board, an electronic component mounting device is provided between the electronic component supply unit and the board positioning unit in a lateral direction intersecting the moving direction of the transfer head. An electronic component mounting apparatus characterized in that a moving optical means is provided, and the electronic component being transferred to the substrate by the transfer head is observed at an intersection. (2) Between the electronic component supply section and the board positioning section,
A lateral moving means for laterally moving a driving means for driving a pitch feeding means for the electronic component encapsulating tape of the parts feeder is provided, and the lateral moving means causes the optical means to be moved laterally. An electronic component mounting apparatus according to claim 1, characterized in that: