JP3462577B2 - Printed circuit board assembly equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board supported by a moving table positioned relative to the nozzle by moving the nozzle in a horizontal direction by lowering the nozzle. For assembling a printed circuit board by performing a predetermined operation on the printed circuit board. 2. Description of the Related Art An apparatus for assembling a printed circuit board of this type is disclosed in Japanese Patent Laid-Open Publication No. Hei 3-160793, in which a predetermined work for assembling a printed circuit board is performed by mounting electronic components on the printed circuit board. In this case, the height of the printed circuit board is always the same even if the type of the circuit board is, for example, a circuit board with pre-installed components. In addition, when the component is mounted, the shorter the distance that the suction nozzle descends, the shorter the component mounting time is, which is advantageous for high-speed mounting of components. As shown in FIG. 14, a printed circuit board 7 having chip components 72 mounted in grooves 71 formed in a pair of chutes 70, respectively.
3 is set, and the height of the substrate is set. [0003] However, in the prior art, when a component 72 having a height higher than an assumed height is mounted, or when a component 72 having a height higher than an assumed height is provided in a pre-attached component, the above-described conventional technique is required. As shown in FIG. 15, when the nozzle 74 for sucking the component 72 moves downward relative to the board 75 while moving horizontally, the component 72 and the component 72
However, there is a drawback in that not only can the components 72 be hit and cannot be mounted, but also the positions of the components 72 already mounted are shifted and a defective board is produced. In an apparatus for applying an adhesive for temporarily fixing an electronic component to a substrate from a nozzle, if the component has an unexpected height mounted on the substrate in advance, the nozzle is not used. There is a disadvantage of hitting parts. In view of the above, an object of the present invention is to provide a printed circuit board that is not defective even when there is a pre-installed component when the nozzle is lowered to perform a predetermined operation on the printed circuit board. SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a pair of movable tables provided on a moving table positioned relative to the nozzle by moving the nozzle in a horizontal direction by lowering the nozzle.
In a printed circuit board assembling apparatus that mounts components or applies an adhesive to the printed circuit board supported by the chute, and assembles the printed circuit board, the height of the printed circuit board is supported.
A plurality of different grooves are provided in the chute . According to the structure of the first aspect, the one on the moving table
One of the grooves of different heights provided in the pair of chutes
The printed circuit board is supported in the pair of grooves . An embodiment of the present invention will be described below in detail with reference to the drawings. 2 and 3, reference numeral 1 denotes a Y table as a moving table which moves in the Y direction by rotation of a Y-axis motor 2. Reference numeral 3 denotes an X direction on the Y table 1 by rotation of an X-axis motor 4. Is an XY table as a moving table that moves in the X and Y directions as a result, and is a chip-shaped electronic component 5 (hereinafter, referred to as a chip component or a component).
The printed circuit board 6 to which is mounted is fixed and mounted on fixing means (not shown). Reference numeral 7 denotes a supply table on which a number of component supply devices 8 for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply stand drive motor, which rotates the ball screw 10 so that the supply stand 7 is guided by the linear guide 12 through a nut 11 fitted with the ball screw 10 and fixed to the supply stand 7, and X Move in the direction. Reference numeral 13 denotes a rotary table which rotates intermittently. At the outer edge of the table 13, mounting heads 15 each having a plurality of suction nozzles 14 as take-out nozzles are arranged at equal intervals in accordance with an intermittent pitch. A suction station I is a stop position of the mounting head 15 where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 due to the intermittent rotation of the rotary table 13. 5 is adsorbed. 16 is a component 5 to which the suction nozzle 14 sucks.
This is a component recognition device which recognizes the positional shift of the component 5 by recognizing the lower surface of the component 5 with a camera in a predetermined visual field range and recognizing and processing the captured screen, and is provided in the recognition station II. Next mounting head 1 of recognition station II
The stop position of the position 5 is the angle correction station III, and the angle in which the angular position for correcting the angular position deviation of the chip component 5 based on the recognition result of the recognition device 16 is added to the predetermined angle amount indicated in the mounting data (not shown). The head rotation device 17 rotates the mounting head 15 in the θ direction by an amount. The θ direction is a direction that rotates around the axis of the nozzle 14. The next stop position after the angle correction station III is the mounting station IV, and the component 5 to which the suction nozzle 14 of the station IV sucks the substrate 6
Is mounted by lowering the mounting head 15. Reference numeral 20 denotes a vertically moving lifting rod, which is a swing lever 21 of the component supply device 8.
Then, the chip component 5 is supplied to the component suction position of the suction nozzle 14 by intermittently feeding a component storage tape (not shown) enclosing the chip component 5 at a predetermined interval according to the interval. Reference numeral 22 denotes a tape reel for winding the component storage tape (not shown). The XY table 3 will be described in detail with reference to FIGS. The XY table 3 is provided with a pair of chutes 24 for supporting the printed circuit board 6 and guiding its conveyance, and the chutes 24 come into contact with the lower surfaces on both sides of the board as shown in FIG. Upper and lower grooves 25 and 26 as supporting members are formed vertically. The printed board 6 is supported at two height positions with respect to the chute 24. Further, the chute 24 passes through a hole (not shown) formed vertically in the XY table with a guide rod 27 vertically extending from the chute 24 to the XY table 3. It is provided so as to be able to move up and down.
It is in the lowered position as shown. XY at this lowered position
The table 3 is moved in the horizontal direction. When the XY table 3 is at a predetermined horizontal position, the chute 24 is raised by a cylinder (not shown) provided at a predetermined position on a base 28 (see FIG. 3) on which the Y table 1 is mounted. FIG.
As shown in the figure, the feeding conveyor 29 and the discharging conveyor 30 as the conveying means are set at a position at which they can be connected. The supply conveyor 29 transports the substrate 6 from an upstream device in order to supply the printed substrate 6 to the chute 24, and a belt 31 which supports and transports one end of the substrate and a pulley 33 attached to a belt support plate 32. When one of the pulleys 33 is rotated by a motor (not shown), and the belt 31 and the belt supporting plate 32 are in a pair, both ends of the substrate 6 are supported and the substrate 6 is transported. The belt support plate 32 is swingably supported by a support shaft 35 provided on a conveyor support base 34 as a fulcrum, and is also supported by a rod 37 of a cylinder 36 as switching means provided on the support base 34. The cylinder 36 can be pivoted up and down by the operation of a cylinder 36 about a support shaft 35 as a fulcrum. Similarly, in the discharge conveyor 30, a belt support plate 41 having a belt 40 wound around a pulley 39 is supported swingably around a support shaft 43 provided on a conveyor support base 42, It is supported by a rod 45 of a cylinder 44 provided on a support base 42 for driving the movement.
The operation of the cylinder 36 and the cylinder 44 causes the rod 3
In a state where the support plates 31 and 41 are moved upward with the protrusions 7 and 45 protruding, the substrate 6 transported to the pair of belts 31
The transfer arm 47 which moves down and moves in the horizontal direction as shown by the arrow of FIG. 3 slides on the belt 31 by contacting the substrate 6 so as to move into the upper groove 25 as shown in FIG. Has been made. The substrate 6 supported in the upper groove 25 is moved on the belt 40 by the transfer arm 47. When the rods 37 and 45 are lowered, the substrate 6 on the belt 31 is transferred by the transfer arm 47 into the lower groove 26 and the substrate 6 supported by the lower groove 26 does not hit the support plate 41 without being hit by the support plate 41. It is designed to be transferred on the horizontal plane 40 in a substantially horizontal state. The angle at which the support plates 32, 41 swing by the operation of the rods 37, 45 need only be about 1 degree, and even when the support plates 32, 41 are horizontal in the raised state as shown in FIG.
Since it descends and is inclined at 1 degree, the substrate 6 is
You won't slide down 40. Referring to FIG. 9, a control block of the electronic component automatic mounting apparatus according to the present embodiment will be described. Reference numeral 49 denotes a CPU, which performs R based on various data stored in the RAM 50.
Various operations related to component mounting are controlled according to a program stored in the OM 51. The cylinder 36 and the cylinder 44 are connected to the CPU 49 via an interface 52 and a drive circuit 53. In the RAM 50, mounting data in which the components 5 to be mounted on the substrate 6 are mounted in the order in which they are mounted on the substrate 6 are stored together with the mounting position and data indicating the mounting position. Support height data for specifying whether to support the upper groove 25 or the lower groove 26 is stored. FIG. 10 shows the supporting height data, and FIG. 11 shows the mounting data. In the mounting data, the steps indicate the order of mounting the components, the XY coordinate positions indicated by “X” and “Y” are positions on the substrate 6 to be mounted, and “θ” indicates the θ direction of the component 6 to be mounted. Indicates, "R"
Indicates a position on the supply table 7 to which the component supply device 8 for supplying the component 6 to be mounted is attached. The supporting height data and the mounting data are stored together with the board name indicating the board type. The operation of the above configuration will be described below. First, an automatic operation of the electronic component automatic mounting apparatus is started by operating an operation unit (not shown). That is, CPU
49 reads out the board data of the board type to be produced stored in the RAM 50. The designation of the board type is usually performed by the operator by specifying the board name from an operation unit (not shown). When the designated board name is "AAA", the board data is shown in FIG.
Since the lower groove is used as shown at 0, the CPU 49 determines that the lower groove 26 should be used to support the substrate 6, and moves the cylinders 36, 44 to the positions where the rods 37, 45 are retracted. The support plates 32 and 41 are lowered to the position shown in FIG. Next, the substrate 6 is transferred from the upstream device to the belt 31.
The substrate 6 is moved upward, and the substrate 6 is rotated by the rotation of the belt 31 as shown in FIG.
And the belt 31 is stopped. Next, the transfer arm 47 is lowered as shown by the arrow and moves horizontally, and the substrate 6 is slid by the arm 47 and inserted into the lower groove 26 at the height of the belt 31. 8 is supported. Next, when the rod of the cylinder (not shown) is retracted, the guide rod 27 descends in the XY table 3 and the chute 24 descends to a position where it does not hit the support plates 32 and 41 as shown in FIG. With this downward movement, the substrate 6 becomes an XY text.
Supported by a backup pin (not shown) erected on the cable 3. Also, it is fixed by a fixing member (not shown) so as not to move in the horizontal direction. Next, the CPU 49 mounts the chip component 5 on the board 6 according to the mounting data of the board name "AAA" stored in the RAM 50. That is, the component supply device 8 moves in accordance with the data of “R” in step 1 and the suction nozzle 14 attached to the mounting head 15 that has moved by the intermittent rotation of the rotary table 13 vacuum-sucks the component 5 from the device 8. And take it out. Next, the rotation of the rotary table 13 causes the head 15 holding the component 5 to move to the recognition station II, where the component recognition device 16 recognizes the positional deviation of the component 5. Next, the part 5 corrects the recognition result by rotating the head 15 by the rotation of the head rotating device 17 at the angle correction station III, and swings the angle to the angular position of θ data. Done. Next, The component is mounted on the printed circuit board 6 by the lowering of the mounting head 15 at the mounting station IV. Before the mounting head 15 is lowered, the Y table 1 is mounted so as to be mounted at the positions of the X and Y data of the mounting data. And the XY table 3 move while correcting the recognition result. As described above, the components 5 are sucked by the suction nozzles 14 of the respective heads 15 in the order of the steps of the mounting data in FIG. 11 and are mounted at the positions of the substrate 6 indicated by the data. At this time, if the substrate 6 is supported in the upper groove 25, as shown in FIG.
When the mounting head 15 moves, the part 5 is mounted so that the head 15 or the XY table 3 may collide when the head 15 is not lowered.
Even when the long component 5 is sucked, since the substrate 6 is supported by the lower groove 26 and the supporting position of the substrate 6 is below, as shown in FIG.
Due to the relative horizontal movement of the bull 3, the mounting head 15 is lowered while horizontally moving without collision, and the component 5 is mounted at a position to be mounted. When the above operation is continued and the step of the mounting data is completed, the CPU 49 determines that the mounting of the component 5 on the board 6 is completed, and places the Y table 1 and the X table in a predetermined position.
The Y table 3 is moved, and the rod of the cylinder (not shown) is projected to raise the chute 24 to the position shown in FIG. Next, the transfer arm 47 is operated in the same manner as described above, and the substrate 6 supported by the lower groove 26 of the chute 24 is transferred onto the belt 40 without colliding with the support plate 41. At this time, the substrate 6 placed on the supply conveyor 29 is simultaneously inserted into the lower groove 26 of the chute 24 and transferred. Next, the substrate 6 on the discharge conveyor 30 is discharged and conveyed to a downstream device by conveying the belt 40. In this way, components are mounted on the board 6 one after another. When the assembly of the printed circuit board, in which the components are mounted on the predetermined number of boards 6, is completed, the automatic operation stops. Next, when the operator designates a board name of another board type from an operation unit (not shown), and the supporting height data indicates that the upper groove is used, the CPU 49 operates the cylinders 36 and 44 to operate the rods 37 and 44. 45 or projecting state, ie, support plate 3
It is assumed that 2, 41 have risen. Next, as described above, the substrate 6 is transported by the belt 31 as shown in FIG. 5, and the substrate 6 is guided into the upper groove 25 of the chute 24 by the transfer operation of the transfer arm 47, as shown in FIGS. Supported by Next, the chute 24 descends and the component 5 is mounted for each step in accordance with the mounting data as described above. In the case of the substrate 6, the state shown in FIG. 13 does not occur, so that the substrate 6 is supported by the upper groove 25. Can be smaller than the case where the substrate 6 is supported by the lower groove 26, and if the descending speed is the same speed that does not damage the component, the component 6 can be mounted on the substrate 5 in a shorter time, Lower groove 26
The components can be mounted at a higher speed than when the substrate 6 is supported on the substrate. In this manner, every time the mounting of the component 5 indicated by the mounting data on the substrate 6 is completed, the chute 24 is raised and the transfer operation of the substrate 6 from the chute 24 to the discharge conveyor 30 by the transfer arm 47 is performed. In this embodiment, the case where the lower groove 26 is used to move horizontally and collide as shown in FIG. 15 has been described. However, even if the lower groove 26 does not collide horizontally as shown in FIG. When the XY table 3 moves in the horizontal direction while the mounting head 15 is descending as shown in FIG. If there is a case where the component 6 can be mounted without collision even if the timing of the movement of the 3 is not changed, such a substrate 6 may be supported by the lower groove 26. In this embodiment, the cylinders 36 and 44 are automatically operated based on the support height data as shown in FIG.
May be directly operated. Alternatively, the height of the supply conveyor and the discharge conveyor can be varied without using a cylinder so that the positions can be maintained, and when the operator wants to change the positions, the operator may manually change the positions. In the present embodiment, the chute 24 has two upper and lower grooves as support members, but grooves may be provided at three or more heights. Also, the present embodiment has described the electronic component automatic mounting apparatus for mounting components on a printed circuit board and assembling the printed circuit board, but applying an adhesive before mounting the components in order to temporarily fix the mounted components in this way. In the case of a coating device that assembles printed circuit boards, if parts are pre-applied to the surface to be coated before applying the adhesive, the coating nozzle may hit the parts if the height of the part is high. In such a case, the chute may be provided with a plurality of grooves capable of supporting the substrate at various heights as in the present embodiment, and the substrate may be supported in the lower groove. As described above, the present invention provides a plurality of different heights.
Since the grooves are provided at different positions in the vertical direction on the moving table, the support height of the substrate can be changed with a simple structure, and the nozzle that performs the predetermined work or the component held by the nozzle is It is possible to avoid hitting. Especially when the moving table itself moves,
Since it is not necessary to mount a driving means for changing the supporting height on the moving table, the position of the substrate supporting height can be changed in a lightweight state. [0036]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a state in which a printed circuit board is mounted on a chute, as viewed from a board conveying direction. FIG. 2 is a plan view of the electronic component automatic mounting apparatus. FIG. 3 is a side view of the electronic component automatic mounting apparatus. FIG. 4 is a perspective view showing a state of an XY table in which a chute is lowered. FIG. 5 is a side view showing a state before a belt support plate moves upward and a substrate is transferred to an upper groove. FIG. 6 is a side view showing a state in which a belt support plate moves upward and a substrate is supported in an upper groove. FIG. 7 is a side view showing a state before a belt support plate is lowered and a substrate is transferred to a lower groove. FIG. 8 is a side view showing a state where the belt support plate is lowered to support the substrate in the lower groove. FIG. 9 is a control block diagram of the electronic component automatic mounting apparatus. FIG. 10 is a diagram showing support height data. FIG. 11 is a diagram showing mounting data. FIG. 12 is a side view showing a state where a suction nozzle that has sucked a component mounts the component on a substrate having a pre-installed component. FIG. 13 is a side view showing a state in which a suction nozzle that has sucked a component mounts the component on a substrate having a pre-installed component. FIG. 14 is a view of a chute on which a substrate of the related art is placed as viewed from a substrate transport direction. FIG. 15 is a side view showing a state in which a suction nozzle that sucks a component according to the related art mounts a component on a substrate having a pre-installed component. [Description of Signs] 3 XY table (moving table) 6 Printed circuit board 25 Upper groove (support member, groove) 26 Lower groove (support member, groove) 36 Cylinder (switching means) 44 Cylinder (switching means)

Claims (1)

(57) [Claim 1] A moving table which is positioned by being relatively moved in a horizontal direction with respect to a nozzle by descending the nozzle.
In a printed circuit board assembling apparatus for assembling a printed circuit board by mounting components or applying an adhesive to a printed circuit board supported by a pair of chutes provided above, a plurality of grooves having different heights for supporting the printed circuit board are formed by the chute. An apparatus for assembling a printed circuit board.