JP2517162B2 - Electronic component mounting device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus that mounts electronic components having different thicknesses on a substrate at high speed.

(Prior Art) As an electronic component mounting apparatus for mounting electronic components on a board,
A rotary head is known (for example, Japanese Patent Laid-Open No. 1-261898). This kind of electronic component mounting device moves the transfer head above the substrate positioned by the substrate positioning device while index-rotating the transfer head around the rotary head, and moves up and down to the nozzle that picked up the electronic component there. An electronic component is mounted (mounted) on the substrate by performing an operation.

(Problems to be Solved by the Invention) In recent years, it has been required to mount electronic components on a substrate at a higher speed. As a means for satisfying such a demand, it is known to adjust the height of the substrate positioned by the positioning device according to the thickness of the electronic component. That is, if the height of the substrate is adjusted according to the thickness of the electronic component, the lifting stroke of the nozzle of the transfer head can be reduced, or the lifting operation of the nozzle can be eliminated, so that the mounting speed of the electronic component can be increased. Can be raised.

However, in this case, the height of the substrate needs to be adjusted at a high speed so as not to be behind the index rotation speed of the transfer head. Furthermore, when the substrate is moved up and down at a high speed to adjust the height of the substrate, the substrate should not rattle. There are various sizes (width) for the board.
However, even if the size (width) of the board changes due to the change of the board type, the board must be able to be fixed firmly.

Therefore, the present invention firmly fixes substrates of various sizes, and adjusts the height of the substrate at a high speed,
An object of the present invention is to provide an electronic component mounting device that enables mounting of electronic components at high speed.

(Means for Solving the Problems) To this end, the present invention constitutes a substrate positioning device.
The Z table was placed on the XY table. On this Z table, a pair of left and right body blocks supporting both sides of the board, a guide rail and a slider for sliding at least one body block in the width direction of the board are provided, and on the top of the body block. A clamper for clamping and fixing both sides of the substrate is provided, and a drive unit for laterally moving at least one clamper is integrally attached to the main body block.

(Operation) In the above configuration, when mounting (mounting) the electronic component sucked by the nozzle of the transfer head on the substrate, the Z table is moved up and down according to the thickness of the electronic component to adjust the height of the substrate. . In this case, since the Z table is placed on the XY table, the lifting load of the Z table is small,
The height can be adjusted by raising and lowering the substrate at a high speed.

(Embodiment) Next, an embodiment of the electronic component mounting apparatus of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus, FIG. 2 is a front view, and FIG. 3 is a side view. This electronic component mounting device
It is composed of a main body device A and a board positioning device B.
The main body device A is similar to the device described in the above-mentioned Japanese Patent Laid-Open No. 1-261898, and therefore its structure will be briefly described below.

1 is a main body box, inside which a motor 2
A drive unit 3 driven by the motor 2 is provided. The drive unit 3 changes the rotational movement of the motor 2 into an index rotational movement by a cam (not shown). The output of the drive unit 3 is transmitted to the cam 7 via the timing belt 4 and the timing pulleys 5 and 6. 8
Is a cam follower, and 9 is a lever to which the cam follower 8 is attached. When the cam 7 rotates, the lever 9 swings.

In FIG. 3, reference numeral 11 is a horizontal rod, and rollers 11a and 11b are axially attached to both ends of the horizontal rod. This roller 11
The a and 11b are engaged with the lever 9 and the other lever 12. The rod 11 is mounted on a guide 13 so as to be slidable in the lateral direction. The guide 13 is attached to the plate 14. In FIG. 1, the plate 14 is mounted on a vertical rail 16 via a slider 15. A nut 17 is attached to the back surface of the plate 14. The nut 17 is screwed onto a feed screw 19 driven by a pulse motor 18. When the pulse motor 18 is driven, the rod 11 moves up and down, and the engagement depth of the rollers 11a and 11b with respect to the levers 9 and 12 changes. The pulse motor 18 is controlled by the computer 20 (see FIG. 1).

In FIG. 1, reference numeral 21 is a rotary head provided at the bottom of the main body box 1. This rotary head 21
There are provided a plurality of transfer heads 22. The rotary head 21 is driven by the drive unit 3 to perform index rotation. Reference numeral 23 is a nozzle that adsorbs the electronic component C.

In FIG. 3, a motor 24 is provided above the transfer head 22.
Is provided. The motor 24 corrects the positional deviation of the electronic component C in the rotational direction by rotating the nozzle 23 by θ through the belt 25 about the axis thereof.

A shaft 27 projects from the main body 26 of the transfer head 22. Rollers 28 and 29 are mounted on the upper end of the shaft 27. One roller 28 is fitted to a guide rail 31 provided inside the main body box 1. When the rotary head 21 makes an index rotation, this roller 28
Rolls along the guide rail 31. The other roller 29
Is fitted to the elevator 32. The roller 33 pivotally attached to the lever 12 is also fitted to the elevator 32. 34
Is an elevating guide for the elevator 32.

When the cam 7 rotates, the rod 11 reciprocates laterally. Then, the lever 12 swings around the pin 35. Then, the transfer head 22 moves up and down to mount the electronic component C adsorbed on the lower end of the nozzle 23 on the substrate 41.

The size of the lifting stroke of the transfer head 22 depends on the lever 12
It is determined by the size of the swing. Further, the magnitude of the swing of the lever 12 is determined by the fitting depth of the roller 11b of the rod 11. Therefore, by driving the pulse motor 18 to move the rod 11 up and down and change the fitting depth of the roller 11b,
The lifting stroke of the transfer head 22 can be adjusted according to the thickness of the electronic component C. Such a transfer head 22
The adjusting means 30 of the lifting stroke of the
This is described in detail in Japanese Patent Publication No. 98.

 Next, the positioning device B for the substrate 41 will be described.

In FIG. 2, reference numeral 42 is a clamper provided on both sides of the substrate 41. 43 is a cylinder and its rod 44
Is connected to the left clamper 42. This cylinder
When the 43 is activated, the clamper 42 moves laterally,
Clamp the 41.

Reference numeral 45 denotes a main body block provided below the clamper 42, and a conveyor belt 46 that conveys the substrate 41 is provided. The body block 45 is supported by the support block 47. A guide rail 48 is arranged below the substrate 41, and the support block 47 is placed on the guide rail 48 via a slider 49.

The right support block 47 is fixed to the guide rail 48 by a bracket 50 and a screw 51. The support block 47 on the left side slides in the lateral direction, and the width of the clamper 42 is adjusted in accordance with the width of the substrate 41.

A push-up body 52 is provided on the support block 47.
The push-up body 52 is located below both sides of the substrate 41. A ground rod 53 is inserted in the support block 47. A coil spring 54 is attached to the ground rod 53. A ground plate 55 is provided below the ground rod 53. 56 is a Z table to which a ground plate 55 is attached.
The push-up body 52 is attached to the upper end of the ground rod 53.

Below the Z table 56, there is a cylinder as a lifting means.
60 are provided. The rod 61 of the cylinder 60 supports a rod 62 vertically provided on the guide rail 48. The rod 62 is inserted in a guide tube 57 penetrating the Z table 56 so as to be able to move up and down. Reference numeral 58 is a coil spring for a cushion.

When the rod 61 of the cylinder 60 descends, the ground rod 53 lands on the ground plate 55 and descends while compressing the spring 54. Along with this, the substrate 41 also descends, and the upper end portions of the pressing bodies 52 are pressed against both side portions of the substrate 41, so that the bending of the substrate 41 is corrected.
In this state, the board 41 is firmly fixed by the clamper 42 and the push-up body 52, and the deflection is corrected to have good flatness, so that the electronic component C can be reliably landed on the board 41.

Reference numeral 65 is an X table, 66 is a Y table, and MX and MY are respective drive motors. X table 65 is Y table 66
It is placed on. A nut 67 is attached to the Z table 56. This nut 67 has a vertical lead screw 68
Are screwed together. The feed screw 68 is driven by a motor MZ provided on the X table 65. When the motors MY, MY are driven, the board 41 moves horizontally in the XY directions. When the motor MZ is driven, the Z table 56 moves up and down, and the substrate 41 also moves up and down. That is, the nut 67, the feed screw 68, and the motor MZ are
It is a height adjusting means for adjusting the height of the table 56. Therefore, drive the XY tables 65 and 66 to move the substrate 41
By horizontally moving in the Y direction, the electronic component C is landed at a predetermined coordinate position. Further, by raising and lowering the Z table 56, the height of the upper surface of the substrate 41 is adjusted according to the thickness of the electronic component C. The motors MX, MY, MZ are controlled by a computer.

In other words, this board positioning device B includes an XY table 6
The Z table 56 is placed on 5, 66, and this makes it possible to reduce the lifting load of the Z table 56 and to move the Z table 56 up and down at a high speed. On the contrary, if the XY tables 65 and 66 are placed on the Z table 56, the lifting load of the Z table becomes large and the Z table 56
It is difficult to move up and down at high speed. Further, a pair of left and right main body blocks 45 are provided on the Z table 56, and at least one main body block 45 (the left main body block 45 in FIG. 2) is slid on a horizontal guide rail 48 via a slider 49. The size (width) of the substrate 41 can be freely adapted. Also, a pair of left and right body blocks 45
A clamper 42 that clamps and fixes the substrate 41 from both sides is provided on the upper side of the substrate, and at least one clamper (left-side clamper 42 in FIG. 2) is used as a drive unit for moving in the lateral direction (width direction of the substrate). Cylinder 43 to body block 45
Since the Z table 56 is integrally mounted on the Z table 56, the Z table 56 can be firmly clamped and fixed so that the substrate 41 does not rattle when moving up and down at a high speed.

The present apparatus has the above-mentioned configuration, and the operation will be described next.

When the rotary head 21 rotates in an index manner, the transfer head 22 that has adsorbed the electronic component C arrives above the substrate 41, and the transfer head 22 moves up and down to mount the electronic component C on the substrate 41. .

As shown in FIG. 4 (a), an electronic component having a large thickness d1
In the case of C1, drive the motor MZ in advance and set the board 41 to the reference plane.
Hold it at a position raised a small distance h1 from SL. In this case, the lifting stroke of the transfer head 22 is S1. Also, as shown in FIG. 4 (b), an electronic component having a small thickness d2
In the case of C2, the substrate 41 is made to stand by at a position where it has been raised a large distance h2 in advance. In this case, the lifting stroke of the transfer head 22 is S2. In this way, the height of the substrate 41 is stepwise adjusted according to the thickness of the electronic component C (in this embodiment, if the two steps of the small distance h1 and the large distance h2 are adjusted, the lifting stroke S1 of the transfer head 22). , S2 can be made smaller, and the electronic component C can be mounted on the substrate 41 at a higher speed accordingly. If the electronic component C is located on the reference plane SL without raising the substrate 41,
As shown in FIG. 7C, the lifting stroke S of the transfer head 22 becomes large, and it takes a long time to land the electronic component C2 on the substrate 41.

By the way, there are many kinds of electronic parts (generally said to be more than 1000 kinds), and their thicknesses are various. In order to correspond to such a wide variety of electronic components in detail, the motor MZ is driven so as to adjust the height of the substrate 41 steplessly (analogically) and the Z table is adjusted.
It is desirable to change the height of 56. However, this makes the control of the motor MZ by computer programming cumbersome. Therefore, as in the present embodiment, the electronic components are roughly divided into a plurality of small values (two types in the present embodiment) by thickness, and the height of the Z table 56 is stepwise by a relatively small number of stages ( It is practically desirable to change it to (digital).

FIG. 5 shows a state in which the electronic components C1 and C2 stored in the pockets 81a and 82a of the tapes 81 and 82 are adsorbed by the nozzles 23a and 23b and taken up. This take-up is performed on the back side of the body box 1.

SL is the reference surface of the tapes 81 and 82. As shown in FIG. 3A, when the thick electronic component C1 is taken up, the nozzle 23a is projected from the transfer head 22 by a small distance l1.
In this case, the elevating stroke of the nozzle 23a required to take up the electronic component C1 is S3, which is considerably long.
This is because the thick electronic component C1 must be completely removed from the pocket 81a of the tape 81.

On the other hand, as shown in FIG.
When C2 is taken up, the nozzle 23b is projected from the transfer head 22 by a large distance l2. In this case, the nozzle 23
The lifting stroke of b is S4, which is quite short. In the case of such a thin electronic component C2, if the nozzle 23a is made to project long, the lifting stroke S4 required for take-up can be shortened and the take-up can be performed at high speed.

If the transfer head is a multi-nozzle type transfer head having a plurality of nozzles, the nozzles that take up thick electronic components should be projected shortly from the transfer head.
The nozzle for taking up thin electronic components should be projected long. In this way, the take-up speed of the electronic component can be increased by adjusting the protruding length of the nozzle from the transfer head according to the thickness of the electronic component.

According to the present invention, the height of the Z table that supports the substrate is adjusted according to the thickness of the electronic component mounted on the substrate. Therefore, it is possible to reduce the lifting stroke of the nozzle of the transfer head by that amount, or it is possible to mount the electronic component on the substrate at a high speed without raising and lowering the nozzle. Moreover, since the Z table is placed on the XY table, the lifting load of the Z table is small, and therefore the Z table can be moved up and down at a high speed so as not to be behind the index rotation speed of the transfer head. In addition, the clamper that clamps and fixes the board and the drive unit that moves the clamper laterally to firmly clamp the board are integrally attached to the main body block and lifted together with the board. The board can always be firmly fixed so that it does not rattle even when it moves up and down at high speed, and it is also possible to freely respond to changes in the width of the board due to board type changes.

[Brief description of drawings]

1 is a perspective view of an electronic component mounting apparatus, FIG. 2 is a front view, FIG. 3 is a side view, and FIG. 4 is a front view during mounting. FIG. 5 is a front view during take-up. 3 Drive unit 21 Rotary head 22 Transfer head 23 Nozzle 30 Adjusting means 41 Substrate 42 Clamper 56 Z table 65 X table 66 Y table

Claims (1)

(57) [Claims] 1. An electronic component mounting apparatus for mounting an electronic component on a substrate positioned by a substrate positioning device while index-rotating a transfer head having a nozzle for sucking the electronic component along a rotary head. The substrate positioning device comprises an XY table for horizontally moving the substrate in the XY directions, and a Z table mounted on the XY table for raising and lowering the substrate to adjust the height of the substrate. On the table, a pair of left and right body blocks that support both sides of the board, and guide rails and sliders for sliding at least one body block in the width direction of the board are provided. A clamper for clamping and fixing the parts is provided, and a drive part for moving at least one clamper in the lateral direction is provided. Electronic component mounting apparatus characterized by being integrally attached to the body block.