JP2512114B2 - Electronic component mounting device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus that scrubs electronic components to mount them on a substrate.

(Prior Art) As a mounting device for electronic components, there is known a device that reciprocates a transfer head between a substage and a substrate such as a lead frame to mount the electronic components on the substage on the substrate. Such a transfer head performs the following two operations in addition to the above-mentioned reciprocating operation.

(1) Slightly (generally about 0.1 mm) slide in the XY direction so that the electronic components adsorbed by the transfer head are firmly landed on the substrate and the electronic components are firmly adhered to the bond previously applied to the substrate. An action to move (this action is called "scrub").

(2) In some cases, a plurality of lead frames may be sent in parallel under the transfer head. In such a case, in order to mount the electronic component at a predetermined position of each lead frame, the Y direction, that is, the leads are mounted. Operation to slide in the width direction of the frame.

Conventionally, such a scrubbing operation and a Y-direction sliding operation of the transfer head are performed on the entire main body of the mounting apparatus equipped with the transfer head.
This was done by setting it on an XY table and driving the XY table to slide the entire body in the XY direction.

(Problems to be Solved by the Invention) However, the above-mentioned conventional means slides the entire main body of the mounting apparatus to slide the transfer head mounted on the main body in the same direction. The load of the driving motor is extremely large, and even if a large-capacity motor is used, there is a limit in increasing the sliding speed, and there is a problem that the mounting speed of the electronic parts does not increase.

Therefore, the present invention provides an electronic component mounting apparatus including a drive mechanism of a transfer head that can perform the above operation by sliding the transfer head in the XY directions at high speed even with a small-capacity motor. The purpose is to do.

(Means for Solving the Problems) To this end, the present invention is directed to an electronic component supply unit arranged side by side, a sub-stage for correcting the position of the electronic component, and a substrate transfer conveyor, and these electronic component supply units. , A transfer head section and a sub transfer head section disposed above the sub stage and the transfer conveyor, and a reciprocating movement of the transfer head section and the sub transfer head section in the Y direction to move the sub transfer head section to the electronic component supply section. And the sub-stage are reciprocally moved to transfer the electronic components provided in the electronic component supply unit onto the sub-stage, and the transfer head is reciprocally moved between the sub-stage and the conveyor to correct the position on the sub-stage. A drive device for transferring the electronic components thus processed to the substrate on the transfer conveyor and an X-direction for the transfer head unit by reciprocating the base in the X direction. Scrubbing in the Y direction by moving the transfer head unit provided on the base along the front surface of the base in the X direction, and reciprocating in the X direction along the front surface of the base. And a Y-direction drive unit having a motor for performing the operation.

(Operation) In the above configuration, when the electronic component is scrubbed and mounted on the substrate, both the X-direction drive unit and the Y-direction drive unit are driven to slightly slide the transfer head in the XY direction. When mounting electronic components on each of the substrates that have been fed in parallel under the transfer head, the Y-direction driving device is driven to
The transfer head is largely slid in the width direction of the board to mount electronic components on each board.

(Example) Next, the Example of this invention is described, referring drawings.

FIG. 1 schematically shows the entire mounting device for electronic components. The mounting device includes a driving device A and a mounting device B.
Made of. The driving device A includes a motor 1, a belt 2, a groove cam 4 driven by the motor 1 via a transmission box 3 and rotating, and the like. Reference numeral 5 denotes a cam follower that fits in a cam groove formed on the wall surface of the groove cam 4, and is attached to the tip end portion of the swing lever 6. The lever 6 is mounted on one end of a spline shaft 7. When the motor 1 is driven to rotate the groove cam 4, the spline shaft 7 reciprocates at an angle of 45 °. Next, the mounting apparatus B will be described.

Reference numeral 11 is a base portion, and a base 12 is placed on the upper surface thereof. An X-direction guide member 13 provided on the upper surface of the base 11
Guide material 14 provided on the lower surface of base 12 is fitted,
The base 12 is slidably mounted on the base 11 in the X direction. Reference numeral 15 denotes an X-direction drive unit provided behind the base 12, which is a pulse motor 17 for driving a feed screw 16, and is provided upright at a rear edge of the base 12, and is screwed to the feed screw 16. When the motor 17 is driven, the base
The guide 12 is guided by the guides 13 and 14 and reciprocates on the base 11 in the X direction. Since the load of the motor 17 is only the base 12 and each member arranged on the base 12, it is considerably small,
Therefore, even with the low-capacity motor 17, the base 12 can be slid back and forth in the X direction at high speed.

A front wall portion 12a is suspended from a front portion of the base 12, and a guide member 21 in the Y direction is provided on the front wall portion 12a. 22 is a transfer head section, and 23 is a sub-transfer head section.
Are provided with guide members 26, 27 that fit into the. A transfer head 28 and a sub-transfer head 29 are provided on the front surfaces of the plates 24 and 25, respectively. 28a and 29a are heads 28 and 29
Is a nozzle that protrudes from the lower end of the device, and sucks electronic components to the lower end. 31 is a wafer, 32 is a substage, and a sub transfer head 29 is a wafer and a substage.
The electronic component on the wafer 31 is transferred to the sub-stage 32 by reciprocating between the sub-stages 32. The substage 32 is a stage for correcting the position of the electronic component. Also transfer head 28
Reciprocates between the sub-stage 32 and the lead frame LF, and mounts the electronic component whose position is corrected by the sub-stage 32 on the lead frame LF. Reference numeral 33 is a conveyor that intermittently conveys the lead frame LF below the transfer head 28. The wafer 31, the sub-stage 32, and the conveyor 33 as the electronic component supply unit are arranged in parallel with each other, and the base 12 is the wafer 3
1, provided above the sub-stage 32 and the conveyor 33. In the present invention, the conveying direction of the lead frame LF by the conveyor 33 is the X direction, and the width direction of the lead frame LF orthogonal to this is the Y direction. Next, both heads 2
A mechanism for reciprocating the 2, 23 in the Y direction (width direction of the lead frame LF) will be described.

Reference numeral 35 denotes a transfer head disposed on the side of the transfer head 22.
The Y-direction driving unit 22 is connected to the plate 25 of the sub transfer head unit 23 by a connecting member 34, and reciprocates integrally with the transfer head unit 22 in the Y direction. The Y-direction drive unit 35 includes a plate 36, a guide member 37 provided on the back surface of the plate 36 and fitted to the guide member 21, a pulse motor 38 attached to the plate 36, and the pulse motor 38. And a feed nut 40 screwed to the feed screw 39 (see also FIG. 2). The feed nut 40 is the plate 24 of the transfer head 22.
When the motor 38 is driven, the transfer head portion 22 reciprocates in the Y direction.

42 is a pillar standing on one side of the base 12,
The column 42 is slidably attached to the other end of the spline shaft 7. Reference numeral 43 denotes a fan-shaped gear mounted on the column 42, which is driven by the spline shaft 7 to reciprocally rotate. Reference numeral 44 denotes an engaging portion mounted on the upper portion of the plate 36 and having a U-shaped cross section, and a rotator 45 is fitted into the groove portion 41. Reference numeral 46 denotes an arm that supports the rotator 45, and one end of the arm is connected to a gear 47 attached to the lower portion of the column 42. The gear 47 is engaged with the fan-shaped gear 43. When the gear 43 is driven by the motor 1 and reciprocates 45 °, the gear 47 reciprocates 180 °. Then, the rotator 45 reciprocates 180 ° about the shaft center of the gear 47, and the engaging portion 4
The Y-direction drive unit 35 that interlocks with the rotator 45 via the 4
Also, both head parts 22 and 23 reciprocate integrally in the Y direction, and as described above, the sub-transfer head 29 moves between the wafer 31 and the sub-stage 32, and the transfer head 28 moves between the sub-stage 32 and the lead frame LF. Reciprocates between.

In FIG. 1, reference numerals 8 and 9 denote pulleys and belts driven by the motor 1, reference numeral 50 denotes a cam driven via a shaft 51, reference numeral 52 denotes a cam follower, reference numeral 53 denotes a swing lever for supporting the cam follower 52, reference numeral 54 denotes a rod. Reference numeral 55 denotes a base plate provided on the base 12, and reference numeral 56 denotes a motor provided on the base plate 55. These members 50 to 56 are connected to the nozzles 28a and 29a of the heads 28 and 29, respectively.
Although it constitutes a device for raising and lowering the motor, since it is not directly related to the present invention, its detailed description is omitted.

The present apparatus has the above-mentioned configuration, and the overall operation will be described below.

When the motor 1 is driven, the sector gear 43 reciprocates 45 ° about the spline shaft 7 and the gear 47 driven by the gear 43 reciprocates 180 °. Then, the rotator 45 becomes the gear 4
The Y-direction drive unit 35 and both head units 2 which reciprocally rotate 180 degrees about the axis of 7 and interlock with the rotor 45 through the engaging unit 44.
2, 23 integrally reciprocate in the Y direction, the sub-transfer head 29 transfers the electronic components on the wafer 31 onto the sub-stage 32,
The transfer head 28 mounts the electronic component whose position has been corrected by the substage 32 on the lead frame LF. Transfer head
When the electronic component attracted by the nozzle 28a is landed on the bond previously applied to the lead frame LF, the X-direction driving unit 15 and the Y-direction driving unit 35 are slightly driven to move the transfer head 28 in the XY directions. Slightly scrubbing (about 0.1 mm) on the electronic components to attach them firmly to the bond.

By the way, as shown in FIG. 3, a plurality of lead frames LF (three as shown in the present embodiment) are fed in parallel to the lower side of the transfer head 28, and these lead frames LF are fed.
Electronic components may be mounted at the mounting points a of the LF. In this case, the transfer head 28 has to slide in the Y direction, that is, the width direction of the lead frame LF with a stroke larger by the pitch t and 2t. This sliding is performed by driving the Y direction drive unit 35. Be seen. in this case,
Since the load on the motor 38 is only the transfer head portion 22, the load is extremely small, and therefore the motor 38 having a low capacity is low.
Even if it is, it can be slid back and forth at high speed. Particularly, the pitches t and 2t are much larger than the sliding pitch of scrubbing (about 0.1 mm as described above), and the high speed sliding of the whole main body portion at such a large pitch t as in the above conventional device. It is practically impossible to move the motor even if a large capacity motor is used. However, according to the present device, since only the head portions 22 and 23 need to be slid, even a small-capacity pulse motor 38 can be reciprocated at a high speed, and thus the mounting speed of electronic components can be increased. Can be raised.

(Effects of the Invention) As described above, according to the present invention, the load of the motor that reciprocates the transfer head portion in the two directions of the X direction and the Y direction for the scrubbing operation is extremely small. Even if there is, the scrubbing operation of the transfer head unit can be performed at high speed, which in turn can increase the mounting speed of electronic components. Further, even when mounting electronic components on a plurality of substrates that are transported in parallel by a conveyor, the Y-direction drive unit equipped with a low-capacity motor is driven to reciprocate only the transfer head unit in the Y-direction with a large stroke. It is possible to mount electronic components on these plural substrates simultaneously at high speed.

[Brief description of drawings]

1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an electronic component mounting apparatus, FIG. 2 is a plan view, and FIG. 3 is a plan view of a lead frame. 12 …… Base 13,14 …… X direction guide material 15 …… X direction drive part 17 …… Motor 21 …… Y direction guide material 22 …… Transfer head part 28 …… Transfer head 32 …… Substage 35 …… Y direction drive unit 38 …… Motor A …… Drive device LF …… Lead frame as substrate

Claims (1)

(57) [Claims] 1. An electronic component supply unit, a sub-stage and a substrate transfer conveyor for correcting the position of the electronic component, which are arranged in parallel with each other, and an electronic component supply unit, a sub-stage and a transfer conveyor arranged above these electronic component supply unit. The transfer head unit and the sub transfer head unit are moved to and from the electronic component supply unit and the sub stage by reciprocating the transfer head unit and the sub transfer head unit in the Y direction. Then, the electronic components provided in the electronic component supply unit are transferred onto the sub-stage, and the transfer head unit is reciprocally moved between the sub-stage and the transfer conveyor to perform position correction on the sub-stage. A drive device for transferring the electronic components to the substrate on the transfer conveyor, and the transfer by reciprocating the base in the X direction. The X-direction driving section having a motor for causing the X-direction of the scrub operation head portion, said transfer head portion provided on the base along the front surface of the base Y
By reciprocating in the direction
An electronic component mounting apparatus comprising: a Y-direction drive unit including a motor for performing a scrubbing operation in a direction.