JP2002141698A - Method and device for mounting electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for mounting an electronic part in which a picking-up operation and rising/falling operation of a transportation head at mounting are improved, and to prevent failure caused by the rising/ falling operation. SOLUTION: Within a prescribed movement range of a pickup station of a supply part of an electronic part and a mounting station on a substrate with a cam follower 27 hitting a cam member 22, a rising/falling operation of a rising/falling rail 25 caused by index rotation of a rotary head is superimposed with the rising/falling operation by a transportation head rising/falling mechanism 40 which raises/lowers a transportation head 7 at a prescribed rising/falling pattern, so that the transportation head 7 is raised/lowered at a low acceleration rising/falling pattern. Thus, the impact on an electronic part is reduced and the failure at picking up operation or mounting operation is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art As a type of electronic component mounting apparatus, there is known a rotary type mounting apparatus which continuously mounts a plurality of transfer heads having a plurality of suction nozzles for sucking electronic components by rotating the index rotation of the heads. ing. This rotary mounting apparatus has an advantage that high-speed mounting can be performed because a large number of transfer heads having a plurality of nozzles are moved by an index rotating body and are sequentially mounted.

In a mounting apparatus of this type, a cam mechanism is generally used as a transfer head elevating mechanism for raising and lowering a plurality of transfer heads at a predetermined station. Hereinafter, description will be made with reference to the drawings. FIG. 9 is an explanatory view of a transfer head elevating mechanism of a conventional rotary electronic component mounting apparatus.
In FIG. 9A, the index rotating body A is rotated around the rotation axis B by a driving mechanism (not shown). A transfer head D provided with a suction nozzle E is further movably mounted on a transfer head holding portion C arranged vertically movable on the index rotating body A, and is coupled to the transfer head holding portion C. The index rotating body rotates the index while the cam follower F is in contact with the cam member G provided on the fixed portion, so that the transfer head holding portion C moves relative to the index rotating body A in FIG. The robot moves up and down along the locus shown in FIG.

In the pick-up station and the mounting station, the transfer head D is moved up and down with respect to the transfer head holding section C by a head lifting mechanism H fixed to each station. By this elevating operation, pickup of the electronic component by the suction nozzle E and mounting of the electronic component on the substrate are performed.

[0005]

However, in the conventional electronic component mounting apparatus, the lifting / lowering operation of the transfer head D by the head lifting / lowering mechanism H in the pickup station or the mounting station is performed when the transfer head D stops the index of the station. While the robot has reached the position and stopped, it was performed according to a linear motion trajectory as shown in FIG. That is, in the pick-up station and the mounting station, the transfer head D has to perform a high-speed operation in order to complete the elevating operation within a limited stop time. For this reason, during a pick-up operation for sucking and holding an electronic component by the suction nozzle E and a mounting operation for landing the held electronic component on a substrate, a situation occurs in which an excessive impact is given to the electronic component. However, there is a problem that such troubles are caused.

Accordingly, the present invention provides an electronic component mounting apparatus and an electronic component mounting method capable of improving the elevating operation of the transfer head during the pick-up operation and the mounting operation of the electronic component and preventing the trouble caused by the elevating operation. The purpose is to provide.

[0007]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus, comprising: an index rotating body which is index-rotated around a vertical rotation axis by an index driving mechanism;
A transfer head holding portion that is disposed at a plurality of positions around the rotation axis of the index rotating body and that can move up and down with respect to the index rotating body, and holds the transfer head holding portion so as to be able to move up and down A transfer head capable of rotating around a vertical rotation axis, a plurality of suction nozzles arranged at positions eccentric from the rotation axis on the transfer head to suction and hold electronic components, and a transfer head holding unit. A cam member disposed in contact with the fixed cam follower to raise and lower the transfer head holding portion with a predetermined trajectory with respect to the index rotator by the index rotation of the index rotator; and a predetermined index stop position of the index rotation. A transfer head elevating mechanism for raising and lowering the transfer head with respect to the transfer head holding unit in a predetermined pattern within a predetermined movement range.

According to a second aspect of the present invention, there is provided an electronic component mounting method, wherein an index rotating body is rotated by an index driving mechanism around a vertical rotating axis, and a plurality of positions around the rotating axis of the index rotating body. Electronic component mounting apparatus, comprising: a transfer head holding unit disposed on the index rotary body and capable of moving up and down with respect to the index rotating body; and a transfer head held to be movable up and down with respect to the transfer head holding unit. A mounting method, wherein the transfer head is held within a predetermined moving range of the transfer head including an index stop position corresponding to a pickup station provided in a supply section of the electronic component and a mounting station for mounting the electronic component on a substrate. The transfer head is held in contact with the cam follower fixed to the section, and is held by the index rotation of the index rotating body. The transfer head by a cam member that moves up and down a predetermined locus with respect to the index rotating body, and the lifting and lowering operation by a transfer head elevating mechanism that moves the transfer head up and down in a predetermined pattern with respect to the transfer head holding unit. Are superimposed to move the transfer head in a low-acceleration elevating pattern.

According to the present invention, the transfer is performed within a predetermined movement range of the transfer head including the index stop position corresponding to the pickup station provided at the electronic component supply section and the mounting station for mounting the electronic component on the substrate. An ascending and descending operation of the transfer head by a cam member which is disposed in contact with a cam follower fixed to the head holding unit and moves the transfer head holding unit up and down with a predetermined trajectory with respect to the index rotator by index rotation of the index rotator;
The transfer head is moved up and down in a low-acceleration elevating pattern by superimposing the elevating operation of the transfer head elevating mechanism that raises and lowers the transfer head with respect to the transfer head holding unit in a predetermined pattern, and reduces the impact on electronic components. In addition, it is possible to prevent problems in the pickup operation and the mounting operation.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a side sectional view of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a partial front view of a pickup station of the electronic component mounting apparatus, FIG. 4 is a partial front view of a mounting station of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 5 is an electronic component mounting apparatus according to one embodiment of the present invention. 6 is a partial view of a transfer head elevating mechanism, FIG. 6 is an explanatory diagram of a pickup operation of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 7 is mounting of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 8 is a graph showing an elevating locus of the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.

First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a large number of parts feeders 4 for supplying electronic components are provided in parallel in a supply unit 3 for electronic components. The parts feeder 4 is mounted on a feeder base (not shown), and moves in the lateral direction by rotating the feed screw 5.

A rotary head 6 is provided in front of the supply unit 3. The rotary head 6 rotates in an index around the rotation axis O, and a plurality of transfer heads 7 are provided on the circumference thereof. The transfer head 7 has a plurality of suction nozzles 7a (see FIG. 2). The electronic component is picked up from the parts feeder 4 when the transfer head 7 moves up and down while being located at the pick-up position P of the pick-up station. At this time, a desired electronic component can be picked up by moving the parts feeder 4 laterally with the feed screw 5.

The transfer head 7 is disposed on a circumference around the rotation axis O of the rotary head 6.
Is rotated around its rotation axis by a rotation mechanism described later. By this rotation, selection of a plurality of suction nozzles provided on the transfer head 7 and setting of the angle of the electronic component held by the suction nozzles in the horizontal rotation direction are performed.

The electronic components picked up at the pickup position P are sequentially moved in the direction of arrow a by the index rotation of the rotary head 6. A height measuring station 8 is provided during the movement. The height measuring station 8 measures the height of the electronic component held by the transfer head 7.

A component recognition station 9 is provided adjacent to the height measuring station 8. The electronic component held by the suction nozzle of the transfer head 7 is imaged from below by a camera (not shown) at the component recognition station 9. Then, by performing image processing on this imaging result,
The dimensions of the electronic component in plan view, that is, the length and width dimensions are detected.

An XY table 11 is provided in front of the rotary head 6. The XY table 11 positions the substrate 1 in the horizontal direction. Therefore, the XY table 1
Reference numeral 1 denotes positioning means for positioning the substrate 1 relative to the transfer head 7. The transfer head 7 moved from the component recognition station 9 reaches the mounting position M of the mounting station located on the substrate 1 and performs an elevating operation to mount the electronic component 14 on the substrate 1 (see FIG. 4). .

A camera 13 is provided adjacent to the XY table 11. By driving the XY table 11 to move the substrate 1 below the camera 13, and by positioning an arbitrary recognition point below the camera 13 and imaging the recognition point,
The position and shape of the recognition target can be detected. That is, the position of the recognition mark formed on the substrate 1 and the position of the electrode to which the electronic component is joined are detected.

Next, the structure of the rotary head 6 will be described with reference to FIG. FIG. 2 shows a section II of FIG. 1 (a section including the pickup position P of the supply unit 3 and the mounting position M of the table 11), and the rotary head 6 is located below a fixing unit 20 fixed to a frame structure (not shown). , A rotor section (index rotating body) 21 that is rotated by an index by an index driving section (not shown). A vertical mounting base 23 is provided on the outer periphery of the rotor portion 21 at the position where the transfer head 7 shown in FIG. 1 is provided, and a plurality of slide guides 24 are fixed to the mounting base 23.

A vertical lift rail 25 is fitted to the slide guide 24 so as to be able to move up and down. A bracket 26 fixed to the upper part of the lift rail 25 is provided with two upper and lower cam followers 27. On the outer peripheral surface of the fixing portion 20,
A cam member 22 that projects in the outer peripheral direction and has a predetermined cam curved surface along the circumferential direction of the fixed portion 20 is provided in a protruding manner, and the cam followers 27 are in contact with the upper and lower surfaces of the cam member 22. Therefore, when the rotor 21 rotates by the index, the lift rail 25 moves up and down following the cam curved surface of the cam member 22.

A slide guide 28 fixed to an elevating block 29 is fitted on the outer surface of the elevating rail 25 so as to be capable of ascending and descending. A transfer head having a plurality of suction nozzles 7a is provided below the elevating block 29. 7 is rotatably mounted. That is, the lifting rail 25 serves as a transfer head holding unit that holds the transfer head 7 so as to be able to move up and down, and the transfer head holding unit is moved up and down by the cam member 22 with respect to the rotor unit 21 in a predetermined path. A spring 32 is extended between a block 33 provided at an intermediate height position of the lifting rail 25 and a lower portion of the lifting block 29, and the lifting block 29 is always biased upward. Two cam followers 35A and 35B are attached to the lifting block 29 via a plate 34.

A bearing block 30 is provided above the elevating block 29. The bearing block 30 supports the upper part of a vertically disposed spline shaft 31 so as to be slidable in the vertical direction. The spline shaft 31 is disposed so as to pass through the lifting block 29, and the lower end is connected to the transfer head 7. A pulley 38 is provided above the spline shaft 31.
Are slidably fitted in the up and down direction.
8 is rotationally driven via a belt 37 by a motor 36 (see FIGS. 3 and 4) fixed to the bearing block 30.

When the motor 36 is driven, the rotation is transmitted via the spline shaft 31 and the transfer head 7 rotates by itself. The suction nozzle 7a is disposed at a position eccentric from the rotation axis, so that any one of the plurality of suction nozzles 7a can be moved to a predetermined angle position by the rotation of the transfer head 7, and the suction nozzle 7a The rotation angle in the horizontal plane of the electronic component sucked and held can be adjusted.

Next, the transfer head elevating mechanism will be described with reference to FIGS. The transfer head elevating mechanism is provided independently of the rotary head 6, and moves the transfer head 7 up and down with respect to the elevating rail 25 at a pick-up station and a mounting station. 2 shows a transfer head elevating mechanism in a station and a mounting station.

In FIG. 3, an arm 41 of the transfer head elevating mechanism 40 extends toward the pickup position P beside the pickup station. Above the arm 41, a head push-down rod 42 movable in the horizontal direction along the arm 41 is provided. The head push-down rod 42 is driven by a rod drive mechanism 48, and the distal end is connected to a lever member 46 via a pin 43.

The lever member 46 is rotatable about a pin 44. By moving the head push-down rod 42 to the pickup position P (arrow a), the lever member 46 rotates in the direction of arrow b. At this time, the lever member 46 is constantly urged in the direction of arrow b by the spring 45. The pressing member 4 is provided on the lever member 46.
When the transfer head 7 is located near the pickup position P, the cam follower 35A contacts the lower surface of the push-down member 47A as shown in FIG. 5A.

When the head push-down rod 42 is moved in the direction of arrow a in this state, the push-down member 47A pushes down the cam follower 35A via the lever member 46. Thereby, the transfer head 7 descends to the parts feeder 4 against the urging force of the spring 32. When the head push-down rod 42 is moved in the direction opposite to the arrow a, the lever member rotates in the direction opposite to the arrow b. Thereby, the transfer head 7 is raised by the urging force of the spring 32. As shown in FIG. 5A, the push-down member 47A has tapered surfaces on both sides on the lower surface, and when the transfer head 7 moves by the index rotation, the cam follower 35A pushes down without interfering with the end of the push-down member 47A. It can be moved below the member 47A.

FIG. 4 shows a similar transfer head elevating mechanism 40 provided at the mounting station, and includes a lever member 4.
The cam follower 35B is in contact with the lower surface of the push-down member 47B provided so as to be coupled to the cam follower 35B. By moving the head pressing rod 42 in the direction of arrow c, the lever member 46 rotates in the direction of arrow d. As a result, the pushing-down member 47B pushes down the cam follower 35B, and the transfer head 7 descends. The electronic component 14 held by the suction nozzle 7a is mounted on the substrate 1 by this lowering operation. As shown in FIG. 5B, a tapered surface is formed on the lower surface of the push-down member 47B, and similarly, the cam follower 35B
To prevent interference.

In the above-described transfer head elevating mechanism 40,
The rod drive mechanism 48 that drives the head push-down rod 42 in the horizontal direction is controlled by the control unit 49 so that the horizontal movement pattern (movement amount, movement speed, movement timing, etc.) can be set arbitrarily. This makes it possible to set the pattern of the elevating operation of the transfer head 7 to a desired pattern.

This electronic component mounting apparatus is configured as described above. The pick-up operation in the pick-up station and the mounting operation in the mounting station will be described below with reference to FIGS. FIG. 6A shows that the transfer head 7 approaches the pickup station by the index rotation of the rotor unit 21 shown in FIG. 2, and the suction nozzle 7a to be picked up by the electronic component moves D1 toward the near side from the pickup position P of the parts feeder 4. The state where it reached the separated position is shown.

At this time, the cam follower 27 is
By moving the fitting rail 2, the lifting rail 25 holding the transfer head 7 is in the process of lowering according to the lifting curve R1 defined by the cam curve shown in FIG.
In this state, the cam follower 35A is in contact with the lower surface of the push-down member 47A, and from this state, the operation of pushing down the transfer head 7 by the transfer head elevating mechanism 40 is started.

That is, as shown in FIG. 6B, the head pushing rod 42 is moved in the direction of the arrow, the cam follower 35A is pushed down by the pushing member 47A, and the transfer head 7 is lowered. During the lowering operation, the suction nozzle 7a is in the middle of horizontal movement toward the pickup position P. Then, as shown in FIG. 6C, at the timing when the suction nozzle 7a reaches the pickup position P, the head push-down rod 42 reaches the moving end.

As a result, the cam follower 35A is further pushed down by the pushing down member 47A, and the suction nozzle 7
The lower end of “a” contacts the upper surface of the electronic component 14 of the parts feeder 4. At this timing, if the electronic component 14 is held by vacuum suction from the suction nozzle 7a, the transfer head 7 shifts to a lifting operation. That is, by moving the head push-down rod 42 in the reverse order to the above-described operation, the transfer head 7 moves up, and moves from the pickup station to the next station by the rotation of the index.

In the above-described operation of moving up and down the transfer head, FIG.
As shown in (a), the transfer head 7 moves up and down according to the axis trace obtained by superimposing the lift trajectory R2 by the transfer head lifting mechanism 40 on the lift trajectory R1 defined by the cam curve of the cam member 22. As described above, various patterns can be selected for the elevating locus R2 depending on the combination of the drive pattern of the rod drive mechanism 48 and the width B1 of the push-down member 47A. An optimal trajectory pattern is set in consideration of conditions such as stability.

FIG. 7 shows the lifting operation of the transfer head in the mounting station. Similarly, from the timing when the transfer head 7 holding the electronic component 14 to the suction nozzle 7a approaches the mounting station and reaches a position separated from the mounting position M by D2 toward the near side as shown in FIG. The pressing operation of the transfer head 7 is started. That is, FIG.
As shown in (b), the head push-down rod 42 is moved, and the push-down member 47B pushes down the cam follower 35B. As a result, the suction nozzle 7a is moved to the mounting position M.
7A, the suction nozzle 7a reaches the lower end as shown in FIG. 7C, and mounts the held electronic component 14 on the substrate 1.

FIG. 8 also shows the lifting operation of the transfer head.
As shown in (b), the transfer head 7 moves up and down according to a trajectory obtained by superimposing an elevating trajectory R2 'by the transfer head elevating mechanism 40 on the elevating trajectory R1. At this time, the optimal lifting trajectory pattern is different between the above-described pickup operation and the mounting operation, so that the width B2 of the pressing member 47B is different from the above-described B1, and the driving pattern by the rod driving mechanism 40 is also the pickup operation. A different driving pattern from that in is used.

As described above, within the predetermined moving range of the transfer head including the index stop position (pickup position P, mounting position M) corresponding to the pickup station and the mounting station for mounting the electronic component on the substrate, the cam curve is determined. The transfer head 7 is moved up and down with an appropriate acceleration trajectory pattern corresponding to the required operation by superimposing the lifting operation defined by the above and the lifting operation by the transfer head lifting mechanism capable of setting the lifting pattern. Can be done.

Therefore, it is possible to reduce the impact on the electronic parts caused by the high-speed operation at the time of pick-up or mounting, which has been difficult to avoid because it is conventionally necessary to complete the elevating operation within a limited index stop time. It becomes possible and a stable mounting operation is realized. Further, by optimizing the elevating trajectory pattern at the time of picking up or mounting, the dead time of the mounting operation can be eliminated, the tact time can be shortened, and the productivity can be improved.

[0038]

According to the present invention, within the predetermined moving range of the transfer head including the index stop position corresponding to the pickup station provided in the electronic component supply section and the mounting station for mounting the electronic component on the substrate, Lifting / lowering operation of the transfer head by a cam member which is disposed in contact with the cam follower fixed to the transfer head holding unit and moves the transfer head holding unit up and down with respect to the index rotator by a predetermined locus by index rotation of the index rotator. And the lifting / lowering operation of the transfer head lifting / lowering mechanism for lifting / lowering the transfer head with respect to the transfer head holding unit in a predetermined pattern. Of the pickup operation and mounting operation can be prevented.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side sectional view of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a partial front view of a pickup station of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 4 is a partial front view of a mounting station of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 5 is a partial view of a transfer head elevating mechanism of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 6 is an operation explanatory view of a pickup operation of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 7 is an operation explanatory view of a mounting operation of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 8 is a graph showing the elevating locus of the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 9 is an explanatory view of a transfer head elevating mechanism of a conventional rotary electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 6 Rotary head 7 Transfer head 7a Suction nozzle 21 Rotor part 22 Cam member 25 Lifting rail 27 Cam follower 35A, 35B Cam follower 40 Transfer head lifting mechanism

Claims (2)

[Claims] 1. An index rotating body that is index-rotated around a vertical rotation axis by an index driving mechanism;
A transfer head holding portion that is disposed at a plurality of positions around the rotation axis of the index rotating body and that can move up and down with respect to the index rotating body, and holds the transfer head holding portion so as to be able to move up and down A transfer head capable of rotating around a vertical rotation axis, a plurality of suction nozzles arranged at positions eccentric from the rotation axis on the transfer head to suction and hold electronic components, and a transfer head holding unit. A cam member disposed in contact with the fixed cam follower to raise and lower the transfer head holding portion with a predetermined trajectory with respect to the index rotator by the index rotation of the index rotator; and a predetermined index stop position of the index rotation. A transfer head elevating mechanism for raising and lowering the transfer head with respect to the transfer head holding unit in a predetermined pattern within a predetermined movement range. Electronic component mounting apparatus according to claim. 2. An index rotating body which is index-rotated by an index driving mechanism around a vertical rotation axis;
A transfer head holding portion that is disposed at a plurality of positions around the rotation axis of the index rotating body and that can move up and down with respect to the index rotating body, and holds the transfer head holding portion so as to be able to move up and down An electronic component mounting method using an electronic component mounting apparatus having a transfer head, wherein an index stop position corresponding to a pickup station provided in an electronic component supply unit and a mounting station for mounting the electronic component on a substrate is set. Within a predetermined moving range of the transfer head including the transfer head holding portion, the transfer head holding portion is disposed in contact with the cam follower fixed to the transfer head holding portion, and the transfer head holding portion is moved relative to the index rotary member by the index rotation of the index rotary member. A lifting / lowering operation of the transfer head by a cam member which moves up and down along the locus, and By overlapping the elevating operation by the transfer head elevating mechanism for elevating at over emissions, the electronic component mounting method characterized by elevating the transfer head at a low acceleration lift pattern.