JPH03116889A - Split board and use thereof - Google Patents

Abstract

PURPOSE:To prevent solder from attaching to a part other than a prescribed face to be soldered by a method wherein a disused part, to which unnecessary solder is made to adhere during the transfer of a board in a soldering tank, is provided to the end of the board or the leading end of the board in a transfer direction in a separable manner. CONSTITUTION:A disused part 14 is provided to the end if a slit board 10 or the leading end of the board 10 in a direction that a board base 13 is transferred. The split board 10 composed of product board bases 11 mounted with various electronic components is mounted on a transfer device making its soldered side face downward so as to be transferred making the disused part 14 a leading end, the split board 10 is transferred to a soldering tank and then conveyed in the tank bringing its underside into contact with the surface of molten solder from the end of the disused part 14. At this point, oxide formed on the surface of solder is attached to the end face of the disused part 14. After a soldering operation is finished, the disused part 14 to which disused solder and oxide are attached is cut off along splitting holes 16.

Description

[Detailed Description of the Invention] [Purpose of the Invention (Industrial Application Field) The present invention provides a method for automatically soldering a board on which various electronic components are mounted, which is transported to a soldering tank by a transport device or the like. The present invention relates to a divided substrate that can prevent solder from adhering to surfaces other than predetermined solder surfaces when soldering, and a method of using the same.

(Prior Art) Generally, when various electronic components are mounted on a so-called printed circuit board, the terminals of the various electronic components are so-called soldered to predetermined solder surfaces formed on the printed circuit board.

The printed circuit board is formed with an insertion hole through which a terminal of an electronic component attached to one surface is inserted into a solder surface formed on the other surface. This solder surface is formed integrally with the so-called end portion of the pattern, which serves as a signal path, so that the solder that fixes the inserted terminal can easily adhere thereto.

In the electronic component having the terminal inserted into the insertion hole, the solder is adhered to the solder surface of the electronic component, so that the terminal is fixed to the solder surface with good conductivity.

Conventionally, such soldering has been performed, for example, in the
The soldering disclosed in Japanese Patent No. 0368 is automatically performed by a device or the like.

This type of soldering equipment includes a transport device that transports printed circuit boards on which various electronic components have been attached in advance by inserting terminals into insertion holes, and a solder tank in which the solder is heated and stored in a molten state. It is equipped.

The conveyance device conveys the printed circuit board with the solder side facing down to the solder bath, and within the solder bath, the printed circuit board is conveyed while bringing the solder side into contact with the solder surface. As a result, the molten solder spreads on the solder surface, and various electronic components are automatically soldered.

However, when a printed circuit board is transported while the solder surface and the molten solder surface are in contact with each other in the solder bath,
Oxide formed on the solder surface adheres to the edge of the printed circuit board, which is the leading edge in the transport direction, and is peeled off from the printed circuit board during the subsequent board cleaning process and gets caught between various mounted electronic components. There were problems such as shorting out the circuit by touching the terminals.

Therefore, conventionally, as shown in FIG. 2, it is necessary to have a board supporting member 1 of a transporting device with a spacer 3 attached thereto at a position in front of the printed circuit board 2 to transport the printed circuit board 2. This spacer 3 is formed of a metal plate such as aluminum or stainless steel, and can be used repeatedly.

By doing so, the solder oxide adheres to the spacer 3 and does not adhere to the end face of the printed circuit board 2, so that the above-mentioned problem can be solved.

(Problem to be Solved by the Invention) However, even if soldering is performed in this way, in a relatively large printed circuit board, the heat of the melted solder may cause warping, and in some cases, There were problems such as solder flowing onto the top surface of the printed circuit board and adhering to electronic components, or adhering to terminals as described above, causing short circuits. To prevent this, it may be possible to form the spacer from the same material as the printed circuit board so that the same warpage occurs and the solder adheres only to the top surface of the spacer, but such spacers are susceptible to thermal effects. However, it is difficult to put it into practical use because it lacks durability and cannot be used repeatedly.

In addition, the spacer needs to have a shape that corresponds to the size of the printed circuit board to be soldered, and there is a processing cost to form such a spacer, which also needs to be managed. There was a problem.

In addition, it is necessary to perform operations such as attaching and detaching the spacer and removing solder attached to the spacer, and such operations are complicated and have problems such as poor productivity.

The present invention has been made in order to solve these conventional problems, and provides a divided board and method of using the same that can prevent solder from adhering to surfaces other than predetermined solder surfaces. With the goal.

[Structure of the Invention] (Means for Solving the Problem) In order to achieve the above object, the present invention provides a device in which a solder surface to which solder adheres is formed on the bottom surface, and various electronic components mounted on the top surface connect to respective terminals. It is attached by being inserted through the solder surface, and is conveyed by the conveying means with the bottom surface in contact with the surface of the solder stored in the solder tank, and various electronic components are soldered by adhering the solder to the solder surface and the terminal. J on the board
'3, the split board is characterized in that an unnecessary part is separably provided at the leading edge in the transport direction, to which unnecessary solder adheres during transport in the solder tank.

Further, after attaching the various electronic components to the pre-formed divided substrates, the divided substrates are conveyed to the solder bath by the conveying means with the unnecessary parts at the top, and the various electronic components are transferred to the divided substrates. The method is characterized in that it is soldered to a board, and then the unnecessary portion is separated from the divided board.

(Function) The present invention configured as described above functions as follows.

Various electronic components are attached to the divided board, and the divided board is mounted on a transport means. Then, the divided board is transported through the solder tank by the transporting means, with the unnecessary portion at the top and the bottom surface being brought into contact with the solder. At this time, the oxide formed on the surface of the molten solder is attached to the end face of the unnecessary portion. In addition, even if the divided board warps due to the heat of the solder, the unused parts will also warp, so the solder will flow onto the upper surface of the unused parts and solidify, causing the product board on which various electronic components are mounted. It does not reach the part where .

Then, the divided board is taken out from the solder bath by the conveyance means, and the unnecessary parts are removed from the divided board to which various electronic components are soldered, thereby forming a product board on which various electronic components are mounted.

Therefore, no solder oxide adheres to the end face of the product substrate, and even if warpage occurs, unnecessary solder will not adhere to electronic components.

Furthermore, the unnecessary parts are formed at the same time as the divided substrates are formed, and are provided corresponding to each product substrate, so there is no processing cost other than processing the divided substrates, and Since the unnecessary parts are also managed at the same time, there is no increase in manufacturing costs.

Further, after soldering is completed, a product board can be formed extremely easily by simply dividing unnecessary parts, which improves productivity.

(Example) Below, the divided substrate according to the present invention and its usage method will be explained in the first example.
This will be explained based on the diagram.

FIG. 1 is a schematic diagram of a divided substrate according to the present invention.

As shown in the figure, the divided board 10 of the present invention is a so-called printed circuit board similar to the conventional one. An unnecessary part 14 which is discarded after the soldering is completed is separably formed at one end of the board base 13 on which the board base 13 is formed. Incidentally, this divided board 10 is transported to a soldering bath by a transport device as in the conventional case, and the soldering process is automatically performed.

A large number of insertion holes are formed in the product board part 11, similar to the printer 1 board described in the prior art section, and various electronic components to be mounted are formed on the other side by pushing terminals through these insertion holes. It can be installed by inserting it through the soldered surface.

Furthermore, a positioning hole 15 is formed in the jig part 12 for positioning the divided board 10 when mounting various electronic components in the mounting process, which is a pre-soldering process. . Further, on this jig portion 12, signs such as @, which are necessary for manufacturing control, are displayed.

These product board section 11 and jig section 12 constitute a board base 13 that corresponds to a conventional board.

Furthermore, an unnecessary portion 14 is formed in the divided substrate 10 at the leading end of the substrate base 13 in the transport direction.

This unnecessary portion 14 corresponds to a conventional spacer and is formed integrally with the end portion of the substrate base 13.

Then, the unnecessary part 14 is soldered after the soldering process is completed.
It is separated from the substrate base 13 and discarded.

The unnecessary parts 14 are formed by using parts that become unnecessary during so-called board cutting during board production.
By providing this unnecessary item 14, the cost of parts does not increase.

At the boundaries of each of the product substrate section 11, jig section 12, and unnecessary section 14, dividing holes 16 passing through the divided substrate 108 are formed at predetermined intervals.

These dividing holes 16 are formed in large numbers with relatively short intervals, similar to so-called perforations, and can be easily separated by applying force such as bending to each part divided by these. It has become.

The divided substrate 10 thus configured is subjected to a soldering process as described below.

First, in the pre-process as in the past, the divided board 10 with various electronic components attached to the product board part 11 is mounted on a transport device so that it is transported with the solder side facing down and the unnecessary part 14 at the top. . Then, when the transport device operates, the divided substrates 10 are transported to the solder tank, and are transported in the solder tank sequentially from the end of the unnecessary portion 14 while bringing the lower surface into contact with the surface of the molten solder.

At this time, the oxide formed on the solder surface is
Since it adheres to the end face of the substrate base 13, it does not adhere to the end face of the substrate base 13. Furthermore, if the divided substrate 10 is warped due to the heat of the solder, the unnecessary parts 14 will also be warped in the same way as the substrate base 13, and oxides and solder will flow onto the upper surface of the unnecessary parts 14, causing the unnecessary parts 14 to warp. Since it solidifies on the substrate 14 and adheres thereto, oxides and the like do not adhere to the substrate base 13. In other words, no unnecessary solder or oxide adheres to the substrate base 13 other than on the solder surface.

After soldering has been performed in this manner, the divided board 10 is transported from the solder tank by the transport device, and the unnecessary parts 14 containing unnecessary solder and oxide are cut off along the dividing holes 16. Ru. The separated unnecessary items 14 are discarded as they are.

Since the substrate base 13 thus formed is free from unnecessary solder and the like, it can be processed as it is in the substrate cleaning step, which is a subsequent step.

Therefore, the oxide of solder does not adhere to the edge of the substrate base 13, and the substrate base 13 is free from adhesion of solder to electronic components due to warpage. This prevents substrate defects due to circuit shorts caused by unnecessary solder and the like in the subsequent substrate cleaning process.

In general, since the unnecessary parts 14 are formed at the same time when forming the divided substrates 10 and are provided corresponding to each substrate, there is no processing cost other than that required for processing the substrates, and Just by managing the divided board 10, the unnecessary part 14 can be removed at the same time.
Since the manufacturing cost will also be managed, there will be no increase in manufacturing costs.

Furthermore, since the unnecessary items 14 are provided integrally with the substrate base 13, there is no need to attach a spacer to the conveying member in correspondence with the substrate base 13 as in the conventional case, and such work is omitted. The more you can, the more productivity you can do. Further, after soldering is completed, the substrate base 13 as a product board can be formed extremely easily by simply separating the unnecessary portion 14, and unnecessary solder and oxides attached to the unnecessary portion 14 can be removed. Since soldering is not necessary, the work in the process is simplified and productivity is improved.

(Effects of the Invention) As is clear from the above description, the present invention necessarily has the following effects.

Oxide formed on the solder surface adheres to the end face of the unnecessary part,
Even if warpage occurs in the divided substrate, unnecessary solder adheres to unnecessary parts and does not adhere to the product substrate, and unnecessary solder and oxides do not adhere to the product substrate. This prevents substrate defects due to circuit shorts and the like caused by these unnecessary solders in the subsequent substrate cleaning process.

Generally speaking, the unnecessary parts are formed at the same time when forming the divided substrates and are provided correspondingly to each substrate, so there is no processing cost other than that required for processing the substrates, and
Since only the divided substrates are managed, the unnecessary parts are also managed at the same time, so the manufacturing cost 1- does not increase.

In addition, since the unnecessary part is provided integrally with the base of the board, there is no need to attach a spacer or the like to the transport member of the transport device corresponding to the base of the board, unlike in the past, and this type of work can be simplified. Productivity will improve as it can be omitted.

Furthermore, after soldering is completed, it is possible to form a product board extremely easily by simply separating the unnecessary parts, and there is no need to remove unnecessary solder or oxides attached to the unnecessary parts. This simplifies the work in the process and improves productivity.

[Brief explanation of drawings]

FIG. 1 is a W4 schematic diagram of a divided board according to the present invention, and FIG. 2 is an explanatory diagram of a conventional soldering process. DESCRIPTION OF SYMBOLS 10... Divided board, 11... Product board part, 12... Repair part, 13... Board base, 14... Unused part, 16... Divided hole.

Claims (2)

[Claims] (1) A solder surface to which solder adheres is formed on the bottom surface, various electronic components to be mounted on the top surface are attached by inserting their respective terminals into the solder surface, and the solder is stored in a solder tank by a conveying means. The inside of the solder bath is placed at the leading end in the transport direction of the board to which various electronic components are soldered by being transported with the bottom surface in contact with the surface of the board, and the solder adheres to the solder surface and terminals. A divided board (10) characterized in that an unnecessary part (14) to which unnecessary solder is attached during transportation is provided in a separable manner. (2) The divided substrate (10) according to claim 1, which is formed in advance.
After attaching the various electronic components to the divided board, the divided board (10) is transported to the solder tank with the unnecessary part (14) at the top by the transport means, and the various electronic components are soldered to the divided board, The method of using a divided substrate (10) according to claim 1, characterized in that the unnecessary portion (14) is then separated from the divided substrate (10).