JPH04258369A - Solder removing method - Google Patents
Solder removing methodInfo
- Publication number
- JPH04258369A JPH04258369A JP1735991A JP1735991A JPH04258369A JP H04258369 A JPH04258369 A JP H04258369A JP 1735991 A JP1735991 A JP 1735991A JP 1735991 A JP1735991 A JP 1735991A JP H04258369 A JPH04258369 A JP H04258369A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pads
- pad
- jig
- wick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 238000009792 diffusion process Methods 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000155 melt Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、ソルダ除去方法に係り
、特に基板上に実装された電子部品に欠陥等が発見され
、当該電子部品をリムーブして、代わりの正常な電子部
品を実装する場合、旧電子部品が実装されたパッド上の
ソルダを当該パッドから除去させるソルダ除去方法に関
するものである。[Industrial Application Field] The present invention relates to a solder removal method, and particularly to a method for removing solder when a defect or the like is discovered in an electronic component mounted on a board, removing the electronic component, and mounting a normal electronic component in its place. In this case, it relates to a solder removal method for removing solder on a pad on which an old electronic component is mounted from the pad.
【０００２】基板上に実装された電子部品に欠陥等が発
見されると、その電子部品を交換する必要が生ずる。こ
の場合、旧電子部品は基板とパッド上のソルダを介して
固着されているわけであるが、旧電子部品を除去する際
に旧電子部品の除去に伴ってそのソルダも一緒に除去さ
れる。具体的には旧電子部品の固着ソルダが完全に取り
除かれるのではなく、一部は依然としてパッド上に残さ
れた状態となる。このパットに正常な新電子部品を実装
する場合、上記の旧電子部品の除去に伴ってパット上か
ら除去された分のソルダが不足しているので、新たにソ
ルダを加えることとなるが、その加えるソルダの量は一
定とはならないため、追加するソルダの量の管理が難し
い。[0002] When a defect or the like is discovered in an electronic component mounted on a board, it becomes necessary to replace the electronic component. In this case, the old electronic component is fixed to the board through the solder on the pad, but when the old electronic component is removed, the solder is also removed together with the old electronic component. Specifically, the stuck solder of the old electronic component is not completely removed, but some remains on the pad. When mounting a normal new electronic component on this pad, there is not enough solder removed from the pad due to the removal of the old electronic component mentioned above, so new solder must be added. Since the amount of solder to be added is not constant, it is difficult to manage the amount of solder to be added.
【０００３】そこで、パッド上に残留したソルダを一旦
全て取り除き、新たに電子部品の実装に必要な量のソル
ダを新たに加えることが行われている。[0003] Therefore, all the solder remaining on the pads is once removed, and a new amount of solder necessary for mounting the electronic component is added.
【０００４】本発明は、電子部品の交換時に、旧電子部
品が実装されたパッド上に残留したソルダを除去する方
法に関するものである。The present invention relates to a method for removing solder remaining on pads on which old electronic components are mounted when electronic components are replaced.
【０００５】[0005]
【従来の技術】従来、欠陥等が発見された旧電子部品が
実装されたパッドからソルダを除去する場合は、図３に
示すように、作業者が手作業で基板３０上のパッド３１
に残留したソルダ３２に対し、その表面に繊維状の銅等
の金属がコーティングされたソルダウィック３３を当接
させ、一方、当該ソルダウィック３３に充分に熱した半
田ごて３４を当てて、パッド３１上の残留したソルダ３
２を溶融し、そのソルダ３２に当接したソルダウィック
３３にその溶融したソルダ３２を吸引させて除去するよ
うにしていた。2. Description of the Related Art Conventionally, when removing solder from a pad on which an old electronic component in which a defect has been found is mounted, an operator manually removes solder from a pad 30 on a board 30, as shown in FIG.
A solder wick 33 whose surface is coated with a metal such as fibrous copper is brought into contact with the solder 32 remaining on the pad.Meanwhile, a sufficiently heated soldering iron 34 is applied to the solder wick 33 to remove the solder 32 from the pad. Remaining solder 3 on 31
2 is melted, and the molten solder 32 is sucked into the solder wick 33 that is in contact with the solder 32 and removed.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、近年の
高密度実装の要求に伴って、電子部品が実装されるパッ
ドの間隔は微小間隔となってきている。よって、従来の
如く作業者の手作業によるソルダ除去方法においては、
図４に示すように、隣接するパッドとパッド間にソルダ
ブリッヂ（Ａ）が形成されて短絡障害の要因となったり
、またパッド上から残留ソルダを完全に除去できない（
Ｂ）とか、除去の対象となっているパッドの近傍の本来
ソルダを塗布したくないパッドにソルダを付けてしまっ
たり（Ｃ）、また基板の表面に繊維状のソルダウィック
によってキズをつけてしまう（Ｄ）ことが発生する。However, with the recent demand for high-density packaging, the spacing between pads on which electronic components are mounted has become minute. Therefore, in the conventional method of removing solder manually by an operator,
As shown in Figure 4, solder bridges (A) are formed between adjacent pads, causing short circuit failures, and residual solder cannot be completely removed from the pads (
B), solder is applied to pads that should not be applied near the pad to be removed (C), and the surface of the board is scratched by fibrous solder wick. (D) Something happens.
【０００７】従って、本発明はソルダウィックを用いて
ソルダの除去の行う場合、高密度実装に伴ってパッドと
パットとの間隔が狭くなってもその信頼性を停止させる
ことのないようにすることを目的とするものである。[0007] Accordingly, the present invention provides a method for removing solder using a solder wick so that reliability does not stop even if the spacing between pads becomes narrow due to high-density mounting. The purpose is to
【０００８】[0008]
【課題を解決するための手段】上記目的は、基板１上の
パッド２に形成されたソルダ３を除去する方法において
、前記パッド２の形成位置に対応して形成されるソルダ
ウィック５を有する治具４を、当該パッド２上に当接さ
せる工程と、該パッド２上に該ソルダウィック５が当接
された状態で熱風を供給し、当該ソルダウィック５に熱
拡散によって前記ソルダ３を吸引させる工程と、を有す
ることを特徴とするソルダ除去方法、によって達成でき
る。[Means for Solving the Problem] The above object is to provide a method for removing solder 3 formed on a pad 2 on a substrate 1, which includes a solder wick 5 formed in a position corresponding to the formation position of the pad 2. A step of bringing the tool 4 into contact with the pad 2, and supplying hot air with the solder wick 5 in contact with the pad 2, causing the solder wick 5 to suck the solder 3 by thermal diffusion. This can be achieved by a solder removal method comprising the steps of:
【０００９】[0009]
【作用】本発明においては、パッドの形成位置に対応し
て形成されるソルダウィックを有する治具を当該ソルダ
に当接させた状態で、熱風を供給してパッド上のソルダ
をソルダウィックにて吸引するようにしている。[Operation] In the present invention, while a jig having a solder wick formed corresponding to the pad formation position is in contact with the solder, hot air is supplied to remove the solder on the pad with the solder wick. I try to attract it.
【００１０】従って、パッドの間隔が狭くなっても、そ
れに対応して治具から立植するソルダウィックの間隔を
狭くすればよいため、高密度実装のパッドからソルダを
除去することが可能となる。[0010] Therefore, even if the spacing between the pads becomes narrower, it is only necessary to correspondingly narrow the spacing between the solder wicks planted upright from the jig, making it possible to remove solder from the pads that are mounted with high density. .
【００１１】[0011]
【実施例】以下、本発明の望ましい実施例を図１および
図２を用いて詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described in detail below with reference to FIGS. 1 and 2.
【００１２】図１は、本発明の実施例を示す図であり、
（ａ）はパッドにソルダが残留している状態、（ｂ）は
残留ソルダに治具から立植するソルダウィックを当接し
た状態、（ｃ）は熱風を供給しソルダウィックにソルダ
を吸引している状態、（ｄ）はパッドからソルダが除去
された状態を示す。FIG. 1 is a diagram showing an embodiment of the present invention,
(a) shows a state in which solder remains on the pad, (b) shows a state in which a solder wick placed from a jig is in contact with the remaining solder, and (c) shows a state in which hot air is supplied to suck the solder into the solder wick. (d) shows the state in which the solder has been removed from the pad.
【００１３】図２は本発明の治具を示す図であり、（ａ
）は背面図、（ｂ）は側面図、（ｃ）は一部断面図を示
す。FIG. 2 is a diagram showing the jig of the present invention, (a
) shows a rear view, (b) shows a side view, and (c) shows a partially sectional view.
【００１４】図１（ａ）に示すように、実装される電子
部品のリード数に対応して基板１の表面にはパッド２が
形成されており、そのパッド２の表面には交換すべき電
子部品の取り除きに伴って除去されたソルダ３が一部残
って残留ソルダとして形成されている。As shown in FIG. 1(a), pads 2 are formed on the surface of a substrate 1 corresponding to the number of leads of electronic components to be mounted, and the pads 2 have pads 2 formed on the surface of the pads 2 corresponding to the number of leads of electronic components to be mounted. A portion of the solder 3 removed as the parts were removed remains and is formed as residual solder.
【００１５】図１（ｂ）に示すように、このパッド２上
に形成されている残留ソルダ３に対し、そのパッド２が
形成された位置に対応して設けられるソルダーウィック
５を有する治具４を位置合わせし、ソルダウィック５の
先端を残留ソルダ３に当接させる。As shown in FIG. 1(b), with respect to the residual solder 3 formed on the pad 2, a jig 4 having a solder wick 5 is provided corresponding to the position where the pad 2 is formed. and bring the tip of the solder wick 5 into contact with the remaining solder 3.
【００１６】この治具４は図２（ａ）の背面図および（
ｂ）の側面図に示すように、基板１上に形成されるパッ
ド２の位置に対応してソルダウィック５が立植している
。尚、本例においては基板１に形成されるパッド２がマ
トリクス状となっているので、治具４から立植している
ソルダウィック５もマトリクス状となっている。This jig 4 is shown in the rear view of FIG. 2(a) and (
As shown in the side view of b), solder wicks 5 are planted upright corresponding to the positions of the pads 2 formed on the substrate 1. In this example, since the pads 2 formed on the substrate 1 are in a matrix shape, the solder wicks 5 standing up from the jig 4 are also in a matrix shape.
【００１７】この治具４は図２（ｃ）に示すように、ソ
ルダウィック５が挿入される貫通孔４ｂが穿孔されてお
り、ステンレス，銅，アルミ等によって形成された本体
４ａと、この本体４ａを押圧する蓋部４ｃとからなり、
この蓋部４ｃにはソルダウィック５が形成される位置に
凹部４ｅが形成されいる。そして、本体４ａに蓋部４ｃ
とを係合する場合は、その両端に互いに内側方向に押圧
する止め部材４ｄにより行われる。上記貫通孔４ｂに挿
入されるソルダウィック５は芯材５ａはその表面は金メ
ッキが施された銅材より形成され、更に金メッキの外側
を銅等の金属を繊維状に編み込んだ部材５ｂが設けられ
ている。一方、上記凹部にソルダウィック５のフランジ
部分５ｃが取りつけられることで、ソルダウィック５の
抜け防止がなされている。As shown in FIG. 2(c), this jig 4 has a through hole 4b into which a solder wick 5 is inserted, and has a main body 4a made of stainless steel, copper, aluminum, etc. It consists of a lid part 4c that presses 4a,
A recess 4e is formed in the lid portion 4c at a position where the solder wick 5 is formed. Then, a lid part 4c is attached to the main body 4a.
When the two are engaged with each other, this is done by means of stop members 4d that press each other inwardly at both ends. The solder wick 5 inserted into the through hole 4b has a core material 5a made of a copper material whose surface is plated with gold, and a member 5b made of a metal such as copper woven into fibers on the outside of the gold plating. ing. On the other hand, by attaching the flange portion 5c of the solder wick 5 to the recess, the solder wick 5 is prevented from coming off.
【００１８】パッド２上の残留ソルダ３にソルダウィッ
ク５の先端を当接した状態で熱風を供給する。すると、
パッド２上の残留ソルダ３が溶融し、熱拡散によりヴィ
ック表面に吸引される。図１（ｃ）はそのソルダウィッ
ク５に吸引された状態を示し、６は吸引ソルダである。
尚、熱風を供給する場合、他の電子部品への影響を考慮
して、ソルダウィック５の他に防風壁となるものを立植
させてもよい。Hot air is supplied while the tip of the solder wick 5 is in contact with the residual solder 3 on the pad 2. Then,
The residual solder 3 on the pad 2 melts and is attracted to the Vic surface by thermal diffusion. FIG. 1(c) shows a state in which the solder wick 5 is attracted, and 6 is a suction solder. Note that when hot air is supplied, a windbreak wall may be planted in addition to the solder wick 5 in consideration of the influence on other electronic components.
【００１９】そして、パッド２上のソルダ３が完全に吸
引されると、図１（ｄ）に示すように、当該パッド２か
ら治具４を取り外し、その後の処理として、正常な電子
部品を実装するためのソルダの塗布等の処理が行われ、
当該パッドに正常な電子部品の取付けが行われる。When the solder 3 on the pad 2 is completely sucked, the jig 4 is removed from the pad 2 as shown in FIG. 1(d), and as a subsequent process, a normal electronic component is mounted. Processing such as applying solder is carried out to
A normal electronic component is attached to the pad.
【００２０】[0020]
【発明の効果】以上説明したように本発明によって、基
板上に形成されたパッドからソルダを除去する場合、例
え高密度実装によってパッド間の間隔が狭くなっても高
い信頼性を保障しつつパッドからソルダの除去を行うこ
とができる。[Effects of the Invention] As explained above, according to the present invention, when removing solder from pads formed on a substrate, even if the spacing between pads becomes narrow due to high-density mounting, high reliability can be guaranteed and the solder can be removed from the pads. Solder can be removed from.
【図１】本発明の実施例を示す図であり、（ａ）はパッ
ドにソルダが残留している状態、（ｂ）は残留ソルダに
治具から立植するソルダウィックを当接した状態、（ｃ
）は熱風を供給しソルダウィックにソルダを吸引してい
る状態、（ｄ）はパッドからソルダが除去された状態を
示す。FIG. 1 is a diagram showing an embodiment of the present invention, in which (a) shows a state in which solder remains on a pad, (b) shows a state in which a solder wick planted from a jig is in contact with the remaining solder, (c
) shows the state in which hot air is supplied and solder is sucked into the solder wick, and (d) shows the state in which the solder is removed from the pad.
【図２】本発明の治具を示す図であり、（ａ）は背面図
、（ｂ）は側面図、（ｃ）は一部断面図を示す。FIG. 2 is a diagram showing a jig of the present invention, in which (a) is a rear view, (b) is a side view, and (c) is a partially sectional view.
【図３】従来例を示す図である。FIG. 3 is a diagram showing a conventional example.
【図４】課題を示す図である。FIG. 4 is a diagram showing a problem.
１ 基板 ２ パッド ３ ソルダ（残留） ４ 治具 ５ ソルダウィック ６ 吸引ソルダ 1 Board 2 Pad 3 Solder (residual) 4 Jig 5 Solderwick 6 Suction solder
Claims (1)
れたソルダ（３）を除去する方法において、前記パッド
（２）の形成位置に対応して形成されるソルダウィック
（５）を有する治具（４）を、当該パッド（２）上に当
接させる工程と、該パッド（２）上に該ソルダウィック
（５）が当接された状態で熱風を供給し、当該ソルダウ
ィック（５）に熱拡散によって前記ソルダ（３）を吸引
させる工程と、を有することを特徴とするソルダ除去方
法。1. A method for removing solder (3) formed on a pad (2) on a substrate (1), comprising: removing a solder wick (5) formed in a position corresponding to the formation position of the pad (2); A step of bringing the jig (4) having the solder wick (5) into contact with the pad (2), and supplying hot air with the solder wick (5) in contact with the pad (2). 5) A method for removing solder, comprising the step of sucking the solder (3) by thermal diffusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1735991A JPH04258369A (en) | 1991-02-08 | 1991-02-08 | Solder removing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1735991A JPH04258369A (en) | 1991-02-08 | 1991-02-08 | Solder removing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04258369A true JPH04258369A (en) | 1992-09-14 |
Family
ID=11941851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1735991A Withdrawn JPH04258369A (en) | 1991-02-08 | 1991-02-08 | Solder removing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04258369A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5871139A (en) * | 1994-07-20 | 1999-02-16 | Praxair S.T. Technology, Inc. | Debrazing of structures with a powdered wicking agent |
| US20210252621A1 (en) * | 2017-08-24 | 2021-08-19 | Micron Technology, Inc. | Solder removal from semiconductor devices |
-
1991
- 1991-02-08 JP JP1735991A patent/JPH04258369A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5871139A (en) * | 1994-07-20 | 1999-02-16 | Praxair S.T. Technology, Inc. | Debrazing of structures with a powdered wicking agent |
| US20210252621A1 (en) * | 2017-08-24 | 2021-08-19 | Micron Technology, Inc. | Solder removal from semiconductor devices |
| US11745281B2 (en) * | 2017-08-24 | 2023-09-05 | Micron Technology, Inc. | Solder removal from semiconductor devices |
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| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |