JPH0223695A - Solder removal method for through-hole - Google Patents
Solder removal method for through-holeInfo
- Publication number
- JPH0223695A JPH0223695A JP17405088A JP17405088A JPH0223695A JP H0223695 A JPH0223695 A JP H0223695A JP 17405088 A JP17405088 A JP 17405088A JP 17405088 A JP17405088 A JP 17405088A JP H0223695 A JPH0223695 A JP H0223695A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- solder
- lead pin
- printed board
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000007664 blowing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
プリント板のスルーホール内に付着したハンダの除去方
法に関し、
上記ハンダ除去作業の効率化とその信頼性の向上を目的
とし、
電子部品をプリント板から抜去するに際し、■当該電子
部品の各リードピンの先端部分に浚渫部材を取付けた状
態でその電子部品を抜去する。■ハンダを溶融させた状
態でスルーホール内に非ハンダ付け性の整孔部材を挿入
し、ハンダが固まった後にこれを抜去する。■電子部品
の各リードピン対応に設けられた非ハンダ付け性材料よ
り成る浚渫部材とプリント板の加熱手段とを具備して成
る抜去治具を用い、スルーホール内のハンダを溶融させ
た状態で前記浚渫部材をリードピン挿入されていたスル
ーホール内に挿入し、ハンダが固まった時点でこれを抜
去する。といった三つの手段によってスルーホール内の
ハンダを除去する。[Detailed Description of the Invention] [Summary] Regarding a method for removing solder adhering to the through holes of a printed circuit board, the purpose of improving the efficiency and reliability of the solder removal work is to remove electronic components from the printed circuit board. When doing so, (1) remove the electronic component with a dredging member attached to the tip of each lead pin of the electronic component; ■Insert a non-soldering hole adjusting member into the through hole with the solder melted, and remove it after the solder hardens. ■ Using a removal jig that is equipped with a dredging member made of a non-solderable material and a means for heating the printed circuit board, which corresponds to each lead pin of the electronic component, the solder in the through hole is melted. Insert the dredging member into the through hole into which the lead pin was inserted, and remove it once the solder has solidified. The solder inside the through hole is removed by three methods.
本発明は、プリント板にハンダ付け実装された電子部品
を抜去して部品交換を行う際に適用される方法に関する
。The present invention relates to a method applied when removing electronic components soldered and mounted on a printed circuit board and replacing the components.
従来のハンダ除去方法として一般に知られている方法は
、■ソルダーウィック（銅等を基材とする編組線にフラ
ツクスと呼ばれる酸化物除去剤を含浸させたもの）をス
ルーホールに当接させ、これをハンダ鏝等で加熱して内
部のハンダを該ソルダーウィックに吸着させて取り除く
。■バキューム機構を備えたハンダ除去装置を用いてス
ルーホール内の溶融ハンダを吸い取る。の二つが挙げら
れる。A commonly known conventional method for removing solder is to: ■ place a solder wick (braided wire made of copper or other material impregnated with an oxide removing agent called flux) on the through hole; is heated with a soldering iron or the like so that the solder inside is adsorbed to the solder wick and removed. ■Suck up the molten solder inside the through-hole using a solder removal device equipped with a vacuum mechanism. There are two examples.
しかしながら上記従来の方法中、■の方法は、板厚が厚
く、従って熱容量の大きいプリント板には適用できない
（スルーホール内のハンダが完全にソルダーウィックに
吸着されず、従って交換部品の実装が不可能となる）。However, among the above conventional methods, method (2) cannot be applied to printed boards that are thick and therefore have a large heat capacity (the solder in the through holes is not completely adsorbed by the solder wick, so it is difficult to mount replacement parts). possible).
また、■の方法は、バキューム機構が付設されているた
めにハンダ除去装置が大型化する、といった問題点があ
った。Furthermore, the method (2) has the problem that the solder removal device becomes large because it is equipped with a vacuum mechanism.
本発明はこれらの問題点を解決するためになされたもの
である。The present invention has been made to solve these problems.
態で前記浚渫部材６を前記電子部品１のリードピン２の
先端部に当てがってこれを押圧する。そして当該スルー
ホール９内において前記浚渫部材６とリードピン２とが
交代するようにする。といった操作を行うことによって
、それぞれスルーホール９内のハンダ２０を除去する。In this state, the dredging member 6 is applied to the tip of the lead pin 2 of the electronic component 1 and pressed. Then, the dredging member 6 and the lead pin 2 are alternated within the through hole 9. By performing these operations, the solder 20 in each through hole 9 is removed.
本発明によるスルーホールのハンダ除去方法は、第１図
、第２図、第３図の各実施例図に示すように、■抜去す
べき電子部品１の各リードピン２の先端部分に浚渫部材
５を取付けた状態で当該電子部品１を抜去する。■スル
ーホール９内のハンダ２０を溶融させた状態で該スルー
ホール９内に非ハンダ付け性の材料で形成された整孔部
材１５を挿入し、ハンダ２０が固まった後にこれを抜去
する。■電子部品１の各リードピン２対応に設けられた
非ハンダ付け性材料より成る浚渫部材６とプリント板１
０の加熱手段とを具備して成る抜去治具１８を用い、ス
ルーホール９内のハンダ２０を溶融させた状〔作 用〕
このように、本発明によるスルーホールのハンダ除去方
法（以下ハンダ除去方法と呼ぶ）は、抜去される電子部
品１のリードピン２の先端部に取り付けた浚渫部材５に
よって、或いはスルーホール９内に整孔部材１５を挿入
することによって、または電子部品１のリードピン２上
に当てかった浚渫部材６を押圧することによって、それ
ぞれスルーホール９の内部が浚えられるため、操作が簡
単で、且つ作業の信頼性が高い。As shown in the embodiments of FIGS. 1, 2, and 3, the method for removing solder from a through hole according to the present invention is as follows. With the electronic component 1 attached, the electronic component 1 is removed. (2) With the solder 20 in the through hole 9 melted, the hole adjusting member 15 made of a non-solderable material is inserted into the through hole 9, and after the solder 20 hardens, it is removed. ■ Dredging member 6 made of non-solderable material and printed board 1 provided corresponding to each lead pin 2 of electronic component 1
The solder 20 in the through hole 9 is melted using the removal jig 18 comprising a heating means of 0. [Function] As described above, the through hole solder removal method (hereinafter referred to as solder removal) according to the present invention is used to melt the solder 20 in the through hole 9. method) is carried out by using the dredging member 5 attached to the tip of the lead pin 2 of the electronic component 1 to be removed, by inserting the hole adjustment member 15 into the through hole 9, or by inserting the dredging member 15 on the lead pin 2 of the electronic component 1 The interior of each through hole 9 is dredged by pressing the dredging member 6 applied to the dredging member 6, which is easy to operate and highly reliable.
〔実 施 例〕 以下実施例図に基づいて本発明の詳細な説明する。〔Example〕 Hereinafter, the present invention will be described in detail based on embodiment figures.
第１図（ａｌ、 （ｂｌ、 （０１，および（ｄ）は、
本発明によるハンダ除去方法の第１の実施例を示す模式
的要部側断面図と斜視図、第２図（ａｌ、 （ｂｌ、お
よび（Ｃ）は第２の実施例を示す模式的要部側断面図、
第３図（ａ）（ｂ）、および（Ｃ）は第３の実施例を示
す模式的要部側断面図と要部斜視図である。Figure 1 (al, (bl, (01, and (d)) is
A schematic side sectional view and a perspective view of the main part showing the first embodiment of the solder removal method according to the present invention, and FIGS. side sectional view,
FIGS. 3(a), 3(b), and 3(C) are a schematic side sectional view and a perspective view of a main part showing a third embodiment.
以下これら各ハンダ除去方法について詳細に説明する。Each of these solder removal methods will be explained in detail below.
（１）第１の実施例〔第１図参照〕
■プリント板１０から抜去される電子部品１のリードピ
ン２に対して圧入状態で挿入される内径ｄと、スルーホ
ール９の内径Ｄ° とほぼ等しい外径寸法りを有する浚
渫部材５ａ、或いはスルーホール９の内径Ｄ′とほぼ等
しい外径寸法Ｄ１に仕上げられた浚渫部材５ｂ （以下
これら５ａ、 ５ｂを総称して浚渫部材５と呼ぶ）を抜
去される電子部品１のリードピン２の先端部分に取着す
る〔第１図（ａ）参照〕。(1) First embodiment [see Fig. 1] ■The inner diameter d of the electronic component 1 inserted in a press-fit state into the lead pin 2 of the electronic component 1 to be removed from the printed board 10 is approximately equal to the inner diameter D° of the through hole 9. A dredging member 5a having an equal outer diameter, or a dredging member 5b finished with an outer diameter D1 approximately equal to the inner diameter D' of the through hole 9 (hereinafter these 5a and 5b are collectively referred to as the dredging member 5). It is attached to the tip of the lead pin 2 of the electronic component 1 to be removed [see FIG. 1(a)].
なお浚渫部材として５ａを選ぶか、或いは５ｂを選ぶか
はその時の状況による。Note that whether to select 5a or 5b as the dredging member depends on the situation at that time.
■プリント板１０を加熱してスルーホール９内のハンダ
２０を溶融させる。(2) Heat the printed board 10 to melt the solder 20 in the through hole 9.
■ハンダ２０が溶融した時点で電子部品１を矢印Ａ方向
に持ち上げる。この操作によって電子部品１はプリント
板１０から抜去される。そして、スルーホール９内のハ
ンダ２０は、その過程において浚渫部材５によって浚え
られる〔第１図（ｂ）参照〕。■When the solder 20 melts, lift the electronic component 1 in the direction of arrow A. By this operation, the electronic component 1 is removed from the printed board 10. The solder 20 in the through hole 9 is dredged by the dredging member 5 during this process [see FIG. 1(b)].
■その結果、電子部品１が抜去された後のスルーホール
９は第１図（Ｃ）に示すように、ハンダ２０が除去され
た状態となる。(2) As a result, the through hole 9 after the electronic component 1 is removed has the solder 20 removed, as shown in FIG. 1(C).
なお、前記浚渫部材５ａは、ハンダ２０が付着しない材
料５例えばステンレス鋼、チタン、クロム或いはテフロ
ン（弗素樹脂の一商品名）を用いて製作され、浚渫部材
５ｂは耐熱性を有する接着剤。The dredging member 5a is made of a material 5 to which the solder 20 does not adhere, such as stainless steel, titanium, chrome, or Teflon (a trade name of fluororesin), and the dredging member 5b is made of a heat-resistant adhesive.
例えばアラルダイト（エポキシ系接着剤の一商品名）等
を用いる。また、浚渫部材５ａの取着はこれをリードピ
ン２に圧入することによって行われ、浚渫部材５ｂの取
着はリードピン２にこれを所定の厚さに塗布することに
よって行われる。For example, Araldite (a trade name of an epoxy adhesive) is used. Further, the dredging member 5a is attached by press-fitting it onto the lead pin 2, and the dredging member 5b is attached by applying it to the lead pin 2 to a predetermined thickness.
第１図（ｄｌは前記浚渫部材５ａの一形状例を示す斜祖
国であるが、ここでｌの寸法は、プリント板１０の厚さ
、即ちスルーホール９の長さ、その他を勘案して決定さ
れる。FIG. 1 (dl is a tilted homeland showing an example of the shape of the dredging member 5a, where the dimension of l is determined by taking into consideration the thickness of the printed board 10, that is, the length of the through hole 9, and others. be done.
（２）第２の実施例（第２図参照）
■スルーホール９対応に設けられ、且つ非ハンダ付け性
の材料９例えばステンレス鋼、チタン、クロム等より成
る整孔部材１５を備えた整孔治具３０を矢印Ｂ方向から
ハンダ２０が溶融状態にあるスルーホール９内に挿入す
る。(2) Second embodiment (see Figure 2) ■ Hole adjustment member 15 provided corresponding to the through hole 9 and made of a non-solderable material 9 such as stainless steel, titanium, chrome, etc. The jig 30 is inserted from the direction of arrow B into the through hole 9 in which the solder 20 is in a molten state.
■整孔部材１５の挿入が終わるとその時点でプリント板
１０を冷却する。これによってスルーホール９内のハン
ダ２０が固まる。(2) Once the hole adjustment member 15 has been inserted, the printed board 10 is cooled down. This solidifies the solder 20 within the through hole 9.
■ハンダ２０が固まるのを待って整孔治具３０を矢印Ｂ
°力方向引き抜く 〔第２図（ｂ）参照〕。これによっ
てスルーホール９の内部は第２図（Ｃ）に示すように整
形される。■Wait for the solder 20 to harden, then move the hole adjustment jig 30 to arrow B.
° Pull out in the force direction [see Figure 2 (b)]. As a result, the inside of the through hole 9 is shaped as shown in FIG. 2(C).
なお、この場合、整孔部材１５の直径ｄ１は前記第１図
に示したリードピン２の直径よりも若干大きく設定され
る。In this case, the diameter d1 of the hole adjusting member 15 is set to be slightly larger than the diameter of the lead pin 2 shown in FIG.
（３）第３の実施例〔第３図参照〕
■電子部品１のリードピン２対応に設けられた浚渫部材
６．および該浚渫部材６の植立面から外方に向かって高
温度エア１７を噴出するエア噴出手段（以下エア噴出孔
と呼ぶ）１６を有してなる抜去治具１８を用意する。(3) Third embodiment (see FIG. 3) ■ Dredging member 6 provided corresponding to the lead pin 2 of the electronic component 1. A removal jig 18 is prepared which includes an air blowing means (hereinafter referred to as an air blowing hole) 16 that blows high temperature air 17 outward from the planting surface of the dredging member 6.
■該抜去治具１８側の各浚渫部材６をプリント板１０に
実装されている電子部品１のリードピン２上に位置決め
する〔第３図（ａｌ参照〕。なお、この図では浚渫部材
６の先端とリードピン２の先端との間に成る距離が設け
られているが、位置決めされた時の両者は互いに密接状
態となる。■ Position each dredging member 6 on the extraction jig 18 side onto the lead pin 2 of the electronic component 1 mounted on the printed board 10 [see Fig. 3 (al)]. In this figure, the tip of the dredging member 6 Although a distance is provided between the lead pin 2 and the tip of the lead pin 2, the two are in close contact with each other when positioned.
■前記エア噴出孔１６から高温度エア１７を噴出させる
。そしてこの高温度エア１７によってスルーホール９内
のハンダ２０を溶融させる。(2) Blowing out high temperature air 17 from the air blowing hole 16; The solder 20 in the through hole 9 is melted by this high temperature air 17.
■スルーホール９内のハンダ２０が溶融した時点で抜去
治具１８を矢印Ｃ方向に移動させる。これによって電子
部品１のリードピン２はスルーホール９から抜去され、
これに代わって該スルーホール９内には浚渫部材６が挿
入される。(2) When the solder 20 in the through hole 9 is melted, move the removal jig 18 in the direction of arrow C. As a result, the lead pin 2 of the electronic component 1 is removed from the through hole 9,
Instead, a dredging member 6 is inserted into the through hole 9.
■高温度エア１７の噴出を停止する。■Stop blowing out the high temperature air 17.
■高温度エア１７の噴出を停止することによってプリン
ト板１０が冷却され、スルーホール９内のハンダ２０は
徐々に固まって行く。(2) By stopping the jetting of the high temperature air 17, the printed board 10 is cooled, and the solder 20 in the through hole 9 gradually hardens.
■スルーホール９内のハンダ２０が固まり始めた時点で
抜去治具１８を矢印Ｃ゛方向引き上げる。(2) When the solder 20 in the through hole 9 begins to harden, pull up the extraction jig 18 in the direction of arrow C.
第３図中、７は浚渫部材６の先端部分に設けられた窪み
であって、この窪み７はリードピン２に対する浚渫部材
６の位置決めを容易化するためのものである。In FIG. 3, reference numeral 7 indicates a recess provided at the tip of the dredging member 6, and this recess 7 is for facilitating positioning of the dredging member 6 with respect to the lead pin 2.
第３図＋ｃ＋は前記抜去治具１８の一構造例を示す要部
斜視図であるが、エア噴出孔１６の配置やその直径等に
ついては特定せず、状況に応じて適宜設定すれば良い。Although FIG. 3+c+ is a perspective view of a main part showing an example of the structure of the extraction jig 18, the arrangement of the air jet holes 16, their diameters, etc. are not specified, and may be set as appropriate depending on the situation.
以上の説明から明らかなように本発明によれば、何れの
方法も簡単、且つ確実にスルーホール内のハンダを除去
することができるので、プリント板に実装された電子部
品を交換する場合における作業効率と作業信親性とを大
幅に向上させることができる。As is clear from the above description, according to the present invention, solder in through-holes can be easily and reliably removed using any of the methods, so that the work when replacing electronic components mounted on a printed board is easy. Efficiency and work reliability can be greatly improved.
第１図ｆａｎ、 （ｂ）、 （ｃ）、および＋ｄ）は、
本発明によるハンダ除去方法の第１の実施例を示す模式
的要部側断面図と斜視図、
第２図ｆａｔ、 （ｂ）、およびｆｏｌは本発明の第２
の実施例を示す模式的要部側断面図、
第３図（ａｌ、 （ｂｌ、および（ｃ）は本発明の第３
の実施例を示す模式的要部側断面図と要部斜視図である
。
図において、１は電子部品、
２はリードピン、
５と６は浚渫部材、
７は窪み、
９はスルーホール、
１０はプリント板、
１４は整孔条、
１５は整孔部材、
１６はエア噴出孔（エア噴出手段）
１７は高温度エア、
１８は抜去治具、
２０はハンダ、
をそれぞれ示す。Figure 1 fan, (b), (c), and +d) are
FIG. 2 is a schematic side sectional view and a perspective view showing the first embodiment of the solder removal method according to the present invention.
FIG. 3 (al, (bl), and (c) are schematic side sectional views of main parts showing the embodiment of the present invention.
FIG. 2 is a schematic side sectional view and a perspective view of main parts showing an embodiment of the present invention. In the figure, 1 is an electronic component, 2 is a lead pin, 5 and 6 are dredging members, 7 is a depression, 9 is a through hole, 10 is a printed board, 14 is a hole adjustment strip, 15 is a hole adjustment member, and 16 is an air jet hole. (Air blowing means) 17 is high temperature air, 18 is a removal jig, and 20 is solder.
Claims (3)
したハンダ（２０）の除去方法であって、 プリント板（１０）から抜去する電子部品（１）のリー
ドピン（２）の先端に前記スルーホール（９）の内径に
対応する外径を備えた浚渫部材（５）を取付け、スルー
ホール（９）内のハンダ（２０）を溶融させた状態で前
記電子部品（１）を抜去するようにしたことを特徴とす
るスルーホールのハンダ除去方法。1. A method for removing solder (20) adhering to a through hole (9) of a printed board (10), wherein the through hole is attached to the tip of a lead pin (2) of an electronic component (1) to be removed from the printed board (10). A dredging member (5) having an outer diameter corresponding to the inner diameter of (9) is attached, and the electronic component (1) is removed while the solder (20) in the through hole (9) is melted. A through-hole solder removal method characterized by the following.
したハンダ（２０）の除去方法であって、 プリント板（１０）を加熱してスルーホール（９）内の
ハンダ（２０）を溶融させた後、ハンダ（２０）が付着
しない材料で形成された整孔部材（１５）を該スルーホ
ール（９）内に挿入し、前記プリント板（１０）を常温
に戻した後に該整孔部材（１５）を抜去するようにした
ことを特徴とするスルーホールのハンダ除去方法。2. A method for removing solder (20) adhering to a through hole (9) of a printed board (10), the method comprises heating the printed board (10) to melt the solder (20) in the through hole (9). After that, a hole adjusting member (15) made of a material to which solder (20) does not adhere is inserted into the through hole (9), and after returning the printed board (10) to room temperature, the hole adjusting member (15) is inserted into the through hole (9). ) through-hole solder removal method.
したハンダ（２０）の除去方法であって、 抜去される電子部品（１）のリードピン（２）対応に設
けられた非ハンダ付け性の浚渫部材（６），及び該浚渫
部材（６）の植立面から外方に向かって高温度エア（１
７）を噴出するエア噴出手段（１６）を有してなる抜去
治具（１８）を使用し、 抜去すべき電子部品（１）のリードピン（２）の先端部
分に前記浚渫部材（６）を位置決めした後，前記エア噴
出孔（１６）から高温度エア（１７）を噴出させて前記
スルーホール（９）内のハンダ（２０）を溶融させ、そ
の後、前記浚渫部材（６）をスルーホール（９）に挿入
してスルーホール（９）内のリードピン（２）と該浚渫
部材（６）とを当該スルーホール（９）内において交代
させるようにしたことを特徴とするスルーホールのハン
ダ除去方法。3. A method for removing solder (20) adhering to a through hole (9) of a printed circuit board (10), comprising a non-soldering dredge provided in correspondence with a lead pin (2) of an electronic component (1) to be removed. member (6), and high temperature air (1
Using a removal jig (18) having an air blowing means (16) for blowing out air 7), place the dredging member (6) at the tip of the lead pin (2) of the electronic component (1) to be removed. After positioning, high temperature air (17) is ejected from the air ejection hole (16) to melt the solder (20) in the through hole (9), and then the dredging member (6) is inserted into the through hole ( 9) and the lead pin (2) in the through hole (9) and the dredging member (6) are replaced in the through hole (9). .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17405088A JPH0223695A (en) | 1988-07-12 | 1988-07-12 | Solder removal method for through-hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17405088A JPH0223695A (en) | 1988-07-12 | 1988-07-12 | Solder removal method for through-hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0223695A true JPH0223695A (en) | 1990-01-25 |
Family
ID=15971746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17405088A Pending JPH0223695A (en) | 1988-07-12 | 1988-07-12 | Solder removal method for through-hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0223695A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013172029A (en) * | 2012-02-21 | 2013-09-02 | Koki Tec Corp | Repairing device and repairing method |
| CN108289387A (en) * | 2018-01-25 | 2018-07-17 | 郑州云海信息技术有限公司 | A kind of wiring board design processing method containing capillary |
-
1988
- 1988-07-12 JP JP17405088A patent/JPH0223695A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013172029A (en) * | 2012-02-21 | 2013-09-02 | Koki Tec Corp | Repairing device and repairing method |
| CN108289387A (en) * | 2018-01-25 | 2018-07-17 | 郑州云海信息技术有限公司 | A kind of wiring board design processing method containing capillary |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4934582A (en) | Method and apparatus for removing solder mounted electronic components | |
| WO1990008616A1 (en) | Improved bond connection for components | |
| JPH0223695A (en) | Solder removal method for through-hole | |
| JPH02237093A (en) | Manufacture of circuit board | |
| JP7042393B2 (en) | Part mounting method, manufacturing method of part mounting structure | |
| JPH0757790A (en) | Structure for connecting terminal to wire | |
| JP3924073B2 (en) | Connection method between circuit board and conductor piece | |
| WO1998049875A1 (en) | Method of attaching metallic objects to a printed circuit board | |
| JP3144096B2 (en) | PCB repair jig | |
| JPH04258369A (en) | Solder removing method | |
| JPS6235570Y2 (en) | ||
| JP3266171B2 (en) | Method for soldering flat ribbon cable to printed circuit board and method and jig for preventing unevenness of core wire of flat ribbon cable used therefor | |
| JP2022070305A (en) | Manufacturing method of printed wiring board | |
| JP2000004078A (en) | Area array package ejector | |
| JPH0239650Y2 (en) | ||
| JPH05198932A (en) | Soldering method for printed board | |
| JP2005033042A (en) | Printed board | |
| JP2001196708A (en) | Method and device for preventing deflection of printed board | |
| JPS6138639B2 (en) | ||
| JPH0555744A (en) | Mounting parts loading/unloading apparatus | |
| JPH04127963A (en) | Lead insulating tool | |
| JP2021520648A (en) | How to form connecting contacts | |
| JPH05206628A (en) | Soldering auxiliary tool | |
| JPH04258158A (en) | Lead frame structure for semiconductor device | |
| JP2002141649A (en) | Mask for coating |