JPH0239650Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a soldering iron, and particularly to a soldering iron suitable for soldering terminals connected at narrow intervals to a circuit board.

BACKGROUND ART Conventionally, electronic components have been connected to printed circuit boards by soldering. In recent years, with the increasing use of ICs, LSIs, and other components having narrowly spaced terminals arranged in a straight line, soldering irons with suitable iron tips have come to be used. A perspective view of the tip of a conventional soldering iron is shown in FIG. 7, and a front view is shown in FIG. 8. The iron tip 20 is heated by a ceramic heater or the like (not shown) to melt the solder in contact with the iron tip 20. The tip 21 of the iron tip 20 is flat and has an edge 22 inclined with respect to the axial direction of the iron tip 20. Next, the soldering work will be explained using FIG. 9. FIG. 9 is a diagram showing the state of the soldering work, and shows the work of connecting the terminals 23 and 24 to a circuit pattern (not shown) on the board 25 with solder 26. Soldering is performed by heating and melting the solder 30 with the iron tip 20 and moving the iron tip 20 in the direction of arrow D.
3 and 24 and the circuit pattern are connected by solder 26. At this time, since the distance between the terminals 23 and 24 is narrow, a so-called bridge 31 is likely to be formed where the terminals 23 and 24 are connected with solder. 31 was prevented from forming.

Problems to be Solved by the Invention However, the above-mentioned conventional method also had the problem of bridging 31. The reason may be as follows. As shown in FIG. 10, when performing soldering work, the solder 29 attached to the edge 22 is
The tensile force a that the terminal 27 pulls through 2 and the edge 22
A resultant force c of the force b which prevents the solder 29 from separating is applied, and the solder 29 moves to the edge tip 28. Therefore, when the edge 22 is separated from the terminal 27, the solder is successively supplied to the edge tip 28, so that the solder is connected between the terminal 27 and the edge 22 in the form of a thread. If the edge 22 contacts the adjacent terminal in this state, a bridge will occur.

Means for Solving the Problems The present invention solves the above-mentioned problems of the conventional technology, and includes a single edge at the tip of the iron tip along a line inclined with respect to the axial direction of the iron tip. The soldering iron is characterized in that a solder attachment part is formed having a boundary line that intersects the edge at an angle greater than the angle at which the axis of the tip of the iron intersects the edge.

Effect: Because the end of the solder attachment part of the edge intersects the edge at an angle greater than the angle at which the axis of the iron tip intersects the edge, it is difficult for solder to be supplied to the tip of the solder attachment part of the edge. Become.

Embodiment of the invention Next, an embodiment of the invention will be described with reference to the drawings. FIG. 1 is a front view of the tip of the soldering iron according to the present invention, FIG. 2 is a back view, and FIG. 3 is a perspective view of the tip of the soldering iron. The tip of the tip 1 is provided with an edge 2 that is inclined at an angle α with respect to the axial direction of the tip 1. The tip of the edge 2 is cut so that the cutting line intersects the edge 2 at an angle β (for example, β=90°). Note that the angle β needs to be larger than the angle α. Tip 1 except for tip 2,
A structure in which solder does not stick, for example, an oxide film or a Teflon film is applied, and only edge 2 has solder.
That is, the structure is such that a solder attachment portion 9 is formed. Incidentally, the edge 2 may be subjected to a process such as solder plating, etc., so that solder easily adheres to the edge 2. Next, a soldering operation using the soldering iron shown in FIG. 1 will be explained. FIG. 4 is a diagram showing the state of the soldering work, and shows the work of connecting the terminals 5 and 6 to a circuit pattern (not shown) on the board 7. The soldering work is similar to the work using the conventional soldering iron described above, and the solder 8 is heated and melted with the tip 1 of the soldering iron while moving in the direction of arrow C, and the solder 1 that has melted the terminals 5 and 6 and the circuit pattern is heated and melted with the tip 1 of the soldering iron.
0 to connect one after another. And the tip 2 of the tip 1
Work as if cutting the bridge. According to this embodiment, the angle β of the tip of the edge 2 is
is greater than the angle α at which the axis intersects edge 2.
Therefore, when separating the iron tip 1 from the terminal 5,
Unlike conventional soldering irons, it is difficult for solder to be supplied to the tip of edge 2, and the solder flows between terminals 5 and 6 and iron tip 1.
There is no thread-like connection between the two. Therefore, a bridge where the terminals 5 and 6 are connected by solder is less likely to occur. Note that the height A of the cutting line is desirably higher than the height B of the terminals 5 and 6 from the substrate 7.
If A<B, it is partially the first
This is because the situation shown in Figure 0 occurs. Further, in this embodiment, since the portions of the cut surface 4 and the like other than the edge 2 are configured to be difficult to solder, excess solder does not adhere to the tip 1 of the iron. Therefore, bridging and the like do not occur, and there is no need to clean the iron tip 1 after each operation, resulting in improved workability.

5 and 6 are a front view and a back view showing another embodiment of the present invention. Furthermore, Figures 1 and 2
Parts similar to those in the figures are given the same reference numerals. As shown in FIG. 5, in this embodiment, the tip 8 of the edge 2 is processed without soldering, for example, by applying an oxide film.
It has a structure in which a Teflon coating is applied, and the angle β at which the boundary line I intersects the edge 2 is larger than the angle α at the tip of the edge 2. In addition, in this example, edge 2
The portions other than the solder attachment portion 9 are processed to prevent solder from attaching, and the solder attachment portion 9 is processed to facilitate solder attachment.

Effects of the invention As described above in detail, according to the invention,
It is possible to efficiently solder the closely spaced terminals of ICs, LSIs, etc. to the board, and prevent the occurrence of bridging.

[Brief explanation of the drawing]

Figure 1 is a front view showing one embodiment of the present invention;
The figure is a back view, Figure 3 is a perspective view of the tip of the iron tip, Figure 4 is a diagram showing the state of soldering work, Figure 5 is a front view showing another embodiment of the present invention, and Figure 6 is a perspective view of the tip of the iron tip. Fig. 7 is a perspective view showing the tip of a conventional soldering iron, Fig. 8 is a front view thereof, Fig. 9 is a view showing the state of soldering work, and Fig. 10 is a view during soldering. FIG. 3 is a diagram showing the state of solder. In the figure, 1 is the tip of the iron, 2 is the edge, 4 is the cutting surface,
5 and 6 are terminals, 7 is a substrate, 8 is solder, and 9 is a solder attachment portion.

Claims (1)

[Claims for Utility Model Registration] (1) A soldering iron having a single edge at the tip of the iron tip along a line inclined with respect to the axial direction of the iron tip, in which the axis of the iron tip coincides with the edge. A soldering iron characterized in that a solder attachment part is formed having a boundary line that intersects the edge at an angle greater than the intersecting angle. (2) The soldering iron according to claim 1, wherein the edge is cut at the boundary line of the solder attachment portion. (3) The soldering iron according to claim 1, wherein the soldering iron tip, except for the solder attachment portion, is covered with a member to which solder does not stick.