JPH0356031Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Technical Field] The present invention relates to an improvement in a lead frame that holds electronic components, such as micro-sized chip components such as resistors and capacitors, and serves as a lead wire.

[Conventional technology]

As conventional lead frames for electronic components, those shown in Figs.
No. 99827.

The disclosed lead frame will be described below. 1 is a lead frame body made of a metal plate made of kovar, nickel, copper, or an alloy thereof, for example, formed into a series of frame shapes by punching, and is used for sprockets. hole 1
a ₁ is formed, and a pair of pillar portions 1b, 1 extending perpendicularly from the strip portion 1a.
b', a connecting part 1c that is formed in a band shape at the upper end of the pillar parts 1b, 1b' and connects the pillar parts 1b, 1b', and a connecting part 1c that connects the pillar parts 1b, 1b' in a perpendicular direction from the connecting part 1c.
Lead parts 1d, 1d' extending on the same line as b', and a clamping part 1 formed at the tips of the lead parts 1d, 1d' to clamp chip parts 2 such as resistors and capacitors.
e, 1e'.

Then, the chip part 2 is inserted along the tapered surface of the upper part of the clamping parts 1e and 1e'.
Since the interval between e and 1e' is formed to be slightly narrower than the thickness of the chip component 2, the elasticity of the material of the lead frame body 1 ensures that the lead frame body 1 is held securely. The chip parts 2 clamped in this way are held at the clamping parts 1e, 1.
A clamping part 1e that is electrically connected at e' by means such as soldering and that includes the chip component 2;
The upper end of 1e' is coated with insulation (the insulation coating is omitted in the illustration). Next, individual electronic components can be manufactured by cutting the connecting portion 1c and the strip portion 1a.

[Problem that the invention attempts to solve]

By the way, when the above-mentioned electronic component is attached to a circuit board or during other assembling, if a force is applied that spreads the clamping parts 1e, 1e' outward, the bonding between the chip component 2 and the clamping parts 1e, 1e' may break. There were drawbacks such as parts peeling off or the chip component 2 itself being destroyed, resulting in poor characteristics or becoming unsuitable for use. And, as the length of the pillar portions 1b, 1b' becomes longer, the above-mentioned drawback becomes more noticeable.

[Purpose of invention]

The present invention aims to solve the above-mentioned drawbacks, and can prevent separation of electrically connected chip components and lead frames, maintain a constant distance between wires, and improve the reliability of electronic components. The purpose of the present invention is to provide lead frames for electronic components.

[Example of idea]

An embodiment of the present invention is shown in FIGS. 1 to 3, and the same reference numerals as in the conventional example described above indicate the same parts and the explanation thereof will be omitted.

In the present invention, the parts that differ from the conventional example are a pair of pillar parts 1b which are to become lead wires of the chip component 2,
A narrowing part 1b ₁ , 1b ₁ ' is formed at an approximately intermediate position in 1b' facing each other in a direction in which the interval becomes narrower, and an insulating resin 3 is poured between the narrowing parts 1b ₁ and 1b ₁ ' and hardened. That is.

Next, using the lead frame 1 described above,
A method for manufacturing electronic components such as thermistors, varistors, and capacitors will be explained.

When the lead frame 1 whose sprocket holes _1a1 are engaged with the claws of an automatic feeder (not shown) is fed by the automatic feeder, an automatic chip inserter (not shown) The chip component 2 is inserted into the holding portions 1e and 1e' from the vertical direction (from the top in the figure) along the tapered surface. Thereby, the chip component 2 is securely clamped and fixed by the elasticity of the lead frame 1 of the clamping portions 1e, 1e'.

Next, the lead frame 1 with the chip component 2 clamped thereon is sent to a solder bath (not shown), which is the next process, and here the chip component 2 and the clamping parts 1e, 1e' are soldered. At this time, since the clamping parts 1e, 1e' are formed with tapered surfaces, the clamping parts 1e, 1e' are formed with tapered surfaces.
There is no electrical short circuit between the tips of e'.

Furthermore, the lead frame 1 to which the chip component 2 is soldered is held between the clamping portion 1e containing the chip component 2,
1e' is sent to the next step of insulating coating, where an insulating layer 4 is formed, and then an insulating resin 3 is also injected between the narrowed parts 1b ₁ and 1b ₁ ', and after the insulating resin 3 has hardened, a cutting step is carried out. Then, the feeding strip portion 1a and the connecting portion 1c are cut to produce an electronic component as shown in FIG. 2.

In the manufacturing process, in injecting the insulating resin 3 into the narrowed parts 1b ₁ , 1b ₁ ', the narrowed parts 1b ₁ , 1
Since the interval b ₁ ' is very narrow, the injected insulating resin 3 flows evenly throughout the resin due to surface tension, and therefore the injection work can be performed very easily.

Although the above explanation shows that the chip part 2 is fixed to the clamping parts 1e and 1e' by solder, heat-resistant conductive paint is used instead of solder, and the insulating resin 3
If an inorganic coating agent such as glass is used for the insulating layer 4, it can be used even when the usage environment is high temperature.

In addition, in this embodiment, the narrowing portions 1b ₁ , 1
Although b ₁ ′ is shown in the pillar portions 1b and 1b′, it may also be formed in the lead portions _1d and _1d ′. This may be performed in advance when the lead frame is in the state, and then sent to the automatic feeder.

Furthermore, in this embodiment, the narrowing portions 1b ₁ , 1
b ₁ ' is shown in the pillar parts 1b, 1b', but it may also be formed in the lead parts 1d, 1d', and if the pillar parts 1b, 1b' are long, the stenosis The portions 1b ₁ and 1b ₁ ' may be formed at several locations, and the insulating resin 3 may be injected and fixed to each of them.

[Effect of idea]

As described above, in the present invention, a narrowed part is formed in at least one place of the pillar part or the lead part of the lead frame body, and an insulating material is injected and fixed there, so that force is applied in the direction of widening the pillar parts. Therefore, even if the pedestal part were to expand, no force would be applied to the chip parts due to the insulating material.Therefore, no defects would occur, and the handling would be simple and workability would be good. Also, even if the lead part is long, it is supported by an insulating material in the middle, so
This eliminates short-circuits between the lead wires, so there is no need to perform special insulation treatment on the lead wires, and the manufacturing process can be simplified.

[Brief explanation of the drawing]

1 and 2 show an embodiment of the lead frame main body of an electronic component according to the present invention, FIG. 1 is a front view of the lead frame main body, FIG. 2 is a front view of the electronic component, and FIG. 3 is a front view of the lead frame main body, and FIG. Same as above - line sectional view, Fig. 4,
Figure 5 is a front view of the conventional lead frame body.
and a front view of the electronic component. 1... Lead frame main body, 1a... Band-shaped part,
1b, 1b' are pillar parts, 1c...connection part, 1d, 1
d'...Lead part, 1e, 1e'...Holding part, 1b ₁ ,
1b ₁ ′... Constricted portion, 2... Chip parts, 3... Insulating resin.

Claims (1)

[Scope of utility model registration request] A strip formed by processing a single metal plate, and a plurality of pillars extending in parallel at right angles from the strip,
A connecting part that connects each pillar part formed in a band shape at the tip of the pillar part, a lead part extending from the connecting part in a perpendicular direction on the same line as the pillar part, and each pair of the lead parts. In a lead frame for an electronic component formed of a clamping part that elastically clamps a chip component at the tip, a narrowed part is formed in at least one part of the pillar part or the lead part so that the interval becomes narrow, and the narrowed part A lead frame for electronic components that is fixed by injecting an insulating agent into the lead frame.