JPH0437568B2 - - Google Patents
Info
- Publication number
- JPH0437568B2 JPH0437568B2 JP63214815A JP21481588A JPH0437568B2 JP H0437568 B2 JPH0437568 B2 JP H0437568B2 JP 63214815 A JP63214815 A JP 63214815A JP 21481588 A JP21481588 A JP 21481588A JP H0437568 B2 JPH0437568 B2 JP H0437568B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- capacitor
- lead
- capacitor element
- feedthrough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 55
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 50
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 12
- 239000003989 dielectric material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 4
- 229920006015 heat resistant resin Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、貫通コンデンサ組及びその製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a feedthrough capacitor set and a method of manufacturing the same.
（従来の技術）
従来の貫通コンデンサは、一般に以下のように
して製造される。(Prior Art) A conventional feedthrough capacitor is generally manufactured as follows.
第９図に示すように、円板状誘電体の中心部に
貫通孔ａを有し、一方の主面及び他方の主面にそ
れぞれ円形電極b1とリング状電極b2が形成された
コンデンサ素子ｃの貫通孔ａに、第１０図示のよ
うな長さ方向中央部に鍔ｄが形成されたリード線
ｅを貫通し、更に、第８図に示すように貫通孔ｆ
を有する絶縁耐熱性樹脂から成る円筒状ストツパ
ｇの貫通孔ｆにリード線ｅを貫通して、コンデン
サ素子ｃをストツパｇと鍔ｄとの間に固定する。
次に、このように構成されたものｍを、第１１図
に示すような基板ｈとこれに一端が固定された複
数の挾持片ｉとから成る半田付け用治具ｊに装着
し、電極b1及びb2とリード線ｅにフラツクスを塗
布した後に加熱し、該治具ｊを持つて半田槽にデ
イツプする。かくてリード線ｅと円形電極b1とは
第８図に示すように半田付けｋされ、リング状電
極b2にも半田ｌが付着される。その後、半田付け
された貫通コンデンサｍを半田付け用治具ｊから
外す。 As shown in FIG. 9, a capacitor has a through hole a in the center of a disc-shaped dielectric, and a circular electrode b 1 and a ring-shaped electrode b 2 are formed on one main surface and the other main surface, respectively. A lead wire e having a flange d formed in the center in the longitudinal direction as shown in FIG. 10 is passed through the through hole a of the element c, and the lead wire e is inserted through the through hole f as shown in FIG.
The capacitor element c is fixed between the stopper g and the collar d by passing the lead wire e through the through hole f of the cylindrical stopper g made of an insulating heat-resistant resin having a cylindrical shape.
Next, the device m configured in this way is attached to a soldering jig j consisting of a substrate h and a plurality of clamping pieces i fixed at one end to the substrate h as shown in FIG. After applying flux to 1 and b2 and the lead wire e, heat it, and dip it into a solder bath with the jig j. In this way, the lead wire e and the circular electrode b1 are soldered as shown in FIG. 8, and the solder l is also applied to the ring-shaped electrode b2 . Thereafter, the soldered feedthrough capacitor m is removed from the soldering jig j.
このような複数個の貫通コンデンサｍは、電子
機器のシヤーシ等に並べて取付けられる。 A plurality of such feedthrough capacitors m are installed side by side on the chassis of an electronic device or the like.
〔発明が解決しようとする課題〕
上記した従来の貫通コンデンサ及びその製造方
法によれば、複数の貫通コンデンサのリード線ｅ
と一方の電極部b1との半田付け及び他方の電極b2
への半田付けをするために、１個づつ半田付け用
治具ｊに装着し、半田付け後取外さなければなら
ず、これ等はいずれも手作業によつて行なわれて
いたために手間がかかり人件費等コスト高となる
という課題があつた。また、複数の貫通コンデン
サを等間隔あるいは所定の不等間隔でシヤーシ等
に装着する場合にも同様に手間がかかるという課
題があつた。[Problems to be Solved by the Invention] According to the above-described conventional feedthrough capacitor and its manufacturing method, the lead wire e of a plurality of feedthrough capacitors
Soldering with one electrode part b 1 and the other electrode part b 2
In order to solder them to the soldering jig, they must be mounted one by one on a soldering jig and removed after soldering, and this is all done by hand, which is time-consuming. There was an issue of high costs such as personnel expenses. Furthermore, there is a similar problem in that it takes time and effort to mount a plurality of feedthrough capacitors on a chassis or the like at equal or predetermined unequal intervals.
本発明は、従来のこのような課題を解決するこ
とをその目的とするものである。 The present invention aims to solve these conventional problems.
（課題を解決するための手段）
上記の目的を達成するために、本発明の貫通コ
ンデンサは、並行に配列された複数のリード線が
その一端において連結片により一体にされたリー
ド線組と、該誘電体に貫通孔が穿設され対向部分
に電極が形成された複数のコンデンサ素子とから
成り、該コンデンサ素子の貫通孔には前記リード
線が貫通され、該リード線は前記対向する電極の
うちの１つに半田付けされたことを特徴とし、そ
の製造方法は、誘電体に貫通孔が穿設され対向部
分に電極が形成された複数のコンデンサ素子の貫
通孔に、並行に配設された複数のリード線がその
一端において連結片により一体にされたリード線
組の複数のリード線を貫通させ、ストツパにより
該コンデンサ素子を該リード線に位置決めし、溶
融半田もデイツプすることによつてリード線を前
記対向する電極のうちの１つに半田付けすること
を取付けとする。(Means for Solving the Problems) In order to achieve the above object, the feedthrough capacitor of the present invention includes a lead wire set in which a plurality of lead wires arranged in parallel are integrated at one end by a connecting piece; It consists of a plurality of capacitor elements in which through-holes are formed in the dielectric material and electrodes are formed in opposing parts, and the lead wires are passed through the through-holes of the capacitor elements, and the lead wires are connected to the opposing electrodes. It is characterized by soldering to one of the capacitor elements, and its manufacturing method involves disposing the capacitor elements in parallel in the through-holes of a plurality of capacitor elements, each of which has through-holes formed in a dielectric material and electrodes formed in opposing parts. The plurality of lead wires are passed through the plurality of lead wires of the lead wire set integrated by a connecting piece at one end, the capacitor element is positioned on the lead wires by a stopper, and the molten solder is also dipped. Attachment includes soldering a lead wire to one of the opposing electrodes.
前記リード線の所定位置にコンデンサ素子位置
決め用の鍔あるいは突起を一体に形成することが
好ましく、該突起の代りに高溶融点半田から成る
突起を設けてもよい。 It is preferable that a collar or a protrusion for positioning the capacitor element be integrally formed at a predetermined position of the lead wire, and a protrusion made of high melting point solder may be provided in place of the protrusion.
（作用）
複数のリード線を複数のコンデンサ素子の貫通
孔にそれぞれ貫通し、ストツパで該コンデンサ素
子をリード線に位置決めして固定し、複数のリー
ド線の一端を連結する連結片を支持して複数のコ
ンデンサ素子を溶融半田にデイツプし、リード線
をコンデンサ素子の一対の電極の１つに半田付け
する。以上によつて製造された貫通コンデンサ組
は、電子機器等のシヤーシ又は基板の複数の孔に
複数のリード線を挿通し、誘電体の他の１つの電
極をシヤーシ又は基板に半田付けする。その後前
記連結片を複数のリード線から切り離す。(Function) The plurality of lead wires are passed through the through holes of the plurality of capacitor elements, the capacitor elements are positioned and fixed to the lead wires with a stopper, and the connecting piece that connects one end of the plurality of lead wires is supported. A plurality of capacitor elements are dipped in molten solder, and a lead wire is soldered to one of the pair of electrodes of the capacitor elements. In the feedthrough capacitor set manufactured as described above, a plurality of lead wires are inserted into a plurality of holes in a chassis or a substrate of an electronic device, etc., and the other electrode of the dielectric material is soldered to the chassis or substrate. After that, the connecting piece is separated from the plurality of lead wires.
（実施例） 以下本発明の実施例を図面につき説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図において、１はリード線組で、該リード
線組１は等間隔に並行に配設された複数のリード
線１ａとその一端を互いに連結する連結片１ｂと
から成り、例えば板厚0.3mmのスチール板をプレ
スすることによつて形成される。２は例えば直径
4.68mm、厚さ0.75mmの円板状の誘電体に貫通孔２
ａが穿設され、その一主面に貫通孔２ａの孔縁に
接する円形の電極３1が、他の主面にその外縁に
接する環状の電極３2がそれぞれ被着形成された
コンデンサ素子で、その貫通孔２ａにリード線１
ａが貫通され、絶縁耐熱性樹脂から成る円筒状の
ストツパ４によりリード線１ａの所定位置に位置
決めされている。リード線１ａは電極３1に半田
付け５され、他の電極３3にも半田付け６されて
いる。 In FIG. 1, 1 is a lead wire set, and the lead wire set 1 is made up of a plurality of lead wires 1a arranged in parallel at equal intervals and a connecting piece 1b that connects one end of the lead wires to each other, and has a plate thickness of, for example, 0.3. It is formed by pressing a mm steel plate. 2 is the diameter, for example
2 through holes in a disc-shaped dielectric material of 4.68 mm and thickness of 0.75 mm.
A is a capacitor element in which a circular electrode 31 is formed in contact with the edge of the through hole 2a on one main surface thereof, and an annular electrode 32 in contact with the outer edge of the through hole 2a is formed on the other main surface of the capacitor element. , the lead wire 1 is inserted into the through hole 2a.
a is penetrated and positioned at a predetermined position of the lead wire 1a by a cylindrical stopper 4 made of insulating heat-resistant resin. The lead wire 1a is soldered 5 to the electrode 3 1 and also soldered 6 to the other electrode 3 3 .
以上の貫通コンデンサ組において、リード線１
ａを電極３1に半田付けするには、第２図示のよ
うなリード線組１の各リード線１ａに、第１図示
のようにコンデンサ素子２を装着し、ストツパ４
の貫通孔４ａにリード線１ａを挿通してストツパ
４によりコンデンサ素子２をリード線１ａの所定
位置に位置決めし、コンデンサ素子２を固定しな
がら、リード線１ａ及び電極３1及び３2にフラツ
クスを塗布した後、プリヒート（加熱）し、リー
ド線組１の連結片１ｂを支持してコンデンサ素子
２を半田槽にデイツプする。 In the above feedthrough capacitor set, lead wire 1
To solder a to the electrode 31 , attach the capacitor element 2 as shown in the first diagram to each lead wire 1a of the lead wire set 1 as shown in the second diagram, and then attach the capacitor element 2 to the stopper 4.
The lead wire 1a is inserted into the through hole 4a, and the capacitor element 2 is positioned at a predetermined position of the lead wire 1a by the stopper 4. While the capacitor element 2 is fixed, flux is applied to the lead wire 1a and the electrodes 31 and 32 . After coating, it is preheated (heated), and the capacitor element 2 is dipped into a solder bath while supporting the connecting piece 1b of the lead wire set 1.
前記リード線組１は、第４図に示すように、各
リード線１ａの所定位置にプレスによつて一体に
作製された突起７を有するものでもよく、また図
示しないが鍔を有するものでもよく、更にストツ
パでもよい。この突起７等は、リード線１ａの所
定位置にコンデンサ素子２を固定するためのもの
で、第３図に示すようにコンデンサ素子２は突起
７とストツパ４との間に固定される。 As shown in FIG. 4, the lead wire set 1 may have a protrusion 7 integrally formed by pressing at a predetermined position of each lead wire 1a, or may have a collar (not shown). , or even a stopper. The protrusions 7 and the like are for fixing the capacitor element 2 at a predetermined position on the lead wire 1a, and the capacitor element 2 is fixed between the protrusion 7 and the stopper 4 as shown in FIG.
また前記リード線組１は、第５図に示すよう
に、各リード線１ａの所定位置に高融点半田８を
付けたものでもよい。第６図はこのリード線組１
を用いた貫通コンデンサ組を示す。 Further, the lead wire set 1 may have high melting point solder 8 attached to each lead wire 1a at a predetermined position, as shown in FIG. Figure 6 shows this lead wire set 1.
This figure shows a feedthrough capacitor set using .
尚、絶縁耐熱性樹脂から成る円筒状のストツパ
４の代りに、リード線１ａを、コンデンサ素子２
の貫通孔に挿通した後該リード線１ａの所定位置
にプレスにより突起又は鍔を設けることによつて
ストツパとしてもよい。 Note that instead of the cylindrical stopper 4 made of insulating heat-resistant resin, the lead wire 1a is connected to the capacitor element 2.
After the lead wire 1a is inserted into the through hole, a projection or a collar may be provided at a predetermined position of the lead wire 1a by pressing, thereby forming a stopper.
第７図は例えば第１図示の貫通コンデンサ組を
電子機器のシヤーシ９に取付けた状態を示す。 FIG. 7 shows, for example, a state in which the feedthrough capacitor set shown in FIG. 1 is attached to a chassis 9 of an electronic device.
リード線組１の連結片１ｂを支持して複数の貫
通コンデンサのリード線１ａを、その間隔に等し
い間隔で並んだシヤーシ９の孔１０に同時に挿通
し、電極３2をシヤーシ９に半田付け１１した後
連結片１ｂを切断するリード線１ａの折曲された
一端はプリント基板１２の配線部に半田付けす
る。 Supporting the connection piece 1b of the lead wire set 1, the lead wires 1a of a plurality of feedthrough capacitors are simultaneously inserted into the holes 10 of the chassis 9 arranged at equal intervals to the holes 10 of the chassis 9, and the electrodes 32 are soldered to the chassis 9 (11). After that, the bent end of the lead wire 1a which is used to cut the connecting piece 1b is soldered to the wiring section of the printed circuit board 12.
尚、以上の実施例では、円板状のコンデンサ素
子を用いたが、円筒状のものでもよい。 In the above embodiments, a disk-shaped capacitor element was used, but a cylindrical one may be used.
また、リード線組の各リード線は、等間隔に並
設されているが、電子機器に配設する複数の貫通
コンデンサの配設間隔に合わせた不等間隔に並設
されてもよい。 Furthermore, although the lead wires of the lead wire set are arranged in parallel at equal intervals, they may be arranged in parallel at irregular intervals in accordance with the arrangement intervals of a plurality of feedthrough capacitors arranged in an electronic device.
（発明の効果）
本発明は、上述のように構成されているので、
従来のように半田付け用治具を使用することなく
複数の貫通コンデンサの電極と複数のリード線と
を半田付けすることができ、手間及び時間がかか
らないという効果があり、また、電子機器のシヤ
ーシ等に複数の貫通コンデンサを装着する場合に
も手間及び時間がかからないという効果がある。(Effect of the invention) Since the present invention is configured as described above,
It is possible to solder the electrodes of multiple feedthrough capacitors and multiple lead wires without using a soldering jig as in the past, which saves time and effort. There is an effect that it does not require much effort and time when installing a plurality of feedthrough capacitors on a vehicle or the like.
第１図は、本発明の一実施例の貫通コンデンサ
組の断面図、第２図Ａはそのリード線組の平面
図、第２図ｂはその正面図、第３図は本発明の他
の実施例における１つの貫通コンデンサの断面
図、第４図Ａはそのリード線組の平面図、第４図
Ｂはその正面図、第５図Ａはリード線組の他の例
の平面図、第５図Ｂはその正面図、第６図はその
リード線組を用いた本発明の他の実施例における
１つの貫通コンデンサの断面図、第７図Ａは本発
明の貫通コンデンサ組を電子機器のシヤーシに装
着した状態を示す正面図、第７図Ｂは第７図Ａの
Ａ−Ａ線截断側面図、第８図は従来の貫通コンデ
ンサの断面図、第９図はそのコンデンサ素子の断
面図、第１０図はそのリード線の平面図、第１１
図Ａは半田付け用治具の正面図、第１１図Ｂは第
１１図ＡのＢ−Ｂ線截断面図である。
１……リード線組、１ａ……リード線、１ｂ…
…連結片、２……コンデンサ素子、３1，３2……
電極、４……ストツパ、５，６……半田付け、７
……突起、８……高融点半田。
FIG. 1 is a sectional view of a feedthrough capacitor set according to an embodiment of the present invention, FIG. 2A is a plan view of the lead wire set, FIG. 2B is a front view thereof, and FIG. 4A is a plan view of the lead wire set, FIG. 4B is a front view thereof, and FIG. 5A is a plan view of another example of the lead wire set. 5B is a front view thereof, FIG. 6 is a sectional view of one feedthrough capacitor according to another embodiment of the present invention using the lead wire set, and FIG. FIG. 7B is a side view taken along line A-A in FIG. 7A, FIG. 8 is a sectional view of a conventional feedthrough capacitor, and FIG. 9 is a sectional view of its capacitor element. , FIG. 10 is a plan view of the lead wire, and FIG. 11 is a plan view of the lead wire.
Figure A is a front view of the soldering jig, and Figure 11B is a cross-sectional view taken along the line B--B in Figure 11A. 1...Lead wire set, 1a...Lead wire, 1b...
...Connecting piece, 2... Capacitor element, 3 1 , 3 2 ...
Electrode, 4... Stopper, 5, 6... Soldering, 7
...Protrusion, 8...High melting point solder.
Claims (1)
において連結片により一体にされたリード線組
と、該誘電体に貫通孔が穿設され対向部分に電極
が形成された複数のコンデンサ素子とから成り、
該コンデンサ素子の貫通孔には前記リード線が貫
通され、該リード線は前記対向する電極のうちの
１つに半田付けされたことを特徴とする貫通コン
デンサ組。 ２ 前記リード線の所定位置にコンデンサ素子位
置決め用の鍔又は突起が一体に形成されたことを
特徴とする請求項第１記載の貫通コンデンサ組。 ３ 前記リード線の所定位置にコンデンサ素子位
置決め用の高融点半田から成る突起が設けられた
ことを特徴とする請求項第１記載の貫通コンデン
サ組。 ４ 誘電体に貫通孔が穿設され対向部分に電極が
形成された複数のコンデンサ素子の貫通孔に、並
行に配設された複数のリード線がその一端におい
て連結片により一体にされたリード線組の複数の
リード線を貫通させ、ストツパにより該コンデン
サ素子を該リード線に位置決めし、溶融半田にデ
イツプすることによつてリード線を前記対向する
電極のうちの１つに半田付けすることを特徴とす
る貫通コンデンサ組の製造方法。[Claims] 1. A lead wire set in which a plurality of lead wires arranged in parallel are integrated at one end by a connecting piece, and a through hole is formed in the dielectric material and an electrode is formed in the opposing portion. Consists of multiple capacitor elements,
A feedthrough capacitor set, characterized in that the lead wire passes through the through hole of the capacitor element, and the lead wire is soldered to one of the opposing electrodes. 2. The feedthrough capacitor set according to claim 1, wherein a collar or a protrusion for positioning a capacitor element is integrally formed at a predetermined position of the lead wire. 3. The feedthrough capacitor set according to claim 1, wherein a protrusion made of high melting point solder for positioning a capacitor element is provided at a predetermined position of the lead wire. 4 A lead wire in which a plurality of lead wires arranged in parallel are integrated by a connecting piece at one end through the through holes of a plurality of capacitor elements in which through holes are drilled in a dielectric material and electrodes are formed on opposing parts. passing through a set of a plurality of lead wires, positioning the capacitor element on the lead wires by a stopper, and soldering the lead wire to one of the opposing electrodes by dipping in molten solder. A manufacturing method of a feedthrough capacitor set featuring features.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21481588A JPH0265113A (en) | 1988-08-31 | 1988-08-31 | Through-type capacitor set and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21481588A JPH0265113A (en) | 1988-08-31 | 1988-08-31 | Through-type capacitor set and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0265113A JPH0265113A (en) | 1990-03-05 |
| JPH0437568B2 true JPH0437568B2 (en) | 1992-06-19 |
Family
ID=16661981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21481588A Granted JPH0265113A (en) | 1988-08-31 | 1988-08-31 | Through-type capacitor set and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265113A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6573783B2 (en) | 2014-06-09 | 2019-09-11 | 日本碍子株式会社 | Sensor element and gas sensor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59219884A (en) * | 1983-05-30 | 1984-12-11 | 株式会社村田製作所 | Method of producing terminal board with capacitor |
-
1988
- 1988-08-31 JP JP21481588A patent/JPH0265113A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59219884A (en) * | 1983-05-30 | 1984-12-11 | 株式会社村田製作所 | Method of producing terminal board with capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0265113A (en) | 1990-03-05 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |