JP2601683B2 - Electronic component manufacturing method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component in which an electronic component to be soldered and fixed to a conductive surface such as a tuner chassis or a printed circuit board is provided with preliminary soldering in advance. is there.

2. Description of the Related Art For example, in the case of a through-disc type capacitor, a tuner chassis or a printed circuit is prepared by using a pre-soldered solder pre-soldered on the bottom surface of a bowl-shaped exterior metal fitting having a built-in circuit element such as a capacitor or an inductance element as an external terminal. 2. Description of the Related Art Soldering and fixing directly to a conductor surface of a circuit board has been performed.

Conventionally, this kind of pre-soldering is to place the electronic component upside down, place the washer-shaped solder on the bottom surface of the exterior fitting, pass it through a heating furnace, and melt and harden it. (Japanese Patent Application Laid-Open No. Sho 57-11172)
No. 90).

However, in the case of a capacitor having a center conductor such as a disk-through-type capacitor, the solder adheres and hardens so as to form a tapered surface from the axial position of the center conductor to the bottom surface of the exterior fitting. As a result, it is difficult to stably seat the bottom surface of the external fitting when mounting electronic components on a conductive surface such as a tuner chassis or a printed circuit board due to the effect of solder-specific surface tension. When the posture is fixed aslant, a case where correction is required afterwards is likely to occur. In addition, when it passes through a heating furnace and melts, it hangs down to the peripheral surface side of the exterior fitting and cannot be soldered with a constant thickness, but also penetrates into the fitting from the gap between the central conductor and the exterior fitting and enters the electrode of the circuit element. Is likely to be short-circuited or thermally damaged.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an electronic component in which a contacting side with a conductor surface is formed flat and solder can be formed into a flat shape having a predetermined thickness without sagging or internal penetration. And

Means for Solving the Problems In a method for manufacturing an electronic component according to the present invention, a flat plate made of a material to which solder does not adhere is used, and a support plate having an opening on the plate surface in which the electronic component can be fitted and placed is used. After the paste-like solder is edged and adhered to the edge of the hole in a desired plane shape, a predetermined surface of the electronic component is brought into contact with the solder, and the electronic component to be fitted into the opening is placed on the plate surface of the support plate. Then, the solder is transferred to a desired state by passing through a heating furnace to transfer the solder from the support plate to the electronic component, and after the solder is cured, the electronic component is removed from the support plate.

In this method of manufacturing an electronic component, the side of the solder that adheres to the electronic component and hardens can be formed with the flat surface of the support plate, so that not only the flat surface can be formed but also the electronic component. Soldering can be performed by placing the component in the same position as the mounting position and placing it on the plate surface of the support plate, so that the molten solder that has passed through the heating furnace hangs down on the part other than the soldering surface of the electronic component or falls inside the component Soldering can be performed with a certain thickness on the fixed surface of the electronic component without incurring intrusion.

Embodiment The following is a description with reference to the accompanying drawings.

This method of manufacturing an electronic component is performed by using a flat support plate 1 as shown in FIG. 1, and the support plate 1 is formed of a metal plate material such as stainless steel or duralumin to which solder does not adhere. Further, the use of the support plate 1 can be applied to soldering on an electronic component such as a disk-through-type capacitor.

The support plate 1 has an opening 1 in which electronic components can be fitted and placed.
are provided according to the shape of the electronic component, and when soldering to the above-described disk-type capacitor, the holes 1a, 1b are formed in a circular shape according to the shape of the exterior fitting that incorporates the circuit element. .. Are arranged in a large number.

By using this support plate 1, each hole is opened as shown in FIG.
Along the periphery of 1a, 1b ..., the paste solders 2, 2 ... are trimmed and adhered to a ring-shaped planar shape according to the bottom shape of the exterior fitting. A screen printing method is applied for the adhesion, and according to this printing, the paste solder 2,2 is formed into a required flat shape with a predetermined thickness.
Can be accurately attached and molded at a time.

After the paste solders 2, 2,... Are attached, as shown in FIG. 2, the electronic component 3 is fitted into the opening 1a, and the solder 2 attached along the periphery of the opening 1a is attached to the bottom surface of the exterior fitting 3a. And the electronic component 3 is placed on the plate surface of the support plate 1 with the center conductor 3b inserted through the opening 1a. In that state, support plate 1
Is transferred to a heating furnace or the like to melt the solder 2, and the solder is transferred to the bottom surface of the exterior fitting 3 a without adhering to the support plate 1. In this case, heat treatment is performed within or near the solidus and liquidus of the paste solder, so that the solder does not hang down to the exterior fitting 3a to maintain a planar shape and promote the flux activity to melt the solder. can do. Thereafter, when the support plate 1 is taken out of the heating furnace, the solder 2 is hardened while adhering to the electronic component 3 by natural cooling, thereby inverting the support plate 1 or applying vibration or impact to the support plate 1 as necessary. For example, as shown in FIG. 4, the electronic component 3 can be removed from the support plate 1 in a state where the solder 2 has been transferred to the exterior fitting 3a.

By performing the solder embossing in this manner, the side facing the conductor surface of the solder 2 can be formed flat according to the plate surface of the support plate 1,
The solder 2 is positioned in the same direction as the mounting direction of the electronic component 3.
Can be adhered and cured, so that it can be adhered and molded to a certain thickness without sagging or invasion into other parts. Therefore,
When the electronic component 3 is mounted on a conductor surface such as a tuner chassis or a printed circuit board, the electronic component 3 can be soldered and fixed in a predetermined posture and at a constant height. The solder transfer is achieved by providing a large number of apertures 1a, 1b... On one support plate 1 and mounting a large number of electronic components 3 on the plate surface of the support plate 1 simultaneously without much trouble. Since the electronic component 3 can be soldered, the manufacturing cost can be reduced.

In the above-described embodiment, the case where soldering is performed on an electronic component having a circular outline is described. However, the present invention is also applied to a case where soldering is performed on electronic components having various outer shapes such as a square shape and an elliptical shape. be able to.

Effects of the Invention As described above, according to the method for manufacturing an electronic component according to the present invention, the contact side with the surface to be mounted can be formed flat and can be soldered to a constant thickness. Moreover, it is possible to accurately fix the solder to a conductor surface of a tuner chassis, a printed circuit board, or the like at a fixed height.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial perspective view of a support plate used in a method of manufacturing an electronic component according to the present invention, FIGS. 2a and 2b are process explanatory views of the same method, and FIG. It is explanatory drawing of the manufactured electronic component. 1: Support plate, 1a, 1b: Open hole, 2: Solder, 3: Electronic component.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Suzuki Shinemon Gate 50, Ranbashi-Kamoda, Ranbashi, Showa-cho, Minami-Akita-gun, Akita, Japan 1-13-1 TDK Corporation

Claims (1)

(57) [Claims] 1. A flat plate made of a material to which the solder (2) does not adhere, using a support plate (1) having openings (1a, 1b...) On the plate surface on which electronic components (3) can be fitted and placed. After paste-like solder (2) is adhered to the edge of the opening (1a, 1b...) In a desired plane shape, a predetermined surface of the electronic component (3) is brought into contact with the solder (2) to open the hole. The electronic component (3) fitted in the (1a, 1b ...) is placed on the plate surface of the support plate (1), and then is melted to a desired state in a heating atmosphere to solder (2) the support plate (1). Transfer from 1) to electronic component (3), this solder (2)
A method for manufacturing an electronic component, wherein the electronic component (3) is removed from the support plate (1) after the hardening of the electronic component.