JPS5812465Y2 - Equipment for mounting electronic components onto printed circuit boards - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for mounting electronic components onto a printed circuit board, particularly when electronic components equipped with lead wires such as resistors and capacitors are mounted on a printed circuit board, particularly a copper-clad metal board.

In order to mount a conventional electronic component, especially one that is cylindrical in shape and has so-called axial lead wires with lead wires drawn out from both ends, to a board, both lead wires 2, 2 are connected as shown in FIG. Usually, it is bent at a right angle and inserted into the hole 10 of the board 4.

However, if the board 4 is a metal plate designed to improve heat dissipation, the holes 1 through which the lead wires 2 are inserted, as shown in FIG.
It is necessary to insulate the lead wire 2 and the metal substrate 4 by means such as disposing an insulator 11 on the lead wire 2 and the metal substrate 4.

Further, in the conventional example shown in FIG. 3, the electronic component 1 is
The bent end of the lead wire 2 is soldered to a predetermined land of the copper foil 5. Although the drawbacks of the conventional example are eliminated, the electronic component 1 is placed in a predetermined position. After that, by the time the tip of the lead wire 2 is soldered to the copper foil 5, the electronic component 1 is likely to move, and it is difficult to place the tip of the lead wire 2 on a predetermined land of the copper foil 5. Therefore, although it is suitable for manual production in small quantities, it is not suitable for mass production.

In order to prevent the electronic component 1 from moving, it is conceivable to provide a mounting hole 6 in the board 4 into which the electronic component 1 fits, as shown in FIG. The insulation distance between the board 4 and the lead wire 2 is small, which is dangerous.

In order to increase this insulation distance, the mounting hole 6 is made small so that only a part of the electronic component 1 can fit therein, and the lead wire 2 is bent and soldered as shown in FIG. When the lead wire 2 has directionality and rotates, the tip of the lead wire 2 becomes separated from the copper foil 5 as shown in FIG.

It is difficult to automate the placement of electronic components with the tips of the lead wires and the copper foil facing each other to avoid this situation.

The present invention was developed in consideration of the above points, and its purpose is to enable accurate placement of electronic components at predetermined positions on a board, and to enable the lead wires of electronic components to be made of copper foil. It does not move beyond the specified land, and even if the board is made of metal, there is a large insulation distance, so there is no bottleneck to automation, and in addition, the overall thickness of the board on which electronic parts are mounted is small. An object of the present invention is to provide a mounting device.

The present invention will be described in detail below based on the illustrated embodiment. As shown in FIG. 7, when the electronic component 1 is cylindrical and the lead wires 2 are drawn out from both ends, is pressed into a spherical or disk shape to form the large diameter portion 3.

The board 4 is provided with mounting holes 6 whose vertical and horizontal dimensions are respectively larger than the diameter and length of the electronic component 1 excluding the lead wire 2.
Make sure that the entire electronic component 1 is fitted.

Then, the electronic component 1 is fitted into the mounting hole 6 of the copper foil 5 of the board 4, and the large diameter part 3 of the terminals of both lead wires 2, 2 is connected to the board 4.
Place it on the designated land of the copper foil 5 around the upper mounting hole 6,
As shown in FIG. 8, the large diameter portion 3 and the copper foil 5 are soldered.

Because the lead wire 2 is floating above the board 4 due to the large diameter portion 3, even if the board 4 is made of metal, the lead wire 2 and the board 4
Even if the insulation distance between the lead wire 2 and the lead wire 2 is large, and even if the electronic component 1 rotates, simply widening the land width of the copper foil 5 will ensure that the large diameter portion 3 at the end of the lead wire 2 is connected to the predetermined land of the copper foil 5. It doesn't stray too far.

In the figure, 8 represents a solder resist, 9 represents solder, and 7 represents an insulating layer.

In the embodiment shown in FIG. 9, the large diameter portion 3 of the node wire 2 is disk-shaped, and the electronic component 1 has an insulating surface like a solid resistor. The dimensions of the mounting hole 6 provided in the electronic component 1 are made slightly larger in the longitudinal direction of the electronic component 1 and slightly smaller in the diametrical direction so that only a part of the electronic component is fitted into the mounting hole 6.

As a result, the play is reduced and the accuracy of the mounting position of the electronic component 1 is improved.

Further, the area of the land of the copper foil 5 can also be small.

The electronic component 1 does not have to be cylindrical and axial,
As shown in Fig. 10, even in the case of a disk-shaped ceramic condenser, the lead wires 2 are bent so that the ends of both lead wires 2.2 are in a straight line, and each terminal has a large After forming the diameter portions 3, 3, the electronic component 1 is dropped into the mounting hole 6 of the board 4 with the copper foil 5 disposed, and the large diameter portion 3 of the lead wire 2 is positioned on a predetermined land of the copper foil 5. Good too.

A large diameter portion 3 of the lead wire 2 that increases the insulation distance and prevents the lead wire 2 from coming out of the copper foil 5 even with play in the electronic component 1 fitted in the mounting hole 6.
can be easily formed by sandwiching and fixing between a pair of dies 15 and 15 and forming the ends with a punch 16, as shown in FIG.

Of course, other methods may be used.

Soldering between the large-diameter portion 3 of the lead wire 2 and the copper foil 5 can be done by using a soldering iron or by applying solder cream to the land portion of the copper foil 5 by printing or dripping. furnace,
It may be melted by means such as infrared ray irradiation.

In any case, the movement of the electronic component 1 up to the soldering process is small, and even if the electronic component 1 moves, the lead wire 2 will not come off from the copper foil 5, so it is possible to automate the mounting. Even if the board 4 is made of metal, the lead wire 2 is kept floating above the board 4 by the large diameter portion 3, so that a sufficient insulation distance between the lead wire 2 and the board 4 can be maintained. It is.

[Brief explanation of drawings]

Fig. 1a is a perspective view of the conventional example, Fig. 2 is a sectional view of the same as above, Fig. 2 is a sectional view of another conventional example, Fig. 3 is a sectional view of yet another conventional example, and Fig. 4 is a further sectional view of the conventional example. Cross-sectional view of another conventional example, FIG. 5a,
1) is a sectional view of another conventional example, FIGS. 6a and 1) are sectional views showing the defects of the above, FIG. 7 is an exploded perspective view of the embodiment of the present invention, and FIG. 8a is a perspective view of the same as the above. Figures 9a and l) are cross-sectional views of another embodiment, Figure 10 is an exploded perspective view of yet another embodiment, and Figure 11 a and l) are leads. FIG. 2 is a perspective view and a cross-sectional view showing a wire processing method. 1 is an electronic component, 2 is a lead wire, 3 is a large diameter part, 4 is a board,
5 indicates a copper foil, and 6 indicates a mounting hole.

Claims (1)

[Scope of utility model registration request] A printed circuit board for an electronic component, in which an electronic component having a lead wire with a large diameter portion at the terminal is fitted into a mounting hole provided on a board, and the lead wire is connected to copper foil on the board around the mounting hole. attachment device.