JP4007851B2 - Electronic circuit unit - Google Patents

Electronic circuit unit Download PDF

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Publication number
JP4007851B2
JP4007851B2 JP2002140356A JP2002140356A JP4007851B2 JP 4007851 B2 JP4007851 B2 JP 4007851B2 JP 2002140356 A JP2002140356 A JP 2002140356A JP 2002140356 A JP2002140356 A JP 2002140356A JP 4007851 B2 JP4007851 B2 JP 4007851B2
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Japan
Prior art keywords
cover
leg
circuit board
bottom wall
wiring pattern
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JP2002140356A
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JP2003332755A (en
JP2003332755A5 (en
Inventor
善久 岸本
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Priority to JP2002140356A priority Critical patent/JP4007851B2/en
Priority to CNB031236537A priority patent/CN1242662C/en
Priority to KR10-2003-0030471A priority patent/KR100493642B1/en
Publication of JP2003332755A publication Critical patent/JP2003332755A/en
Publication of JP2003332755A5 publication Critical patent/JP2003332755A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0234—Feet; Stands; Pedestals, e.g. wheels for moving casing on floor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Description

【０００１】
【発明の属する技術分野】
本発明は携帯電話機に使用される送受信ユニット等に適用して好適な電子回路ユニットに関する。
【０００２】
【従来の技術】
従来の電子回路ユニットの構成を図６に基づいて説明すると、金属板を折り曲げして形成された箱形の枠体５１は、四角形の底壁５２と、この底壁５２の四辺から上方に折り曲げされた４つの側壁５３と、対向する側壁５３の下端から下方に突出する複数個の取付脚５４と、底壁５２から切り曲げされて、枠体５１内に突出する脚部５５と、底壁５２に設けられた貫通孔５６とを有し、側壁５３の上方が開放部となっている。
【０００３】
プリント基板からなる回路基板５７は、上面である一面側５７ａには配線パターン５８が設けられ、この一面側５７ａには、ＩＣ部品や抵抗、コンデンサ等の電気部品５９が搭載されると共に、下面である他面側５７ｂには、配線パターン５８に接続された状態で、凹状の雌型の第１コネクタ６０が取り付けられて、送受信回路等の所望の回路が形成されている。
【０００４】
そして、この回路基板５７は、電気部品５９を搭載した一面側５７ａを上方にして、枠体５１の上部の開放部から枠体５１内に挿入して、枠体５１に適宜手段により取り付けられる。
また、脚部５５は回路基板５７の孔（図示せず）に挿通され、脚部５５の先端部側が配線パターン５８に半田付けされている。
【０００５】
そして、枠体５１には、上部の開放部を覆うようにカバー６１が取り付けられて、枠体５１内に配設された回路基板５７が電気的にシールドされると共に、第１コネクタ６０は、底壁５２の貫通孔５６と対向した状態となっている。
【０００６】
このような構成を有する電子回路ユニットは、図６に示すように、取付脚５４の肩部（図示せず）がマザー基板６２に当接した状態で、取付脚５４がマザー基板６２に挿通される。
そして、この取付脚５４がマザー基板６２に半田付けされて、電子回路ユニットがマザー基板６２に取り付けられるようになる。
【０００７】
この取付時、第１コネクタ６０は、マザー基板６２上に設けられた凸状の雄型の第２コネクタ６３に嵌合、接続されて、そして、電子回路ユニットに形成された回路がこの第１，第２コネクタ６０，６３を介してマザー基板６２上の回路に接続されるようになっている。
【０００８】
次に、電子回路ユニットの製造方法を説明すると、先ず、回路基板５７に設けられた配線パターン５８上の所定の箇所にはクリーム半田（図示せず）が設けられ、このクリーム半田上に種々の電気部品５９を載置する。
次に、第１の半田付け工程として、電気部品５９が載置された回路基板５７をリフロー炉内に搬送して、クリーム半田に熱風をかけて溶かした後、半田を固化して、回路基板５７に電気部品５９を半田付けする。
【０００９】
次に、このような回路基板５７が枠体５１内に取り付けられると共に、脚部５５が回路基板５７に挿通された状態となり、この挿通された箇所に位置する配線パターン５８上にはクリーム半田（図示せず）が設けられる。
次に、第２の半田付け工程として、回路基板５７が取り付けられた枠体５１をリフロー炉内に搬送して、クリーム半田に熱風をかけて溶かした後、半田を固化して、脚部５５が回路基板５７の配線パターン５８に半田付けされて、電子回路ユニットの製造が完了する。
【００１０】
通常、第１の半田付け工程における半田は、第２の半田付け工程における半田の溶融温度より高く設定されているが、第２の半田付け工程時、熱風が固化状態にある電気部品５９用の半田に直接当たって、この半田を溶かしてしまうものであった。
【００１１】
【発明が解決しようとする課題】
従来の電子回路ユニットは、電気部品５９を搭載した回路基板５７が箱形の枠体５１とカバー６１とでシールドされるため、上下方向に大型になるという問題がある。
また、枠体５１の他にカバー６１を必要とし、コスト高になるという問題がある。
また、第２の半田付け工程時、熱風が固化状態にある電気部品５９用の半田に直接当たって、この半田を溶かしてしまうという問題がある。
【００１２】
そこで、本発明は薄型で、安価であると共に、リフロー半田の確実な電子回路ユニットを提供することを目的とする。
【００１３】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、底壁、及びこの底壁から上方に折り曲げられた側壁を有する箱形のカバーと、このカバーの上方の開放部を覆うように前記側壁の自由端側に取り付けられた回路基板とを備え、前記回路基板の一面側には、配線パターンが設けられて、電気部品が搭載されると共に、前記回路基板の他面側には、接地用となる導電パターンが設けられ、前記回路基板は、前記導電パターンが外側になるように前記カバーに取り付けられて、前記カバー内に位置する前記電気部品が前記カバーと前記導電パターンとで電気的にシールドされると共に、前記カバーの前記底壁には、該底壁から切り曲げされ、前記カバー内に突出した脚部と、この脚部の形成時に設けられる幅狭の開口、及びこの開口の一部を広げるように、前記脚部の根本近傍に前記脚部の幅より大きな幅の箇所を有する開口部を設け、リフロー半田付け時の熱風が前記開口部を通して前記脚部の先端部に至るようにして、前記脚部の先端が前記配線パターンに半田付けされた構成とした。
【００１４】
また、第２の解決手段として、前記脚部が接地用の前記配線パターンに半田付けされた構成とした。
【００１５】
また、第３の解決手段として、前記脚部の先端部には、前記脚部の幅より小さな幅の凸部を有し、この凸部を含む箇所が前記配線パターンに半田付けされた構成とした。
【００１６】
【発明の実施の形態】
本発明の面実装型の電子回路ユニットの図面を説明すると、図１は本発明の電子回路ユニットを裏返した状態の斜視図、図２は図１の２−２線における断面図、図３は図１の３−３線における要部の断面図、図４は図１の４−４線における断面図、図５は本発明の電子回路ユニットに係り、カバーの脚部を示す要部の断面図である。
【００１７】
次に、本発明の電子回路ユニットの構成を図１〜図５に基づいて説明すると、金属板を折り曲げして形成され、枠体等からなる箱形のカバー１は、四角形の底壁２と、この底壁２の四辺から下方に折り曲げされた４つの側壁３と、対向する側壁３から切り曲げられ、底壁２と同一面で底壁２よりも外方に突出した平板状の複数個の端子４と、底壁２から切り曲げされ、カバー１内に突出した脚部５と、脚部５の形成時に設けられる開口、及びこの開口の一部を拡げるように、脚部５の幅より大きな幅の箇所を有する開口部６と、底壁２に設けられた矩形状の貫通孔７とを有し、側壁３の上方が開放部となっている。
【００１８】
プリント基板からなる回路基板１１は、下面である一面側１１ａには配線パターン１２が設けられ、この一面側１１ａには、ＩＣ部品や抵抗、コンデンサ等の電気部品１３が搭載されると共に、この一面側１１ａには、配線パターン１２に多数の導体１４ａを接続した凹状の雌型の第１コネクタ１４が取り付けられて、送受信回路等の所望の回路が形成されている。
【００１９】
また、回路基板１１の上面である他面側１１ｂには、ほぼ全面に接地用の導電パターン１５が形成されている。
そして、この回路基板１１は、電気部品１３を搭載した一面側１１ａを下方にして、カバー１の上部の開放部を覆うように、側壁３の自由端側に載置された状態で、カバー１に適宜手段により取り付けられる。
【００２０】
回路基板１１がカバー１に取り付けられた際、接地用の導電パターン１５は、外側に位置すると共に、電気部品１３はカバー１内に位置し、この電気部品１３は、底壁２と側壁３、即ち、カバー１と接地用の導電パターン１５によって電気的にシールドされた構成となっている。
【００２１】
また、回路基板１１がカバー１に取り付けられた際、第１コネクタ１４は、電気部品１３と同様に、回路基板１１から下方に突出した状態となると共に、第１コネクタ１４の下部は、底壁２に設けられた貫通孔７から露出した状態となる。
【００２２】
更に、回路基板１１がカバー１に取り付けられた際、図４，図５に示すように、脚部５の先端部が接地用の配線パターン１２に半田付けされている。
この時、脚部５の先端部には、脚部５の幅より小さい幅の凸部５ａが設けられ、この凸部５ａを含む脚部５の先端部が半田付けされることによって、半田付けの確実性と、配線パターン１２の幅を小さくしている。
【００２３】
このような構成を有する電子回路ユニットは、図２，図３に示すように、底壁２と端子４をマザー基板１６に載置した状態で、マザー基板１６に設けられた配線パターン１７に端子４が半田付けされて、電子回路ユニットがマザー基板１６に面実装される。
【００２４】
この取付時、マザー基板１６上に設けられた凸状の雄型の第２コネクタ１８が孔７に挿通されて、第１コネクタ１４に嵌合、接続されて、そして、電子回路ユニットに形成された回路がこの第１，第２コネクタ１４，１８を介してマザー基板１６上の回路に接続されるようになっている。
【００２５】
次に、このような構成を有する電子回路ユニットの製造方法を説明すると、先ず、回路基板１１に設けられた配線パターン１２上の所定の箇所にはクリーム半田（図示せず）が設けられ、このクリーム半田上に種々の電気部品１３を載置する。
次に、第１の半田付け工程として、電気部品１３が載置された回路基板１１をリフロー炉内に搬送して、クリーム半田に熱風をかけて溶かした後、半田を固化して、回路基板１１に電気部品１３を半田付けする。
【００２６】
次に、このような回路基板１１がカバー１の開放部に取り付けられると共に、接地用の配線パターン１２に設けられたクリーム半田（図示せず）には、図４，図５に示すように、脚部５の先端部が接触した状態となる。
次に、第２の半田付け工程として、図４，図５に示すように、カバー１を上方にした状態で、カバー１をリフロー炉内に搬送して、カバー１の上方から熱風をかける。
【００２７】
すると、熱風は、脚部５の根本近傍に設けられた開口部６を通して、脚部５の先端部に位置するクリーム半田に至って、クリーム半田を溶かした後、半田を固化して、脚部５が回路基板１１の配線パターン１２に半田付けされて、電子回路ユニットの製造が完了する。
【００２８】
そして、この第２の半田付け工程時、熱風は開口部６からカバー１内に吹き込まれ、開口部６以外は底壁２によって熱風が遮られており、このため、固化状態にある電気部品１３用の半田には、熱風が直接当たらないようになっているため、この半田が溶けるようなことがない。
【００２９】
また、第１の半田付け工程における半田は、第２の半田付け工程における半田の溶融温度より高く設定されている点は従来と同様である。
【００３０】
【発明の効果】
本発明の電子回路ユニットは、底壁、及びこの底壁から上方に折り曲げられた側壁を有する箱形のカバーと、このカバーの上方の開放部を覆うように側壁の自由端側に取り付けられた回路基板とを備え、回路基板の一面側には、配線パターンが設けられて、電気部品が搭載されると共に、回路基板の他面側には、接地用となる導電パターンが設けられ、回路基板は、導電パターンが外側になるようにカバーに取り付けられて、カバー内に位置する電気部品がカバーと導電パターンとで電気的にシールドされると共に、カバーの底壁には、カバー内に切り曲げされた脚部と、この脚部の根本近傍に設けられた開口部とを有し、リフロー半田付け時の熱風が開口部を通して脚部の先端部に至るようにして、脚部の先端が配線パターンに半田付けされたため、カバーの高さを従来に比して著しく小さくでき、薄型の電子回路ユニットを提供できる。
また、このような構成によって、従来のカバーを無くすることができて、安価であると共に、カバーの半田付け時に、電気部品用の半田の溶融が無く、リフロー半田の確実なものが得られる。
【００３１】
また、脚部が接地用の配線パターンに半田付けされたため、回路基板の中央部での接地を確実に行うことができる。
【００３２】
また、開口部は、脚部の幅より大きな幅の箇所を有したため、リフロー半田時の熱風を脚部の先端部に確実に送り込むことができて、脚部の半田付けを効率的、且つ、確実に行うことができる。
【００３３】
また、脚部の先端部には、脚部の幅より小さな幅の凸部を有し、この凸部を含む箇所が配線パターンに半田付けされたため、脚部の半田付けが確実で、配線パターンの幅を小さくすることができる。
【図面の簡単な説明】
【図１】本発明の電子回路ユニットを裏返した状態の斜視図。
【図２】図１の２−２線における断面図。
【図３】図１の３−３線における要部の断面図。
【図４】図１の４−４線における断面図。
【図５】本発明の電子回路ユニットに係り、カバーの脚部を示す要部の断面図。
【図６】従来の電子回路ユニットの要部の断面図。
【符号の説明】
１ カバー
２ 底壁
３ 側壁
４ 端子
５ 脚部
５ａ 凸部
６ 開口部
７ 貫通孔
１１ 回路基板
１１ａ 一面側
１１ｂ 他面側
１２ 配線パターン
１３ 電気部品
１４ 第１コネクタ
１４ａ 導体
１５ 導電パターン
１６ マザー基板
１７ 配線パターン
１８ 第２コネクタ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic circuit unit suitable for application to a transmission / reception unit used in a mobile phone.
[0002]
[Prior art]
The structure of a conventional electronic circuit unit will be described with reference to FIG. 6. A box-shaped frame 51 formed by bending a metal plate is bent upward from four sides of the bottom wall 52 and the bottom wall 52. Four side walls 53, a plurality of mounting legs 54 projecting downward from the lower ends of the opposing side walls 53, leg portions 55 cut and bent from the bottom wall 52 and projecting into the frame 51, and a bottom wall And an upper portion of the side wall 53 is an open portion.
[0003]
The circuit board 57 made of a printed circuit board is provided with a wiring pattern 58 on the one surface side 57a which is the upper surface, and an electric component 59 such as an IC component, a resistor or a capacitor is mounted on the one surface side 57a. A concave female first connector 60 is attached to a certain other surface side 57b in a state of being connected to the wiring pattern 58 to form a desired circuit such as a transmission / reception circuit.
[0004]
Then, the circuit board 57 is inserted into the frame body 51 from the open portion on the upper side of the frame body 51 with the one surface side 57a on which the electrical component 59 is mounted facing upward, and is attached to the frame body 51 by appropriate means.
The leg 55 is inserted through a hole (not shown) of the circuit board 57, and the tip end side of the leg 55 is soldered to the wiring pattern 58.
[0005]
A cover 61 is attached to the frame 51 so as to cover the open portion of the upper part, the circuit board 57 disposed in the frame 51 is electrically shielded, and the first connector 60 is It is in a state of facing the through hole 56 of the bottom wall 52.
[0006]
As shown in FIG. 6, the electronic circuit unit having such a configuration is inserted into the mother board 62 with the shoulder portion (not shown) of the mounting leg 54 in contact with the mother board 62. The
Then, the mounting legs 54 are soldered to the mother board 62 so that the electronic circuit unit is attached to the mother board 62.
[0007]
At the time of attachment, the first connector 60 is fitted and connected to a convex male second connector 63 provided on the mother board 62, and a circuit formed in the electronic circuit unit is connected to the first connector 60. , Are connected to a circuit on the mother board 62 via the second connectors 60 and 63.
[0008]
Next, a method for manufacturing an electronic circuit unit will be described. First, cream solder (not shown) is provided at a predetermined position on the wiring pattern 58 provided on the circuit board 57, and various kinds of solder are provided on the cream solder. An electrical component 59 is placed.
Next, as a first soldering step, the circuit board 57 on which the electrical component 59 is placed is transported into a reflow furnace and melted by applying hot air to the cream solder, and then the solder is solidified. An electrical component 59 is soldered to 57.
[0009]
Next, such a circuit board 57 is mounted in the frame body 51, and the leg portion 55 is inserted into the circuit board 57, and cream solder (on the wiring pattern 58 positioned at the inserted position) (Not shown) is provided.
Next, as a second soldering step, the frame body 51 to which the circuit board 57 is attached is conveyed into a reflow furnace and melted by applying hot air to the cream solder, and then the solder is solidified to form the leg portions 55. Is soldered to the wiring pattern 58 of the circuit board 57 to complete the manufacture of the electronic circuit unit.
[0010]
Usually, the solder in the first soldering process is set to be higher than the melting temperature of the solder in the second soldering process. However, during the second soldering process, the hot air is in a solidified state for the electrical component 59. The solder hits directly and melts the solder.
[0011]
[Problems to be solved by the invention]
The conventional electronic circuit unit has a problem that the circuit board 57 on which the electrical component 59 is mounted is shielded by the box-shaped frame body 51 and the cover 61, and thus becomes large in the vertical direction.
Further, there is a problem that the cover 61 is required in addition to the frame body 51 and the cost is increased.
In addition, there is a problem that, during the second soldering step, the hot air directly hits the solder for the electrical component 59 in a solidified state, thereby melting the solder.
[0012]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic circuit unit that is thin, inexpensive, and reliable in reflow soldering.
[0013]
[Means for Solving the Problems]
As a first means for solving the above-mentioned problems, a box-shaped cover having a bottom wall and a side wall bent upward from the bottom wall, and a side wall of the side wall so as to cover an open portion above the cover. A circuit board mounted on the free end side, and a wiring pattern is provided on one surface side of the circuit board, and electrical components are mounted on the other surface side of the circuit board. A conductive pattern is provided, and the circuit board is attached to the cover so that the conductive pattern is on the outside, and the electrical component located in the cover is electrically shielded by the cover and the conductive pattern In addition, the bottom wall of the cover has a leg portion cut from the bottom wall and protruding into the cover, a narrow opening provided when the leg portion is formed, and a part of the opening. Widen As such, the leg openings with a portion of greater width than the width provided for, as the hot air reflow soldering reaches the distal end of the legs through the opening in the root neighborhood of the legs, The leg ends are soldered to the wiring pattern.
[0014]
As a second solution, the leg portion is soldered to the wiring pattern for grounding .
[0015]
As a third solution, the tip of the leg has a protrusion having a width smaller than the width of the leg, and a portion including the protrusion is soldered to the wiring pattern. did.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a perspective view of the electronic circuit unit of the present invention turned upside down, FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1, and FIG. FIG. 4 is a sectional view taken along line 4-4 in FIG. 1, FIG. 5 is a sectional view taken along line 4-4 in FIG. 1, and FIG. FIG.
[0017]
Next, the configuration of the electronic circuit unit of the present invention will be described with reference to FIGS. 1 to 5. A box-shaped cover 1 formed by bending a metal plate and made of a frame or the like has a rectangular bottom wall 2 and The four side walls 3 bent downward from the four sides of the bottom wall 2, and a plurality of flat plate-like pieces that are cut from the opposite side walls 3 and project outward from the bottom wall 2 on the same plane as the bottom wall 2. Terminal 4, leg 5 cut and bent from bottom wall 2, projecting into cover 1, opening provided when leg 5 is formed, and width of leg 5 so as to expand a part of this opening It has the opening part 6 which has a location of a larger width | variety, and the rectangular through-hole 7 provided in the bottom wall 2, The upper part of the side wall 3 is an open part.
[0018]
A circuit board 11 made of a printed circuit board is provided with a wiring pattern 12 on one side 11a which is a lower surface, and an electrical component 13 such as an IC component, a resistor or a capacitor is mounted on the one side 11a. A concave female first connector 14 in which a large number of conductors 14a are connected to the wiring pattern 12 is attached to the side 11a to form a desired circuit such as a transmission / reception circuit.
[0019]
On the other surface 11b, which is the upper surface of the circuit board 11, a grounding conductive pattern 15 is formed on almost the entire surface.
Then, the circuit board 11 is placed on the free end side of the side wall 3 so as to cover the open part of the upper part of the cover 1 with the one surface side 11a on which the electrical component 13 is mounted facing downward. Are attached by appropriate means.
[0020]
When the circuit board 11 is attached to the cover 1, the grounding conductive pattern 15 is located outside, and the electrical component 13 is located in the cover 1, and the electrical component 13 includes the bottom wall 2, the side wall 3, That is, the cover 1 and the conductive pattern 15 for grounding are electrically shielded.
[0021]
When the circuit board 11 is attached to the cover 1, the first connector 14 protrudes downward from the circuit board 11, as with the electrical component 13, and the lower portion of the first connector 14 is the bottom wall. It will be in the state exposed from the through-hole 7 provided in No.2.
[0022]
Further, when the circuit board 11 is attached to the cover 1, as shown in FIGS. 4 and 5, the tip of the leg 5 is soldered to the grounding wiring pattern 12.
At this time, a protrusion 5a having a width smaller than the width of the leg 5 is provided at the tip of the leg 5, and the tip of the leg 5 including the protrusion 5a is soldered, thereby soldering. And the width of the wiring pattern 12 is reduced.
[0023]
As shown in FIGS. 2 and 3, the electronic circuit unit having such a configuration has terminals on the wiring pattern 17 provided on the mother board 16 with the bottom wall 2 and the terminals 4 placed on the mother board 16. 4 is soldered, and the electronic circuit unit is surface-mounted on the mother board 16.
[0024]
At the time of attachment, a convex male second connector 18 provided on the mother board 16 is inserted into the hole 7 , fitted and connected to the first connector 14, and formed in the electronic circuit unit. The circuit is connected to the circuit on the mother board 16 via the first and second connectors 14 and 18.
[0025]
Next, a method of manufacturing an electronic circuit unit having such a configuration will be described. First, a cream solder (not shown) is provided at a predetermined location on the wiring pattern 12 provided on the circuit board 11. Various electrical components 13 are placed on the cream solder.
Next, as a first soldering step, the circuit board 11 on which the electrical component 13 is placed is transported into a reflow furnace and melted by applying hot air to the cream solder, and then the solder is solidified. The electrical component 13 is soldered to 11.
[0026]
Next, such a circuit board 11 is attached to the open portion of the cover 1, and the cream solder (not shown) provided in the grounding wiring pattern 12 is, as shown in FIGS. It will be in the state which the front-end | tip part of the leg part 5 contacted.
Next, as a second soldering step, as shown in FIG. 4 and FIG. 5, the cover 1 is transported into the reflow furnace with hot air from above the cover 1 with the cover 1 facing upward.
[0027]
Then, the hot air reaches the cream solder located at the tip of the leg part 5 through the opening 6 provided near the base of the leg part 5, melts the cream solder, solidifies the solder, and the leg part 5 Is soldered to the wiring pattern 12 of the circuit board 11 to complete the manufacture of the electronic circuit unit.
[0028]
During the second soldering process, hot air is blown into the cover 1 from the opening 6 and the hot air is blocked by the bottom wall 2 except for the opening 6, and thus the electric component 13 in a solidified state. Since the solder is not directly exposed to hot air, the solder does not melt.
[0029]
Further, the solder in the first soldering process is the same as the conventional one in that it is set higher than the melting temperature of the solder in the second soldering process.
[0030]
【The invention's effect】
The electronic circuit unit of the present invention is attached to the free end side of the side wall so as to cover a box-shaped cover having a bottom wall and a side wall bent upward from the bottom wall, and an open part above the cover. A circuit board, a wiring pattern is provided on one side of the circuit board, and electrical components are mounted, and a conductive pattern for grounding is provided on the other side of the circuit board. Is attached to the cover so that the conductive pattern is on the outside, the electrical components located in the cover are electrically shielded by the cover and the conductive pattern, and the bottom wall of the cover is cut and bent into the cover Leg and an opening provided near the base of the leg, so that the hot air during reflow soldering reaches the tip of the leg through the opening, and the tip of the leg is wired Soldered to the pattern And therefore, it can be significantly smaller than the height of the cover in the prior art, can provide a thin electronic circuit unit.
Also, with such a configuration, the conventional cover can be eliminated, and it is inexpensive, and at the time of soldering the cover, there is no melting of the solder for the electrical component, and a reliable reflow solder can be obtained.
[0031]
Further, since the leg portion is soldered to the grounding wiring pattern, the grounding at the center portion of the circuit board can be reliably performed.
[0032]
In addition, since the opening has a portion having a width larger than the width of the leg portion, the hot air at the time of reflow soldering can be reliably sent to the tip portion of the leg portion, and the soldering of the leg portion is efficiently performed, and It can be done reliably.
[0033]
In addition, the tip of the leg has a convex part with a width smaller than the width of the leg part, and the part including the convex part is soldered to the wiring pattern, so that the soldering of the leg part is reliable and the wiring pattern The width of can be reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic circuit unit of the present invention turned over.
FIG. 2 is a cross-sectional view taken along line 2-2 of FIG.
3 is a cross-sectional view of a main part taken along line 3-3 in FIG.
4 is a cross-sectional view taken along line 4-4 of FIG.
FIG. 5 is a cross-sectional view of a main part showing a leg part of a cover according to the electronic circuit unit of the present invention.
FIG. 6 is a cross-sectional view of a main part of a conventional electronic circuit unit.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Cover 2 Bottom wall 3 Side wall 4 Terminal 5 Leg part 5a Protrusion part 6 Opening part 7 Through-hole 11 Circuit board 11a One surface side 11b Other surface side 12 Wiring pattern 13 Electrical component 14 1st connector 14a Conductor 15 Conductive pattern 16 Mother board 17 Wiring pattern 18 Second connector

Claims (3)

底壁、及びこの底壁から上方に折り曲げられた側壁を有する箱形のカバーと、このカバーの上方の開放部を覆うように前記側壁の自由端側に取り付けられた回路基板とを備え、前記回路基板の一面側には、配線パターンが設けられて、電気部品が搭載されると共に、前記回路基板の他面側には、接地用となる導電パターンが設けられ、前記回路基板は、前記導電パターンが外側になるように前記カバーに取り付けられて、前記カバー内に位置する前記電気部品が前記カバーと前記導電パターンとで電気的にシールドされると共に、前記カバーの前記底壁には、該底壁から切り曲げされ、前記カバー内に突出した脚部と、この脚部の形成時に設けられる幅狭の開口、及びこの開口の一部を広げるように、前記脚部の根本近傍に前記脚部の幅より大きな幅の箇所を有する開口部を設け、リフロー半田付け時の熱風が前記開口部を通して前記脚部の先端部に至るようにして、前記脚部の先端が前記配線パターンに半田付けされたことを特徴とする電子回路ユニット。A box-shaped cover having a bottom wall and a side wall bent upward from the bottom wall, and a circuit board attached to a free end side of the side wall so as to cover an open portion above the cover, A wiring pattern is provided on one side of the circuit board to mount an electrical component, and a conductive pattern for grounding is provided on the other side of the circuit board. pattern attached to the cover so that the outer, together with the electrical components located within said cover is electrically shielded by said conductive pattern and said cover, said bottom wall of said cover, said The leg portion that is cut and bent from the bottom wall and protrudes into the cover, the narrow opening provided when the leg portion is formed, and the leg portion in the vicinity of the base of the leg portion so as to widen part of the opening portion. Than the width of the part Kina an opening is provided having a portion of the width, as hot air reflow soldering reaches the distal end of the legs through the opening, the distal end of the leg portion is soldered to the wiring pattern Electronic circuit unit characterized by 前記脚部が接地用の前記配線パターンに半田付けされたことを特徴とする請求項１記載の電子回路ユニット。  2. The electronic circuit unit according to claim 1, wherein the leg portion is soldered to the wiring pattern for grounding. 前記脚部の先端部には、前記脚部の幅より小さな幅の凸部を有し、この凸部を含む箇所が前記配線パターンに半田付けされたことを特徴とする請求項２記載の電子回路ユニット。 3. The electronic device according to claim 2, wherein a protrusion having a width smaller than a width of the leg is formed at a tip of the leg, and a portion including the protrusion is soldered to the wiring pattern. Circuit unit.
JP2002140356A 2002-05-15 2002-05-15 Electronic circuit unit Expired - Fee Related JP4007851B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002140356A JP4007851B2 (en) 2002-05-15 2002-05-15 Electronic circuit unit
CNB031236537A CN1242662C (en) 2002-05-15 2003-05-12 Electronic circuit unit
KR10-2003-0030471A KR100493642B1 (en) 2002-05-15 2003-05-14 Electronic circuit unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002140356A JP4007851B2 (en) 2002-05-15 2002-05-15 Electronic circuit unit

Publications (3)

Publication Number Publication Date
JP2003332755A JP2003332755A (en) 2003-11-21
JP2003332755A5 JP2003332755A5 (en) 2005-08-18
JP4007851B2 true JP4007851B2 (en) 2007-11-14

Family

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JP2002140356A Expired - Fee Related JP4007851B2 (en) 2002-05-15 2002-05-15 Electronic circuit unit

Country Status (3)

Country Link
JP (1) JP4007851B2 (en)
KR (1) KR100493642B1 (en)
CN (1) CN1242662C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175314A (en) * 2003-12-12 2005-06-30 Alps Electric Co Ltd Electronic circuit unit
JP4539983B2 (en) * 2005-07-14 2010-09-08 ニチコン株式会社 Shield structure of electronic circuit
JP5883420B2 (en) * 2013-08-26 2016-03-15 原田工業株式会社 In-vehicle circuit board holding structure
TWM499394U (en) 2014-12-19 2015-04-21 Bothhand Entpr Inc Packaging case of electronic device

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CN1242662C (en) 2006-02-15
JP2003332755A (en) 2003-11-21
KR20030089457A (en) 2003-11-21
KR100493642B1 (en) 2005-06-02

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