JP3773158B2

JP3773158B2 - Circuit board assembly

Info

Publication number: JP3773158B2
Application number: JP34519398A
Authority: JP
Inventors: 敏斉藤
Original assignee: Yazaki Corp
Current assignee: Yazaki Corp
Priority date: 1998-12-04
Filing date: 1998-12-04
Publication date: 2006-05-10
Anticipated expiration: 2018-12-04
Also published as: JP2000174460A

Description

【０００１】
【発明の属する技術分野】
本発明は、回路基板の表裏両面側に電子部品や端子といった部品を配置した回路基板組立体に関するものである。
【０００２】
【従来の技術】
図３は従来の回路基板組立体の一例を示すものである。
この回路基板組立体４１は、平板状の回路基板４２の一方の面から雄端子４３のタブ状（平板状）の電気接触部や各電子部品４４を突出させ、回路基板４２の他方の面に雄端子４３のピン状の基部（図示せず）や電子部品４４のリード端子４５をハンダ４６で接続したものである。
【０００３】
回路基板４２の他方の面の側にはプリント回路（図示せず）がパターン形成されており、雄端子４３の基部や電子部品４４のリード端子４５はプリント回路のランド部（図示せず）にハンダ４６で接続されている。ランド部は露出しており、プリント回路のランド部以外の部分の表面は絶縁処理及びハンダレジスト処理されており、ハンダ４６が付着しないようになっている。あるいは、回路基板４２の一方の面にプリント回路（図示せず）が形成され、回路基板４２のスルーホール（図示せず）を経てプリント回路が他方の面のランド部（図示せず）に続いている。
【０００４】
回路基板４２に電子部品４４のリード端子４５や雄端子４３の基部を挿入した後、回路基板４２の他方の面をハンダ槽（図示せず）内の溶融したハンダに接触させることで、ランド部とリード端子４５と雄端子４３の基部にハンダ４６が付着する。ハンダ４６を固化させて回路基板組立体４１を得る。
【０００５】
図４は上記同様の回路基板組立体を収容した電気接続箱の一例を示すものである。
回路基板４８の一方の面には大小の電子部品４９や雄端子５０，５１が配置され、回路基板４８の他方の面で電子部品４９のリード端子５２や雄端子５０，５１の基部がハンダ５３で回路基板４８のプリント回路（図示せず）に接続されている。
【０００６】
回路基板組立体５４は合成樹脂製のケース５５の内部に収容され、回路基板４８の一側方の雄端子５０の電気接触部がケース５５の雌型のコネクタハウジング５６の内側に配置されている。コネクタハウジング５６と雄端子５０とで雌コネクタが構成されている。また、回路基板４８の他側方の雄端子５１の電気接触部には中継端子５７が逆向きに接続され、中継端子５７は回路基板４８の他方の面の側、すなわちハンダ接続面の側に突出して、前記コネクタハウジング５６とは回転対称に位置する雌型のコネクタハウジング５８の内側に収容されている。
【０００７】
この中継端子５７は、雄端子５１の電気接触部に対する雌型の接続部５９を一方に有し、タブ状の電気接触部６０を他方に有したものである。雌型の接続部５９を雄端子５１の電気接触部に係合させることで、雄端子５１と中継端子５７とが接続される。中継端子５７の電気接触部６０がハンダ接続面の側でコネクタハウジング５８内に突出している。中継端子５７とコネクタハウジング５８とで雌コネクタが構成されている。
【０００８】
中継端子５７を用いることで、回路基板４８の両面側、すなわち電気接続箱６１の表側と裏側とでコネクタの接続が可能となる。各コネクタはワイヤハーネス（図示せず）の雄コネクタやヒュージブルリンク等の電気部品（図示せず）に接続される。電気接続箱６１の表裏両側にワイヤハーネスを接続できるから、ワイヤハーネスの配索方向に合ったコネクタ接続が可能となり、ワイヤハーネスの無駄な取り廻し等が不要となる。あるいはヒュージブルリンク等の電気部品の配設位置の自由度が高まる。
【０００９】
図５は従来の回路基板組立体の他の例を示すものである。
この回路基板組立体６３は、二枚の回路基板６４，６５を上下に平行に配置し、上側の回路基板６４の上面側と下側の回路基板６５の下面側とに雄端子６６，６７のタブ状の電気接触部や電子部品６８を配設し、上側の回路基板６４の下面側と下側の回路基板６５の上面側とにおいて、各雄端子６６，６７の基部や電子部品６８のリード端子６９をハンダ７０で各回路基板６４，６５のプリント回路（図示せず）のランド部に接続し、両回路基板６４，６５のプリント回路を例えばフレキシブル回路７１で相互に接続したものである。
【００１０】
各回路基板６４，６５をフラットに展開した状態で、各回路基板６４，６５のランド部（図示せず）のある面をハンダ槽（図示せず）の内部で溶融ハンダに浸漬することで、雄端子６６，６７や電子部品６８がハンダ７０でランド部に接続される。その後、一方の回路基板６５を上下反転させて、両回路基板６４，６５のハンダ接続面を内側に対向させた状態で、例えば電気接続箱（図示せず）内に回路基板組立体６３が収容される。一方の回路基板６５を反転させることで、電気接続箱の上下両側に雄端子６６，６７や電子部品６８といった部品が配置される。
【００１１】
【発明が解決しようとする課題】
しかしながら、上記従来の第一の回路基板組立体５４（図４）にあっては、中継端子５７を用いるために、部品点数及び部品コストが増すと共に、中継端子５７を雄端子５１に接続する工数が増すという問題や、電気接続箱６１内でハンダ接続面側のスペース６２が無駄になり、電気接続箱６１自体が大型化するといった問題があった。また、従来の第二の回路基板組立体６３（図５）にあっては、二枚の回路基板６４，６５を用いるために、部品コストが増すと共に、構造が肥大化するという問題があった。
【００１２】
本発明は、上記した各点に鑑み、部品点数や部品コストを増大させることなく、且つ構造を肥大化させることなく、回路基板の両面側に端子や電子部品といった部品を配置することができ、しかも電気接続箱内のスペースを有効に活用でき、電気接続箱の大型化をも防止できる回路基板組立体を提供することを目的とする。
【００１３】
【課題を解決するための手段】
上記目的を達成するために、本発明は、一方の基板部と、該一方の基板部に直交して一体成形された段差状の壁部と、該段差状の壁部に直交して一体成形された他方の基板部とで回路基板が構成され、該一方の基板部と該他方の基板部との各内側面に部品が配置され、該一方の基板部と該他方の基板部との各外側面に該部品がハンダ接続され、該部品が該段差状の壁部の高さの範囲内に位置した回路基板組立体を採用する。
【００１４】
【発明の実施の形態】
以下に本発明の実施の形態の具体例を図面を用いて詳細に説明する。
図１は本発明に係る回路基板組立体の一実施例、図２は同じく回路基板組立体の類似例をそれぞれ示すものである。
【００１５】
図１の回路基板組立体１において、回路基板２は縦断面略矩形波状に屈曲して構成されている。すなわち、回路基板２の前端寄りにおいて水平な第一の基板部３から逆凹字状の中空の突出部４が形成されると共に、回路基板２の後端側において水平な第一の基板部３から横Ｌ字状の突出部５が形成されている。回路基板２の前端と後端とは説明の便宜上定義しているのみである。
【００１６】
前側の突出部４は、第一の基板部３からそれぞれ垂直に立ち上げられた前後の段差部（段差状の壁部）６，６と、前後の段差部６，６を連結して、第一の基板部３と平行に位置する第二の基板部８とで構成されている。また、後側の突出部５は、第一の基板部３から垂直に立ち上げられた段差部（段差状の壁部）９と、段差部９から後方に水平に延びる第三の基板部１０とで構成されている。各突出部４，５の内側に部品としての雄端子１１，１２や電子部品１３を収容する空間１４が構成されている。
【００１７】
第二の基板部８と第三の基板部１０の高さ（段差部６，９の高さ）Ｌ₁，Ｌ₂は同一である。各基板部８，１０の高さＬ₁，Ｌ₂は、第一の基板部３における電子部品１３の突出高さよりも若干高く設定されている。各基板部３，８，１０の板厚は等しい。
【００１８】
本例では第一の基板部３の一方の面である上面（表面ないし内側面）３ａ側に各電子部品１３が配置され、各電子部品１３のリード端子１５は第一の基板部３の通孔（図示せず）を貫通して第一の基板部３の他方の面である下面（裏面ないし外側面）３ｂ側に達し、下面３ｂ側で回路基板２のプリント回路（図示せず）のランド部（図示せず）にハンダ（図示せず）で接続されている。
【００１９】
また、第二の基板部８と第三の基板部１０の他方の面である各下面（裏面ないし内側面）８ｂ，１０ｂ側には、突出部４，５の下側の空間１４，１６内において雄端子１１，１２のタブ状の電気接触部１１ａ，１２ａが配置され、各雄端子１１，１２のピン状の基部１１ｂ，１２ｂが各基板部８，１０の通孔（図示せず）を貫通して、各基板部８，１０の一方の面である上面（表面ないし外側面）８ａ，１０ａ側において各雄端子１１，１２の基部１１ｂ，１２ｂがハンダ１７，１９でプリント回路（図示せず）のランド部に接続されている。
【００２０】
雄端子１１，１２の電気接触部１１ａ，１２ａの突出長さは第一の基板部３の下面３ｂから第二，第三の基板部８，１０の下面８ｂ，１０ｂまでの高さ（段差部６，９の高さ）Ｌ₃，Ｌ₄よりも短く設定されている。各基板部３，８，１０の板厚は等しいから、高さＬ₁〜Ｌ₄は同一である。電子部品１３の突出方向と雄端子１１，１２の突出方向とは１８０°反対であるが、電子部品１３と雄端子１１，１２とは段差部６，９の高さＬ₃，Ｌ₄の範囲内に配置されている。回路基板２と各電子部品１３及び雄端子１１，１２とで回路部品組立体１が構成されている。
【００２１】
回路基板２の上下（表裏）両面のハンダ付け作業は、各電子部品１３のリード端子１５及び各雄端子１１，１２の基部１１ｂ，１２ｂを各通孔（図示せず）に挿入した後、先ず、一方の面（例えば第一の基板部３の下面３ｂ）をハンダ槽（図示せず）内の溶融ハンダに浸して、電子部品１３のリード端子１５をプリント回路（図示せず）のランド部にハンダ接続し、次いで、回路基板２を上下反転させ、他方の面（第二，第三の基板部８，１０の上面８ａ，１０ａ）を溶融ハンダ（図示せず）に浸して、各雄端子１１，１２の基部１１ｂ，１２ｂをプリント回路（図示せず）のランド部にハンダ接続することで行われる。第一の基板部３の下面３ｂと第二，第三の基板部８，１０の上面８ａ，１０ａとはハンダ接続面として作用する。
【００２２】
上記構成により、一枚の回路基板２の表面側と裏面側とに電子部品１３や雄端子１１，１２の電気接触部１１ａ，１２ａを配置することが可能となっている。これにより、従来（図４）の中継端子や二枚の回路基板（図５）を用いる必要がなくなり、回路基板組立体１の構造が簡素化、コンパクト化、低コスト化している。
【００２３】
また、回路基板２が略矩形波状及び略横Ｌ字状に屈曲していることで、回路基板２の曲げ剛性が増し、且つ電気接続箱（図示せず）内に収容した際の安定性が向上している。例えば電気接続箱内で第一の基板部３の下面３ｂと第二，第三の基板部８，１０の上面８ａ，１０ａとが同時に支持される。また、両突部４，５の間の凹部１８内で電子部品１３が外部との干渉等なく保護され、突部４，５の内側で雄端子１１，１２が外部との干渉等なく保護される。
【００２４】
本例では、前側の突出部４を雌型のコネクタハウジングとして作用させ、突出部４と雄端子１１とで雌コネクタを構成させている。雄端子１１は両段差部６，６の間で横一列に配置されている。なお、後側の突出部５を前側の突出部４と同様に略逆凹字状に形成して雌コネクタとして作用させることも可能である。
【００２５】
また、前側の突出部４を後側の突出部５と同様に横Ｌ字状に形成することも可能である。また、第二の基板部８と第三の基板部１０の高さＬ₁，Ｌ₂を相違させることも可能である。また、第三の基板部１０からさらに段差部（図示せず）を介して第四の基板部（図示せず）を形成することも可能である。
【００２６】
また、第一の基板部３の上面３ａ側に雄端子１１，１２を配設し、第二，第三の基板部８，１０の下面８ｂ，１０ｂ側に電子部品１３を配設することも可能である。また、第一，第二，第三の各基板部３，８，１０に雄端子１１，１２を配置することも可能である。また、第一，第二，第三の各基板部３，８，１０に電子部品１３と雄端子１１，１２を混在させたり、他の部品である電気部品や電子機器等（図示せず）をハンダ接続させることも可能である。雄端子１１，１２に代えて雌端子（図示せず）を用いることも可能である。
【００２７】
図２の回路基板組立体２１においては、回路基板２２が縦断面略クランク状に形成されている。すなわち、下側に位置する第一の基板部２３と、第一の基板部２３から上方に突出した略横Ｌ字状の突出部２４とを備え、突出部２４は、第一の基板部２３から垂直に立ち上げられた段差部（段差状の壁部）２５と、段差部２５から第一の基板部２３とは反対方向に平行に延びる第二の基板部２６とで構成されている。段差部２５によって第二の基板部２６の下側に雄端子２７を配置する空間２８が構成されている。
【００２８】
第一の基板部２３の一方の面である上面（表面ないし内側面）２３ａ側に各電子部品（部品）２９が配置され、各電子部品２９のリード端子３０は第一の基板部２３を貫通して第一の基板部２３の他方の面である下面（裏面ないし外側面）２３ｂにおいてハンダ３１でプリント回路（図示せず）のランド部に接続されている。また、第二の基板部２６の他方の面である下面（裏面ないし内側面）２６ｂ側に雄端子２７のタブ状の電気接触部２７ａが配置され、雄端子２７のピン状の基部２７ｂは第二の基板部２６を貫通して第二の基板部２６の一方の面である上面（表面ないし外側面）２６ａ側においてハンダ３２でプリント回路（図示せず）のランド部に接続されている。
【００２９】
電子部品２９の突出高さＬ₅は第二の基板部２６の高さ（段差部２５の高さ）Ｌ₆よりも低く、雄端子２７の突出長さＬ₇は第一の基板部２３の下面２３ｂから第二の基板部２６の下面２６ｂまでの高さ（段差部２５の高さ）Ｌ₈よりも短い。各基板部２３，２６の板厚は等しく、高さＬ₆，Ｌ₈は同一である。電子部品２９と雄端子２７との突出方向は１８０°反対であるが、電子部品２９と雄端子２７とは段差部２５の高さＬ₆，Ｌ₈の範囲内に位置している。本例で雄端子２７及び電子部品２９は各基板部２６，２３において段差部２５と直交する方向に配列されている。
【００３０】
回路基板２２の上下（表裏）両面のハンダ付け作業は、電子部品２９のリード端子３０及び雄端子２７の基部２７ｂを各基板部２３，２６の通孔（図示せず）に挿入した後、先ず、一方の面（例えば第一の基板部２３の下面２３ｂ）をハンダ槽（図示せず）の溶融ハンダに浸して、電子部品２９のリード端子３０をプリント回路（図示せず）のランド部にハンダ接続し、次いで、回路基板２２を上下反転させ、他方の面（第二の基板部２６の上面２６ａ）を溶融ハンダ（図示せず）に浸して、雄端子２７の基部２７ｂをプリント回路（図示せず）のランド部にハンダ接続することで行われる。第一の基板部２３の下面２３ｂと第二の基板部２６の上面２６ａとはハンダ接続面として作用する。
【００３１】
上記構成により、従来（図４）の中継端子や二枚の回路基板（図５）を用いることなく、一枚の回路基板２２の表裏両面側に電子部品２９や雄端子２７といった部品を配置することが可能となり、回路基板組立体２１の構造が簡素化、コンパクト化、低コスト化している。
【００３２】
【発明の効果】
以上の如く、本発明によれば、段差状の壁部によって各基板部の高さが異なり、且つ段差状の壁部の範囲内で一方の基板部の内側面と他方の基板部の内側面とに部品が配置されるから、例えば一方の基板部の外側面を溶融ハンダに接触させた後、他方の基板部の外側面を溶融ハンダに接触させることができ、各部品を溶融ハンダに浸すことなく、各部品の基部やリード端子を基板部に確実にハンダ付けすることができる。それにより、従来のような中継端子や二枚の回路基板を用いることなく、回路基板の両面側に端子や電子部品といった部品を配置することができ、従来に較べて部品点数や部品コスト及び中継端子を組み付ける工数が削減されると共に、二枚の回路基板による構造の肥大化が防止され、構造の簡単で低コストでコンパクトで高密度な回路基板組立体が提供される。特に、段差状の壁部の範囲内で各基板部に部品が配置されるから、部品の配置密度が高まり、例えば電気接続箱の制限されたスペース内で効率的に部品が配置され、且つ部品の配置の自由度も高まり、電気接続箱自体のコンパクト化が可能となる。
【図面の簡単な説明】
【図１】本発明に係る回路基板組立体の一実施例を示す斜視図である。
【図２】回路基板組立体の他の実施例を示す側面図である。
【図３】従来の回路基板組立体の一例を示す側面図である。
【図４】同じく回路基板組立体を収容した電気接続箱を示す縦断面図である。
【図５】従来の回路基板組立体の他の例を示す斜視図である。
【符号の説明】
１，２１回路基板組立体
２，２２回路基板
３，２３第一の基板部
８，２６第二の基板部
１０第三の基板部
３ａ，８ａ，１０ａ，２３ａ，２６ａ上面（一方の面）
３ｂ，８ｂ，１０ｂ，２３ｂ，２６ｂ下面（他方の面）
６，９，２５段差部
１１，１２，２７雄端子（部品）
１３，２９電子部品（部品）
１７，１９，３１，３２ハンダ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board assembly in which components such as electronic components and terminals are arranged on both front and back sides of a circuit board.
[0002]
[Prior art]
FIG. 3 shows an example of a conventional circuit board assembly.
The circuit board assembly 41 has a tab-shaped (flat plate) electrical contact portion of each male terminal 43 and each electronic component 44 projecting from one surface of a flat circuit board 42, and is placed on the other surface of the circuit board 42. A pin-like base (not shown) of the male terminal 43 and a lead terminal 45 of the electronic component 44 are connected by solder 46.
[0003]
A printed circuit (not shown) is patterned on the other surface side of the circuit board 42, and the base portion of the male terminal 43 and the lead terminal 45 of the electronic component 44 are formed on a land portion (not shown) of the printed circuit. They are connected by solder 46. The land portion is exposed, and the surface of the portion other than the land portion of the printed circuit is subjected to insulation treatment and solder resist treatment so that the solder 46 does not adhere. Alternatively, a printed circuit (not shown) is formed on one surface of the circuit board 42, and the printed circuit continues to a land portion (not shown) on the other surface via a through hole (not shown) of the circuit board 42. ing.
[0004]
After inserting the lead terminal 45 of the electronic component 44 and the base of the male terminal 43 into the circuit board 42, the other surface of the circuit board 42 is brought into contact with the melted solder in the solder tank (not shown), thereby The solder 46 adheres to the base of the lead terminal 45 and the male terminal 43. The circuit board assembly 41 is obtained by solidifying the solder 46.
[0005]
FIG. 4 shows an example of an electrical junction box containing a circuit board assembly similar to the above.
A large and small electronic component 49 and male terminals 50 and 51 are arranged on one surface of the circuit board 48, and a lead terminal 52 of the electronic component 49 and a base portion of the male terminals 50 and 51 are soldered on the other surface of the circuit board 48. To a printed circuit (not shown) of the circuit board 48.
[0006]
The circuit board assembly 54 is housed in a case 55 made of synthetic resin, and the electrical contact portion of the male terminal 50 on one side of the circuit board 48 is disposed inside the female connector housing 56 of the case 55. . The connector housing 56 and the male terminal 50 constitute a female connector. Further, the relay terminal 57 is connected to the electrical contact portion of the male terminal 51 on the other side of the circuit board 48 in the reverse direction, and the relay terminal 57 is connected to the other surface side of the circuit board 48, that is, the solder connection surface side. It protrudes and is housed inside a female connector housing 58 that is rotationally symmetrical with respect to the connector housing 56.
[0007]
The relay terminal 57 has a female connection portion 59 for the electrical contact portion of the male terminal 51 on one side and a tab-shaped electrical contact portion 60 on the other side. The male terminal 51 and the relay terminal 57 are connected by engaging the female connection portion 59 with the electrical contact portion of the male terminal 51. The electrical contact portion 60 of the relay terminal 57 protrudes into the connector housing 58 on the solder connection surface side. The relay terminal 57 and the connector housing 58 constitute a female connector.
[0008]
By using the relay terminal 57, connectors can be connected on both sides of the circuit board 48, that is, on the front side and the back side of the electrical connection box 61. Each connector is connected to an electrical component (not shown) such as a male connector or fusible link of a wire harness (not shown). Since the wire harness can be connected to both the front and back sides of the electrical connection box 61, it is possible to connect the connector according to the wiring direction of the wire harness, and unnecessary wiring of the wire harness becomes unnecessary. Or the freedom degree of arrangement | positioning positions of electrical components, such as a fusible link, increases.
[0009]
FIG. 5 shows another example of a conventional circuit board assembly.
In this circuit board assembly 63, two circuit boards 64 and 65 are arranged in parallel vertically, and male terminals 66 and 67 are provided on the upper surface side of the upper circuit board 64 and the lower surface side of the lower circuit board 65, respectively. A tab-shaped electrical contact portion and an electronic component 68 are arranged, and the bases of the male terminals 66 and 67 and the leads of the electronic component 68 are provided on the lower surface side of the upper circuit board 64 and the upper surface side of the lower circuit board 65. A terminal 69 is connected to a land portion of a printed circuit (not shown) of each circuit board 64, 65 by solder 70, and the printed circuits of both circuit boards 64, 65 are connected to each other by, for example, a flexible circuit 71.
[0010]
By immersing the surface with the land portion (not shown) of each circuit board 64, 65 in molten solder inside the solder tank (not shown) in a state where each circuit board 64, 65 is flatly developed, Male terminals 66 and 67 and electronic component 68 are connected to the land portion by solder 70. Thereafter, one circuit board 65 is turned upside down, and the circuit board assembly 63 is accommodated in, for example, an electrical connection box (not shown) in a state where the solder connection surfaces of both circuit boards 64 and 65 face each other. Is done. By inverting one of the circuit boards 65, components such as male terminals 66 and 67 and electronic components 68 are arranged on both the upper and lower sides of the electrical junction box.
[0011]
[Problems to be solved by the invention]
However, in the conventional first circuit board assembly 54 (FIG. 4), since the relay terminal 57 is used, the number of parts and the part cost increase, and the number of steps for connecting the relay terminal 57 to the male terminal 51 is increased. There is a problem that the solder connection surface 61 in the electrical connection box 61 is wasted and the space 62 on the solder connection surface side is wasted, and the electrical connection box 61 itself is increased in size. Further, in the conventional second circuit board assembly 63 (FIG. 5), since the two circuit boards 64 and 65 are used, there is a problem that the component cost increases and the structure becomes enlarged. .
[0012]
In view of the above points, the present invention can arrange components such as terminals and electronic components on both sides of a circuit board without increasing the number of components and component costs and without enlarging the structure. Moreover, it is an object of the present invention to provide a circuit board assembly that can effectively use the space in the electrical junction box and can prevent the electrical junction box from being enlarged.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides one substrate portion, a stepped wall portion integrally formed perpendicular to the one substrate portion, and an integrally formed portion orthogonal to the stepped wall portion. A circuit board is constituted by the other board part formed, and components are arranged on the respective inner side surfaces of the one board part and the other board part, and each of the one board part and the other board part is arranged. A circuit board assembly in which the component is soldered to the outer surface and the component is located within the height of the stepped wall portion is employed.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Specific examples of embodiments of the present invention will be described below in detail with reference to the drawings.
FIG. 1 shows an embodiment of a circuit board assembly according to the present invention, and FIG. 2 shows a similar example of the circuit board assembly.
[0015]
In the circuit board assembly 1 of FIG. 1, the circuit board 2 is configured to be bent in a substantially rectangular wave shape in the longitudinal section. That is, a hollow projection 4 having an inverted concave shape is formed from the horizontal first substrate portion 3 near the front end of the circuit board 2, and the horizontal first substrate portion 3 is formed on the rear end side of the circuit board 2. A horizontal L-shaped protruding portion 5 is formed. The front end and the rear end of the circuit board 2 are only defined for convenience of explanation.
[0016]
The front protrusion 4 connects the front and rear stepped portions (stepped wall portions) 6 and 6 raised vertically from the first substrate portion 3 and the front and rear stepped portions 6 and 6, respectively. The first substrate portion 3 and the second substrate portion 8 positioned in parallel with each other. The rear protrusion 5 includes a stepped portion (stepped wall portion) 9 raised vertically from the first substrate portion 3 and a third substrate portion 10 extending horizontally rearward from the stepped portion 9. It consists of and. A space 14 for accommodating the male terminals 11 and 12 and the electronic component 13 as components is formed inside the projecting portions 4 and 5.
[0017]
The heights of the second substrate portion 8 and the third substrate portion 10 (the heights of the step portions 6 and 9) L ₁ and L ₂ are the same. The heights L ₁ and L ₂ of the substrate portions 8 and 10 are set slightly higher than the protruding height of the electronic component 13 in the first substrate portion 3. The board thickness of each board | substrate part 3,8,10 is equal.
[0018]
In this example, each electronic component 13 is arranged on the upper surface ( front surface or inner surface ) 3 a side, which is one surface of the first substrate portion 3, and the lead terminals 15 of each electronic component 13 pass through the first substrate portion 3. It penetrates through a hole (not shown) and reaches the lower surface (back surface or outer surface ) 3b side which is the other surface of the first substrate part 3, and the printed circuit (not shown) of the circuit board 2 is formed on the lower surface 3b side. It is connected to a land portion (not shown) by solder (not shown).
[0019]
Further, in the respective lower surfaces (back surface or inner surface ) 8b, 10b which are the other surfaces of the second substrate portion 8 and the third substrate portion 10, the spaces 14 and 16 below the projecting portions 4 and 5 are provided. The tab-shaped electrical contact portions 11a and 12a of the male terminals 11 and 12 are arranged in FIG. 2, and the pin-shaped base portions 11b and 12b of the male terminals 11 and 12 pass through holes (not shown) of the substrate portions 8 and 10, respectively. The base portions 11b and 12b of the male terminals 11 and 12 are printed on the solder 17 and 19 on the upper surface (surface or outer surface ) 8a and 10a side, which is one surface of the substrate portions 8 and 10, respectively. )).
[0020]
The protruding lengths of the electrical contact portions 11a and 12a of the male terminals 11 and 12 are the heights from the lower surface 3b of the first substrate portion 3 to the lower surfaces 8b and 10b of the second and third substrate portions 8 and 10 (stepped portions). height of 6,9) L _3, is set shorter than L _4. Since the thickness of the substrate portions 3, 8, 10 are equal, the height L ₁ ~L ₄ are identical. The protruding direction of the electronic component 13 and the protruding direction of the male terminals 11 and 12 are 180 ° opposite, but the electronic component 13 and the male terminals 11 and 12 are in the range of the heights L ₃ and L ₄ of the step portions 6 and 9. Is placed inside. The circuit board assembly 2, each electronic component 13, and male terminals 11 and 12 constitute a circuit component assembly 1.
[0021]
The soldering work on both the upper and lower (front and back) surfaces of the circuit board 2 is performed after inserting the lead terminals 15 of the electronic components 13 and the base portions 11b and 12b of the male terminals 11 and 12 into the through holes (not shown). One surface (for example, the lower surface 3b of the first substrate portion 3) is immersed in molten solder in a solder bath (not shown), and the lead terminal 15 of the electronic component 13 is landed on the printed circuit (not shown). Next, the circuit board 2 is turned upside down, and the other surface (the upper surfaces 8a and 10a of the second and third substrate portions 8 and 10) is immersed in molten solder (not shown), This is done by soldering the base portions 11b and 12b of the terminals 11 and 12 to the land portions of a printed circuit (not shown). The lower surface 3b of the first substrate portion 3 and the upper surfaces 8a and 10a of the second and third substrate portions 8 and 10 act as solder connection surfaces.
[0022]
With the above configuration, it is possible to arrange the electrical contact portions 11 a and 12 a of the electronic component 13 and the male terminals 11 and 12 on the front surface side and the back surface side of the single circuit board 2. As a result, it is not necessary to use a conventional relay terminal (FIG. 4) or two circuit boards (FIG. 5), and the structure of the circuit board assembly 1 is simplified, compact, and cost-effective.
[0023]
Further, since the circuit board 2 is bent into a substantially rectangular wave shape and a substantially horizontal L shape, the bending rigidity of the circuit board 2 is increased and the stability when accommodated in an electrical connection box (not shown) is improved. It has improved. For example, the lower surface 3b of the first substrate unit 3 and the upper surfaces 8a and 10a of the second and third substrate units 8 and 10 are simultaneously supported in the electrical junction box. In addition, the electronic component 13 is protected without interference with the outside in the recess 18 between the protrusions 4 and 5, and the male terminals 11 and 12 are protected with no interference with the outside inside the protrusions 4 and 5. The
[0024]
In this example, the front protrusion 4 acts as a female connector housing, and the protrusion 4 and the male terminal 11 constitute a female connector. The male terminals 11 are arranged in a horizontal row between the step portions 6 and 6. It is also possible to form the rear protruding portion 5 in a substantially inverted concave shape like the front protruding portion 4 so as to act as a female connector.
[0025]
Also, the front protrusion 4 can be formed in a horizontal L shape like the rear protrusion 5. It is also possible to make the heights L ₁ and L ₂ of the second substrate portion 8 and the third substrate portion 10 different. It is also possible to form a fourth substrate portion (not shown) from the third substrate portion 10 via a step portion (not shown).
[0026]
Alternatively, the male terminals 11 and 12 may be disposed on the upper surface 3a side of the first substrate part 3, and the electronic component 13 may be disposed on the lower surface 8b and 10b side of the second and third substrate parts 8 and 10. Is possible. It is also possible to arrange the male terminals 11 and 12 on the first, second and third substrate portions 3, 8 and 10. Also, the electronic component 13 and the male terminals 11 and 12 are mixed in the first, second, and third substrate portions 3, 8, and 10, or other components such as electric components and electronic devices (not shown). It is also possible to make a solder connection. A female terminal (not shown) can be used in place of the male terminals 11 and 12.
[0027]
In the circuit board assembly 21 of FIG. 2, the circuit board 22 is formed in a substantially crank shape in the longitudinal section. That is, the first substrate portion 23 located on the lower side and the substantially horizontal L-shaped protrusion portion 24 protruding upward from the first substrate portion 23 are provided. Are formed of a stepped portion (stepped wall portion) 25 raised vertically from the first substrate portion and a second substrate portion 26 extending in parallel with the first substrate portion 23 in the opposite direction from the stepped portion 25. A space 28 in which the male terminal 27 is disposed below the second substrate portion 26 is formed by the step portion 25.
[0028]
One surface is a top surface (surface to the inner surface) each electronic component 23a side of the (part) 29 of the first substrate portion 23 is disposed, lead terminals 30 of the electronic component 29 through the first substrate portion 23 The lower surface (back surface or outer surface ) 23b, which is the other surface of the first substrate portion 23, is connected to a land portion of a printed circuit (not shown) by solder 31. Further, a tab-shaped electrical contact portion 27a of the male terminal 27 is disposed on the lower surface (back surface or inner surface ) 26b side which is the other surface of the second substrate portion 26, and the pin-shaped base portion 27b of the male terminal 27 is the first surface. The second substrate portion 26 is connected to a land portion of a printed circuit (not shown) by solder 32 on the upper surface (surface or outer surface ) 26a side which is one surface of the second substrate portion 26.
[0029]
The protruding height L ₅ of the electronic component 29 is lower than the height (the height of the stepped portion 25) L ₆ of the second substrate portion 26, and the protruding length L ₇ of the male terminal 27 is the height of the first substrate portion 23. from the lower surface 23b to the lower surface 26b of the second substrate portion 26 height (height of the step portion 25) is shorter than L _8. The board portions 23 and 26 have the same thickness, and the heights L ₆ and L ₈ are the same. Although the protruding directions of the electronic component 29 and the male terminal 27 are 180 ° opposite to each other, the electronic component 29 and the male terminal 27 are located within the heights L ₆ and L ₈ of the step portion 25. In this example, the male terminal 27 and the electronic component 29 are arranged in a direction orthogonal to the step portion 25 in each of the substrate portions 26 and 23.
[0030]
The soldering work on both the upper and lower (front and back) surfaces of the circuit board 22 is performed after inserting the lead terminals 30 of the electronic component 29 and the base portions 27b of the male terminals 27 into the through holes (not shown) of the board portions 23 and 26, respectively. One surface (for example, the lower surface 23b of the first substrate portion 23) is immersed in molten solder in a solder bath (not shown), and the lead terminal 30 of the electronic component 29 is placed on the land portion of the printed circuit (not shown). Next, the circuit board 22 is turned upside down, the other surface (the upper surface 26a of the second substrate portion 26) is immersed in molten solder (not shown), and the base portion 27b of the male terminal 27 is printed circuit ( This is performed by soldering to a land portion (not shown). The lower surface 23b of the first substrate portion 23 and the upper surface 26a of the second substrate portion 26 act as solder connection surfaces.
[0031]
With the above configuration, components such as the electronic component 29 and the male terminal 27 are arranged on both the front and back sides of one circuit board 22 without using the conventional relay terminal (FIG. 4) or two circuit boards (FIG. 5). Therefore, the structure of the circuit board assembly 21 is simplified, downsized, and reduced in cost.
[0032]
【The invention's effect】
As described above, according to the present invention, different heights of the substrate section by the stepped wall portion, and an inner surface and an inner surface of the other substrate portion of one substrate portion within the stepped wall portion because components are arranged in bets, for example, after the outer surface of one substrate portion is brought into contact with molten solder, it is possible to the outer surface of the other substrate portion in contact with the molten solder, immersing the components in molten solder Therefore, the base portion and lead terminal of each component can be securely soldered to the substrate portion. As a result, components such as terminals and electronic parts can be arranged on both sides of the circuit board without using a conventional relay terminal or two circuit boards, and the number of parts, parts cost, and relay can be increased compared to conventional ones. The number of man-hours for assembling the terminals is reduced, the enlargement of the structure by two circuit boards is prevented, and a compact and high-density circuit board assembly with a simple structure and low cost is provided. In particular, since the components are arranged on each substrate portion within the range of the stepped wall portion , the arrangement density of the components is increased, for example, the components are efficiently arranged in a limited space of the electric junction box, and the components The degree of freedom of the arrangement is increased, and the electrical junction box itself can be made compact.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a circuit board assembly according to the present invention.
FIG. 2 is a side view showing another embodiment of the circuit board assembly.
FIG. 3 is a side view showing an example of a conventional circuit board assembly.
FIG. 4 is a longitudinal sectional view showing an electrical junction box that similarly accommodates a circuit board assembly.
FIG. 5 is a perspective view showing another example of a conventional circuit board assembly.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1,21 Circuit board assembly 2,22 Circuit board 3,23 1st board | substrate part 8,26 2nd board | substrate part 10 3rd board | substrate part 3a, 8a, 10a, 23a, 26a Upper surface (one surface)
3b, 8b, 10b, 23b, 26b Lower surface (the other surface)
6, 9, 25 Step part 11, 12, 27 Male terminal (component)
13, 29 Electronic components (components)
17, 19, 31, 32 Solder

Claims

A circuit board is composed of one board part, a step-like wall part integrally molded perpendicular to the one board part, and the other board part integrally molded perpendicular to the step-like wall part. A component is disposed on each inner surface of the one substrate portion and the other substrate portion, and the component is solder-connected to each outer surface of the one substrate portion and the other substrate portion. Is located within the height range of the stepped wall portion .

A pair of stepped wall portions are arranged opposite to each other, a pair of stepped wall portions, the other substrate portion connecting the pair of stepped wall portions, and the pair of stepped wall portions 2. The circuit board assembly according to claim 1, wherein a connector is constituted by the terminals which are the components arranged therebetween.