KR100675703B1 - Connector set - Google Patents

Abstract

The present invention relates to an electrical connector that can be positioned very accurately in the position to be arranged.

The electrical connector set comprises a pair of insulated housings 10, 10a having a plurality of openings 14 arranged in the same array and a plurality of protrusions 18 extending into the coalesced openings, respectively, and formed of metal and one of the housings. Female terminals 24 detachably fitted over corresponding protrusions 18 of the housing 10 and having solder balls 30 and soldered to the IC package by the solder balls, and around the protrusions 18 of the other housing 10a. A male terminal 34 having a contact section 38 provided at and capable of coupling to a corresponding female terminal 24 and a lead section 36 electrically connecting the housing bottom side 22 to the contact section 38; A solder ball 40 attached to the lead section 36 at the bottom of 10a.

Electrical Connectors, Housings, Terminals, Connectors, Plated Conductive Layers, Lead Sections, Solder Balls

Description

Connector set {CONNECTOR SET}

1 is a perspective view schematically showing an insulated housing for forming a set of electrical connectors according to a preferred embodiment of the present invention;

FIG. 2 is a partially enlarged view of a portion of the insulating housing in FIG. 1; FIG.

3 is a schematic view of the insulated housing of FIG. 1 with a female terminal and solder balls attached thereto;

4 is a schematic perspective view showing an IC package with a female terminal.

5A and 5B show a male connector according to a preferred embodiment of the present invention, FIG. 5A is a perspective view, and FIG. 5B is a partially enlarged cross-sectional view showing the male terminal.

Fig. 6 is a schematic perspective view showing a state of the male connector shown in the solder ball side.

7A and 7B show an IC package with a female terminal attached. FIG. 7A is a side schematic view of the IC package immediately after the insulating housing is disconnected and connected to the male connector, and FIG. 7B is a separated insulating housing. Sectional view.

Fig. 8 is a sectional view showing a male connector attached to a printed circuit board.

<Explanation of symbols for the main parts of the drawings>

10: insulated housing

14: opening

16: bottom wall

18: protrusion

20: slot

22: bottom surface

24: female terminal

26: arm section

28: donation section

30: solder ball

36: conductive layer

38: plating contact layer

39: lead plating layer

The present invention relates to a high density electrical connector called a BGA connector connected to a substrate via solder balls arranged in a grid array.

BACKGROUND With the recent trend of electronic devices such as computers, which are becoming a trend toward high density and miniaturization, surface-mounted high density connectors called BGA connectors have been developed in such a manner as to connect to substrates having solder balls arranged as a grid array on a housing. The BGA connector is located on a connection pad arranged on the substrate surface. The compounding unit is then heated such that at least a portion of each terminal is formed of partially melted solder balls. In this operation, the solder balls are melted in the connection pads incorporated in the substrate. The distance between adjacent solder ball terminals is so close that it is possible to provide a large number of connections on the substrate in a limited area.

In very small cases, such as high density connectors for IC packages such as CPUs, it is difficult to align each terminal against a large number of small electrodes arranged in a grid array. Thus, annoying work occurs. It is also difficult to align each terminal with each terminal of a separately formed mating connector.

It is an object of the present invention to provide a simple and inexpensive electrical connector which can very accurately align each terminal of a pair of male and female connectors.

In one embodiment of the invention, a plurality of openings arranged in the same array and open at the top surface, a plurality of protrusions extending into the opening from the bottom wall, extending through the bottom wall at a position adjacent to each protrusion and the bottom surface being A pair of insulated housings having a plurality of slots to allow communication with each opening, and detachably attached to each protrusion, each connecting a pair of arm sections and these arm sections to each other and having solder balls attached thereto. Contact sections, slots and housings having base sections and soldered to one of the IC package and the printed circuit board by solder balls and plated conductive layers formed at the periphery of the projections of the other housing and capable of coupling to the female terminals Electrically connected to the contact section with a plated conductive layer formed in the portion corresponding to the bottom surface A set of electrical connectors is provided that includes a male terminal having a lead section and solder balls connected to a plated conductive layer on the bottom of the housing and soldered to another of the IC package and the printed circuit board.

According to this set of electrical connectors, the female terminal is soldered to one of the IC package and the printed circuit board in such a way that it is attached to the protrusion in one of the pair of housings. When the housing is detached, the female terminal is exposed with protection from one of the IC package and the printed circuit board. On the other hand, the male terminals protrude from the openings integrated in the same array as the openings of the housing to which the female terminals are attached, and the male terminals and the female terminals are accurately positioned at mutually aligned positions.

In another embodiment of the invention, a plurality of openings arranged in the same array as the terminal array of the coalesced female connector and open at the top surface, a plurality of protrusions extending from the bottom wall into the corresponding openings, the bottom in a position adjacent to the protrusion An insulated housing having a plurality of slots extending through the wall and allowing the bottom surface to communicate with the opening, and a contact section, the slot having a plated conductive layer formed at the periphery of the protrusion of the housing, the coupler being coupled to the female terminal; A male terminal having a plated conductive layer formed in a portion of the protrusion corresponding to the housing bottom surface and having a lead section electrically connected to the contact section, the IC package and the printed circuit board being connected to the conductive layer plated on the housing bottom surface. There is provided a male connector set comprising solder balls soldered to another. The contact section of the male terminal preferably further has a contact layer plated on a conductive layer comprising gold plated directly on the housing.

In another embodiment of the present invention, an insulating housing having a plurality of openings arranged in the same array as the terminals of the male connector and a plurality of protrusions extending into the openings from the bottom wall, and a pair of each detachably mounted to the protrusions, respectively A female metal terminal having an arm section of and a base section connecting the arm sections to each other, each attached to a base section of the female terminal and protruding from an upper surface of the housing, whereby each female terminal is formed of an IC package and a printed circuit board. There is provided a female connector forming set comprising solder balls solderable to one.

Since the female connector forming set has a female terminal detachably attached to the protrusion of the housing, it is soldered to the IC package or the printed circuit board with solder balls. Thus, when the housing is separated, the female connector is integrally formed on the IC package or the printed circuit board.

A method of manufacturing an electrical connector includes a plurality of openings arranged in the same array as a pair of insulated housings and open from the top surface and through the bottom wall in a position adjacent each protrusion and a plurality of protrusions extending into the opening from the bottom wall. Forming a plurality of slots extending and allowing the bottom surface to communicate with respective openings, and female metal terminals each having a pair of arm sections and a base section connecting these arm sections together and to which solder balls are attached; Separately attaching to each protrusion in one of the housings, and a continuously plated conductive layer is formed at the periphery of each protrusion of the other housing and in the portion corresponding to the slot and the housing bottom surface, Forming a male terminal and conducting a plated solder ball to the male terminal formed at the bottom of the housing And soldering the pair of housings to the IC package and the printed circuit board, respectively, by means of a remelt soldering method by means of solder balls, and each female terminal attached to one of the IC package and the printed circuit board. Separating the one housing to connect the IC package and the printed circuit board together.

1 schematically shows an entire insulating housing 10 according to an embodiment of the invention and FIG. 2 shows a partially enlarged view.

The insulating housing 10 is formed of a suitable insulating material, such as a liquid crystal polymer, and the plurality of openings 14 open in an array of predetermined patterns on the upper surface of the insulating housing. Each protrusion 18 extends from the bottom wall 16 into the opening 14. The tapered end of the protrusion 18 is located at substantially the same height as the upper surface 12 of the insulating housing 10. Slots 20 are formed at positions adjacent to both sides of each protrusion 18 and extend through bottom wall 16. The opening 14 communicates with the bottom surface 22 of the insulating housing 10 through the slot 20.

In this case, the female connector is formed as shown in Fig. 3, and the pre-formed female terminal 24 is detachably mounted on the protrusion 18 in each opening 14. The female terminal 24 of the present embodiment is shaped like a clip and has a pair of plate spring arm sections 26 and flat plate base sections 28 connected to these arm sections 26. The pair of arms 26 retract the protrusions 18 in a state of being connected with the protrusions 18. In addition, the base section 28 is positioned substantially parallel to the top surface 12 of the housing 10 and the solder balls 30 are attached to the base section 28 by a remelt soldering method.

The female terminal 24 is formed of a suitable terminal material such as phosphor bronze or beryllium copper. The thin lead plate layer is formed in the region of the female terminal to which the solder balls 30 are attached. The nickel base gold plating layer is preferably formed at the connecting portion of the female terminal to which the protrusion 18 is connected. In this embodiment, the female terminal 24 has a very simple structure having a pair of arms 26 and a base section 28, and can be simply formed in one stamping operation.

Insulated housing 10 having respective female terminals 24 attached to solder balls 30 and protrusions 18 provides a female connector on an IC package such as a CPU or a printed circuit board. For example, when formed in the electrical connector of the CPU, each female terminal 24 is soldered to the IC package by a remelting soldering method with the terminals 24 arranged on the insulating housing 10. In this case, depending on the array of female terminals, the openings 14 of the insulating housing 10 have a spacing, size, or the like that matches the arrangement of the electrodes exposed on the surface of the IC package. Each female terminal has solder balls 30 that are soldered by remelting solder to electrodes incorporated into the IC package, and the composite structure is formed as an IC package with an integral female connector.

4 shows a state where the female terminal 24 is mounted on the IC package P. As shown in FIG. In Figure 4, the female terminal 24 is shown separate from the insulating housing 10. In order to protect the female terminal and the IC package (P), the insulating housing 10 is preferably held in the mounting state until just before the female terminal is connected to the integrated male connector.

5A, 5B and 6 show another housing 10a formed to have the same structure as the housing 10 described above. Parts of this housing that are identical to the housing 10 are denoted by the same reference numerals and description is omitted for brevity.

The insulating housing 10a constitutes a male connector. Each protrusion 18 is formed as a male terminal. For this reason, as shown in FIG. 5B, the conductive layer 36 is plated directly on a plastic substrate such as a liquid crystal polymer and the outer periphery of each protrusion 18 and the inner periphery of the slot 20 adjacent the protrusion 18. And a portion of the protrusion 18 corresponding to the bottom face 22 of the housing, the conductive layer being electrically connected to the bottom face 22 side. In addition, a nickel-based gold plated layer is formed on the side of the protruding portion 18 connected to the female terminal 24 described above. A thin lead plating layer 39 is formed on opposite sides of the protrusion 18 at a portion of the bottom surface 22. The solder balls 40 making up the contact section are attached to the thin lead plating layer 39 by remelting soldering technology. In this operation, the solder ball 40 is electrically connected to the inner plating conductive layer 36 by a thin lead plating layer 39, and the plating on the protrusion 18 side by the conductive layer 36 constituting the lead section. Is electrically connected to the contact layer 38. 6 shows a grid array of solder balls 40 attached on the bottom 22 side of the housing 10a.

Thus, the formed insulating housing 10a is arranged in the opening 14 in which each male terminal 34 is incorporated, and the solder ball 40 constitutes a male connector protruding from the bottom surface of the housing 10a. The male connector can be soldered to a conductive pad such as a printed circuit board by solder balls 40 using, for example, a remelting soldering method.

7A, 7B and 8 show a printed circuit board B having an IC package P with a female terminal 24 mounted therein and a male connector with an insulating housing 10a. In the manufacture of the IC package P, this IC package P mounts the female terminal 24 and the insulating housing 10 therein. When the IC package P is mounted on the printed circuit board B, the insulating housing 10 is removed from the IC package P. FIG. 7A shows an IC package with a separate insulating housing 10, and FIG. 7B shows an insulating housing 10 separated from an IC package P. FIG. Since the insulating housing 10 has the same structure as the insulating housing 10a to form a male connector on the printed circuit board B, each female terminal 24 attached to the protrusion 18 is formed on the protrusion 18. Aligned with the coalescing male terminal 34, the male terminal 24 and the female terminal 34 can be aligned with each other and fixed in the correct coupling state. In addition, each female terminal 24 is conveyed in a state that can be protected by the insulating housing 10. As a result, these female terminals 24 and the IC package are not damaged while being transported.

In addition, since the insulating housing 10 and the insulating housing 10a have the same structure, it is not necessary to manufacture the two types of housings in separate forms. Thus, it is possible to manufacture two male and female electrical connectors using a single mold.

As described above, according to the present invention, the electrical connector consists of male and female connectors which can be manufactured at low cost using a pair of insulating housings having the same size and structure. Such a male connector and a female connector allow an IC package and a printed circuit board having a plurality of electrodes to be easily and preferably connected to each other in a high density arrangement.

The male connector is each male terminal having a plated conductive layer formed around the protrusion. Thus, the male connector can be manufactured at low cost since there is no need to attach it to a predetermined separate metal terminal.

The female connector is a female terminal attached to an IC package or a printed circuit board by solder balls, and thus can be formed in a very small unit. The female terminal can be attached to and held therein with the same insulating housing as the insulating housing therefor to accurately prevent mismatches between the female terminal and the male terminal.

The present invention provides a simple and inexpensive electrical connector that can very accurately align each terminal of a pair of male and female connectors.

Claims (5)

A plurality of openings 14 arranged in the same array in the pair of insulating housings 10 and 10a and opened to the upper surface 12 and a plurality of protrusions extending from the lower wall 16 to the opening 14 ( 18) and a pair including a plurality of slots 20 extending through the bottom wall 16 at positions adjacent to each of the protrusions 18 and communicating the bottom surface 22 and the respective openings. Insulating housings 10 and 10a, Releasably attached to each of the protrusions 18 on the insulating housing 10, connecting the pair of arm sections 26 and the pair of arm sections 26 to each other and having a solder ball 30 attached thereto. A female metal terminal 24 having a base section 28 which is present and is soldered by the solder balls 30 to one of an IC package and a printed circuit board, A contact section 38 formed on the periphery of each protrusion 18 of the other insulating housing 10a and comprising a plated conductive layer capable of engaging with the female terminal 24 and the slot and housing bottom surface. A male terminal 34 having a lead section 36 formed in a portion of the protrusion corresponding to 22 and comprising a plated conductive layer electrically connected to the contact section 38; And a solder ball (40) connected to the plated conductive layer of the bottom surface (22) of the other insulating housing (10a) and soldered to the other of the IC package and the printed circuit board. A plurality of openings 14 arranged in the same array as the terminal array of female connectors to be joined and open to the upper surface 12 and extending from the bottom wall 16 to the corresponding openings 14. And a plurality of slots 20 extending through the bottom wall 16 at a position adjacent the protrusion 18 and communicating the bottom surface 22 with the opening 14. and, A contact section 38 formed on the periphery of the protrusion 18 of the insulating housing 10a and capable of engaging with the female terminal 24 and corresponding to the slot 20 and the housing bottom 22. A male terminal 34 having a lead section formed in a portion of the projection 18 and including a plated conductive layer electrically connected to the contact section 38; And a solder ball (40) connected to the conductive layer (36) plated on the housing bottom (22) and soldered to one of the IC package and the printed circuit board. The method of claim 2, The contact section of the male terminal (34) further has a plated contact layer (39) comprising gold on a conductive layer (36) plated directly on the insulating housing (10a). An insulated housing (10) having a plurality of openings (14) arranged in the same array as the terminals of the male connector and a plurality of protrusions (18) extending from the bottom wall to the openings (14); A female metal terminal 24 detachably mounted to the protrusion 18 and having a base section 28 connecting the pair of arm sections 26 and the pair of arm sections 26 to each other; A solder ball 30 attached to the base section 28 of the female metal terminal 24 and protruding from an upper surface 12 of the housing 10, And a female connector (24) is soldered to one of the IC package and the printed circuit board through the solder ball (30). A plurality of openings 14 arranged in the same array in the pair of insulating housings 10 and 10a and opened to the upper surface 12 and a plurality of protrusions extending from the lower wall 16 to the opening 14 ( 18) and forming a plurality of slots 20 extending through said bottom wall 16 at positions adjacent said respective projections 18 and communicating said bottom surface 22 with said respective openings; , A female metal terminal 24 having a base section 28 to which a pair of arm sections 26 and the pair of arm sections 26 are connected to each other and to which a solder ball 30 is attached is connected to the insulating housing 10. Detachably attaching to each projection 18 of &lt; RTI ID = 0.0 &gt; Conductive layers successively plated on the periphery of each protrusion 18 of the insulating housing 10a and the portion of the protrusion 18 corresponding to the slot 20 and the bottom surface 22 of the insulating housing 10a. Forming a male terminal 34 by forming 36; Coupling the solder ball 40 to a plated conductive layer of a male terminal formed on the bottom surface 22 of the housing 10a; Soldering the pair of insulating housings 10 and 10a to the IC package and the printed circuit board, respectively, by the remelting soldering method by the solder balls 30 and 40; Removing the insulated housing (10) associated with a female terminal (24) attached to an IC package or a printed circuit board, and coupling the IC package and the printed circuit board.

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