JPH05206628A - Soldering auxiliary tool - Google Patents

Soldering auxiliary tool

Info

Publication number
JPH05206628A
JPH05206628A JP3283592A JP3283592A JPH05206628A JP H05206628 A JPH05206628 A JP H05206628A JP 3283592 A JP3283592 A JP 3283592A JP 3283592 A JP3283592 A JP 3283592A JP H05206628 A JPH05206628 A JP H05206628A
Authority
JP
Japan
Prior art keywords
soldering
lead wire
wire
pair
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3283592A
Other languages
Japanese (ja)
Inventor
Minoru Kojima
穣 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP3283592A priority Critical patent/JPH05206628A/en
Publication of JPH05206628A publication Critical patent/JPH05206628A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To readily carry out soldering operations manually by a method wherein an engaging part on a printed board and a lead wire holder are provided. CONSTITUTION:A pair of arms 2 are pinched from both sides and bent inside, and then a lead wire 7 is interposed between a pair of lead wire holders 3 from both sides. Next, a pair of engaging parts 4 is inserted vertically into an engaging hole 9 such as a through hole or the like of a part to be engaged on a printed board 8 to engage it. A tip of a core wire 7a of a lead wire is accurately positioned on a land 10a which is a part to be soldered for a wiring pattern 10 on the printed board 8, and the tip thereof is fixed in such the state. Next, an operator grasps only a soldering wire by his one hand and a soldering iron by his another hand to freely move his both hands, while he accurately melts the soldering wire at a tip of the core wire 7a and a soldering lump 11 is accurately formed on the land 10a to accurately and readily solder the tip of the core wire 7a on the land 10a. Thus, soldering operations can be carried out manually.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、リード線をプリント基
板の配線パターンに半田付けする際に使用する半田付け
用補助工具に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an auxiliary soldering tool used for soldering a lead wire to a wiring pattern of a printed circuit board.

【0002】[0002]

【従来の技術】従来から、プリント基板の配線パターン
にリード線を手作業で半田付けする場合、例えば左手等
の一方の手でリード線と半田線とを互いに重ねるように
同時に握り、右手等の他方の手で半田ごてを握って、リ
ード線を配線パターンに押し付けるようにして、半田ご
てで半田線を溶かして半田付けを行うのが一般的であ
る。
2. Description of the Related Art Conventionally, when a lead wire is manually soldered to a wiring pattern of a printed circuit board, for example, one hand such as the left hand is used to hold the lead wire and the solder wire at the same time so that the lead wire and the solder wire are overlapped with each other. It is common to hold the soldering iron with the other hand, press the lead wire against the wiring pattern, and melt the solder wire with the soldering iron for soldering.

【0003】[0003]

【発明が解決しようとする課題】しかし、この手作業に
よる半田付け作業は、非常に煩雑であり、熟練技術を要
する。そして、往々にして、配線パターンに対するリー
ド線の半田位置にずれを生じたり、リード線が配線バタ
ーンから浮いてしまって、リード線と配線パターンとの
間に十分な合金層が形成されないような半田不良が発生
し易い等の問題があった。なお、十分な合金層が形成さ
れず、リード線が配線パターンから浮き上がってしまう
と、電子回路内のノイズ発生の原因になり易い上に、リ
ード線が配線パターンから脱落し易くなる。
However, this manual soldering work is very complicated and requires skill. And, in many cases, the solder position of the lead wire with respect to the wiring pattern is displaced or the lead wire floats from the wiring pattern, so that a sufficient alloy layer is not formed between the lead wire and the wiring pattern. There was a problem that defects were likely to occur. If a sufficient alloy layer is not formed and the lead wire is lifted from the wiring pattern, it is likely to cause noise in the electronic circuit and the lead wire is easily dropped from the wiring pattern.

【0004】本発明は、上記の問題を解決するためにな
されたものであって、手作業による半田付け作業を容易
に行うことができる半田付け用補助工具を提供すること
を目的としている。
The present invention has been made to solve the above problems, and an object of the present invention is to provide an auxiliary soldering tool that can easily perform a manual soldering operation.

【0005】[0005]

【課題を解決するための手段】上記の目的を達成するた
めの本発明の半田付け用補助工具は、プリント基板への
係止部と、リード線保持部とを備えたものである。
An auxiliary tool for soldering according to the present invention for achieving the above object comprises an engaging portion for a printed circuit board and a lead wire holding portion.

【0006】[0006]

【作用】上記のように構成された本発明の半田付け用補
助工具は、リード線をリード線保持部で保持して、係止
部をプリント基板に係止するようにして、リード線をプ
リント基板の配線パターンに対して正確に位置決めして
固定できる。
With the auxiliary soldering tool of the present invention configured as described above, the lead wire is printed by holding the lead wire with the lead wire holding portion and locking the locking portion with the printed circuit board. It can be accurately positioned and fixed to the wiring pattern of the board.

【0007】[0007]

【実施例】以下、本発明の半田付け用補助工具の一実施
例を図を参照して説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the auxiliary soldering tool of the present invention will be described below with reference to the drawings.

【0008】まず、図5の(A)〜(C)に示すよう
に、半田付け用補助工具1は、金属板や合成樹脂等の適
度な弾性を有する部材によってほぼピンセット形状に形
成されていて、U字状に折り曲げられた垂直状の一対の
アーム2の下端に、相対向するほぼ半円形状に弯曲され
た一対のリード線保持部3が水平状に一体に形成され、
これら一対のリード線保持部3の中央部の下部に相対向
するほぼ半円形状に弯曲された一対の係止部4が垂直状
に一体に形成されている。なお、一対の係止部4の一対
のリード線保持部3に対する接続部の両側にはそれぞれ
一対の切れ目5が形成されている。
First, as shown in FIGS. 5A to 5C, the auxiliary soldering tool 1 is formed into a substantially tweezers shape by a member having a proper elasticity such as a metal plate or a synthetic resin. , A pair of lead wire holding portions 3 curved in a semi-circular shape facing each other are integrally formed horizontally at the lower ends of a pair of vertical arms 2 bent in a U shape,
A pair of engaging portions 4 that are curved in a substantially semicircular shape and are opposed to each other are integrally formed vertically in the lower part of the center of the pair of lead wire holding portions 3. A pair of cuts 5 are formed on both sides of the connecting portion of the pair of locking portions 4 to the pair of lead wire holding portions 3.

【0009】次に、この半田付け用補助工具1の使い方
を図1〜図4によって説明する。
Next, how to use the auxiliary soldering tool 1 will be described with reference to FIGS.

【0010】まず、一対のアーム2を両側から指でつま
んで弾性に抗して内側に撓ませるようにして、一対のリ
ード線保持部3間でリード線7を両側から弾性に抗して
挟持する。
First, the pair of arms 2 is pinched with fingers from both sides so as to be bent inwardly against elasticity, so that the lead wire 7 is sandwiched between the pair of lead wire holding portions 3 against elasticity. To do.

【0011】次に、プリント基板8の被係止部であるス
ルーホール等の係止穴9内に一対の係止部4を弾性に抗
して垂直に差し込んで係止して、リード線7の芯線7a
の先端をプリント基板8の配線パターン10の被半田付
け用部分であるランド10a上に正確に位置決めした状
態に固定することができる。
Next, a pair of locking portions 4 are vertically inserted into the locking hole 9 such as a through hole which is a locked portion of the printed circuit board 8 against elasticity and locked, and the lead wire 7 is formed. Core wire 7a
The tip of can be fixed in a state of being accurately positioned on the land 10a which is the portion to be soldered of the wiring pattern 10 of the printed circuit board 8.

【0012】次に、作業者は、例えば左手等の一方の手
で半田線のみを握り、右手等の他方の手で半田ごて(何
れも図示せず)を握って、両手を自在に操作しながら、
半田線を芯線7aの先端に正確に溶かして、ランド10
a上に半田塊11を正確に形成するようにして、芯線7
aの先端をランド10a上に正確かつ容易に半田付けす
ることができる。なお、この半田付け後は、半田付け用
補助工具1の一対の係止部4を係止穴9から上方に抜き
取る。
Next, the operator can freely operate both hands by grasping only the solder wire with one hand such as the left hand and the soldering iron (neither is shown) with the other hand such as the right hand. while doing,
The solder wire is accurately melted at the tip of the core wire 7a, and the land 10
The solder wire 11 is accurately formed on the core wire 7a.
The tip of a can be soldered accurately and easily onto the land 10a. After the soldering, the pair of locking portions 4 of the auxiliary soldering tool 1 are pulled out upward from the locking holes 9.

【0013】このように、手作業による半田付けを行う
際に、半田付け用補助工具1を使用すると、リード線7
の芯線7aの先端部をランド10a上に予め正確に位置
決めして固定しておくことができるので、作業者は手で
リード線7を保持する必要が一切なくて、半田線と半田
ごてのみを両手で握って、両手を自在に操作できる。従
って、熟練技術を必要とせず、半田付け作業を正確かつ
容易に行える。そして、ランド10aに対する芯線7a
の先端の半田位置のずれが全く発生せず、芯線7aの先
端をランド10a上に確実に押し付けて半田付けできる
ので、図4の(C)に示すように、半田塊11と母材で
あるランド10aとの間に合金層12を確実に形成する
ことができて、芯線7aの先端がランド10aから浮い
てしまうような半田不良が全く発生しない。なお、図中
13はフラックスである。
As described above, when the auxiliary soldering tool 1 is used for manual soldering, the lead wire 7
Since the tip portion of the core wire 7a can be accurately positioned and fixed on the land 10a in advance, the operator does not need to hold the lead wire 7 by hand, only the solder wire and the soldering iron. With both hands, you can operate both hands freely. Therefore, the soldering work can be accurately and easily performed without requiring any skill. And the core wire 7a for the land 10a
Since there is no displacement of the soldering position of the tip of the core wire 7 and the tip of the core wire 7a can be reliably pressed against the land 10a for soldering, as shown in FIG. The alloy layer 12 can be surely formed between the land 10a and the solder layer, and no soldering failure occurs in which the tip of the core wire 7a floats from the land 10a. In the figure, 13 is a flux.

【0014】なお、半田付け用補助工具1の一対のアー
ム2の弾性反発力及び各一対の切れ目5により、係止穴
9の内面に対する一対の係止部4の十分な弾性圧着力を
発揮させることができるので、半田付け用補助工具1を
プリント基板8に確実に係止して、リード線7をプリン
ト基板8に正確に固定できる。
By the elastic repulsive force of the pair of arms 2 of the auxiliary soldering tool 1 and each pair of the cuts 5, sufficient elastic crimping force of the pair of locking portions 4 with respect to the inner surface of the locking hole 9 is exerted. Therefore, the auxiliary soldering tool 1 can be securely locked to the printed circuit board 8 and the lead wire 7 can be accurately fixed to the printed circuit board 8.

【0015】この際、図5の(D)に示すように、係止
穴9の内面に対する一対の係止部4の摩擦係止力を増大
させるために、一対の係止部9の外周面に高摩擦シート
や尖状粒子等の高摩擦部材14を接着や塗布等しておく
のが望ましい。
At this time, as shown in FIG. 5D, in order to increase the friction locking force of the pair of locking portions 4 with respect to the inner surface of the locking hole 9, the outer peripheral surfaces of the pair of locking portions 9 are increased. Further, it is desirable to adhere or apply a high friction sheet 14 or a high friction member 14 such as pointed particles.

【0016】以上、本発明の一実施例に付き述べたが、
本発明は上記の実施例に限定されることなく、本発明の
技術的思想に基づいて各種の変更が可能である。例え
ば、リード線保持部3及び係止部4の形状等は如何なる
形状等であっても良く、また、プリント基板の被係止部
である係止穴9はスルーホール等でなくても、プリント
基板の如何なる形状部であっても良い。
The above is a description of one embodiment of the present invention.
The present invention is not limited to the above embodiments, and various modifications can be made based on the technical idea of the present invention. For example, the lead wire holding portion 3 and the locking portion 4 may have any shape, and the locking hole 9 which is the locked portion of the printed circuit board does not have to be a through hole. It may be any shape of the substrate.

【0017】[0017]

【発明の効果】以上のように構成された本発明の半田付
け用補助工具は次のような効果を奏する。
The auxiliary soldering tool of the present invention constructed as described above has the following effects.

【0018】リード線をリード線保持部で保持して、係
止部をプリント基板に係止するようにして、リード線を
プリント基板の配線パターンに対して正確に位置決めし
て固定できるので、手作業による半田付け作業を行う際
に、作業者が手でリード線を保持する必要が一切ない。
従って、作業者は半田線と半田ごてのみを両手で握っ
て、両手を自在に操作しながら、半田付け作業を行える
ので、熟練技術が必要でなくなり、手作業による半田付
け作業を容易に行える。
Since the lead wire is held by the lead wire holding portion and the locking portion is locked to the printed circuit board, the lead wire can be accurately positioned and fixed with respect to the wiring pattern of the printed circuit board. There is no need for the operator to hold the lead wire by hand when performing soldering work.
Therefore, since the worker can carry out the soldering work while grasping only the solder wire and the soldering iron with both hands and freely operating both hands, no skill is required and the manual soldering work can be easily performed. .

【0019】リード線をプリント基板の配線パターンに
対して正確に位置決めして固定した状態で半田付けする
ことができるので、配線パターンに対するリード線の半
田位置がずれたり、リード線が配線パターンから浮いた
状態に半田付けされてしまい、合金層を形成できなくな
る等の半田不良が全く発生せず、常に正確かつ確実な半
田付けを行える。従って、半田不良による電子回路内の
ノイズ発生を防止できる。
Since the lead wire can be accurately positioned and fixed with respect to the wiring pattern of the printed circuit board and soldered, the solder position of the lead wire with respect to the wiring pattern is displaced or the lead wire floats from the wiring pattern. The soldering is performed in such a state that no soldering failure such as the inability to form an alloy layer occurs, and accurate and reliable soldering can always be performed. Therefore, it is possible to prevent noise generation in the electronic circuit due to defective solder.

【0020】半田付け用補助工具は構造が簡単で、製造
も容易であり、低コストである。
The auxiliary tool for soldering has a simple structure, is easy to manufacture, and is low in cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例による半田付け用補助工具の
使い方を説明する斜視図である。
FIG. 1 is a perspective view illustrating how to use an auxiliary soldering tool according to an embodiment of the present invention.

【図2】図1のA−A矢視での断面図である。FIG. 2 is a sectional view taken along the line AA of FIG.

【図3】図2のB−B矢視での平面図である。FIG. 3 is a plan view taken along the line BB of FIG.

【図4】図4の(A)は図2のC−C矢視での断面図、
図4の(B)は図2のD−D矢視での断面図であり、図
4の(C)は半田接合部の拡大断面図である。
4A is a cross-sectional view taken along the line CC of FIG.
4B is a cross-sectional view taken along the line D-D of FIG. 2, and FIG. 4C is an enlarged cross-sectional view of the solder joint portion.

【図5】図5の(A)は半田付け用補助工具の斜視図、
図5の(B)は正面図、図5のC)は底面図であり、図
5の(D)は変形例を示す要部の底面図である。
FIG. 5 (A) is a perspective view of an auxiliary tool for soldering,
5B is a front view, FIG. 5C is a bottom view, and FIG. 5D is a bottom view of a main part showing a modified example.

【符号の説明】[Explanation of symbols]

1 半田付け用補助工具 3 リード線保持部 4 係止部 7 リード線 8 プリント基板 9 係止穴(被係止部) 10 配線パターン 1 soldering auxiliary tool 3 lead wire holding part 4 locking part 7 lead wire 8 printed circuit board 9 locking hole (locked part) 10 wiring pattern

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】プリント基板への係止部と、リード線保持
部とを備えた半田付け用補助工具。
1. A soldering auxiliary tool including a printed circuit board engaging portion and a lead wire holding portion.
JP3283592A 1992-01-24 1992-01-24 Soldering auxiliary tool Pending JPH05206628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3283592A JPH05206628A (en) 1992-01-24 1992-01-24 Soldering auxiliary tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3283592A JPH05206628A (en) 1992-01-24 1992-01-24 Soldering auxiliary tool

Publications (1)

Publication Number Publication Date
JPH05206628A true JPH05206628A (en) 1993-08-13

Family

ID=12369879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3283592A Pending JPH05206628A (en) 1992-01-24 1992-01-24 Soldering auxiliary tool

Country Status (1)

Country Link
JP (1) JPH05206628A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108784A (en) * 2009-11-16 2011-06-02 Rb Controls Co Soldering structure
DE102013105568A1 (en) * 2013-05-29 2014-12-04 Phoenix Contact Gmbh & Co. Kg Leiterplattenlöthilfe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108784A (en) * 2009-11-16 2011-06-02 Rb Controls Co Soldering structure
DE102013105568A1 (en) * 2013-05-29 2014-12-04 Phoenix Contact Gmbh & Co. Kg Leiterplattenlöthilfe
DE102013105568B4 (en) * 2013-05-29 2017-03-23 Phoenix Contact Gmbh & Co. Kg Leiterplattenlöthilfe

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