JPH02126695A - Connection of electronic component to printed-wiring board - Google Patents
Connection of electronic component to printed-wiring boardInfo
- Publication number
- JPH02126695A JPH02126695A JP27981688A JP27981688A JPH02126695A JP H02126695 A JPH02126695 A JP H02126695A JP 27981688 A JP27981688 A JP 27981688A JP 27981688 A JP27981688 A JP 27981688A JP H02126695 A JPH02126695 A JP H02126695A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- wiring board
- copper foil
- printed wiring
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000011889 copper foil Substances 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000005476 soldering Methods 0.000 abstract description 11
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は電子部品のプリント配線板への接続方法に関し
、より詳細には、フライバンクトランス等の発熱性の高
い電子部品をプリント配線板へ確実に接続する方法に関
する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for connecting electronic components to a printed wiring board, and more specifically, the present invention relates to a method for connecting electronic components to a printed wiring board. Regarding how to connect securely.
従来の技術は第７図に示すように、プリント配線板ｌに
設けた所定の穴２に電子部品４の端子５を挿入した後、
プリント配線板ｌの下面すなはち銅箔３側を溶融したハ
ンダに接触させて、端子５と銅箔３とをハンダ付は接続
していた。しかし、この方法は端子５と銅箔３との相対
する面積が僅かであり、相互を結合するハンダ６の付着
量が少ないため電子部品４の通電による発熱が端子５か
らプリント配線板１に伝導されることによって、端子５
とプリント配線板ｌそれぞれの膨張と、通電休止時にお
ける冷却収縮によるストレスが端子５と銅箔３とを結合
するハンダ６に応力として加わり、長期間の繰り返しに
よる金属疲労のためにハンダ６がリング状に切断して電
子部品の接続不良を発生させる欠点があった。一方、こ
の欠点を軽減するために、スルーホール型のプリント配
線板を使用すればｉＦＩ Ｆｌｆと端子との相対する面
積は大きくなり、端子と銅箔との結合力が増してハンダ
切れの問題を解決することはできるが、スルーホール型
のプリント配線板は高価なものでありこれを使用するこ
とにより機器のコストが大幅に上昇するという問題があ
った。In the conventional technology, as shown in FIG. 7, after inserting the terminal 5 of the electronic component 4 into a predetermined hole 2 provided in the printed wiring board l,
The terminal 5 and the copper foil 3 were connected by soldering by bringing the lower surface of the printed wiring board l, that is, the copper foil 3 side, into contact with the molten solder. However, in this method, the opposing area between the terminal 5 and the copper foil 3 is small, and the amount of solder 6 adhering to each other is small, so heat generated by energizing the electronic component 4 is conducted from the terminal 5 to the printed wiring board 1. Terminal 5
Stress caused by the expansion of the and printed wiring board l and cooling contraction when the current is not applied is applied as stress to the solder 6 that connects the terminal 5 and the copper foil 3, causing the solder 6 to ring due to metal fatigue due to repeated use over a long period of time. It has the disadvantage that it can be cut into pieces, resulting in poor connection of electronic parts. On the other hand, in order to alleviate this drawback, if a through-hole type printed wiring board is used, the opposing area between iFI Flf and the terminal will increase, and the bonding force between the terminal and the copper foil will increase, which will reduce the problem of solder breakage. Although this problem can be solved, there is a problem in that the through-hole type printed wiring board is expensive and its use significantly increases the cost of the equipment.
［発明が解決しようとする課題］
本発明は上記従来の欠点を解決し、ハンダ切れの起きな
い電子部品のプリント配線板への接続方法を提供するこ
とを目的としている。[Problems to be Solved by the Invention] It is an object of the present invention to solve the above-mentioned conventional drawbacks and to provide a method for connecting electronic components to a printed wiring board without causing solder breakage.
（課題を解決するための手段）
上記課題を解決するために本発明では、プリント配線板
に設けられた孔に電子部品の端子を挿入して電子部品を
装着し、前記端子と共にこのプリント配線板の銅箔面を
溶融ハンダと接触させてハンダ付けする電子部品のプリ
ント配線板への接続方法において、前記プリント配ｖＡ
仮の銅箔より突出した前記電子部品の端子に、接続具を
その一端が前記銅箔と当設するように装着し、ハンダ付
けを行った。(Means for Solving the Problems) In order to solve the above problems, in the present invention, a terminal of an electronic component is inserted into a hole provided in a printed wiring board, the electronic component is mounted, and the printed wiring board together with the terminal is mounted. In the method for connecting an electronic component to a printed wiring board in which the copper foil surface of the printed wiring board is soldered by contacting the copper foil surface with molten solder, the printed wiring board A
A connector was attached to the terminal of the electronic component protruding from the temporary copper foil so that one end of the connector was in contact with the copper foil, and soldering was performed.
〔作用］
上記構成によれば、プリント配線板の銅箔面より下側を
溶融したハンダに接触させることによりハンダは濡れと
毛細管現象とにより、端子、銅箔接続具のそれぞれに融
着し、端子の根本においては、端子、ｉＦＩ笛、接続具
の相互を固着し、端子の根本より先端にかけては、端子
と接続具とを固着する。[Function] According to the above configuration, when the lower side of the copper foil surface of the printed wiring board is brought into contact with the molten solder, the solder is fused to each of the terminal and the copper foil connector due to wetting and capillary action, At the base of the terminal, the terminal, the iFI whistle, and the connecting tool are fixed to each other, and from the base to the tip of the terminal, the terminal and the connecting tool are fixed to each other.
（実施例） 以下本発明の実施例を図面を参照しながら説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
１上裏差上
本方法においては、第１図に示すように、プリント配線
板１に電子部品４を装着し、このプリント配線板ｌの下
面即ち、銅箔３より突出している電子部品４の端子５に
、第２図及び第３図に示すような接続具７を装着し、そ
の上端を銅箔３に当設させて第４図の如＜＃ｐＩ笛３よ
り下部を溶融したハンダと接触させることにより接続具
７を介在して銅箔３と端子５をハンダ付けしている。1. In this method, as shown in FIG. Attach the connecting tool 7 as shown in FIGS. 2 and 3 to the terminal 5, put its upper end against the copper foil 3, and connect the lower part from the whistle 3 with molten solder as shown in FIG. By bringing them into contact, the copper foil 3 and the terminal 5 are soldered with the connector 7 interposed therebetween.
この接続具７は、バネ性の薄板を用いて、はぼコ字状ま
たはＣ字状とし、その内接円の径を端子５の径より若干
細く形成すると共に、上端に外側への折り曲げ片８と中
間部に窓９を設けている。This connector 7 is made of a thin spring plate and has a hollow or C shape, the diameter of the inscribed circle is slightly smaller than the diameter of the terminal 5, and the upper end has a piece bent outward. 8 and a window 9 is provided in the middle part.
このようにすれば接続具７を介在して、銅箔３と端子５
のハンダ６による接合力が高まり、ハンダ付けの信頼性
が格段に向上する。In this way, the copper foil 3 and the terminal 5 can be connected to each other via the connecting tool 7.
The bonding force of the solder 6 is increased, and the reliability of soldering is significantly improved.
１Ｌ災濾１
本方法においては、第５図及び第６図に示すように、接
続具７がバネ性の線材にてコイル状に巻回されており、
その上端の内径は端子５の径より大きく、下端の内径は
端子５の径より若干細くしたもので、その他の構成は第
１実施例と同しである。この第２実施例のものでは、線
材が粗目に巻回されているので、溶融したハンダの端子
５への侵入が第１実施例のものより容易である。1L disaster filter 1 In this method, as shown in FIGS. 5 and 6, the connector 7 is wound in a coil shape with a springy wire,
The inner diameter of the upper end is larger than the diameter of the terminal 5, and the inner diameter of the lower end is slightly smaller than the diameter of the terminal 5, and the other configuration is the same as that of the first embodiment. In the second embodiment, since the wire is wound roughly, it is easier for molten solder to enter the terminal 5 than in the first embodiment.
（発明の効果〕
本発明によれば、プリント配線板に電子部品を装着して
ハンダ付けする際に、接続具を上記電子部品の端子へ装
着すると共に、その上端を前記プリント配線板の銅箔に
当設させてハンダ付けを行うので、接続具は端子と銅箔
の双方と接合して端子とＭｆｆａの結合力を格段に高め
、従来方法の欠点であったハンダ切れの危険を避けるこ
とが出来るそして、接続具はバネ性の薄板にてほぼコ字
状またはＣ字状とし、その内接円の径を端子の径より若
干細めに形成すると共に、上端を外側に折り曲げたもの
や、バネ性の線材にて粗いコイル状に巻回して、その上
端は端子の径より太く、下端は端子の径より若干細く形
成したものを用いることによって、端子に装着したまま
ハンダ付は前に運搬等を行っても、接続具の装着状態が
変化すること無く端子及び銅箔の双方に対して充分な接
合面積を持ち、かつ溶融したハンダが容易に接続具の内
側に侵入できる構造であるため、端子と銅箔の双方に強
い接合力を持つことが出来る。(Effects of the Invention) According to the present invention, when mounting and soldering electronic components on a printed wiring board, a connecting tool is mounted on the terminal of the electronic component, and the upper end is connected to the copper foil of the printed wiring board. Since the connecting tool is connected to both the terminal and the copper foil, the bonding strength between the terminal and Mffa is greatly increased, and the risk of solder breakage, which is a disadvantage of the conventional method, can be avoided. The connecting tool is made of a thin springy plate that is approximately U-shaped or C-shaped, and the diameter of the inscribed circle is slightly narrower than the diameter of the terminal, and the upper end is bent outward. By using a coarse wire wound into a rough coil shape, the upper end of which is thicker than the diameter of the terminal, and the lower end slightly thinner than the diameter of the terminal, it is possible to transport the wire while it is attached to the terminal before soldering. Even if the connection tool is installed, the mounting condition of the connection tool does not change, and the structure has a sufficient bonding area for both the terminal and the copper foil, and the structure allows molten solder to easily enter the inside of the connection tool. It can provide strong bonding strength to both the terminal and the copper foil.
第１図は本発明の電子部品のプリント配線板への接続方
法の全体の構成を示す概略説明図、第２図及び第３図は
それぞれ本発明の電子部品のプリント配線板への接続方
法の第１実施例のハンダ付は前の状態を示す要部正面図
及び要部平面図、第４図は本発明の電子部品のプリント
配線板への接続方法の第１実施例のハンダ付は後の状態
を示す要部側断面図、第５図及び第６図はそれぞれ本発
明の電子部品のプリント配線板への接続方法の第２実施
例のハンダ付は前と後の状態を示す要部圧゛面図及び要
部側断面図、第７図は従来例のハンダけ；す後の状態を
示す要部側断面図である。
１・・・プリント配線板、２・・・孔、３・・銅箔、４
・・・電子部品、５・・・端子、７・・接続具、８・・
・折り曲げ片。
特許出願人 株式会社富士通ゼネラル第１図
第２図
第５図
第４図
第６図
第７図FIG. 1 is a schematic explanatory diagram showing the overall configuration of the method for connecting electronic components to a printed wiring board according to the present invention, and FIGS. 2 and 3 respectively illustrate the method for connecting electronic components to a printed wiring board according to the present invention. The soldering of the first embodiment is a front view and a plan view of the main parts showing the front state, and FIG. 4 shows the soldering of the first embodiment of the method for connecting electronic components to a printed wiring board of the present invention after. FIGS. 5 and 6 are side sectional views of the main parts showing the state of soldering before and after soldering of the second embodiment of the method for connecting electronic components to a printed wiring board of the present invention, respectively. FIG. 7 is a side sectional view of the main part showing the state after soldering of the conventional example. 1... Printed wiring board, 2... Hole, 3... Copper foil, 4
...Electronic parts, 5.. Terminals, 7.. Connections, 8..
・Folded piece. Patent applicant Fujitsu General Ltd. Figure 1 Figure 2 Figure 5 Figure 4 Figure 6 Figure 7
Claims (3)
を挿入して電子部品を装着し、前記端子と共にこのプリ
ント配線板の銅箔面を溶融ハンダと接触させてハンダ付
けする電子部品のプリント配線板への接続方法において
、 前記プリント配線板の銅箔より突出した前記電子部品の
端子に、接続具をその一端が前記銅箔と当設するように
装着し、ハンダ付けすることを特徴とする電子部品のプ
リント配線板への接続方法。(1) The terminal of the electronic component is inserted into the hole provided in the printed wiring board, the electronic component is mounted, and the copper foil surface of the printed wiring board is brought into contact with molten solder together with the terminal to solder the electronic component. The method for connecting to a printed wiring board is characterized in that a connecting tool is attached to a terminal of the electronic component protruding from the copper foil of the printed wiring board so that one end thereof is in contact with the copper foil, and soldered. A method for connecting electronic components to a printed wiring board.
字状とし、その内接円の径を前記端子の径より若干細く
形成すると共に、一端に少なくとも１つの外側への折り
曲げ片を有することを特徴とする請求項１記載の電子部
品のプリント配線板への接続方法。(2) The connecting tool is made of a thin spring plate in an approximately U-shape or C shape.
2. The electronic component printed wiring board according to claim 1, wherein the printed wiring board is shaped like a letter, the diameter of its inscribed circle is slightly smaller than the diameter of the terminal, and at one end has at least one bent piece to the outside. How to connect to.
、一端の内径は前記端子の径より太く、他端の内径を前
記端子の径より若干細く形成したことを特徴とする請求
項１記載の電子部品のプリント配線板への接続方法。(3) A claim characterized in that the connecting device is wound into a coil with a springy wire, and the inner diameter of one end is larger than the diameter of the terminal, and the inner diameter of the other end is slightly smaller than the diameter of the terminal. A method for connecting an electronic component according to item 1 to a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27981688A JPH02126695A (en) | 1988-11-05 | 1988-11-05 | Connection of electronic component to printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27981688A JPH02126695A (en) | 1988-11-05 | 1988-11-05 | Connection of electronic component to printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02126695A true JPH02126695A (en) | 1990-05-15 |
Family
ID=17616317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27981688A Pending JPH02126695A (en) | 1988-11-05 | 1988-11-05 | Connection of electronic component to printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02126695A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302289A (en) * | 2008-06-13 | 2009-12-24 | Fujitsu Telecom Networks Ltd | Printed circuit board |
| JP2015106692A (en) * | 2013-12-02 | 2015-06-08 | 株式会社デンソー | Electronic apparatus and manufacturing method of the same |
-
1988
- 1988-11-05 JP JP27981688A patent/JPH02126695A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302289A (en) * | 2008-06-13 | 2009-12-24 | Fujitsu Telecom Networks Ltd | Printed circuit board |
| JP2015106692A (en) * | 2013-12-02 | 2015-06-08 | 株式会社デンソー | Electronic apparatus and manufacturing method of the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02126695A (en) | Connection of electronic component to printed-wiring board | |
| JPH0710973U (en) | Mounting structure of integrated circuit board | |
| JP2961880B2 (en) | Connection method between circuit pattern on one side of printed circuit board and circuit pattern on the other side | |
| JPS5926619Y2 (en) | Connection structure of electronic components | |
| JP3248343B2 (en) | Solder connection method for flexible printed circuit boards | |
| JPH0364876A (en) | Lead terminal fitting to electronic parts | |
| JPH06349561A (en) | Method of soldering lead terminal to wiring board | |
| JPS6188471A (en) | Connector | |
| JPH08162745A (en) | Fixing terminal structure of electronic device | |
| JPH0777285B2 (en) | High current board device | |
| JPH0227575Y2 (en) | ||
| JP2755087B2 (en) | Removable jig | |
| JPH0134291Y2 (en) | ||
| JPS59191360A (en) | Lead frame material for semiconductor device and lead frame as well as assembling for semiconductor device | |
| JPH0758430A (en) | Connection structure of board | |
| JPS6259461B2 (en) | ||
| JPH0732041B2 (en) | Multi-terminal hybrid IC terminal mounting structure | |
| JPS61154101A (en) | Lead mounting of electronic component | |
| JPH0710969U (en) | Printed board | |
| JPH0736476B2 (en) | Method of manufacturing circuit module | |
| JPS58192A (en) | Method of mounting electronic part on printed board | |
| JPH06132448A (en) | External terminal of semiconductor device | |
| JPH08138777A (en) | Method for soldering connector | |
| JPH08222282A (en) | Composite electronic part | |
| JPS62241281A (en) | Pin jack fitting method |