JPH0732041B2 - Multi-terminal hybrid IC terminal mounting structure - Google Patents

Description

The present invention relates to a manufacturing method and a terminal structure of a hybrid IC which requires many terminals for input and output.

[Prior art]

Conventionally, this type of hybrid IC has soldered by reflowing components on the board and soldering input / output terminals at the same time. For this reason, one end of the lead 71 is provided with an inverted bent portion 73 as shown in FIG. 4 (a), the tip end 72 of the lead 71 is brought into contact with the soldering pad 75 substantially perpendicularly, and soldering 76 by reflow is performed. Had been done (see Japanese Utility Model Application No. 61-134856).

Another method of forming the input / output terminals on one side of the board is to form the lead frame 81 in a substantially hat shape as shown in FIG. 4 (b), and insert a notch 84 in a part of the hat to sandwich the board. In this structure, a lead terminal is formed by soldering with a solder dip and then removing the connecting portion 83 (see Japanese Patent Laid-Open No. 62-266856).

[Problems to be Solved by the Invention]

If a hybrid IC requires a large number of input / output terminals, the number of terminals will be insufficient if only one side of the board is connected, and it becomes necessary to provide input / output terminals from both sides of the board. Also, the through-hole pitch of the motherboard on which the hybrid IC is mounted is usually 2.54 mm pitch due to reasons such as strength and workability. Therefore, in order to obtain the connection of the input / output terminals within the mounting range of a certain length, it is necessary to use multiple rows. However, the conventional terminal structure has a problem that it is very difficult to fix a large number of terminals to both surfaces of the substrate by reflow or solder dipping.

The present invention has been made in view of the above problems, and an object thereof is to attach multiple terminals to both surfaces of a substrate of a hybrid IC and fix them by reflow.

[Means for Solving the Problems]

The present invention, when fixing a terminal to a multi-terminal hybrid IC, forms a pair of two comb-shaped multi-terminals, which are alternately bent at different bending positions and connected by a chain portion, and face each other. The pad portion is fixed so as to be sandwiched, and after reflow, the chain portion is cut from the comb-shaped multi-terminal. This forms a zigzag comb-shaped multi-terminal in the hybrid IC.

[Action]

According to the present invention, since a large number of input / output terminals of the hybrid IC are provided, the zigzag lattice multi-terminals are realized by alternately changing the folding positions when the comb-shaped multi-terminals are bent in a stepwise manner. Through-hole pitch of the motherboard is 2.54mm due to the multi-terminal of this houndstooth pattern.
It is intended to realize a multi-terminal structure by maintaining the above-mentioned characteristics and further increasing the number of rows of terminals without impairing the strength and workability.

〔Example〕

FIG. 1 is a perspective view showing an embodiment of the present invention. This is a comb-shaped multiple terminal made by continuous punching and bending of a metal plate,
Alternately change the bending position when bending in a staircase. Terminal 1
Form 2,13. One of the terminals 12 and 13 is connected by the chain portion 11.

The soldering portion 18 fixed to the terminal pad of the board is formed at the opposite end of the chain portion 11. The terminal 12 extends straight from the chain portion 11 to form the required terminal length, and then the first bend 14 (mountain fold)
Then, the second bending 15 (valley fold) is performed to form the soldering portion 18 at the tip. Here, the step difference between the first bend 14 and the second bend 15 becomes the through hole pitch in the column direction of the motherboard.

Next, the terminal 13 is subjected to the first bending 16 (mountain fold) and the second bending 17 (valley fold) immediately from the chain portion 11 to form the necessary terminal length substantially parallel to the chain portion, and then the soldering portion 18 is formed. Set up.

Next, FIG. 2 shows an explanatory view when the multi-terminal 1 according to the present invention is set on the substrate 2.

Two sets of the multi-terminals 1 are set as one set and face each other, and are sandwiched between the fixing portion 43 and the holding portions 41, 42 of the clamp jig 4.
In this state, the solder pads 12 of the multi-terminal 1 are set so as to fit the terminal pads 21 and 22 of the substrate 2. The substrate 2, the multi-terminal 1, and the clamp jig 4 are held by the elastic force of the pressing spring 44 of the clamp jig 4. Therefore, it becomes possible to flow into the reflow device as it is, and the terminal pads 21 and 22 of the substrate 2
And the soldered portion 18 of the multi-terminal 1 are fixed and connected by the solder 3.

FIG. 3 is a terminal assembly process diagram according to the present invention. The terminal assembling process of the present invention will be described with reference to FIG.

First, FIG. 3A shows a printing process of the back surface solder paste. Normally, the solder paste 3 is printed only on the terminal pads 21 of the substrate 2. FIG. 3B is a solder paste printing process on the component mounting surface (front surface). This step is for terminal pad
22. The solder paste 3 is printed on the component pads 23, 24. FIG. 3C shows a component mounting process, in which the components 5 and 6 are mounted. FIG. 3 (d) shows a process of inserting the multi-terminal 1, in which the soldering portion 18 of the multi-terminal 1 held by the clamp jig 4 described in FIG. Set on pads 21 and 22. After the above steps are completed, the components 5 and 6 and the multi-terminal 1 are soldered at the same time by flowing them into a reflow device. Third
The figure (e) shows the central part of the multi-terminal 1 (Fig. 2 X-
The multi-terminal 1 of the 4-row zigzag lattice is completed by cutting to remove the chain portion 11 at the X'line).

〔The invention's effect〕

As described in detail above, according to the present invention, the hybrid IC
It is easy to form the input and output terminals in a zigzag pattern, which enables high-density mounting. Multiple terminals have the same first bending second
Since bending is performed, the ground cutting size for continuous punching and bending can be minimized, and it is easy to obtain high dimensional accuracy. Further, since the terminal assembly is simultaneously reflowed together with the mounted components, the cost of multi-terminal connection is very low, and it is possible to provide a low-cost multi-terminal hybrid IC suitable for high-density mounting.

[Brief description of drawings]

FIG. 1 is a perspective view of a terminal according to the present invention, FIG. 2 is a terminal mounting structure diagram during reflow according to the present invention, FIG. 3 is a terminal assembly process diagram according to the present invention, and FIG. 4 is a conventional terminal assembly. Fig. 1 ... Multi-terminal, 2,7,8 ... Board, 3 ... Solder paste,
4 ... Clamping jig, 11 ... Chain part, 12, 13 ... Terminal, 1
8 …… Soldering part, 21,22 …… Terminal pad.

Claims (1)

[Claims] 1. A terminal mounting structure for a hybrid IC, comprising: a substrate having pads on the front and back surfaces; and a multi-terminal in which a comb-shaped terminal provided with a soldering portion at its tip is alternately bent in a staircase pattern to form a houndstooth check pattern. A terminal mounting structure for a multi-terminal hybrid IC, characterized in that the multi-terminals are faced to each other to form a set, and soldering portions are fixed to front and back pads of the substrate.