JPH04345083A - Printed wiring board for three-dimensional mounting and its manufacture - Google Patents

Abstract

PURPOSE:To easily position a component on the title board. CONSTITUTION:Printed wiring boards 2a, 2b are connected to both sides of a plurality of electronic components 1 arranged in the longitudinal direction in such a way that leads 1b are directed to the same direction while the leads 1b are made to correspond to the printed wiring boards 2a, 2b in their prescribed positions. The individual electronic components 1 are supported by the wiring boards 2a, 2b. Both wiring boards 2a, 2b are supported by a motherboard 3. During their manufacturing process, the plurality of electronic components 1 are arranged in the longitudinal direction by using a positioning jig in such a way that the leads 1b are directed in the same direction; the wiring boards 2a, 2b are soldered from both sides of the plurality of electronic components 1 in a state that the leads 1b are made to correspond to and brought into contact with the wiring boards 2a, 2b in their prescribed positions; the individual electronic components 1 are supported by the wiring boards 2a, 2b; after that, both wiring boards 2a, 2b are supported by the motherboard 3.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for mounting components on a printed wiring board, and more particularly to a three-dimensionally mounted printed wiring board that is three-dimensionally mounted on a printed wiring board, and a method for manufacturing the same.

0002

[Background Art] Currently, there is a strong demand for electronic devices to be smaller, lighter, and faster, and for this reason, there is a need to develop technology for compactly mounting a large number of electronic components on printed wiring boards. has been done. As a technology to meet such demands, for example, as shown in FIG.
A plurality of printed wiring boards 102 mounted with 01 are arranged at a predetermined interval in the board thickness direction, and each printed wiring board 1
02 on another printed wiring board called a motherboard 103 has been proposed and put into practical use.

Further, as a technique for mounting components on a printed wiring board, as shown in FIG.
2, a component insertion type mounting technique in which a through hole 204 corresponding to the lead 201b of the electronic component 201 is formed, and the lead 201b of the electronic component 201 is inserted into the through hole 204 and soldered; and as shown in FIG. , a pad (or land) on the surface of the printed wiring board 302
305 and solder the terminal or lead 301b of the electronic component 301 placed on the surface of the printed wiring board 302 to the pad (or land) 305 (SMT=Surface Mount Tech).
nology) is being implemented.

[0004] In the component insertion type mounting technology, it is necessary to increase the distance between the through holes 204 formed in the printed wiring board 202 beyond a certain value required for strength.
This increases the dimensions of the electronic components 201 and the intervals between the electronic components 201, which is disadvantageous in increasing component mounting density. On the other hand, in SMT, since the spacing between the leads 301b can be reduced, the electronic component 301 can be made smaller, and the component mounting density and circuit density can be increased.

[0005]

However, in these component mounting techniques, since the electronic components 201 or 301 are two-dimensionally arranged at predetermined intervals on the surface of the printed wiring board 202 or 302, each There is a large limit to the number of components that can be mounted on the surface of the printed wiring board 202 or 302, and in order to mount a large number of electronic components 201 or 301, it is necessary to increase the area of the printed wiring board 202 or 302. There remains a big dissatisfaction in trying to miniaturize.

The present invention has been proposed in view of the above-mentioned conventional circumstances, and provides a three-dimensional printed wiring board that further increases the mounting density of the printed wiring board. The purpose of this invention is to provide a method for manufacturing plates accurately and efficiently.

[0007]

[Means for Solving the Problems] In order to achieve the above object, the present invention employs the following means. That is, as shown in FIG. 1, for example, printed wiring boards 2a and 2b are placed on both sides of a plurality of electronic components 1 arranged vertically so that the leads 1b face in the same direction. , 2b are connected in correspondence with each other at predetermined positions so that each electronic component 1 is supported by printed wiring boards 2a, 2b, and both printed wiring boards 2a, 2b are supported by a motherboard 3.

As will be described later, the predetermined positions of the printed wiring boards 2a and 2b are the through holes 4 formed in the printed wiring boards 2a and 2b in the case of through-hole mounting, and in the case of surface mounting, The printed wiring boards 2a, 2b
This is the pad 6 formed in the. This pad 6 may be formed flush with the printed wiring boards 2a, 2b as shown in FIG. 4, or may be formed flush with the printed wiring boards 2a, 2b as shown in FIG.
It may be formed on the lower side of the groove 5 formed on the surface of the groove 2b.

Although various methods of manufacturing the three-dimensional printed wiring board having the above-mentioned configuration can be considered, a method using the positioning jig 50 for positioning the plurality of electronic components is simple. For example, as shown in FIGS. 2 and 3, a plurality of electronic components 1 are placed on a lead 1 using a positioning jig 50
Arrange multiple pieces vertically so that b faces in the same direction,
From both sides of the plurality of electronic components 1, printed wiring boards 2a,
2b are connected to the leads 1b in correspondence with predetermined positions on the printed wiring boards 2a, 2b, and each electronic component 1 is supported by the printed wiring boards 2a, 2b, and both printed wirings are connected to each other. The plates 2a and 2b are supported by the motherboard 3.

As shown in FIG. 2, the positioning jig 50 may be an end of the electronic component 1 or a lead frame 1d protruding from the end of the electronic component 1 at a predetermined interval (FIG. 12). , see FIG. 13) is fitted with a plurality of positioning grooves 9, and as shown in FIG. It is conceivable that the upper surface of each shelf board 11 is provided with a lead positioning groove 13 for positioning the lead 1b of the electronic component 1 placed on the shelf board 11.

As another method for manufacturing a three-dimensional printed wiring board, as shown in FIG. 9(a), a plurality of electronic components 1 are arranged vertically, and each electronic component is After inserting the lead 1b on one side of the lead 1b into the through hole 4 of the printed wiring board 2a and bending the tip of the lead 1b protruding from the back surface of the printed wiring board 2a as shown in FIG. 9(b), The printed wiring board 2a is laid down, the electronic component 1 is suspended and supported on the printed wiring board 2a, and the leads 1b on one side are soldered to the printed wiring board 2a,
After that, as shown in FIG. 9(c), another printed wiring board 2b is placed on the other side of each electronic component 1, and the through hole 4 formed in this printed wiring board 2b is inserted into the other side of each electronic component 1. There is a method in which the leads 1b are inserted and soldered, and then both printed wiring boards 2a and 2b are supported by the motherboard 3.

Further, as shown in FIG. 10, a support tape 1 is attached to the outer surface of one of the two printed wiring boards 2a, 2b.
0, and by inserting the leads 1b on one side of the plurality of electronic components 1 into the through holes 4 of the printed wiring board 2a and through the support tape 10, After supporting a plurality of electronic components 1, the printed wiring board 2a is laid down and the electronic components 1 are suspended and supported on the printed wiring board 2a, and the leads 1b on one side and the leads on the other side of each electronic component 1 are connected. 1b into the through hole 4 of another printed wiring board 2b, then peel off the support tape 10, and connect the leads of each electronic component 1 with both printed wiring boards 2a, 2b supporting each electronic component 1. 1
There is also a method in which the electronic components 1 are soldered to the through-holes 4 of both printed wiring boards 2a and 2b, and both printed wiring boards 2a and 2b to which each electronic component 1 is soldered are supported by the motherboard 3.

[0013]

[Function] In the three-dimensional mounted printed wiring board of the present invention, a plurality of vertically arranged electronic components 1 are connected to a motherboard 3 via a pair of printed wiring boards 2a and 2b arranged laterally. Therefore, the number of components arranged relative to the area of the motherboard 3 increases, and the component mounting density increases dramatically.

Furthermore, according to the method for mounting a three-dimensional printed wiring board using the positioning jig 50 of the present invention, the leads 1b of the printed wiring boards 2a and 2b and the printed wiring board 2a
, 2b with the through hole 4 (or the positional relationship between the lead 1b and the pad 6), and insert the lead 1b into the through hole 4 (or insert the lead 1b into the through hole 4).
b) is made extremely easy. In particular, each shelf board 11 of the positioning jig 50 as shown in FIG.
When a lead positioning groove 13 for positioning the lead 1b of the electronic component 1 placed on the shelf board 11 is provided on the top surface, bending of the lead 1b can be corrected, so that more accurate and speedy work can be performed.

Furthermore, in the three-dimensional mounting method for electronic components of the present invention shown in FIG.
After inserting the leads 1b into the through holes 4 of the printed wiring board 2a on one side and bending the tips of the leads 1b on the one side that protrude from the printed wiring board 2a to the side opposite to the package body 1a, the printed wiring board 2a is laid down and the electronic component 1 is suspended and supported on the printed wiring board 2a,
Each electronic component 1 hangs down in parallel due to its own weight. In this state, the leads 1b on one side are soldered to the printed wiring board 2a, so that the leads 1b on the other side of each electronic component 1 are fixed to the printed wiring board 2a in parallel alignment. Therefore, after this, the tips of the leads 1b on the other side of the electronic component 1 can be aligned and inserted into the through holes 4 of the other printed wiring board 2b all at once, thereby improving work efficiency.

In addition, in another three-dimensional mounting method for electronic components according to the present invention shown in FIG. 10, the electronic component 1 can be held. Therefore, the tip of the lead 1b on the other side of the electronic component 1 can be connected to another printed wiring board 2.
They can be aligned and inserted all at once into the through-holes 4 of b, improving work efficiency. After this, each lead 1b of each electronic component 1 is connected to both printed wiring boards 2a.
, 2b are soldered all at once by, for example, a reflow bonding method, which further improves work efficiency.

[0017]

[Example] Fig. 1(a) is an exploded perspective view of a three-dimensionally mounted printed wiring board according to the present invention, Fig. 1(b) is an external perspective view of a three-dimensionally mounted printed wiring board, and Fig. 1(c) is a three-dimensionally mounted printed wiring board. FIG. 3 is a side view of the mounted printed wiring board attached to the motherboard. A printed wiring board 2 is placed on both sides of a plurality of electronic components 1 arranged vertically so that the leads 1b face in the same direction.
a, 2b to the above lead 1b and printed wiring boards 2a, 2.
Each electronic component 1 is supported by printed wiring boards 2a, 2b by connecting them to predetermined positions of b, and both printed wiring boards 2a, 2b are supported by a motherboard 3.

In the case of through-hole mounting, the above-mentioned predetermined position is the through hole 4 formed in the printed wiring boards 2a, 2b, and in the case of surface mounting, it is the through hole 4 formed in the printed wiring board 2a, 2b. This is pad 6. FIG. 2 shows an example of the manufacturing process of this three-dimensional printed wiring board. First, a positioning jig 50 is used here to position the electronic components. This positioning jig 50 is provided with a plurality of positioning grooves 9 at predetermined intervals, and has a plurality of T-SOP (Thin-Small Outline
An end portion (or a lead frame 1c, which will be described later) protruding from the end portion, of a package main body 1a of an electronic component 1 consisting of an electronic component 1 is fitted into the positioning groove 9. Thereby, each electronic component 1 is positioned at a predetermined pitch and arranged in large numbers.

[0019] At this stage, the final vertical direction is now the horizontal direction. In this way, with each electronic component 1 arranged, the leads 1b of each electronic component 1 are simultaneously aligned with the through holes 4 of a pair of printed wiring boards 2a and 2b from both sides, and the printed wiring of the pair is The plates 2a and 2b can be inserted, improving work efficiency. Note that this positioning jig 50 can be removed after the leads 1b of each electronic component 1 are supported by the pair of printed wiring boards 2a, 2b.

[0020] Also, the leads 1b of each electronic component 1 are
After supporting the pair of printed wiring boards 2a and 2b, each lead 1b is connected to the corresponding through hole 4 at the same time as in the previous example.
After soldering, both printed wiring boards 2a and 2b may be supported by the motherboard 3. Next, Figure 3(a)
The positioning jig 50 shown in FIG.
A lead positioning groove 13 for positioning the lead 1b of the electronic component 1 placed on the electronic component 1 is formed.

In this embodiment, the leads 1b of each electronic component 1 are bent into a crank shape, so that the planar shape of the lead positioning groove 13 is the same as the planar projection of the leads 1b. Further, the depth of the lead positioning groove 13 is not particularly limited, but it needs to be deep enough to prevent the lead 1b fitted therein from moving in the horizontal direction. For the positioning jig 50 configured in this way, each shelf board 11
Place each electronic component 1 on top and connect the lead 1b of each electronic component 1.
By fitting the leads into the lead positioning grooves 13, each electronic component 1 is positioned and supported by the positioning jig 50. Then, as shown in FIG. 3(b), the printed wiring boards 2a and 2b are brought together sequentially or simultaneously from both sides, and each electronic component 1
The leads 1b can be aligned and inserted into the through holes 4 of each printed wiring board 2a, 2b all at once, thereby improving work efficiency.

Similar to the previous example, this positioning jig 50 also has the following features:
It can be removed after the leads 1b of each electronic component 1 are supported by the pair of printed wiring boards 2a, 2b. Further, after the leads 1b of each electronic component 1 are supported by the pair of printed wiring boards 2a and 2b, each lead 1b is simultaneously soldered to the corresponding through hole 4 as in the example shown in FIG. Then both printed wiring boards 2b,
2b may be supported by the motherboard 3.

By the way, in conventional two-dimensional component mounting, in order to increase the packaging density, components are miniaturized and surface mounting techniques that do not use through holes are widely used. The objectives and techniques described above should of course also be utilized for this three-dimensional implementation. When applying surface mounting technology to three-dimensional component mounting, first, as shown in FIG.
A pad 6 corresponding to each lead 1b (or terminal) is formed. Each electronic component 1 is connected to a positioning jig 50 as shown in FIGS. 2 and 3 above (in particular, when using a positioning jig 50 equipped with a lead positioning groove 13 as shown in FIG. 3, the positioning groove 9 is unnecessary). Each positioning groove 9 or shelf board 11
It is located at and positioned at. In this state, the tip of each lead 1b is brought into contact with the corresponding pad 6, and the tip of each lead 1b is brought into contact with the corresponding pad 6.
), it is soldered using the reflow bonding method. Here, the shape of each lead 1b of each electronic component 1 is not particularly limited, but in order to improve the contact efficiency with the pad 6, for example, as shown in FIG. For example, as shown in FIG. 6, it may be formed into a T-shape having a flat surface 1c, or it may be formed into a coil spring shape, for example, as shown in FIG. That is advantageous. In this embodiment, as in the above-mentioned embodiment, the component mounting density can be dramatically increased, and by employing the reflow bonding method as the soldering method, the soldering workability can be improved.

FIGS. 8(a) and 8(b) show another embodiment of the present invention in which surface mounting technology is applied. Mutually opposing surfaces of each printed wiring board 2a, 2b (
As shown in FIG. 8(b), a plurality of grooves 5 are formed in parallel in the vertical direction, and pads 6 corresponding to the leads 1b of each electronic component 1 are formed on the lower groove side surface of each groove 5. . The leads 1b of each electronic component 1 can be bent into a crank shape if necessary, and are placed on the corresponding pads 6 and soldered by, for example, a reflow bonding method.

In this embodiment as well, the electronic component 1 is initially shown in FIG.
, the leads 1b of the electronic component 1 are arranged using a positioning jig 50 as shown in FIG. This makes it easy to maintain the position of the electronic component 1 during soldering, and by adopting the reflow soldering method as the soldering method, the position of the electronic component 1 can be easily maintained during soldering. Defects such as misalignment, short-circuiting, and non-bonding are less likely to occur, and the workability of soldering can be improved.

FIG. 9 is a process diagram showing another embodiment of the present invention. A through hole 4 corresponding to each lead 1b is formed in each printed wiring board 2a, 2b, and each lead 1b of each electronic component 1 is inserted into the corresponding through hole 4. After that, as shown in FIG. 9(a), the tip of each lead 1b on one side protruding from the outside of the printed wiring board 2a, that is, the side opposite to the package body 1a, is bent into an L-shape. ), lay the printed wiring board 2a horizontally and place each electronic component 1 on the printed wiring board 2a.
In a state in which is suspended and supported, each lead 1b on one side is soldered to the through hole 4 by, for example, reflow soldering.

[0027] As a result, each electronic component 1 is fixed to one printed wiring board 2a in a parallel state, and the other printed wiring board 2a is placed horizontally below it, as shown in Fig. 9(c). The tips of the leads 1b on the other side of each electronic component 1 are aligned and inserted into the through hole 4 of the printed wiring board 2b at the same time. Furthermore, after this, the leads 1b on the other side of each electronic component 1 are soldered to each through hole 4 of the lower printed wiring board 2b by, for example, a reflow bonding method. According to this, there is an advantage that positioning can be performed without using the positioning jig 50.

In this embodiment, each electronic component 1 is suspended and supported on the printed wiring board 2a by inserting the lead 1b into a through hole 4 of one printed wiring board 2a and bending the tip end of the lead 1b. However, for example, FIG. 10(a)
As shown in FIG. 2, a support tape 10 is attached to the outside of one printed wiring board 2a, and leads 1b are attached to this support tape 10.
As shown in FIG. 10(b), each electronic component 1 is configured to be suspended and supported on one printed wiring board 2a by the frictional force acting between the support tape 10 and the lead 1b. It is also possible. In this case, each lead 1b on the other side of each electronic component 1 suspended on one printed wiring board 2a is connected to the through hole 4 of the other printed wiring board 2b.
After the leads 1b are inserted through the through holes 4 of both printed wiring boards 2a and 2b, each lead 1b can be simultaneously soldered to the through holes 4 of both printed wiring boards 2a and 2b by, for example, a reflow bonding method, thereby simplifying the soldering work. Note that the support tape 10 may be removed as soon as there is no longer a risk that each electronic component 1 will be misaligned with respect to both printed wiring boards 2a, 2b. For example, it is only necessary to insert the leads 1b of each electronic component 1 into the through holes 4 of both printed wiring boards 2a and 2b.

The three-dimensional printed wiring board formed as described above has a large number of stud pins 14 implanted in one end of each printed wiring board 2a, 2b, as shown in FIG. 1(b). By inserting these stud pins 14 into the stud holes 15 of another printed wiring board called the motherboard 3, both printed wiring boards 2a and 2b are connected to the motherboard 3, as shown in FIG. 1(c).
The internal circuits of each electronic component 1 are supported by the internal circuits of both printed wiring boards 2a and 2b, and the stud pins 14.
and is electrically connected to the circuit of the motherboard 3 via the stud hole 15. In addition, both printed wiring boards 2a, 2
b can also be surface mounted on the motherboard 3. At this time, as shown in FIG. 11, terminals 14 provided at the lower ends of each printed circuit board 2a, 2b and pads 15 provided on the motherboard 3 may be soldered. This allows three-dimensional mounting on both sides of the motherboard, allowing for higher density mounting.

In the embodiment shown in FIG. 2, the package 1a of the electronic component 1 is supported by the positioning jig 50. For example, as shown in FIG. The lead frame 1d may be structured to protrude in a T-shape from both the front and rear ends of the main body 1a, and the lead frame 1d may be inserted into the positioning groove 9. As shown in FIG. 13, this T-shaped lead frame 1d is initially formed integrally with the leads 1b, and the terminals of the electronic element 1f are connected to the corresponding leads 1b with bonding wires 1g, and then placed in a protective resin. After molding,
The unnecessary parts outside the range shown by the two-dot chain line in FIG. 12 are cut off.

[0031]

As explained above, the three-dimensionally mounted printed wiring board according to the present invention has the effect of further increasing component mounting density. If a positioning jig is used when assembling these three-dimensionally mounted printed wiring boards, it is possible to position a pair of printed wiring boards from both sides of the electronic component, reducing positioning time and increasing the efficiency of mounting work. . Furthermore, if a positioning jig is used that has lead positioning grooves on the shelf board on which the electronic components are placed, the lead positions will be accurate, which has the effect of allowing even more accurate and rapid component positioning.

[0032] When surface mounting technology is applied to the present invention, there is an effect that the entire printed wiring board can be miniaturized. In particular, forming a pad on the bottom surface of a groove formed in a printed wiring board has the effect of making it easier to hold components during the manufacturing process. Furthermore, the three-dimensional mounting method for electronic components according to the present invention bends the leads on one side of each electronic component, suspends the electronic component from one printed wiring board, and solders the electronic component in parallel. Since they are positioned and fixed to one printed wiring board, the leads on the other side of the electronic component can be aligned and inserted all at once into the through holes of the other printed wiring board, which requires the use of a special positioning jig. Therefore, it is possible to improve the workability of assembling each electronic component onto a printed wiring board. In addition, after this, by soldering the leads on both sides of each electronic component to the through holes of both printed wiring boards at the same time using, for example, reflow soldering, it is possible to prevent misalignment of each electronic component during soldering. It is possible to prevent this, and also to simplify the soldering work and to improve the workability.

[Brief explanation of the drawing]

FIG. 1 is a conceptual diagram of a three-dimensionally mounted printed wiring board according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram showing a manufacturing process of a three-dimensionally mounted printed wiring board according to an embodiment of the present invention to which insertion mounting is applied.

FIG. 3 is a conceptual diagram showing a manufacturing process of a three-dimensionally mounted printed wiring board according to an embodiment of the present invention to which insertion mounting is applied.

FIG. 4 is a partially detailed view of another embodiment of the present invention to which surface mounting is applied.

FIG. 5 is a detailed diagram of the electrode structure of the present invention to which surface mounting is applied.

FIG. 6 is a detailed diagram of the electrode structure of the present invention to which surface mounting is applied.

FIG. 7 is a detailed diagram of the electrode structure of the present invention to which surface mounting is applied.

FIG. 8 is a partial detailed view of another embodiment of the present invention to which surface mounting is applied.

FIG. 9 is a flow diagram of another embodiment of the present invention applying insertion implementation.

FIG. 10 is a flow diagram of another embodiment of the present invention applying insertion implementation.

FIG. 11: Conceptual diagram of another embodiment of the present invention

FIG. 12 is a conceptual diagram of an electronic component used in the present invention.

FIG. 13 is a conceptual diagram of a method for manufacturing the electronic component shown in FIG. 11;

FIG. 14 is an explanatory diagram of conventional surface mounting technology.

FIG. 15 is an explanatory diagram of conventional surface mounting technology.

FIG. 16 is an explanatory diagram of conventional surface mounting technology.

[Explanation of symbols]

1 Electronic parts 1a Package body 1b lead 1d Lead frame 2a Printed wiring board 2b Printed wiring board 3. Motherboard 4 Through hole 5 Groove 6 Pad 9 Positioning groove 10 Support tape 11 Shelf board 13 Lead positioning groove 50 Positioning jig

Claims (10)

[Claims] 1. Printed wiring boards (2a) and (2b) are placed on both sides of an electronic component (1) in which a plurality of electronic components (1) are arranged vertically so that the leads (1b) face in the same direction.
) and printed wiring boards (2a), (2b) at predetermined positions in correspondence, each electronic component (1) is supported by the printed wiring boards (2a), (2b), and both printed wiring boards ( 2a), (2b) on the motherboard (3
) A three-dimensional mounted printed wiring board characterized by being supported by. Claim 2: The printed wiring boards (2a), (2b)
) is located at the predetermined position of the printed wiring board (2a), (2
b) is a through hole (4) formed in both printed wiring boards (2a) and (2b), and the plurality of electronic components (
1) The three-dimensional printed wiring board according to claim 1, wherein the lead (1b) is inserted and mounted. Claim 3: The printed wiring board (2a), (2
The predetermined position of b) is the printed wiring board (2a), (2
b), and the plurality of electronic components (1) are mounted on both printed wiring boards (2a) and (2b).
The three-dimensionally mounted printed wiring board according to claim 1, wherein the leads (1b) are surface mounted. 4. The three-dimensional printed wiring according to claim 3, wherein the pad (6) is formed on the lower surface of a groove (5) formed on the surface of the printed wiring board (1). Board. 5. A plurality of electronic components (1) are arranged vertically using a positioning jig (50) so that the leads (1b) face in the same direction, and the plurality of electronic components (
1) Printed wiring boards (2a), (2b) from both sides of
), the lead (1b) and the printed wiring board (2a),
Connect each electronic component (1) to the printed wiring board (2b) by soldering it in contact with the specified position of
2a), (2b), and then both printed wiring boards (2a), (2b) are supported by a motherboard (3). 6. The positioning jig (50) includes an electronic component (1) at an end of the electronic component (1) at a predetermined interval, or a lead frame (from which the electronic component (1) protrudes from the end).
6. The method for manufacturing a three-dimensionally mounted printed wiring board according to claim 5, comprising: a plurality of positioning grooves (9) into which the wires 1d) are inserted. 7. The positioning jig (50) includes a plurality of shelf boards (11) arranged in parallel at predetermined intervals;
The tertiary device according to claim 5, further comprising a lead positioning groove (13) on the upper surface of each shelf board (11) for positioning the lead (1b) of the electronic component (1) placed on the shelf board (11). A method for manufacturing an original printed wiring board. 8. A T-shaped lead frame (1d) that is fitted into the positioning groove (9) of the positioning jig (50).
) is formed on a side surface perpendicular to the side surface from which the lead (1b) of the package body (1a) of the electronic component (1) projects. 9. A plurality of electronic components (1) are arranged vertically in a state where the plurality of electronic components (1) are vertically arranged.
1) Connect the leads (1b) on one side to the printed wiring board (2).
After inserting the lead (1b) into the through hole (4) in a) and bending the tip of the lead (1b) that protrudes from the back side of the printed wiring board (2a), lay the printed wiring board (2a) horizontally and remove the printed wiring board (2a). The electronic components (1) are suspended and supported on the printed wiring board (2a), the leads (1b) on one side are soldered to the printed wiring board (2a), and then each electronic component (1) is
Another printed wiring board (2b) is placed on the other side, and a through hole (4) formed in this printed wiring board (2b)
Insert and solder the leads (1b) on the other side of each electronic component (1), and then connect both printed wiring boards (2a).
), (2b) are supported by a motherboard (3). [Claim 10] A pair of two printed wiring boards (2a)
, (2b), and attach a support tape (10) to one of the outer surfaces of the electronic components (1).
1) Insert the leads (1b) on one side into the through holes (4) of the printed wiring board (2a) and pass through the support tape (10) while the leads (1b) are arranged vertically. After supporting it on the board (2a), the printed wiring board (2a) is laid down and the electronic component (1) is suspended and supported on the printed wiring board (2a), and the leads (1b) on one side are connected to each other. Insert the lead (1b) on the other side of the electronic component (1) into the through hole (4) of another printed wiring board (2b), then peel off the support tape (10) and connect both printed wiring boards (2a). ), (2b) with each electronic component (1) supported, connect the leads (1b) of each electronic component (1) to both printed wiring boards (2a), (2b).
) to the through holes (4) of each electronic component (
1) Both printed wiring boards (2a) to which are soldered,
(2b) is supported by a motherboard (3). A method for producing a three-dimensional printed wiring board.