JPS6130745B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a semiconductor device, and particularly aims to improve mass productivity and reliability.

As a conventional method for manufacturing a semiconductor device, for example, the method shown in FIG. 1 is known. In this method, as shown in FIGS. 1A to 1D, first, a plurality of circuit boards 1
Each component 2 is mounted on the substrate by, for example, a solder printing method or a reflow method using a substrate depth. 3 is a terminal portion of the wiring pattern. On the other hand, a predetermined jig 4 is prepared in advance in which a plurality of terminal pins 5 are arranged at equal intervals so as to correspond to each circuit board 1. In this state, each terminal pin 5 is soldered to the terminal portion 3 of the respective circuit board 1, and then resin molding is performed. 6 is solder. However, the hybrid integrated circuit manufactured by such a method has a drawback that the thermal strength of the terminal pins 5 is weak. That is, the hybrid integrated circuit obtained in this way is then mounted on a motherboard such as a printed circuit board by soldering to obtain a desired semiconductor device, but the soldering heat at this time causes the terminals in the hybrid integrated circuit to The solder between the pin 5 and the terminal portion 3 melts, causing problems such as the terminal pin being displaced. In order to overcome this drawback, it is conceivable to use high-temperature solder as the solder used to connect the terminal pins 5 and terminal portions 3 in the hybrid integrated circuit, but high-temperature solder has the disadvantage that it is troublesome to handle. Furthermore, the conventional method described above is not suitable for mass production and inevitably increases costs.

In view of the above-mentioned points, the present invention provides a method for manufacturing a semiconductor device that eliminates the conventional drawbacks, enables mass production, and improves reliability.

An example of the present invention will be described below with reference to FIG. In the figure, reference numeral 1 denotes a circuit board, and each terminal portion 3 of the circuit board, on which a desired pattern of wiring is formed on one surface of an insulating substrate such as an alumina substrate or a glass epoxy substrate, extends to one side of the substrate. In the present invention, first, as shown in FIGS. 2A and A', a plurality of terminal pins 8 are made of phosphor bronze with a thickness of 0.2 to 0.4 mm, are arranged in one direction for a predetermined period of time, and each end is connected. A comb-shaped lead frame 7 connected at a portion 9 is provided. As shown in FIGS. 3A and 3B, the free end 8a of each terminal pin 8 is formed into a so-called clip structure so that it can be held by claws 10a, 10b on both sides and a center claw 10c. A plurality of circuit boards 1 are attached to this lead frame 7 so that the terminal portions 3 of the boards are clamped onto the free ends 8a of the terminal pins 8. The circuit board 1 may be fitted onto the terminal pins 8 one by one by an automatic machine, or a plurality of circuit boards 1 may be fitted simultaneously. Furthermore, in this case, as will become clear later, one terminal pin among the plurality of terminal pins connected to each circuit board is an unnecessary pin and is used to support the circuit board during post-processing. It is not connected to the terminal section 3.

Next, in order to solder each terminal portion 3 of the board to the free end 8a of each terminal pin 8, flux is applied to that portion to form a solder depth. 11 is solder. (Fig. 2 B and B') Next, among the soldered terminal pins, one of the terminal pins 8 connected to the terminal part 3, for example, the terminal pin 8N, and an unnecessary terminal pin that is not connected to the terminal part 3. Leave 8M and connect the other terminal pins 8 to the connecting part 7.
Cut and separate electrically and mechanically. In this case, each circuit board 1 has two terminal pins 8N and 8M.
It is stably supported by Further, the remaining terminal pins 8N are at the same position on each circuit board 1, that is, they are terminal pins to which the same potential, for example, the ground potential is applied. In this state, predetermined components 2 are mounted on each circuit board 1 (FIG. 2C).

After mounting the parts 2, an operation check is performed on each circuit board. In this case, since only one necessary terminal pin 8N on each circuit board 1 is commonly connected to each other via the connecting portion 7, this connecting portion 7
By using this, it is possible to easily check the operation. Further, since the mounting of the component 2 and the operation check can all be performed by determining the position by the pitch of the terminal pins 8, automation is facilitated by utilizing the equally pitched through holes h provided in the lead frame 7.

Next, each circuit board 1 is molded with a resin mold 12 together with the component 2, and the remaining terminal pins 8N and 8M are cut from the connecting portion 7 to obtain a hybrid integrated circuit 13 (FIG. 2D).

Furthermore, the hybrid integrated circuit 13 thus obtained is mounted on a motherboard such as a printed circuit board. That is, as shown in FIG. 4A, the terminal pin 8M, which was used to support the circuit board 1 and is no longer needed, is bent at a substantially right angle from a predetermined length, and in that state, as shown in FIG. 4B. Each terminal pin 8 of the hybrid integrated circuit 13 is inserted into each insertion hole 15 of the motherboard 14. At this time, the hybrid integrated circuit is held at a predetermined position from the surface of the motherboard 14 by the bent unnecessary terminal pins 8M, and any further terminal pins 8M
This prevents excessive insertion of the terminal pins, and also prevents the hybrid integrated circuit 13 from falling due to the bent portions of the unnecessary terminal pins. Furthermore, incorrect insertion into other insertion holes is prevented. Therefore, if soldering is performed in this state, the hybrid integrated circuit 13 can be mounted on the motherboard 14 satisfactorily. In addition, as shown in FIG. 5, the unnecessary terminal pins 8M may be cut to a predetermined length to prevent incorrect insertion and over-insertion. Furthermore, as shown in FIG. It is also conceivable that the unnecessary terminal pin 8M is cut into a predetermined shape and inserted into the hole 16. In this way, the desired semiconductor device is obtained.

According to the present invention described above, the reliability of the terminal pins 8 in a semiconductor device is improved, and such semiconductor devices can be mass-produced. That is, the terminal pin 8 has a clip structure and is attached to the terminal portion 3 of the circuit board 1.
Since the hybrid integrated circuit is sandwiched and soldered thereon, heat resistance is improved when the hybrid integrated circuit is subsequently mounted on the motherboard 14 by soldering, and the heat during soldering can cause the terminal pin 8 of the hybrid integrated circuit to Part 3
The connection relationship between them will not shift. Furthermore, since the entire series of steps can be automated using the lead frame 7 as a carrier, mass production can be achieved and costs can be reduced.
Furthermore, since it is possible to check the operation of the parts after mounting them, mass production and automation are further facilitated.

[Brief explanation of the drawing]

Figures 1 A to D are process diagrams showing the conventional manufacturing method, Figure 2
Figures A to D are process diagrams showing an example of the manufacturing method according to the present invention, Figures 2 A' and B' are sectional views of Figures 2 A and B, respectively, and Figures 3 A and B are examples of the terminal pin of the present invention. An enlarged plan view and a side view thereof, FIGS. 4A and B
5 is a process diagram for mounting the hybrid integrated circuit obtained according to the present invention on a motherboard, and FIGS. 5 and 6 are perspective views showing other examples of mounting the hybrid integrated circuit on a motherboard, respectively. 1 is a circuit board, 2 is a component, 7 is a lead frame, and 8 is a terminal pin.

Claims (1)

[Claims] 1. A method for manufacturing a semiconductor device in which a hybrid integrated circuit is attached to a motherboard, comprising: a comb-shaped lead frame in which a plurality of terminal pins are connected at one end via a connecting portion; a step of connecting a plurality of circuit boards to the circuit board; a step of separating the other terminal pins from the connecting portion, leaving at least two terminal pins corresponding to each of the circuit boards; and utilizing the connecting portion. a step of performing an operation check on the circuit board on which the components are mounted; a step of separating the remaining at least one terminal pin from the connecting portion; and a step of electrically connecting the circuit board with the circuit board. A method for manufacturing a semiconductor device, comprising: positioning a hybrid integrated circuit made of the circuit board with respect to a motherboard using at least one terminal pin that is not connected to the circuit board; and mounting the hybrid integrated circuit on the motherboard.