JPH0538772U - Electronic component terminal mounting structure - Google Patents

Electronic component terminal mounting structure

Info

Publication number
JPH0538772U
JPH0538772U JP9585091U JP9585091U JPH0538772U JP H0538772 U JPH0538772 U JP H0538772U JP 9585091 U JP9585091 U JP 9585091U JP 9585091 U JP9585091 U JP 9585091U JP H0538772 U JPH0538772 U JP H0538772U
Authority
JP
Japan
Prior art keywords
circuit board
terminal
electronic component
flat portion
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9585091U
Other languages
Japanese (ja)
Inventor
薫明 渡辺
朝海 樋浦
嘉千安 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP9585091U priority Critical patent/JPH0538772U/en
Publication of JPH0538772U publication Critical patent/JPH0538772U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】回路基板10の対向する二側面に複数の端子20を
取付けてなる電子部品において、回路基板10への端子20
の取付けを容易にして生産性を向上させる。 【構成】導体を被着した半円状の凹部12を回路基板10の
二側面に形成し、端子20の先端には平面部21とこの平面
部21からほぼ垂直に切り起こした舌片22を設け、凹部12
の一端部を端子20の平面部21の上に載置し、舌片22を半
円状の凹部12内に位置させて、それぞれの端子20を回路
基板10に取付ける。 【効果】1本のリードフレーム25の上に回路基板10を一
方向から載置するだけで端子20を回路基板10に位置決め
しながら装着できるので、製造工程が簡略化され自動機
による組立も容易になる。
(57) [Abstract] [Purpose] In an electronic component in which a plurality of terminals 20 are attached to two opposite side surfaces of the circuit board 10, the terminals 20 to the circuit board 10
To facilitate installation and improve productivity. [Structure] A semicircular recess 12 having a conductor is formed on two side surfaces of a circuit board 10, and a flat portion 21 and a tongue piece 22 cut and raised from the flat portion 21 are formed at the tip of the terminal 20. Provided and recessed 12
One end of each is placed on the flat surface portion 21 of the terminal 20, the tongue piece 22 is positioned in the semicircular recess 12, and each terminal 20 is attached to the circuit board 10. [Effect] The terminal 20 can be mounted while positioning it on the circuit board 10 simply by mounting the circuit board 10 on one lead frame 25 from one direction, which simplifies the manufacturing process and facilitates assembly by an automatic machine. become.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、回路基板の対向する二側面に端子を取付けた電子部品の端子取付構 造に関するものである。 The present invention relates to a terminal mounting structure for an electronic component in which terminals are mounted on two opposite side surfaces of a circuit board.

【0002】[0002]

【従来の技術とその課題】[Prior art and its problems]

従来の電子部品には、図1に示すように端子1の先端を二股に成形し、回路基 板2をこの二股部分で挟持するようにして端子1を装着したものがある。 しかし、このような構造では、端子1を回路基板2の両側に取付ける作業が面 倒になる欠点があった。すなわち、回路基板2への端子1の取付けは、図1のよ うに端子1を連結した形の2本のリードフレーム3を回路基板2に対し両側から 互いに近づけて二股部分で回路基板2を挟まなくてはならない。このため、組立 工程が複雑で生産性が低下する欠点があった。 As a conventional electronic component, as shown in FIG. 1, the tip of a terminal 1 is formed into a bifurcated shape, and the terminal 1 is mounted so that the circuit board 2 is sandwiched between the bifurcated portions. However, such a structure has a drawback that the work of mounting the terminals 1 on both sides of the circuit board 2 is troublesome. That is, in order to attach the terminal 1 to the circuit board 2, the two lead frames 3 in which the terminals 1 are connected as shown in FIG. Must-have. Therefore, the assembly process is complicated and the productivity is reduced.

【0003】[0003]

【考案の目的】[The purpose of the device]

本考案は、回路基板の対向する二側面に複数の端子を取付けてなる電子部品に おいて、回路基板への端子の取付けを容易にして生産性を向上させることを目的 とするものである。 An object of the present invention is to improve productivity by facilitating attachment of terminals to a circuit board in an electronic component in which a plurality of terminals are attached to two opposite side surfaces of the circuit board.

【0004】[0004]

【課題を解決するための手段】[Means for Solving the Problems]

本考案の端子取付構造は、導体を被着したほぼ半円状の凹部を回路基板の二側 面に形成し、各々の端子の先端には平面部とこの平面部からほぼ垂直に切り起こ した舌片を設け、凹部の一端部側を端子の平面部の上に載置し、舌片を凹部内に 位置させて、それぞれの端子を回路基板に取付けた構成を特徴とする。 In the terminal mounting structure of the present invention, a substantially semicircular recess having a conductor attached is formed on the two side surfaces of the circuit board, and a flat portion is formed at the tip of each terminal and is cut and raised substantially vertically from the flat portion. The present invention is characterized in that a tongue is provided, one end of the recess is placed on the flat surface of the terminal, the tongue is positioned in the recess, and each terminal is attached to the circuit board.

【0005】[0005]

【実施例】【Example】

図2に、本考案による端子取付構造を適用した電子部品の一実施例を示す。実 際には、回路基板10の表面に導体パターンが設けられたり、回路基板10の上に種 々の回路素子が実装されることになるが、図ではこれらを省略し、要部のみを図 示してある。 回路基板10の対向する二側面には、図3から明らかなように、半円形に切り欠 き、その内側から回路基板10の表裏に至る部分まで導体11を被着した半円状の凹 部12を形成してある。このような回路基板10は、図4のように一枚の母基板15か らスルーホール16の中央を切断して複数枚の回路基板10を切り出すことによって 簡単に得られる。図4における一点鎖線が切断部分を示している。 一方、端子20の先端には、図5に示すように平面部21と、平面部21から垂直に 切り起こした舌片22を設けてある。端子20の舌片22が凹部12の中に挿入され、凹 部12の一端部の導体11が端子20の平面部21の上に載った状態で、回路基板10が端 子20の上に載置され、端子20は凹部12の導体11に半田付けされている。図示しな い回路素子を実装した回路基板10は、さらに外装樹脂30によってモールドされ、 端子20を折り曲げて電子部品として完成する。 FIG. 2 shows an embodiment of an electronic component to which the terminal mounting structure according to the present invention is applied. Actually, a conductor pattern is provided on the surface of the circuit board 10 or various circuit elements are mounted on the circuit board 10. However, these are omitted in the figure and only the main part is shown. It is shown. As is clear from FIG. 3, the two opposite side surfaces of the circuit board 10 are notched in a semicircular shape, and a semicircular concave portion is formed by applying conductors 11 from the inside to the front and back surfaces of the circuit board 10. 12 has been formed. Such a circuit board 10 can be easily obtained by cutting the center of the through hole 16 from one mother board 15 and cutting out a plurality of circuit boards 10 as shown in FIG. The dashed line in FIG. 4 indicates the cut portion. On the other hand, as shown in FIG. 5, a flat portion 21 and a tongue piece 22 vertically cut from the flat portion 21 are provided at the tip of the terminal 20. The circuit board 10 is placed on the terminal 20 with the tongue piece 22 of the terminal 20 being inserted into the depression 12 and the conductor 11 at one end of the depression 12 being placed on the flat portion 21 of the terminal 20. And the terminal 20 is soldered to the conductor 11 of the recess 12. The circuit board 10 on which circuit elements not shown are mounted is further molded with the exterior resin 30, and the terminals 20 are bent to complete the electronic component.

【0006】 回路基板10への端子20の取付けは次のようにして行う。まず、平面部21とこれ から垂直に切り起こした舌片22を有する端子20を向かい合わせに多数形成した図 6のような1本のリードフレーム25を用意する。次に、舌片22を凹部12内に挿入 しながら、回路基板10を上方から降ろして端子20の上に載置する。そして、凹部 12部分の導体11と端子20とを半田付けすればよい。この後、外装樹脂30でモール ドしてから、リードフレーム25から切り離せば図2のような状態となる。なお、 回路基板10は、図7のように、端子の平面部21に接合されない方の回路基板表面 の導体11の一部を除去した構成としてもよい。The terminal 20 is attached to the circuit board 10 as follows. First, there is prepared one lead frame 25 as shown in FIG. 6 in which a large number of terminals 20 each having a flat portion 21 and a tongue piece 22 which is vertically cut and raised are formed facing each other. Next, while inserting the tongue piece 22 into the recess 12, the circuit board 10 is lowered from above and placed on the terminal 20. Then, the conductor 11 and the terminal 20 in the recess 12 may be soldered. After this, the state is as shown in FIG. 2 by molding with the exterior resin 30 and then separating from the lead frame 25. The circuit board 10 may have a structure in which a part of the conductor 11 on the surface of the circuit board which is not joined to the flat portion 21 of the terminal is removed as shown in FIG.

【0007】[0007]

【考案の効果】[Effect of the device]

本考案によれば、1本のリードフレームの上に回路基板を一方向から載置する だけで、端子を回路基板に位置決めしながら装着できる。したがって、製造工程 が簡略化され、自動機による組立も容易である。また、回路基板もスルーホール の中央を切断して簡単に製造できるので量産性がよい。 According to the present invention, the terminals can be mounted while positioning the terminals on the circuit board only by mounting the circuit board on one lead frame from one direction. Therefore, the manufacturing process is simplified and assembly by an automatic machine is easy. In addition, the circuit board can be easily manufactured by cutting the center of the through hole, so mass productivity is good.

【0008】[0008]

【図面の簡単な説明】[Brief description of drawings]

【図1】 従来の端子取付構造を示す斜視図FIG. 1 is a perspective view showing a conventional terminal mounting structure.

【図2】 本考案の端子取付構造の一実施例を示す斜視
FIG. 2 is a perspective view showing an embodiment of the terminal mounting structure of the present invention.

【図3】 同実施例における回路基板の一部の斜視図FIG. 3 is a perspective view of a part of the circuit board according to the embodiment.

【図4】 同回路基板の製造方法を示す平面図FIG. 4 is a plan view showing a method for manufacturing the same circuit board.

【図5】 端子の先端の拡大斜視図FIG. 5 is an enlarged perspective view of the tip of the terminal.

【図6】 組立工程の斜視図FIG. 6 is a perspective view of the assembly process.

【図7】 回路基板の他の実施例を示す部分斜視図FIG. 7 is a partial perspective view showing another embodiment of the circuit board.

【符号の説明】[Explanation of symbols]

10 回路基板 11 導体 12 凹部 20 端子 21 平面部 22 舌片 10 Circuit Board 11 Conductor 12 Recess 20 Terminal 21 Plane 22 Tongue

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】回路基板の対向する二側面に複数の端子を
取付けてなる電子部品において、ほぼ半円状の凹部を回
路基板の二側面に形成して該凹部表面から回路基板の少
なくとも一方の面にわたって導体を被着し、各々の端子
の先端には平面部及び該平面部からほぼ垂直に切り起こ
した舌片を設け、該凹部の一端部側を端子の平面部の上
に載置し、舌片を該凹部内に位置させて、それぞれの端
子を回路基板に取付けたことを特徴とする電子部品の端
子取付構造。
1. An electronic component having a plurality of terminals attached to two opposite side surfaces of a circuit board, wherein substantially semicircular recesses are formed on the two side surfaces of the circuit board, and at least one of the circuit board is provided from the surface of the recess. A conductor is applied over the surface, a flat portion and a tongue piece that is cut and raised substantially vertically from the flat portion are provided at the tip of each terminal, and one end side of the recess is placed on the flat portion of the terminal. A terminal mounting structure for an electronic component, characterized in that the tongue pieces are located in the recesses and the respective terminals are mounted on the circuit board.
JP9585091U 1991-10-25 1991-10-25 Electronic component terminal mounting structure Pending JPH0538772U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9585091U JPH0538772U (en) 1991-10-25 1991-10-25 Electronic component terminal mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9585091U JPH0538772U (en) 1991-10-25 1991-10-25 Electronic component terminal mounting structure

Publications (1)

Publication Number Publication Date
JPH0538772U true JPH0538772U (en) 1993-05-25

Family

ID=14148851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9585091U Pending JPH0538772U (en) 1991-10-25 1991-10-25 Electronic component terminal mounting structure

Country Status (1)

Country Link
JP (1) JPH0538772U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017201631A (en) * 2011-11-26 2017-11-09 ジョンソン コントロールズ オートモーティブ エレクトロニクス エスエイエス Method for placing electronic circuit board in contact with plurality of contact elements in housing receiving or surrounding the electronic circuit board, and housing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017201631A (en) * 2011-11-26 2017-11-09 ジョンソン コントロールズ オートモーティブ エレクトロニクス エスエイエス Method for placing electronic circuit board in contact with plurality of contact elements in housing receiving or surrounding the electronic circuit board, and housing

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