JPH081564Y2 - Lead wire structure of ceramic substrate circuit - Google Patents
Lead wire structure of ceramic substrate circuitInfo
- Publication number
- JPH081564Y2 JPH081564Y2 JP1990011118U JP1111890U JPH081564Y2 JP H081564 Y2 JPH081564 Y2 JP H081564Y2 JP 1990011118 U JP1990011118 U JP 1990011118U JP 1111890 U JP1111890 U JP 1111890U JP H081564 Y2 JPH081564 Y2 JP H081564Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- ceramic substrate
- lead
- mount
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案は、セラミック基板回路にリード線を結合した
構造に係り、特に半製品の状態におけるリード線の取付
け構造に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a structure in which a lead wire is connected to a ceramic substrate circuit, and more particularly to a lead wire mounting structure in a semi-finished product state.
（従来の技術） 面上に回路を形成したセラミック基板回路にリード線
を半田付け等により結合する場合、従来はまず第９図に
示すように、金属板の打抜き成形により、帯状部１と一
体にリード線２を形成したリードフレーム３を作り、帯
状部１に送り用兼位置決め用の穴４を設けておき、リー
ドフレーム３を位置決めした状態でセラミック基板回路
５の電極６（７はセラミック基板回路上に搭載された電
子部品であり、基板上に形成された導体パターンの図示
は省略している）にリード線２の先端を半田付けし、そ
の後リード線２を帯状部１から切り離し、リード線２を
検査機の端子に接続して検査を行ない、自動挿入機によ
り、マザー基板（図示せず）の貫通穴にリード線２を挿
通して半田付けすることにより、該セラミック基板５の
取付けを行なっていた。(Prior Art) When a lead wire is connected to a ceramic substrate circuit having a circuit formed on the surface by soldering or the like, conventionally, as shown in FIG. 9, it is integrated with the strip-shaped portion 1 by punching a metal plate. A lead frame 3 having a lead wire 2 formed on it is formed, and a feed / positioning hole 4 is provided in the band-shaped portion 1. With the lead frame 3 positioned, an electrode 6 (7 is a ceramic substrate) of a ceramic substrate circuit 5 is formed. The tip of the lead wire 2 is soldered to an electronic component mounted on a circuit, and a conductor pattern formed on the substrate is not shown. After that, the lead wire 2 is separated from the strip-shaped portion 1, Attach the ceramic substrate 5 by connecting the wire 2 to the terminal of the inspection machine and performing the inspection, and inserting the lead wire 2 into the through hole of the mother board (not shown) by an automatic insertion machine and soldering it. I was injured.
（考案が解決しようとする課題） しかし第７図のリード線構造には次のよう問題点があ
った。(Problems to be solved by the device) However, the lead wire structure shown in FIG. 7 has the following problems.
（１）複数本のリード線２がリードフレーム３の一部と
して形成され、帯状部１により相互に電気的に導通して
いるので、リード線２を帯状部１から切り離さなければ
セラミック基板５上の回路特性の検査が行なえない。こ
のため、リードフレーム３のラインの他に、検査のため
の設備を別に備えなければならず、製造設備コストがか
かり、また工程数も多くなり製造上の能率が悪い。(1) Since a plurality of lead wires 2 are formed as a part of the lead frame 3 and are electrically connected to each other by the strip portion 1, the lead wires 2 must be separated from the strip portion 1 on the ceramic substrate 5. The circuit characteristics of cannot be inspected. For this reason, in addition to the lead frame 3 line, equipment for inspection must be additionally provided, resulting in high manufacturing equipment cost, a large number of steps, and poor manufacturing efficiency.
（２）リードフレーム３は、リード線２と帯状部１が一
体に形成されたものであり、多種少量生産を行なうに
は、リード線２の間隔等が異なる各々の製品に対応した
リードフレームの成形金型を用意しなければならず、加
工費が高い。(2) The lead frame 3 is formed by integrally forming the lead wire 2 and the strip-shaped portion 1, and in order to carry out a variety of small-quantity production, the lead frame 3 corresponding to each product having different intervals between the lead wires 2 and the like is used. A molding die must be prepared, and the processing cost is high.
（３）リードフレーム３は打抜き加工により形成され、
材料費が高くなり、このため、前記（２）との相乗効果
により製造コスト高を招く。(3) The lead frame 3 is formed by punching,
The material cost becomes high, and therefore the manufacturing cost becomes high due to the synergistic effect with the above (2).
（４）リード線２は打抜きにより形成されるため、断面
形状は四角形であり、円錐形のようなマザー基板への挿
入を容易とする形状等を採用しえない。(4) Since the lead wire 2 is formed by punching, the cross-sectional shape is quadrangular, and a shape such as a cone shape that facilitates insertion into the mother substrate cannot be adopted.
本考案は、上述した問題点に鑑み、基板上の回路検査
のオンライン化が可能となり、また、異種基板につい
て、同種の搬送帯の使用が可能となって多種少量生産に
適し、製造コスト、設備コストを低減、ひいては製品コ
ストを低減できると共に、リード線を切断した後のマザ
ー基板の取付け穴へのリード線の挿入が容易となるセラ
ミック基板回路のリード線構造を提供することを目的と
する。In view of the above-described problems, the present invention enables online circuit inspection on a board, and enables the use of the same kind of carrier band for different types of boards, which is suitable for small-lot production of various types, manufacturing cost and equipment. An object of the present invention is to provide a lead wire structure of a ceramic substrate circuit which can reduce the cost and eventually the product cost and facilitate the insertion of the lead wire into the mounting hole of the mother board after cutting the lead wire.
（課題を解決するための手段） 上記の目的を達成するため、本考案は、リード線の一
端に二股状の結合部を設け、かつリード線の該結合部と
他端との間に、該結合部側から他端に向けて次第に細く
なるテーパー部を設け、これらのリード線の前記テーパ
ー部より他端側の一部を、複数本のリード線を１組とし
て、帯状をなす台紙とこれに貼付する粘着テープとの間
で挟持固定し、前記台紙および粘着テープを貫通する送
り用兼位置決め用の穴を、リード線の各組の間に台紙の
送り方向に等間隔に設け、各組の複数本のリード線ごと
に、セラミック基板回路を、その電極を前記リード線の
結合部で挟持固定して結合したことを特徴とする。(Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention provides a bifurcated coupling portion at one end of a lead wire, and provides a fork between the coupling portion and the other end of the lead wire. A taper part is provided which gradually becomes thinner from the coupling part side toward the other end, and a part of the other end side of the lead parts of these lead wires forms a strip-shaped mount with a plurality of lead wires as one set. It is sandwiched and fixed between the tape and the adhesive tape that is affixed to, and holes for feeding and positioning that penetrate through the mount and the adhesive tape are provided at equal intervals in the feed direction of the mount between each set of lead wires. In each of the plurality of lead wires, the ceramic substrate circuit is connected by sandwiching and fixing the electrodes of the ceramic board circuit with the connecting portions of the lead wires.
（作用） 本考案のセラミック基板回路のリード線構造において
は、セラミック基板に複数のリード線を結合した状態に
おいて、各リード線は台紙と粘着テープとの間で挟持さ
れて固定されており、基板外の部分では各リード線どう
しは電気的に導通していないため、台紙送りラインに基
板が乗った状態、すなわちオンライン状態で基板上の回
路の特性検査が行なえる。(Operation) In the lead wire structure of the ceramic substrate circuit of the present invention, each lead wire is sandwiched and fixed between the mount and the adhesive tape when the plurality of lead wires are coupled to the ceramic substrate. Since the lead wires are not electrically connected to each other in the outer portion, it is possible to inspect the characteristics of the circuit on the board while the board is on the mount feeding line, that is, in the online state.
リード線の間隔は、基板上の電極の間隔に応じて決定
され、台紙上に配置される。また、リード線をテーパー
部の細くなった部分で切断することにより、リード線の
取付け端が先細りとなり、マザー基板の取付け穴へのリ
ード線の挿入が容易となる。The distance between the lead wires is determined according to the distance between the electrodes on the substrate and arranged on the mount. Further, by cutting the lead wire at the tapered portion, the attachment end of the lead wire is tapered, and the lead wire can be easily inserted into the attachment hole of the mother board.
（実施例） 第１図は本考案によるセラミック基板回路のリード線
構造の一実施例を示す平面図、第２図、第３図および第
４図はそれぞれ第１図のＡ−Ａ、Ｂ−Ｂ、Ｃ−Ｃ拡大断
面図である。(Embodiment) FIG. 1 is a plan view showing an embodiment of a lead wire structure of a ceramic substrate circuit according to the present invention, and FIGS. 2, 3, and 4 are AA and B- of FIG. 1, respectively. It is B, CC enlarged sectional view.
８はリード線であり、該リード線８は断面形状が円形
をなし、第６図に示すように、一端に二股状の結合部8a
を設け、第８図に示すように、該結合部8aと他端との間
に、リード線８の結合部側8aから他端に向けて次第に細
くなるテーパー部8b（ｌはテーパー部8bの最も細い部分
となる切断部である）を設ける。また、第２図に示すよ
うに、セラミック基板５の一辺上に形成された複数の電
極６の形成部分をそれぞれ結合部8aで挟持し、半田９に
より固定される。10は帯状をなす台紙、11は該台紙に貼
付される粘着テープである。第１図、第４図に示すよう
に、各リード線８はそれぞれ平行をなすように、かつ各
セラミック基板５が等間隔をなすように、帯状をなす台
紙10とこれに貼付する粘着テープ11との間に挟持固定さ
れる。この場合、前記テーパー部8bは、切断部ｌが台紙
10の縁の近傍になるように、台紙10よりセラミック基板
５側に位置させる。また、台紙10および粘着テープ11に
は、第１図、第３図に示すように、これらを貫通する送
り用兼位置決め用の穴12が、各セラミック基板回路５対
応の複数本のリード線８の組の間に位置する個所に、台
紙10の送り方向に等間隔に穿設される。Reference numeral 8 is a lead wire, and the lead wire 8 has a circular cross-sectional shape, and has a bifurcated connecting portion 8a at one end as shown in FIG.
As shown in FIG. 8, a taper portion 8b (l indicates a taper portion 8b of the taper portion 8b) which is gradually narrowed from the joint portion side 8a of the lead wire 8 toward the other end between the joint portion 8a and the other end. It is a cutting part which becomes the thinnest part). Further, as shown in FIG. 2, the forming portions of the plurality of electrodes 6 formed on one side of the ceramic substrate 5 are respectively sandwiched by the coupling portions 8a and fixed by the solder 9. Reference numeral 10 is a strip-shaped mount, and 11 is an adhesive tape attached to the mount. As shown in FIGS. 1 and 4, the lead wires 8 are parallel to each other, and the ceramic substrates 5 are arranged at equal intervals, and a strip-shaped mount 10 and an adhesive tape 11 attached thereto. It is pinched and fixed between and. In this case, the taper portion 8b has a cut portion l as a mount.
The ceramic substrate 5 is located closer to the ceramic substrate 5 side than the mount 10 so that it is near the edge of 10. Further, as shown in FIGS. 1 and 3, the mount 10 and the adhesive tape 11 are provided with a plurality of lead wires 8 corresponding to each ceramic substrate circuit 5 and having holes 12 for feeding and positioning therethrough. Are provided at equal intervals in the feeding direction of the mount 10 at the positions located between the sets.
第５図はこの実施例の製造工程を示す図であり、まず
第５図（Ａ）に示すように、各セラミック基板回路５対
応のリード線８を台紙10と粘着テープ11との間に固定す
ると共に、各セラミック基板５対応のリード線８の組の
間に、送り用兼位置決め用の穴12を穿設する。FIG. 5 is a diagram showing the manufacturing process of this embodiment. First, as shown in FIG. 5 (A), the lead wire 8 corresponding to each ceramic substrate circuit 5 is fixed between the mount 10 and the adhesive tape 11. At the same time, holes 12 for feeding and positioning are provided between the sets of lead wires 8 corresponding to the respective ceramic substrates 5.
次に第５図（Ｂ）および第６図に示すように、リード
線８の先端に二股状の結合部8aを形成する。Next, as shown in FIGS. 5B and 6, a bifurcated coupling portion 8a is formed at the tip of the lead wire 8.
そしてこのように形成された結合部8aに、第１図、第
２図に示すようにセラミック基板回路５の電極６形成部
分を挟持し、半田槽に結合部8aを浸漬することにより、
半田付けする。Then, by sandwiching the electrode 6 forming portion of the ceramic substrate circuit 5 in the joint portion 8a thus formed as shown in FIGS. 1 and 2, and immersing the joint portion 8a in the solder bath,
Solder.
また、このように半田付けしたものにおいて、リード
線８どうしはセラミック基板５上の回路外で導通してい
ないため、回路特性の検査が可能であり、リード線を第
１図の線ｌで切断する前に回路特性の検査を行なう。Further, in the soldered product as described above, since the lead wires 8 are not electrically connected to each other outside the circuit on the ceramic substrate 5, the circuit characteristics can be inspected, and the lead wires are cut at the line l in FIG. Before doing so, inspect circuit characteristics.
第７図は本考案の他の実施例であり、この実施例は、
セラミック基板５上に抵抗あるいはコンデンサ、インダ
クタ等の電子部品13を形成し、各電子部品13の一端の電
極６と、他端の共通の導体パターン14につながる電極６
に、それぞれリード線８を接続したもので、リード線８
の固定構造は前記実施例と同様である。FIG. 7 shows another embodiment of the present invention.
An electronic component 13 such as a resistor, a capacitor or an inductor is formed on a ceramic substrate 5, and an electrode 6 at one end of each electronic component 13 and an electrode 6 connected to a common conductor pattern 14 at the other end.
The lead wire 8 is connected to the
The fixing structure of is the same as that of the above embodiment.
この実施例においても、各電子部品13の特性の検査
は、リード線切断前の状態で行なわれる。Also in this embodiment, the inspection of the characteristics of each electronic component 13 is performed before the cutting of the lead wire.
第８図に示したように、切断部ｌより結合部8a側をテ
ーパー部8bとしたので、切断後のマザー基板の取付け穴
への挿入が容易となり、挿入率が向上する。As shown in FIG. 8, since the connecting portion 8a side from the cutting portion 1 is the taper portion 8b, it is easy to insert into the mounting hole of the mother substrate after cutting, and the insertion rate is improved.
なお、上記実施例においては、送り用兼位置決め用の
穴12を円形に形成したので、穴12の強度が角穴に比較し
て大となり、穴12の破損、変形を防止することができ、
また、穴12は台紙10と粘着テープ11の双方に設けられて
いるので、送り用のピン（図示せず）を穴12に出し入れ
しても、穴精度を損なわない。In addition, in the above embodiment, since the hole 12 for feeding and positioning is formed in a circular shape, the strength of the hole 12 becomes greater than that of the square hole, and it is possible to prevent damage and deformation of the hole 12,
Further, since the hole 12 is provided on both the mount 10 and the adhesive tape 11, the accuracy of the hole is not deteriorated even if a feeding pin (not shown) is taken in and out of the hole 12.
（考案の効果） 本考案によれば、セラミック基板回路に結合されるリ
ード線の一部を台紙と粘着テープとの間に挟持し固定し
たので、台紙にリード線を固定した切断前の状態でセラ
ミック基板５上の回路特性の検査が行なえる。このた
め、回路検査のための装置を台紙を送るライン上に設け
ることができ、製造設備が簡略化され、また、工程数も
減少するので製造上の能率が向上する。(Effect of the Invention) According to the present invention, since a part of the lead wire coupled to the ceramic substrate circuit is clamped and fixed between the mount and the adhesive tape, the lead wire is fixed to the mount before cutting. The circuit characteristics on the ceramic substrate 5 can be inspected. Therefore, an apparatus for circuit inspection can be provided on the line for feeding the mount, which simplifies the manufacturing equipment and reduces the number of steps, thus improving manufacturing efficiency.
また、台紙上に配列するリード線のピッチは任意に選
択できるので、多種少量生産を行なう場合、製品の電極
間隔に応じてリード線の間隔を変えれば良く、多種少量
生産における加工費が廉価ですむ。Also, the pitch of the lead wires arranged on the backing sheet can be selected arbitrarily, so when performing small-lot production of various types, it suffices to change the spacing of the lead lines according to the electrode spacing of the product, and the processing cost in the production of small-lot types is low Mu.
また、従来のリードフレームに比較し、本考案で用い
る台紙や粘着テープは廉価ですむから、材料費が廉価と
なり、このため、設備費が廉価ですむことともに相まっ
て、製造コストの低減が達成できる。In addition, since the mount and the adhesive tape used in the present invention are less expensive than the conventional lead frame, the material cost is low, and therefore, the equipment cost is low, and the manufacturing cost can be reduced.
また、本考案においては、リード線にテーパー部を設
け、そのテーパー部が台紙よりセラミック基板回路側に
位置するようにしたので、テーパー部の細くなった部分
で切断することにより、リード線の取付け端が先細とな
り、マザー基板の取付け穴へのリード線の挿入が容易と
なる。Further, in the present invention, the lead wire is provided with a taper portion, and the taper portion is located closer to the ceramic substrate circuit side than the mount, so that the lead wire can be attached by cutting at the thin portion of the taper portion. The tapered end makes it easy to insert the lead wire into the mounting hole of the mother board.
第１図は本考案によるセラミック基板回路のリード線構
造の一実施例を示す平面図、第２図、第３図、第４図は
それぞれ第１図のＡ−Ａ、Ｂ−Ｂ、Ｃ−Ｃ拡大断面図、
第５図は該実施例の工程図、第６図は該実施例の結合部
を示す側面図、第７図は本考案の他の実施例を示す平面
図、第８図は本考案によるリード線を示す拡大平面図、
第９図は従来のリード線構造を示す平面図である。 5:基板、6:電極、7:電子部品、8:リード線、9:半田、1
0:台紙、11:粘着テープ、12:穴、13:電子部品、14:導体
パターンFIG. 1 is a plan view showing an embodiment of a lead wire structure of a ceramic substrate circuit according to the present invention, and FIGS. 2, 3, and 4 are AA, BB, C- of FIG. 1, respectively. C enlarged sectional view,
FIG. 5 is a process drawing of the embodiment, FIG. 6 is a side view showing a coupling portion of the embodiment, FIG. 7 is a plan view showing another embodiment of the present invention, and FIG. 8 is a lead according to the present invention. An enlarged plan view showing the lines,
FIG. 9 is a plan view showing a conventional lead wire structure. 5: Board, 6: Electrode, 7: Electronic component, 8: Lead wire, 9: Solder, 1
0: Mount, 11: Adhesive tape, 12: Hole, 13: Electronic component, 14: Conductor pattern
───────────────────────────────────────────────────── フロントページの続き (72)考案者 工藤 隆夫 東京都中央区日本橋１丁目13番１号 ティ ーディーケイ株式会社内 (72)考案者 小野寺 晃 東京都中央区日本橋１丁目13番１号 ティ ーディーケイ株式会社内 (56)参考文献 特開 平１−130487（ＪＰ，Ａ) 実開 昭51−58849（ＪＰ，Ｕ) 特公 平１−60909（ＪＰ，Ｂ２) 実公 平１−103277（ＪＰ，Ｙ２) ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Takao Kudo 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Inc. (72) Inventor Akira Onodera 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Incorporated (56) References JP-A-1-130487 (JP, A) SAIKAI Sho 51-58849 (JP, U) JPK 1-60909 (JP, B2) JUKI 1-103277 (JP, Y2)
Claims (1)
かつリード線の該結合部と他端との間に、該結合部側か
ら他端に向けて次第に細くなるテーパー部を設け、 これらのリード線の前記テーパー部より他端側の一部
を、複数本のリード線を１組として、帯状をなす台紙と
これに貼付する粘着テープとの間で挟持固定し、 前記台紙および粘着テープを貫通する送り用兼位置決め
用の穴を、リード線の各組の間に台紙の送り方向に等間
隔に設け、 各組の複数本のリード線ごとに、セラミック基板回路
を、その電極を前記リード線の結合部で挟持固定して結
合した ことを特徴とするセラミック基板回路のリード線構造。1. A bifurcated coupling portion is provided at one end of a lead wire,
Further, a taper portion is provided between the connecting portion and the other end of the lead wire, the taper portion gradually narrowing from the connecting portion side to the other end, and a part of the other end side of the taper portion of the lead wires is provided. A set of a plurality of lead wires is sandwiched and fixed between a strip-shaped mount and an adhesive tape attached to the lead, and a feed / positioning hole that penetrates the mount and the adhesive tape is provided for each lead wire. It is characterized in that it is provided at equal intervals in the feed direction of the mount between the sets, and the ceramic substrate circuit is connected for each of the plurality of lead wires of each set by sandwiching and fixing the electrodes at the connecting parts of the lead wires. Lead wire structure of ceramic substrate circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011118U JPH081564Y2 (en) | 1990-02-07 | 1990-02-07 | Lead wire structure of ceramic substrate circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011118U JPH081564Y2 (en) | 1990-02-07 | 1990-02-07 | Lead wire structure of ceramic substrate circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03103560U JPH03103560U (en) | 1991-10-28 |
| JPH081564Y2 true JPH081564Y2 (en) | 1996-01-17 |
Family
ID=31514655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990011118U Expired - Lifetime JPH081564Y2 (en) | 1990-02-07 | 1990-02-07 | Lead wire structure of ceramic substrate circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH081564Y2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6460909A (en) * | 1987-09-01 | 1989-03-08 | Murata Manufacturing Co | Shielded conductor |
| JPH01130487A (en) * | 1987-11-16 | 1989-05-23 | Mitsubishi Electric Corp | Lead inserting machine |
| JPH01103277U (en) * | 1987-12-28 | 1989-07-12 |
-
1990
- 1990-02-07 JP JP1990011118U patent/JPH081564Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03103560U (en) | 1991-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |