JPH03103560U - - Google Patents
Info
- Publication number
- JPH03103560U JPH03103560U JP1990011118U JP1111890U JPH03103560U JP H03103560 U JPH03103560 U JP H03103560U JP 1990011118 U JP1990011118 U JP 1990011118U JP 1111890 U JP1111890 U JP 1111890U JP H03103560 U JPH03103560 U JP H03103560U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- mount
- adhesive tape
- lead
- feeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図は本考案によるセラミツク基板回路のリ
ード線構造の一実施例を示す平面図、第２図、第
３図、第４図はそれぞれ第１図のＡ−Ａ，Ｂ−Ｂ
，Ｃ−Ｃ拡大断面図、第５図は該実施例の工程図
、第６図は該実施例の結合部を示す側面図、第７
図は本考案の他の実施例を示す平面図、第８図は
本考案によるリード線の他の例を示す平面図、第
９図は従来のリード線構造を示す平面図である。
５……基板、６……電極、７……電子部品、８
……リード線、９……半田、１０……台紙、１１
……粘着テープ、１２……穴、１３……電子部品
、１４……導体パターン。
FIG. 1 is a plan view showing an example of the lead wire structure of a ceramic substrate circuit according to the present invention, and FIGS. 2, 3, and 4 are A-A, B-B of FIG. 1, respectively.
, CC enlarged sectional view, FIG. 5 is a process diagram of the embodiment, FIG. 6 is a side view showing the joint part of the embodiment, and FIG.
8 is a plan view showing another example of the lead wire according to the present invention, and FIG. 9 is a plan view showing a conventional lead wire structure. 5...Substrate, 6...Electrode, 7...Electronic component, 8
... Lead wire, 9 ... Solder, 10 ... Mounting paper, 11
... Adhesive tape, 12 ... Hole, 13 ... Electronic component, 14 ... Conductor pattern.
Claims (1)
が同じ間隔を有し、かつリード線が相互に平行を
なすように、帯状をなす台紙とこれに貼付する粘
着テープとの間にリード線の一部を挟持固定し、
台紙および粘着テープとを貫通する送り用兼位置
決め用の穴を、リード線の各組の間に台紙の送り
方向に等間隔に設け、各リード線の組ごとにそれ
ぞれセラミツク基板回路を結合したことを特徴と
するセラミツク基板回路のリード線構造。 The lead wires are placed between the strip-shaped mount and the adhesive tape attached thereto so that each set of lead wires has the same spacing and the lead wires are parallel to each other. Clamp and fix a part of the
Holes for feeding and positioning that pass through the mount and the adhesive tape are provided at equal intervals in the feeding direction of the mount between each set of lead wires, and a ceramic substrate circuit is connected to each set of lead wires. A lead wire structure for a ceramic board circuit featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011118U JPH081564Y2 (en) | 1990-02-07 | 1990-02-07 | Lead wire structure of ceramic substrate circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011118U JPH081564Y2 (en) | 1990-02-07 | 1990-02-07 | Lead wire structure of ceramic substrate circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03103560U true JPH03103560U (en) | 1991-10-28 |
| JPH081564Y2 JPH081564Y2 (en) | 1996-01-17 |
Family
ID=31514655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990011118U Expired - Lifetime JPH081564Y2 (en) | 1990-02-07 | 1990-02-07 | Lead wire structure of ceramic substrate circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH081564Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6460909A (en) * | 1987-09-01 | 1989-03-08 | Murata Manufacturing Co | Shielded conductor |
| JPH01130487A (en) * | 1987-11-16 | 1989-05-23 | Mitsubishi Electric Corp | Lead inserting machine |
| JPH01103277U (en) * | 1987-12-28 | 1989-07-12 |
-
1990
- 1990-02-07 JP JP1990011118U patent/JPH081564Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6460909A (en) * | 1987-09-01 | 1989-03-08 | Murata Manufacturing Co | Shielded conductor |
| JPH01130487A (en) * | 1987-11-16 | 1989-05-23 | Mitsubishi Electric Corp | Lead inserting machine |
| JPH01103277U (en) * | 1987-12-28 | 1989-07-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH081564Y2 (en) | 1996-01-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |