JPS6311697Y2 - - Google Patents

Description

[Detailed Description of the Invention] Field of the Invention This invention relates to a ceramic electronic component in which electrodes are formed at both ends of a ceramic electronic component body, terminal leads are soldered to each electrode and pulled out in parallel directions. In particular, it relates to improvements in terminal leads.

Description of the Prior Art FIGS. 1 to 3 are diagrams for explaining the manufacturing process of a conventional ceramic electronic component which is the prior art of this invention.

Conventionally, terminal leads attached to ceramic electronic components are typically made of copper wire or CP wire with a circular cross section. Some of them are soldered (or plated) in advance, but in any case, the cross section is circular.

As shown in FIG. 1, the lead wire 1 having a circular cross section as described above is formed into a U-shape. In order to efficiently proceed with the process of obtaining ceramic electronic components using such a plurality of lead wires 1, as shown by the imaginary line in FIG. hold it with this holding tape 2
It is sometimes handled with a plurality of lead wires 1 distributed along its length.

Next, as shown in FIG. 2, the two ends of the lead wire 1 are bent inwardly and shaped so as to cross each other at these ends.

As shown in FIG. 3, the ceramic electronic component main body 3 is held between the ends of the lead wires 1 and held by the spring properties of the lead wires 1. Electrodes are formed on both ends of the ceramic electronic component body 3, that is, on both sides of the ceramic electronic component body 3 shown in the figure since it is plate-shaped. Each end of is in contact with each electrode. In this state, each electrode and each end of the lead wire 1 are soldered. Examples of the soldering method include a solder dip method, and a method in which solder paste or the like is applied in advance to the end of the lead wire 1 and then heated and melted.

Thereafter, a resin sheath is applied to cover the ceramic electronic component body 3 and the ends of the lead wires 1, and the ceramic is cut into a finished product by cutting along the cutting line 4 shown in FIG. 3, for example. Electronic components can be obtained.

However, such prior art has problems that need to be solved. For example, in the conventional manufacturing of ceramic electronic components that involves the process described above, the lead wire 1 used has a circular cross section, so the electronic component body 3 cannot be held sufficiently, and it is difficult to increase the speed. However, it was not suitable for high-speed processing, which has been in high demand in recent years. Further, as shown in FIG. 1, the work required to hold the U-shaped lead wire 1 on the holding tape 2 was relatively troublesome. Furthermore, such a retaining tape 2
When they completed their mission, they had no choice but to throw them away, which was not desirable in terms of resource conservation. Furthermore, when holding tape (mainly paper tape or adhesive tape) is used, careful attention must be paid to the heat treatment conditions during the manufacturing process, and the process itself takes a long time because the heat treatment temperature cannot be raised too high. There was also the problem of unsuitability.

Purpose of the invention The purpose of this invention is to provide a structure for ceramic electronic components suitable for high-speed production, and also to save labor in electronic component manufacturing lines.
Ceramic electronic components that can be expected to be significantly reduced in cost can be obtained.

Summary of the invention A major feature of this invention is that a terminal lead formed by punching out a metal plate is used in place of the conventional lead wire with a circular cross section. That is, the terminal leads are obtained by punching out a plurality of terminal leads distributed along the length of a strip-shaped metal plate material. 1 serves as a terminal lead for one electronic component
The distal end portions of the plurality of terminal leads constituting the group are formed with protrusions that protrude toward the mutually opposing terminal leads and intersect with each other over substantially the entire area thereof, at side end portions that are provided oppositely to each other. Note that this protruding piece must have a sufficiently large amount of interruption in order to stably hold the electronic component. For example, 1
When there are two terminal leads for an electronic component, the tip of one terminal lead is shaped to branch into two, and the tip of the other is shaped to fit between these two branches. be done. and between the tip of at least one terminal lead and the tip of another terminal lead, for example, in an example using two terminal leads, the tip of one terminal lead and the tip of the other terminal lead. The main body of the ceramic electronic component is held between them, and in this state, the tip of each terminal lead and each corresponding electrode are connected by soldering. In the final stage of the manufacturing process of such ceramic electronic components, each terminal lead is cut from the strip-shaped metal plate material to obtain a ceramic electronic component as a finished product.

Effects of the invention According to this invention, since the terminal lead is formed by punching out a strip-shaped metal plate material, it is possible to obtain a terminal lead of a desired shape at high speed, and a ceramic electronic component body can be attached to the terminal lead. The entire manufacturing process of such ceramic electronic components, including the mounting process, can be sped up. In addition, the ceramic electronic component body before soldering is held by the uncut terminal lead, which has an advantageous spring property, and the protruding pieces that intersect with each other can ideally hold the ceramic electronic component body, ensuring that the ceramic electronic component body is held securely. This also makes it possible to speed up the manufacturing process. This is also facilitated by the fact that a terminal lead formed by punching out a metal plate has a larger contact area with the ceramic electronic component body than a lead wire having a circular cross section. In addition, such a large contact area leads to an increase in the soldering area, ensuring reliable soldering, and significantly improving reliability compared to conventional products. Furthermore, disposable materials such as conventional holding tapes are no longer used, and the strip-shaped metal plates from which the terminal leads have been cut can be collected and reprocessed, making it possible to reuse them, which is advantageous in terms of resource conservation. . In addition, each terminal lead can be held securely by the strip-shaped metal plate material, and when a single ceramic electronic component is obtained, there will be no deviation in the spacing between the terminal leads, and it will not be possible to attach the terminal leads to the printed circuit board. It is possible to significantly reduce the insertion error rate in automatic equipment, stabilize quality, and save labor for monitoring workers in the production process. Further, all positioning in the production process can be performed using the strip-shaped metal plate material as a reference, and there is no need to adjust the dimensions of the ceramic electronic component body. Further, since the shape of the terminal lead can be arbitrarily selected, a shape that is easy to solder or a shape that is necessary for obtaining strength can be easily obtained by molding. Therefore, there is no need to use special soldering lead wires to facilitate soldering, which has been done in the past, which eliminates wasted solder and prevents troubles caused by the solder being rubbed during the process. It will no longer cause anything. Furthermore, when the ceramic electronic component according to this invention is mounted on a printed circuit board, the plate-shaped terminal leads are inserted into the round holes of the printed circuit board, so that the solder rises well. In addition, since the plate-shaped terminal lead is obtained by punching, it is easy to add a step to a part of the lead-out side of the terminal lead and limit the resin sheathing material to less than the step. This stage has the function of a stopper on the printed circuit board, allowing for good degassing during soldering and greatly improving the reliability of the electrical connection of the wiring electrodes. As a result, it is particularly suitable for communication devices and the like that strongly require such reliability. In conventional terminal leads with a circular cross section, a part of the terminal lead is separately crimp-molded to ensure reliability, but this not only increases the cost of forming the terminal lead, but also increases the cost of forming the terminal lead at the crimp-molded part. There were problems such as breakage due to brittleness and insufficient dimensional accuracy.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of this invention will be described in connection with ceramic capacitors.

4 to 6 are diagrams illustrating an embodiment of this invention, in which FIG. 4 shows a state in which the terminal lead is formed, and FIG. 5 is an enlarged view of part A in FIG.
FIG. 6 shows a ceramic electronic component held by a strip-shaped metal plate.

The ceramic capacitor to be obtained in this embodiment includes, for example, a disk-shaped ceramic capacitor body, and electrodes are formed on both sides of the ceramic capacitor body, respectively. Therefore, two terminal leads for one ceramic capacitor constitute one group.

Referring to FIG. 4, two types of terminal leads 5 and 6 are shown, and these two terminal leads 5 and 6 constitute a terminal lead for one ceramic capacitor. The terminal leads 5, 6 are formed by punching out a band-shaped metal plate material, and each terminal lead 5, 6 is distributed along the length direction of such a band-shaped metal plate material, and is attached to the holding portion. It is obtained in a state held by 7. Preferably, the holding portion 7 has a hole 8 formed therein for positioning and feeding in the production process for the ceramic capacitor described below. In addition, the thickness of the metal plate material is about 0.1 to 0.8 mm, which improves strength, elasticity,
Although it is desirable in terms of cost, it goes without saying that it may be selected appropriately depending on the size and shape of the ceramic capacitor (electronic component) to be held. Tip portion 5 of each terminal lead 5, 6 constituting one group
The shapes of a and 6a are shown enlarged in FIG.

In FIG. 5, each tip portion 5a, 6a is characterized by a shape that cuts into each other. To explain more specifically, one tip 6a has 2
It is branched into two parts, and the other end portion 5a is shaped to fit between the two branched parts. Preferably, the tip portions 5a, 6a are made wider than the lead-out portions 5b, 6b of each terminal lead 5, 6, and a stepped portion 5c is formed at the boundary between the tip portions 5a, 6a and the draw-out portions 5b, 6b. , 6c are formed. The function of the stepped portions 5c and 6c will be described later.

Referring to FIG. 6, a ceramic capacitor body 9 is placed between the tips 5a and 6a of each terminal lead 5 and 6.
is caught. The ceramic capacitor main body 9 is, for example, disc-shaped, and electrodes are formed on both sides thereof. Therefore, each electrode comes into contact with the tip portions 5a, 6a of each terminal lead 5,6. In this way, when the ceramic capacitor main body 9 is held between the two tip parts 5a and 6a, the spring properties of the two terminal leads 5 and 6 held by the holding part 7 work, and this spring force is applied. Accordingly, the ceramic capacitor body 9 has two tip portions 5a and 6.
It is temporarily held during a. In this state, soldering is performed. As this soldering method, a soldering dip method or a reflow method is used, but the tip portions 5a and 6a may be soldered (or plated) in advance. After soldering has been performed in this manner, a resin sheath 10 is applied, as shown in phantom lines on the left side of FIG. The terminal leads 5 and 6 are then cut along the cutting line 11 to obtain a finished ceramic capacitor.

The resin sheath 10 described above is formed by, for example, dipping the ceramic capacitor body 9 in a resin paint. Until it hardens, this resin paint has the property of being drawn up by capillary action, but the resin paint has the property of being drawn up by capillary action until it hardens.
c, 6c prevent such dripping of the paint from occurring within the stepped portions 5c, 6c, thereby advantageously preventing the paint from reaching the pull-out portions 5b, 6c of each terminal lead 5, 6 and causing dripping. . Therefore, it is possible to prevent the reliability of soldering to printed circuit boards etc. from deteriorating.

FIGS. 7 to 11 show other embodiments of this invention, and show modifications of the planar shape of the tip of the terminal lead. The tip portions 5 of the terminal leads 5 and 6 shown in FIGS. 7 to 11
a, 6a, one tip 5a is shaped to cut into the other tip 6a, as in the previous embodiment.
In the embodiment shown in FIG. 7, the tip portions 5a, 6a of each terminal lead 5, 6 have a rounded shape as a whole, and the stepped portions 5c, 6c extend outward from the respective lead-out portions 5b, 6b. It is formed so that it can come out. According to this embodiment, the distance between the lead-out portions 5b, 6b of a pair of terminal leads 5, 6 can be further reduced.

In FIG. 8, the tip 5 of each terminal lead 5, 6 is shown.
In the part where the shapes of a and 6a intersect with each other,
It is made into a V shape.

In FIG. 9, the tips 5a of one terminal lead 5 are surrounded by the tips 6a of the other terminal lead 6 from the sides and above, so that they intersect with each other.

In FIG. 10, the tips 5 of each terminal lead 5, 6 are shown.
The number of branches at a and 6a is increased compared to that shown in FIG. 5, and the shape is such that the tip 5a having two branches is inserted between the tip 6a having three branches.

In the case shown in FIG. 11, the number of branches is increased as in the case of FIG. 10, and the shape of the portion where the tips 5a and 6a intersect with each other is wavy. In this example, since the amount of interference between the tip ends 5a and 6a is not so large, it is not suitable for holding an electronic component having an excessively large shape.

In this way, while the planar modification examples of the tip portions 5a, 6a of the terminal leads 5, 6 have been described with reference to FIGS. 7 to 11, other shapes in which they intersect with each other are also possible. be. Further, although a cut-out portion was inserted between the tip portions 5a and 6a described above to form a gap of a predetermined width, there is no such cut-out portion, and the pair of tip portions are in a state in which they are in close contact with each other. May be punched out.

FIGS. 12 to 16 show still other embodiments of this invention, and show modified examples of the side cross-sectional shape of the tip of the terminal lead.

In FIG. 12, bent portions 12 are positively formed on both sides of a ceramic capacitor body 9 having a predetermined thickness so that the tip portions 5a, 6a can come into contact over a wide area. Preferably, an insulator 18 is formed between the terminal leads 5, 6 and the ceramic capacitor body 9. According to this embodiment, the ceramic capacitor main body 9 can be held more securely by the pair of terminal leads 5 and 6 before soldering, and the area that can be soldered is increased.

In FIG. 13, the tips 5 of each terminal lead 5, 6 are shown.
Protrusions 13 are formed on a and 6a to define contact points with electrodes of the ceramic capacitor body 9. In this way, the lead portions 5a, 6a of each terminal lead 5, 6 and the ceramic capacitor body 9
Reliable contact with each electrode can be obtained.

In FIG. 14, the tip 5 of each terminal lead 5, 6 is shown.
Solder holes 14 are formed in a and 6a, and filled with solder 15 in advance. In this way, reliable soldering can be achieved, for example, when performing a solder dip. Furthermore, if the solder holes 14 are filled with solder 15 in advance, it becomes possible to perform soldering by reheating using this solder 15.

The example of FIG. 15 also includes a configuration for holding preliminary solder 15. That is,
A solder recess 16 is formed at the tip end portions 5a, 6a of each terminal lead 5, 6, and solder 15 is preloaded therein.

The same applies to FIG. 16, in order to hold the solder 15, the tips 5a,
A pleat 17 is formed in 6a.

In this way, the desired side cross-sectional shapes given to the tips 5a, 6a of the terminal leads 5, 6 shown in FIGS. 12 to 16 are such that each terminal lead 5, 6 is made of a metal plate material. Therefore, it can be easily formed using a press or the like.

FIGS. 17 and 18 respectively show still other embodiments of the invention, showing modified examples of the cross-sectional shape of the lead-out portion of the terminal lead.

The pull-out portions 5b and 6b of each terminal lead 5 and 6 are
Typically, it is formed to have a planar cross-sectional shape, but it may also be formed into an L-shape or a V-shape, as shown in FIG. 17 or 18, for example.
By deforming the cross-sectional shape in this way, the strength of the pull-out portions 5b, 6b increases, and such deformation of the pull-out portions 5b, 6b is advantageously prevented.

Furthermore, although applied to each of the embodiments described above, terminal leads 5 and 6 may be formed on both sides of the series of holding portions 7, as shown in FIG.
In this case, it is efficient to paint the resin sheath 10 by bending the terminal leads 5 and 6 so that their respective tips face in the same direction as shown in FIG.

Although this invention has been described above with respect to embodiments related to ceramic capacitors, this invention can also be applied to other ceramic electronic components. Other examples of ceramic electronic components to which this invention can be applied include thermistors and varistors. In addition, the shape of the electronic component body is also
In addition to circular or square plate shapes, they may also be columnar, cylindrical, or the like.

Further, in each of the embodiments described above, a ceramic electronic component having two terminal leads has been described, but the invention can also be applied to a ceramic electronic component having three or more terminal leads. For example, in the case of three terminal leads, a group of three terminal leads are formed along the length of the strip-shaped metal plate, and a terminal lead is located at the center of each group of terminal leads. The thing is
It is located on one side of the ceramic electronic component body, and those on both sides are located on the other side.

[Brief explanation of the drawing]

1 to 3 are diagrams sequentially illustrating the manufacturing process of a conventional ceramic electronic component, which is the prior art of this invention. 4 to 6 are diagrams illustrating an embodiment of this invention, in which FIG. 4 shows a state in which the terminal lead is formed, FIG. 5 is an enlarged view of part A in FIG. 4, and FIG. FIG. 6 shows a ceramic electronic component held by a band-shaped metal plate. FIGS. 7 to 11 show other embodiments of this invention, and show modifications of the planar shape of the tip of the terminal lead. FIGS. 12 to 16 show still other embodiments of this invention, and show modified examples of the side cross-sectional shape of the tip of the terminal lead. Figure 17 and 1
FIGS. 8A and 8B show still other embodiments of this invention, and show modifications of the cross-sectional shape of the terminal lead lead-out portion. FIG. 19 and FIG. 20 show still another embodiment of this invention.
The figure shows the state of formation of the terminal lead, and FIG. 20 shows the process of painting the resin exterior in the example of FIG. 19. In the figure, 5 and 6 are terminal leads, 5a and 6a
1 is a tip, 7 is a holding portion, 9 is a ceramic capacitor body, and 11 is a cutting line.

Claims (1)

[Claims for Utility Model Registration] A ceramic electronic component in which electrodes are formed at both ends of a ceramic electronic component body, and terminal leads are soldered to each electrode and drawn out in parallel directions, wherein each of the terminal leads is , 1, which is formed from a metal plate material and serves as a terminal lead for one electronic component.
The distal ends of the plurality of terminal leads constituting the group are formed with protruding pieces at side end portions disposed opposite to each other that protrude toward the mutually disposed terminal leads, and substantially the entire area of which intersects with each other; The ceramic electronic component body is held between mutually intersecting tip portions of the terminal leads, and the tip portions of each terminal lead and the corresponding electrodes are soldered to each other. , ceramic electronic components.