KR0125424Y1 - Mounting structure of electronic component of printed circuit board - Google Patents
Mounting structure of electronic component of printed circuit board Download PDFInfo
- Publication number
- KR0125424Y1 KR0125424Y1 KR2019950011990U KR19950011990U KR0125424Y1 KR 0125424 Y1 KR0125424 Y1 KR 0125424Y1 KR 2019950011990 U KR2019950011990 U KR 2019950011990U KR 19950011990 U KR19950011990 U KR 19950011990U KR 0125424 Y1 KR0125424 Y1 KR 0125424Y1
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- KR
- South Korea
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- electronic component
- component module
- printed circuit
- circuit board
- integrated structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
본 고안은 인쇄회로기판 표면상에 일체형 구조물로서 전자부품모듈을 실장하는 전자부품모듈 실장구조에 관한 것으로 그 기술적인 구성은, 일체형 구조물내 양 측면상에 삼각형형태의 노칭이 각각 형성되어 상기 전자부품모듈이 삽착토록 되고, 상기 일체형 구조물 상측 저부면에 회로가 형성되어 상기 전자부품모듈의 배면이 접속토록 되며, 전자부품모듈이 실장된 상기 일체형 구조물의 하측으로 돌출된 다수의 접속핀이 인쇄회로기판 표면상의 동축패턴부에 납땜으로 연결접속되는 것이다.The present invention relates to an electronic component module mounting structure for mounting an electronic component module as an integrated structure on a printed circuit board surface, the technical configuration of the electronic component is formed by notching in the form of a triangle formed on both sides of the integrated structure, respectively The module is inserted and inserted into the circuit, and a circuit is formed on the bottom surface of the upper part of the integrated structure so that the rear surface of the electronic component module is connected. It is connected by soldering to the coaxial pattern portion on the surface.
이에 따라서, 구조물이 일체형으로 형성토록되어 제작비가 절감되는 한편, 전자부품모듈의 실장작업이 용이하게 수행토록 되며, 전자부품모듈이 실장된 상기 일체형 구조물이 인쇄회로기판상에 용이하게 연결접속되어 작업성이 향상되고, 간단한 구조로 인해 제작이 용이하여 생산성이 향상되는 것이다.Accordingly, the structure is integrally formed to reduce manufacturing costs, and the mounting of the electronic component module can be easily performed, and the integrated structure on which the electronic component module is mounted is easily connected and connected to the printed circuit board. It is improved in productivity, easy to manufacture due to the simple structure is to improve the productivity.
Description
제1도는 종래의 인쇄회로기판의 전자부품모듈 구조물을 나타낸 개략사시도.1 is a schematic perspective view showing an electronic component module structure of a conventional printed circuit board.
제2도는 종래의 인쇄회로기판의 전자부품모듈 실장구조를 나타낸 개략구조도.2 is a schematic structural diagram showing an electronic component module mounting structure of a conventional printed circuit board.
제3도는 본 발명에 따른 인쇄회로기판의 전자부품모듈 일체형 구조물을 나타낸 개략사시도.3 is a schematic perspective view showing an electronic component module integrated structure of a printed circuit board according to the present invention.
제4도는 본 발명에 따른 인쇄회로기판의 전자부품모듈 실장구조를 나타낸 개략구조도.4 is a schematic structural diagram showing an electronic component module mounting structure of a printed circuit board according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 인쇄회로기판 2 : 일체형 구조물1: printed circuit board 2: integrated structure
3 : 전자부품모듈 4 : 노칭3: electronic component module 4: notching
5 : 접속핀 6 : 동축패턴부5: connecting pin 6: coaxial pattern part
7 : 납땜7: soldering
본 고안은 인쇄회로기판 표면상에 일체형 구조물로서 전자부품모듈을 실장하는 전자부품모듈 실장구조에 관한 것으로 이는 특히, 일체형 구조물내 양 측면상에 삼각형형태의 노칭(Noching)이 각각 형성되어 그 상측으로 전자부품모듈이 삼착토록 되고, 상기 일체형 구조물 상측 저부면에 회로가 형성되어 상기 전자부품모듈의 배면이 접속토록 되며, 전자부품모듈이 실장된 상기 일체형 구조물의 하측으로 돌출된 다수의 접속핀이 인쇄회로기판 표면상의 동축패턴부에 납땜으로 연결접속됨으로서, 전자부품모듈이 실장되는 상기 구조물이 일체형으로 형성토록 되어 제작비가 절감되는 한편, 전자부품모듈의 실장작업이 용이하게 수행토록 되며, 전자부품모듈이 실장된 상기 일체형 구조물을 인쇄회로기판상에 용이하게 연결접속 토록하여 작업성이 향상되고, 간단한 구조로 인해 제작이 용이하여 생산성이 향상될 수 있도록 한 인쇄회로기판의 전자부품모듈 실장구조에 관한 것이다.The present invention relates to an electronic component module mounting structure for mounting an electronic component module as an integrated structure on the surface of the printed circuit board, in particular, triangular notching is formed on both sides of the integrated structure, respectively, The electronic component module is attached three times, and a circuit is formed on the bottom surface of the upper part of the integrated structure to connect the rear surface of the electronic component module, and a plurality of connection pins protruding to the lower side of the integrated structure on which the electronic component module is mounted are printed. By connecting and connecting the coaxial pattern portion on the surface of the circuit board by soldering, the structure on which the electronic component module is mounted is integrally formed, thereby reducing manufacturing costs and facilitating the mounting of the electronic component module. Workability is improved by easily connecting and connecting the mounted structure on the printed circuit board. And, due to a simple structure, easy manufacturing relates to an electronic component module mounting structure of a printed circuit board to be improved in productivity.
일반적으로 알려진 종래의 인쇄회로기판의 전자부품모듈 구조물은 제1도에서 도시한 바와같이, 상부 구조물(22)과 하부 구조물(23)로서 형성되고 그 내측으로 전자부품모듈(21)이 실장토록된 후 상기 상부 및 구조물(22)(23)이 일체로 조립토록 된다.In general, the electronic component module structure of the conventional printed circuit board is formed as the upper structure 22 and the lower structure 23, as shown in Figure 1 and the electronic component module 21 is mounted therein After that, the upper and the structures 22 and 23 are integrally assembled.
또한, 제2도에서 도시한 바와같이, 인쇄회로기판(20) 표면상에 전자부품모듈(21)이 실장된 상기 구조물(22)(23)이 납땜(24)으로 연결 접속토록되어 상기 전자부품모듈(24)이 인쇄회로기판(20) 표면상에 실장토록 구성되는 것이다.In addition, as shown in FIG. 2, the structures 22 and 23 on which the electronic component module 21 is mounted on the surface of the printed circuit board 20 are connected to each other by soldering 24 so as to connect and connect the electronic components. The module 24 is configured to be mounted on the surface of the printed circuit board 20.
그러나, 상기와 같은 구조로 된 종래의 인쇄회로기판(20)의 전자부품모듈(21) 실장구조는 상부 및 하부(22)(23)로 분리된 구조물이므로 전자부품모듈(21)이 실장된 후 별도의 조립공정이 필요하게 되어 작업성이 저하됨은 물론, 제작비가 상승되고, 상기 상부 및 하부 구조물(22)(23)의 조립시 불량이 발생할 경우 그 내부에 실장된 전자부품모듈(21)도 불량이 될 수 있는 등의 문제점이 있었던 것이다.However, since the mounting structure of the electronic component module 21 of the conventional printed circuit board 20 having the above structure is a structure separated into upper and lower portions 22 and 23, the electronic component module 21 is mounted thereafter. As a separate assembly process is required, workability is lowered, as well as manufacturing cost is increased, and when the defect occurs when assembling the upper and lower structures 22 and 23, the electronic component module 21 mounted therein is also included. There could be a problem such as a defect.
본 고안은 상기와 같은 종래의 여러 문제점을 개선하기 위해 안출된 것으로서 그 목적은, 전자부품모듈 구조물을 일체형으로 형성토록 하여 제작비가 절감되고, 전자부품모듈의 실장작업이 용이토록 되며, 전자부품모듈이 실장된 상기 일체형 구조물이 용이하게 인쇄회로기판상에 연결접속토록 되어 작업성이 향상되고, 간단한 구조로 인해 제작이 용이하여 생산성이 향상되는 인쇄회로기판의 전자부품모듈 실장구조를 제공하는데 있다.The present invention has been made to improve the various problems as described above, the purpose of which is to form an electronic component module structure integrally to reduce the manufacturing cost, to facilitate the mounting work of the electronic component module, the electronic component module The mounted integrated structure is easily connected to the printed circuit board to improve the workability, it is easy to manufacture due to a simple structure to provide an electronic component module mounting structure of a printed circuit board.
상기와 같은 목적을 달성하기 위한 본 고안의 기술적인 구성은, 전자부품모듈의 실장을 용이토록 하는 개방된 면이 일측으로 마련되고, 양쪽 내측면상에 노칭이 압입 형성되어 그 상측으로 전자부품모듈이 삽착토록 되며, 하측으로 다수의 접속핀이 돌출되어 마련된 일체형 구조물과, 상기 전자부품모듈이 실장된 일체형 구조물과 그 하측으로 돌출된 다수의 접속핀이 인쇄회로기판 표면상의 동축패턴부에 납땜으로 연결 접속되는 인쇄회로기판의 전자 부품모듈 실장구조를 마련함에 의한다.Technical configuration of the present invention for achieving the above object is provided with an open surface to facilitate the mounting of the electronic component module to one side, the notch is press-formed on both inner surfaces to the upper side of the electronic component module An integrated structure, which is inserted and inserted, protrudes a plurality of connecting pins downward, and an integral structure on which the electronic component module is mounted, and a plurality of connecting pins protruding downward are soldered to the coaxial pattern portion on the surface of the printed circuit board. By providing an electronic component module mounting structure of the printed circuit board to be connected.
이하, 도면에 의거하여 본 고안을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the drawings.
제3도는 본 발명에 따른 인쇄회로기판의 전자부품모듈 일체형 구조물을 나타낸 개략사시도이고, 제4도는 본 발명에 따른 인쇄회로기판의 전자부품모듈 실장구조를 나타낸 개략구조도로서, 본 고안은 일체형의 구조물(2)로서 전자부품모듈(3)이 실장토록 되며, 상기 전자부품모듈(3)이 실장된 일체형 구조물(2)이 인쇄회로기판(1) 표면상에 연결되어 납땜(7)으로 접속된다.3 is a schematic perspective view showing an integrated structure of an electronic component module of a printed circuit board according to the present invention, and FIG. 4 is a schematic structural diagram showing an electronic component module mounting structure of a printed circuit board according to the present invention. (2) The electronic component module 3 is mounted, and the integrated structure 2 on which the electronic component module 3 is mounted is connected on the surface of the printed circuit board 1 and connected by soldering 7.
이때, 상기 일체형 구조물(2)은 양측면 내에 전자부품모듈(3)을 삽착가능토록 하는 노칭(4)이 압입 형성되고, 일측으로 상기 전자부품모듈(3)을 용이하게 실장토록 하는 개방면이 형성되며, 하측으로 돌출된 다수의 접속핀(5)이 마련된다.In this case, the integrated structure 2 is formed by pressing notch (4) for inserting the electronic component module 3 in both sides, an open surface for easily mounting the electronic component module 3 to one side. A plurality of connection pins 5 protruding downward are provided.
또한, 인쇄회로기판(1)의 전자부품모듈(3) 실장구조는 전자부품모듈(3)이 실장된 상기 일체형 구조물(2)과 그 하측으로 돌출된 다수의 접속핀(5)이 인쇄회로기판(1) 표면에 인쇄된 동축패턴부(6)에 납땜(7)으로서 연결 접속토록 되는 구성으로 이루어 진다.In addition, the mounting structure of the electronic component module 3 of the printed circuit board 1 includes the integrated structure 2 on which the electronic component module 3 is mounted and a plurality of connecting pins 5 protruding downward. (1) It consists of the structure which is connected to the coaxial pattern part 6 printed on the surface as soldering 7 as connection.
이때, 상기 일체형 구조물(2) 상측면 저부에 회로가 형성되어 그 내측으로 상기 전자부품모듈(3) 이 삽착될 때 상기 회로에 결합토록 구성되는 것이다.At this time, a circuit is formed at the bottom of the upper surface of the unitary structure 2 and is configured to be coupled to the circuit when the electronic component module 3 is inserted into the inside thereof.
이와 같은 구조로 된 본 고안의 작용 및 효과를 설명하면 다음과 같다.Referring to the operation and effects of the present invention having such a structure as follows.
제3도 및 제4도에서 도시한 바와같이, 전자부품모듈(3)이 실장토록 되는 일체형 구조물(2)은 양측면 내에 삼각형형태의 노칭(4)이 압입 형성됨으로서, 상기 전자부품모듈(3) 기판 양측면이 상기 노칭(4) 상측으로 삽착되는 한편, 상기 일체형 구조물(2) 상측 저부에 회로가 마련되어 상기 전자부품모듈(3) 기판 배면이 상기 회로와 연결토록 되고, 이에따라 상기 전자부품모듈(3)이 상기 일체형 구조물(2)내에 실장토록 된다.As shown in FIG. 3 and FIG. 4, in the integrated structure 2 to which the electronic component module 3 is mounted, the notch 4 of a triangular form is press-formed in both sides, so that the electronic component module 3 is formed. Both sides of the substrate are inserted into the upper side of the notching 4, while a circuit is provided at the bottom of the upper part of the unitary structure 2 so that the back surface of the electronic component module 3 is connected to the circuit. ) Is mounted in the unitary structure (2).
또한, 상기 일체형 구조물(2) 일측으로 개방면(9)이 형성되어 상기 전자부품모듈(3)이 상기 일체형 구조물(2)내에 용이하게 실장된다.In addition, an open surface 9 is formed at one side of the unitary structure 2 such that the electronic component module 3 is easily mounted in the unitary structure 2.
이에 더하여, 상기 일체형 구조물(2) 하측으로 다수의 접속핀(5)이 돌출되어 형성되고, 인쇄회로기판(1)상에 인쇄된 동축패턴부(6)에 상기 다수의 접속핀(5)이 납땜(7)으로 견고하게 연결 접속토록 됨으로서, 전자부품모듈(3)이 실장된 일체형 구조물(2)이 인쇄회로기판(1) 표면에 용이하게 연결 접속가능토록 되는 것이다.In addition, the plurality of connection pins 5 protrude below the unitary structure 2, and the plurality of connection pins 5 are formed on the coaxial pattern part 6 printed on the printed circuit board 1. By being firmly connected and connected by soldering 7, the integrated structure 2 on which the electronic component module 3 is mounted can be easily connected and connected to the surface of the printed circuit board 1.
이상에서와 같이 본 고안인 인쇄회로기판의 전자부품 실장구조에 의하면, 전자부품모듈 구조물을 일체형으로 형성토록 하여 제작비가 절감되고, 전자부품모듈의 실장작업이 용이하게 수행되며, 전자부품모듈이 실장된 상기 일체형 구조물이 용이하게 인쇄회로기판상에 연결접속토록 되어 작업성이 향상되고, 간단한 구조로 인해 제작이 용이하여 생산성이 향상되는 우수한 효과가 있다.As described above, according to the electronic component mounting structure of the printed circuit board of the present invention, the electronic component module structure is formed integrally, thereby reducing manufacturing costs, and easily mounting the electronic component module, and mounting the electronic component module. The integrated structure is easily connected to the printed circuit board to improve the workability, and due to the simple structure is easy to manufacture has an excellent effect of improving productivity.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950011990U KR0125424Y1 (en) | 1995-05-30 | 1995-05-30 | Mounting structure of electronic component of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950011990U KR0125424Y1 (en) | 1995-05-30 | 1995-05-30 | Mounting structure of electronic component of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960039042U KR960039042U (en) | 1996-12-18 |
| KR0125424Y1 true KR0125424Y1 (en) | 1998-12-15 |
Family
ID=19414513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950011990U KR0125424Y1 (en) | 1995-05-30 | 1995-05-30 | Mounting structure of electronic component of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0125424Y1 (en) |
-
1995
- 1995-05-30 KR KR2019950011990U patent/KR0125424Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960039042U (en) | 1996-12-18 |
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| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
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| FPAY | Annual fee payment |
Payment date: 20010423 Year of fee payment: 4 |
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| LAPS | Lapse due to unpaid annual fee |