JPS58192A - Method of mounting electronic part on printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved method of attaching electronic components to printed circuit boards.

Conventionally, when attaching electronic components to a printed circuit board, first, as shown in Figure 1, an electric circuit conductor 2 is printed on the board surface, and the hole 5 passing through the base 4 is placed on the side where the conductor 2 is located. and the opposite 1
[Insert the lead wire 4a of the electronic component 4 from the surface side. Then, as shown in FIG. 1CB), the board 1 is connected to the electronic section 44.
After soldering *4 m of leads to the conductor 2 on the side opposite to the side facing the conductor 2, as shown in Figure 1 (C), cut and remove the part of the lead wire that protrudes from the part 5 when soldering. I was doing it.

However, the method for installing such electronic components is
If the board 1 is soldered to the side opposite to the side facing the electronic component 4, the part 5 will bulge, so it is not possible to attach one side of the board 1 in close contact with the other board. In addition to requiring extra installation space, soldering also had the disadvantage of posing problems with insulation on the part side.

The present invention has been made to improve this point, and the present invention will be described in detail below with reference to drawings of embodiments.

The electronic component mounting method of the present invention is first shown in JII Figure 2 (4).
As shown in , the lead wire 4a of the electronic component 4 is inserted into the through hole 6 that passes through the conductor 2 and the board 1 from the side of the board 1 on which the electric circuit conductor 2 is printed, and the lead wire 4a of the electronic component 4 is connected to the conductor 2 and the lead 84&
Apply creamy solder 6a around the bonding part.

Then, the bulk solder is heated and melted, and the lead 114g is soldered to the conductor 2 as shown by reference numeral 6 in (4). Thereafter, as shown in FIG. 5 (03), the lead wires protruding from the side of the board 1 that does not face the electronic components 4 are cut and removed, completing the attachment of the electronic components 40 to the board 1.

Note that the creamy solder 61 is shown in figure K' (4).
As shown in Figure 4, the conductor 20 is coated in advance on the surrounding area of the through hole, and then the lead wire 4a of the electronic component 4 is inserted into the through hole from the side where the solder is applied with scissors, as shown in Figure 4. 6 may be inserted. Thereafter, the solder 6a is heated and soldered as shown in FIG.
Just cut and remove the nine-lead edge that extends from the back side as shown in Figure 3 (8).

Further, the creamy solder 6a may be heated and melted using a soldering iron or in an appropriate heating furnace.

As mentioned above, the mounting of electronic components on the printed circuit board according to the present invention is carried out by method company, placing the electronic components on the printed conductor side of the circuit board, inserting the leads of Ikuaki Akira into the through-holes of the circuit board, A creamy solder is applied around the connecting portion of the conductor and the lead wire, the solder is heated and melted, and the lead wire is soldered to the conductor. Since the protruding lead wires are cut and removed, there is no welding solder buildup on the back side of the board opposite to the side where the electronic components are attached, and the lead wires of the parts are removed from the back side of the board. There's nothing to do.

Therefore, it is possible to maintain good flatness on the back surface of the printed circuit board on which the electronic components are attached, and to remove the printed circuit board from other parts.
When it is assembled into a device in combination with components on a single-layer board, it has the advantage of saving installation space, providing stability in installation, and providing a large degree of freedom.

[Brief explanation of drawings]

Figure 1 - Ω shows the conventional method for installing electronic components.
Figure i, Figure #I2 (support) and imcA), @ Mori An explanatory diagram showing an example of method OII for attaching electronic components according to the invention, Figures 4 (2) and (6) are the illustrations of this invention. It is an explanatory view and a figure showing other enclosing constructions in O Nakanaseki Works 1. DESCRIPTION OF SYMBOLS 1... Board, 2... Electric circuit conductor, 6... Through hole, 4... Electronic component, 4m... Lead wire, 6m...
Creamy solder, 6... Soldered n part. 1 patent attorney Hidetoshi Matsumoto

Claims (1)

[Claims] A method for attaching an electronic component to a printed circuit board includes inserting a lead wire tube of an electronic component into a hole penetrating the board on which an electric circuit conductor is printed and connecting the lead to the conductor. The conductor of the board is printed and the component is placed fF-H, and a creamy solder is applied around the connecting part between the conductor and the lead wire, and the wrinkles are melted by heating to form the lead wire. A method for attaching electronic components to a printed circuit board consists of soldering wires to the conductor and then cutting and removing the lead wires protruding from the side of the board that does not face the electronic components.