JPS60176294A - Device for connecting lead wire - Google Patents
Device for connecting lead wireInfo
- Publication number
- JPS60176294A JPS60176294A JP3162684A JP3162684A JPS60176294A JP S60176294 A JPS60176294 A JP S60176294A JP 3162684 A JP3162684 A JP 3162684A JP 3162684 A JP3162684 A JP 3162684A JP S60176294 A JPS60176294 A JP S60176294A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electronic component
- circuit board
- printed circuit
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はリード線の接続装置に関するもので、特にプリ
ント基板にリード線を容易に接続できるようにしだもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead wire connecting device, and particularly to a device for easily connecting lead wires to a printed circuit board.
従来例の構成とその問題点 第１図（＆）（ｂ）（Ｃ）は従来例を示すものである。Conventional configuration and its problems 1(&)(b)(C) show a conventional example.
まずプリント基板１に電子部品２を取付け、プリント基
板３に設けられたリード線挿入孔にリード線露出部４ａ
を挿入して仮止めし、第１図（ａ）のように半田伺する
ことにより、リード線４とプリント基板１を接続してい
た。First, the electronic component 2 is mounted on the printed circuit board 1, and the lead wire exposed portion 4a is inserted into the lead wire insertion hole provided in the printed circuit board 3.
The lead wires 4 and the printed circuit board 1 were connected by inserting and temporarily fixing them and soldering them as shown in FIG. 1(a).
しかしながら、この種の装置では、リード線をリード線
挿入孔３に挿入した後にプリント基板１を反転させてリ
ード線露出部４ａを半田伺する作業が必要であり、能率
的でなかった。However, in this type of device, after inserting the lead wire into the lead wire insertion hole 3, it is necessary to invert the printed circuit board 1 and solder the exposed lead wire portion 4a, which is not efficient.
発明の目的
本発明は、この様な従来の欠点を解消ｊ７．１７−ド線
の接続をプリント基板を反転させずとも、接続できる装
置を提供するものである。OBJECTS OF THE INVENTION The present invention overcomes these conventional drawbacks and provides a device that can connect the j7.17- wire without reversing the printed circuit board.
発明の構成
本発明は、プリント基板に取り伺けられる電子部品のリ
ード線露出部近傍にリード線挿入孔を設けたものであり
、このリード線挿入孔にリード線露出部を挿入、仮止め
によって、リード線挿入方向より電子部品のリード線と
、リード線露出部を半田付等により、接続できる様にし
たものである。Structure of the Invention The present invention provides a lead wire insertion hole in the vicinity of an exposed lead wire portion of an electronic component that can be inserted into a printed circuit board, and the exposed lead wire portion is inserted into this lead wire insertion hole and temporarily fixed. The lead wire of the electronic component and the exposed portion of the lead wire can be connected by soldering or the like from the lead wire insertion direction.
実施例の説明
以下本発明に係るリード線の接続装置について一実施例
の図面と共に説明する。第２図において３はプリント基
板１上に電子部品２を挿入して取り付けたときに電子部
品２ａのリード線部近傍に設けられたリード線挿入孔で
ある。また５は半田であり、６は半田ゴテである。その
他の第１図と同一符号のものは第１図と同一機能を有し
ている。DESCRIPTION OF EMBODIMENTS A lead wire connection device according to the present invention will be described below with reference to drawings of one embodiment. In FIG. 2, reference numeral 3 denotes a lead wire insertion hole provided near the lead wire portion of the electronic component 2a when the electronic component 2 is inserted and attached onto the printed circuit board 1. Further, 5 is solder and 6 is a soldering iron. Other components having the same symbols as in FIG. 1 have the same functions as in FIG.
次に上記実施例のり一ド紳の接続装置の接続を説明する
。リード線先端部４のリード線露出部４ａをプリント基
板１のリード線挿入孔３に挿入し、先に取付けである電
子部品２のリード線部２ａに密着させて、次に同一作業
方向から半田６と半田ゴテ６で電子部品リード線部２ａ
とリード線露出部４ａを半田付し、電気的導通接続が簡
単に行なえる。Next, the connection of the connecting device of the above embodiment will be explained. Insert the lead wire exposed portion 4a of the lead wire tip portion 4 into the lead wire insertion hole 3 of the printed circuit board 1, first bring it into close contact with the lead wire portion 2a of the electronic component 2 to be mounted, and then solder from the same working direction. 6 and soldering iron 6 to connect the electronic component lead wire part 2a.
By soldering the exposed lead wire portion 4a, electrical continuity can be easily established.
発明の効果
以上のように、本発明によれば、リード線の挿入方向か
ら作業が行なえることにより、従来例による作業のプリ
ント基板を反転させることなく、作業が可能であり、リ
ード線接続作業の作業能率を大巾に向上することができ
るものである。Effects of the Invention As described above, according to the present invention, since the work can be performed from the lead wire insertion direction, the work can be performed without reversing the printed circuit board as in the conventional example, and the lead wire connection work can be performed. The work efficiency can be greatly improved.
第１図（ａ）は従来の接続装置の平面図、第１図（ｂ）
は従来の接続方法の斜視図、第１図（０）は従来の接続
後の状態を説明するだめの側面図、第２図（ａ）は本発
明の接続装置の一実施例の平面図、第２図（１））は同
実施例の接続方法を説明する斜視図、第２図（０）は同
実施例の接続作業を説明する側面図、第２図Ｃｄ）は同
実施例の接続後の状態を説明するための側面図である。
１・・・・プリント基板、２・・・・・電子部品、２ａ
・・・・・・電子部品のリード部、３・・・・・リード
線挿入孔、４・・・・・リード線、４ａ・・・・リード
線の露出部、６・・・・半田、６・・・・・・半田ゴテ
。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図Figure 1(a) is a plan view of a conventional connection device, Figure 1(b)
1 is a perspective view of a conventional connection method, FIG. 1 (0) is a side view for explaining the state after the conventional connection, and FIG. 2 (a) is a plan view of an embodiment of the connection device of the present invention. Figure 2 (1)) is a perspective view explaining the connection method of the same embodiment, Figure 2 (0) is a side view explaining the connection work of the same embodiment, and Figure 2 Cd) is the connection of the same embodiment. It is a side view for explaining a later state. 1...Printed circuit board, 2...Electronic component, 2a
...Lead part of electronic component, 3...Lead wire insertion hole, 4...Lead wire, 4a...Exposed part of lead wire, 6...Solder, 6... Soldering iron. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (1)
にリード線挿入孔を設け、該リード線挿入孔に、リード
線の露出部の先端部を挿入、仮止めし、上記電子部品の
リード線露出部とリード線の露出部を半田付することに
より、上記リード線の露出部を」＝記プリント基板上に
配置する電子部品のリード線に電気的導通するようにし
たことを特徴とするリード線の接続装置。A lead wire insertion hole is provided near the exposed lead wire portion of the electronic component to be placed on the printed circuit board, and the tip of the exposed portion of the lead wire is inserted into the lead wire insertion hole and temporarily secured to expose the lead wire of the electronic component. A lead wire characterized in that the exposed portion of the lead wire is electrically connected to the lead wire of an electronic component disposed on the printed circuit board by soldering the exposed portion of the lead wire to the exposed portion of the lead wire. connection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3162684A JPS60176294A (en) | 1984-02-22 | 1984-02-22 | Device for connecting lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3162684A JPS60176294A (en) | 1984-02-22 | 1984-02-22 | Device for connecting lead wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60176294A true JPS60176294A (en) | 1985-09-10 |
Family
ID=12336419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3162684A Pending JPS60176294A (en) | 1984-02-22 | 1984-02-22 | Device for connecting lead wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60176294A (en) |
-
1984
- 1984-02-22 JP JP3162684A patent/JPS60176294A/en active Pending
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